DRA. Automotive grade High power density, high efficiency, shielded drum core power inductors. Technical Data Applications.
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1 Supersedes September 2017 High power density, high efficiency, shielded drum core power inductors Applications Body electronics o Headlamps, tail lamps and interior lighting o Heating Ventilation and Air Conditioning controllers (HVAC) o Doors, window lift and seat control Advanced driver assistance systems o Adaptive cruise control (ACC) o Collision avoidance system o Car black box system Infotainment and cluster electronics o Audio subsystem: head unit and trunk amp o Digital instrument cluster o In-Vehicle Infotainment (IVI) and navigation Chassis and safety electronics o Electronic Stability Control system (ESC) o Electric parking brake o Electronic Power Steering (EPS) Engine and powertrain systems o Diesel/gasoline engine management o Powertrain Control Module (PCM)/ Engine Control Unit (ECU) o Transmission Control Unit (TCU) Product features AEC-Q200 qualified Five different mechanical sizes available Magnetically shielded-reduces EMI Ferrite core material Inductance range from 0.28 µh to 00 µh Current range up to 56 A Rugged construction for high shock and vibration environments Moisture Sensitivity Level (MSL): 1 Environmental data Storage temperature range (component): -40 C to +165 C Operating temperature range: -40 C to +165 C (ambient plus self-temperature rise) Solder reflow temperature: J-STD-020 (latest revision) compliant Pb HF FREE HALOGEN
2 Product specifications Part Number 6 OCL 1 ±20% (µh) 2 I rms Typical Maximum K-Factor 5 73-R33-R R0-R R5-R R2-R R3-R R7-R R8-R R2-R R R R R R R R R R R R R R R R Open Circuit Inductance (OCL) Test Parameters: 0 khz, 0.25 V rms, 0.0A 2. I rms : DC current for an approximate temperature rise of 40 C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, airflow and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed +165 C under worst case operating conditions verified in the end application. 3. 1: Peak current for approximately 30% rolloff at. 4. 2: Peak current for approximately 40% rolloff at +125 C. 5. K-factor: Used to determine Bp-p for core loss (see graph). B p-p = K * L * I. B p-p :(Gauss), K: (K-factor from table), L: (Inductance in µh), I (peak-to-peak ripple current in amps). 6. Part Number Definition: xxx-yyy-r xxx = Product code and size yyy= Inductance value in uh, R = decimal point, if no R is present then third character = number of zeros. -R suffix = RoHS compliant 2
3 Product specifications Part Number 6 OCL 1 ±20% (µh) 2 I rms Typical Maximum K-Factor 5 74-R33-R R0-R R5-R R2-R R3-R R7-R R8-R R2-R R R R R R R R R R R R R R R R Open Circuit Inductance (OCL) Test Parameters: 0 khz, 0.25 V rms, I rms : DC current for an approximate temperature rise of 40 C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, airflow and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed +165 C under worst case operating conditions verified in the end application. 3. 1: Peak current for approximately 30% rolloff at. 4. 2: Peak current for approximately 40% rolloff at +125 C. 5. K-factor: Used to determine Bp-p for core loss (see graph). B p-p = K * L * I. B p-p :(Gauss), K: (K-factor from table), L: (Inductance in µh), I (peak-to-peak ripple current in amps). 6. Part Number Definition: xxx-yyy-r xxx = Product code and size yyy= Inductance value in uh, R = decimal point, if no R is present then third character = number of zeros. -R suffix = RoHS compliant 3
4 Product specifications Part Number 6 OCL 1 ±20% (µh) 2 I rms Typical Maximum K-Factor R47-R R0-R R5-R R2-R R3-R R7-R R8-R R2-R R R R R R R R R R R R R R R R Open Circuit Inductance (OCL) Test Parameters: 0 khz, 0.25 V rms, I rms : DC current for an approximate temperature rise of 40 C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, airflow and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed +165 C under worst case operating conditions verified in the end application. 3. 1: Peak current for approximately 30% rolloff at. 4. 2: Peak current for approximately 40% rolloff at +125 C. 5. K-factor: Used to determine Bp-p for core loss (see graph). B p-p = K * L * I. B p-p :(Gauss), K: (K-factor from table), L: (Inductance in µh), I (peak-to-peak ripple current in amps). 6. Part Number Definition: xxx-yyy-r xxx = Product code and size yyy= Inductance value in µh, R = decimal point, if no R is present then third character = number of zeros. -R suffix = RoHS compliant 4
5 Product specifications Part Number 6 OCL 1 ±20% (µh) 2 I rms Typical Maximum K-Factor R47-R R0-R R5-R R2-R R3-R R7-R R8-R R2-R R R R R R R R R R R R R R R R Open Circuit Inductance (OCL) Test Parameters: 0 khz, 0.25 V rms, I rms : DC current for an approximate temperature rise of 40 C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, airflow and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed +165 C under worst case operating conditions verified in the end application. 3. 1: Peak current for approximately 30% rolloff at. 4. 2: Peak current for approximately 40% rolloff at +125 C. 5. K-factor: Used to determine Bp-p for core loss (see graph). B p-p = K * L * I. B p-p :(Gauss), K: (K-factor from table), L: (Inductance in µh), I (peak-to-peak ripple current in amps). 6. Part Number Definition: xxx-yyy-r xxx = Product code and size yyy= Inductance value in µh, R = decimal point, if no R is present then third character = number of zeros. -R suffix = RoHS compliant 5
6 Product specifications Part Number 6 OCL 1 ±20% (µh) 2 I rms Maximum K-Factor R47-R R0-R R5-R R2-R R3-R R7-R R8-R R2-R R R R R R R R R R R R R R R R Open Circuit Inductance (OCL) Test Parameters: 0 khz, 0.25 V rms, I rms : DC current for an approximate temperature rise of 40 C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, airflow and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed +165 C under worst case operating conditions verified in the end application. 3. 1: Peak current for approximately 30% rolloff at. 4. 2: Peak current for approximately 40% rolloff at +125 C. 5. K-factor: Used to determine Bp-p for core loss (see graph). B p-p = K * L * I. B p-p :(Gauss), K: (K-factor from table), L: (Inductance in µh), I (peak-to-peak ripple current in amps). 6. Part Number Definition: xxx-yyy-r xxx = Product code and size yyy= Inductance value in µh, R = decimal point, if no R is present then third character = number of zeros. -R suffix = RoHS compliant 6
7 Dimensions - mm 73 & 74 Top view Front view Schematic Bottom view Part Marking: ### = inductance value in µh, R = decimal point; if no R is present, then 3rd digit equals number of zeros wwllyy = Date code, R = revision level All soldering surfaces to be coplanar within 0. millimeters Tolerances are ± 0.2 millimeters unless stated otherwise. Do not route traces or vias underneath the inductor *Special Characteristic epoxy protrusion or any flashing from the plastic on the header/base can be below the terminal surface and must not exceed 0.08 mm beyond the bottom surface of the terminal. 124, 125 & 127 Top view Recommended pad layout Max Front view Schematic Bottom view Part Marking: xx, xx = 124, 125 or 127, ### = inductance value in µh, R = decimal point; if no R is present, then 3rd digit equals number of zeros wwllyy = Date code, R = revision level All soldering surfaces to be coplanar within 0. millimeters Tolerances are ± 0.2 millimeters unless stated otherwise. Do not route traces or vias underneath the inductor *Special Characteristic epoxy protrusion or any flashing from the plastic on the header/base can be below the terminal surface and must not exceed 0.08 mm beyond the bottom surface of the terminal. 7
8 Packaging information - mm 73 & 74 Supplied in tape and reel packaging, on a 13 diameter reel: pieces pieces 124, 125 & 127 Supplied in tape and reel packaging, on a 13 diameter reel: pieces pieces pieces 8
9 Temperature rise vs. total loss Temp. Rise( C) Temp. Rise( C) Total Loss (W) Total Loss (W) Temp. Rise( C) Temp. Rise( C) Total Loss (W) Total Loss (W) Temp. Rise( C) Total Loss (W) 9
10 Core loss vs. Bp-p Core Loss vs B p-p Core Loss vs B p-p 1 1 Core Loss (W) 0.1 Core Loss (W) B p-p (Gauss) B p-p (Gauss) Core Loss vs B p-p Core Loss vs B p-p 1 1 Core Loss (W) 0.1 Core Loss (W) B p-p (Gauss) B p-p (Gauss) Core Loss vs B p-p 1 Core Loss (W) B p-p (Gauss)
11 Inductance characteristics % of OC L 120 % 1 % 0 % 90 % 80 % 70 % 60 % 50 % 40 % 30 % 20 % % 0% OCL vs 1-40 C +25 C +85 C +125 C 0% % 20% 30 % 40% 50 % 60% 70 % 80% 90 % 0 % 1 % 120 % 130 % 140 % % of 1 % ofocl 120% 1% 0% 90 % 80 % 70 % 60 % 50 % 40 % 30 % 20 % % 0% OCL vs 1-40 C +25 C +85 C +125 C 0% % 20% 30 % 40% 50 % 60% 70 % 80% 90 % 0 % 1 % 120 % % of % OCL vs 1 120% OCL vs 1 1 % 1% 0 % 0% 90 % 90 % 80 % 80 % % ofocl 70 % 60 % 50 % 40 % -40 C +25 C % ofocl 70 % 60 % 50 % 40 % -40 C +25 C 30 % 20 % % +85 C +125 C 30 % 20 % % +85 C +125 C 0% 0% % 20% 30 % 40% 50 % 60% 70 % 80% 90 % 0 %1 % 120 %130 %140 % 150 %160 % % of 1 0% 0% % 20% 30 % 40% 50 % 60% 70 % 80% 90 % 0 % 1 % 120 % 130 % 140 % % of % OCL vs 1 1% 0% 90% 80% % of OCL 70% 60% 50% -40 C 40% 30% 20% % +25 C +85 C +125 C 0% 0% % 20% 0% 3 40% 50% 0% 6 70% 80% 90% 0% 1% 120% 130% 140% 150% 160% % of 1 11
12 Solder Reflow Profile T P T L Temperature T smax T smin Max. Ramp Up Rate = 3 C/s Max. Ramp Down Rate = 6 C/s Preheat A ts t t P T C -5 C Table 1 - Standard SnPb Solder (T c ) Volume Volume Package mm 3 mm 3 Thickness <350 _>350 <2.5mm 235 C 220 C _>2.5mm 220 C 220 C Table 2 - Lead (Pb) Free Solder (T c ) Volume Volume Volume Package mm 3 mm 3 mm 3 Thickness < >2000 <1.6mm 260 C 260 C 260 C mm 260 C 250 C 245 C >2.5mm 250 C 245 C 245 C 25 C Time 25 C to Peak Time Reference JDEC J-STD-020 Profile Feature Standard SnPb Solder Lead (Pb) Free Solder Preheat and Soak Temperature min. (T smin ) 0 C 150 C Temperature max. (T smax ) 150 C 200 C Time (T smin to T smax ) (t s ) Seconds Seconds Average ramp up rate T smax to T p 3 C/ Second Max. 3 C/ Second Max. Liquidous temperature (TL) 183 C 217 C Time at liquidous (t L ) Seconds Seconds Peak package body temperature (T P )* Table 1 Table 2 Time (t p )** within 5 C of the specified classification temperature (T c ) 20 Seconds** 30 Seconds** Average ramp-down rate (T p to T smax ) 6 C/ Second Max. 6 C/ Second Max. Time 25 C to Peak Temperature 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (T p ) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (t p ) is defined as a supplier minimum and a user maximum. Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Compan. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant inju y to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Eaton Electronics Division 00 Eaton Boulevard Cleveland, OH United States 2018 Eaton All Rights Reserved Printed in USA Publication No BU-MC17080 January 2018 Eaton is a registered trademark. All other trademarks are property of their respective owners.
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