HCM1307 High current power inductors
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- Lawrence Norton
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1 Applications Multi-phase regulators Voltage Regulator Modules (VRMs) Distributed power systems - converters Desktop and server VRMs and EVRDs Point-of-Load (POL) modules Field Programmable Gate Array (FPGA) - converters Battery power systems High current power supplies Data networking and storage systems Description High current carrying capacity Low core losses Magnetically shielded, low EMI Frequency range up to MHz Inductance range from 0.47μH to 3.3μH Current range from 5 to 63 amps 4. x 3.0mm footprint surface mount package in a 6.5mm height Iron powder core material Halogen free, lead free, RoHS compliant Environmental Data Storage temperature range (Component): -55 C to +5 C Operating temperature range: -55 C to +5 C (ambient + self-temperature rise) Solder reflow temperature: J-STD-00D compliant Pb HALOGEN HF FREE
2 Product Specifications Part Number 6 OCL (μh) ±0% FLL (μh) minimum I rms 3 (amps) I sat 4 (amps) R (mω) +0 C R (mω) +0 C K-factor 5 -R47-R R0-R R3-R Open Circuit Inductance (OCL) Test Parameters: 00kHz,.0Vrms, +5 C. Full Load Inductance (FLL) Test Parameters: I +5ºC 3. I rms: current for an approximate temperature rise of 40 C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed 5 C under worst case operating conditions verified in the end application. 4. I sat: Peak current for approximately 30% +5 C 5. K-factor: Used to determine B p-p for core loss (see graph). Bp-p = K * L * ΔI. B p-p: (Gauss), K: (K-factor from table), L: (Inductance in μh), ΔI (Peak to peak ripple current in Amps). 6. Part Number Definition: -xxx-r = Product code and size xxx= inductance value in μh, R= decimal point, If no R is present then last character equals number of zeros -R suffix = RoHS compliant Dimensions (mm) a b Recommended Pad Layout Schematic 3. ± ±0..5 ± ±0.5 XXX wlyy R 3.8 ± ref Part marking: XXX=Inductance value in uh, R= decimal point. If no R is present then last character equals number of zeros. wlyy=date code, R=revision level All soldering surfaces to be coplanar within 0.0 millimeters Tolerances are ±0.3 millimeters unless stated otherwise Color: Grey Do not route traces or vias underneath the inductor
3 Packaging information (mm) Supplied in tape and reel packaging, 400 parts per 3 diameter reel dia.75 XXX wlyy R ± dia User direction of feed Temperature rise vs. total loss Temperature Rise ( C) R47-R -R0-R -3R3-R Total Loss (W) 3
4 Core loss vs. Bp-p Core Loss (mw) MHz 500kHz 300kHz 00kHz 00kHz 50kHz 5kHz B p-p (Gauss) Inductance characteristics 0% -R47-R 0% -R0-R 00% 00% % -3R3-R 00%
5 Solder reflow profile T P Max. Ramp Up Rate = 3 C/s Max. Ramp Down Rate = 6 C/s t P T C -5 C Table - Standard SnPb Solder (T c ) Package Thickness mm3 <350 mm3 350 T L Temperature T smax T smin Preheat A ts t <.5mm) 35 C 0 C.5mm 0 C 0 C Table - Lead (Pb) Free Solder (T c ) Package Thickness < >000 <.6mm 60 C 60 C 60 C.6.5mm 60 C 50 C 45 C >.5mm 50 C 45 C 45 C 5 C Time 5 C to Peak Time Reference JDEC J-STD-00D Profile Feature Standard SnPb Solder Lead (Pb) Free Solder Preheat and Soak Temperature min. (T smin ) 00 C 50 C Temperature max. (T smax ) 50 C 00 C Time (T smin to T smax ) (t s ) 60-0 Seconds 60-0 Seconds Average ramp up rate T smax to T p 3 C/ Second Max. 3 C/ Second Max. Liquidous temperature (Tl) Time at liquidous (t L ) 83 C Seconds Peak package body temperature (T P )* Table Table 7 C Seconds Time (t p )** within 5 C of the specified classification temperature (T c ) 0 Seconds** 30 Seconds** Average ramp-down rate (T p to T smax ) 6 C/ Second Max. 6 C/ Second Max. Time 5 C to Peak Temperature 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (T p ) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (t p ) is defined as a supplier minimum and a user maximum. Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Eaton Electronics Division 000 Eaton Boulevard Cleveland, OH 44 United States 05 Eaton All Rights Reserved Printed in USA Publication No BU-MC5009 September 05 Eaton is a registered trademark. All other trademarks are property of their respective owners.
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