Part Number Order Number Package Quantity Supplying Form. (Pb-Free)
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1 <R> NESGM NPN SiGe RF Transistor for Low Noise, High-in Amplification Flat-Lead -Pin Thin-Type Super Minimold (M) FEATURES The device is an ideal choice for low noise, high-gain at low current amplifications. =.8 db TYP., = 7. db V CE = V, I C = ma, f = GHz =. db TYP., G a =. db V CE = V, I C = ma, f =. GHz Maximum stable power gain: =. db V CE = V, I C = ma, f = GHz High breakdown voltage technology for SiGe Tr. adopted: V CEO (absolute maximum ratings) =. V Flat-lead -pin thin-type super minimold (M) package ORDERING IORMATION Data Sheet Part Number Order Number Package Quantity Supplying Form NESGM NESGM-A Flat-lead -pin thintype pcs 8 mm wide embossed supper minimold (Non reel) taping NESGM-T NESGM-T-A (M, PKG) (Pb-Free) kpcs/reel Pin (Collector), Pin (Emitter) face the perforation side of the tape Remark To order evaluation samples, please contact your nearby sales office. Unit sample quantity is pcs. ABSOLUTE MAXIMUM RATINGS (T A = + C) Parameter Symbol Ratings Unit Collector to Base Voltage V CBO. V Collector to Emitter Voltage V CEO. V Emitter to Base Voltage V EBO. V Collector Current I C ma Total Power Dissipation Note P tot 7 mw Junction Temperature T j C Storage Temperature T stg to + C Note: Mounted on.8 cm. mm (t) glass epoxy PCB CAUTION R9DSEJ Rev.. Jun, Observe precautions when handling because these devices are sensitive to electrostatic discharge. R9DSEJ Jun, Rev.. The mark <R> shows major revised points. The revised points can be easily searched by copying an "<R>" in the PDF file and specifying it in the "Find what:" field. Page of
2 NESGM <R> <R> ELECTRICAL CHARACTERISTICS (T A = + C) DC Characteristics Parameter Symbol Test Conditions MIN. TYP. MAX. Unit Collector Cut-off Current I CBO V CB = V, I E = na Emitter Cut-off Current I EBO V EB = V, I C = na DC Current in Note h FE V CE = V, I C = ma 9 RF Characteristics in Bandwidth Product f T V CE = V, I C = ma, f = GHz GHz Insertion Power in S e V CE = V, I C = ma, f = GHz. 8. db Noise Figure () V CE = V, I C = ma, f = GHz,.8. db Z S = Z Sopt, Z L = Z Lopt Noise Figure () V CE = V, I C = ma, f =. GHz,. db Z S = Z Sopt, Z L = Z Lopt Associated in () G a V CE = V, I C = ma, f = GHz,. 7. db Z S = Z Sopt, Z L = Z Lopt Associated in () G a V CE = V, I C = ma, f =. GHz,. db Z S = Z Sopt, Z L = Z Lopt Reverse Transfer Capacitance C re Note V CB = V, I E =, f = MHz.. pf Maximum Stable Power in Note V CE = V, I C = ma, f = GHz 9.. db in db Compression Output Power rd Order Intermodulation Distortion Output Intercept Point P O ( db) OIP Notes:. Pulse measurement: PW μs, Duty Cycle %. Collector to base capacitance when the emitter grounded. = h FE CLASSIFICATION Rank Marking S S FB/YFB TH h FE Value to V CE = V, I C = ma, f = GHz, dbm Z S = Z Sopt, Z L = Z Lopt V CE = V, I C = ma, f = GHz, dbm Z S = Z Sopt, Z L = Z Lopt R9DSEJ Jun, Rev.. Page of
3 NESGM TYPICAL CHARACTERISTICS (T A = + C, unless otherwise specified) Total Power Dissipation Ptot (mw) 7 TOTAL POWER DISSIPATION vs. AMBIENT TEMPERATURE Mounted on Glass Epoxy PCB (.8 cm. mm (t) ) VCE = V Ambient Temperature TA ( C) COLLECTOR CURRENT vs. BASE TO EMITTER VOLTAGE Base to Emitter Voltage VBE (V) COLLECTOR CURRENT vs. BASE TO EMITTER VOLTAGE Base to Emitter Voltage VBE (V) Reverse Transfer Capacitance Cre (pf)... REVERSE TRANSFER CAPACITANCE vs. COLLECTOR TO BASE VOLTAGE f = MHz Collector to Base Voltage VCB (V) COLLECTOR CURRENT vs. BASE TO EMITTER VOLTAGE VCE = V Base to Emitter Voltage VBE (V) COLLECTOR CURRENT vs. COLLECTOR TO EMITTER VOLTAGE Collector to Emitter Voltage VCE (V) μa 8 μa μa μa μa μa 8 μa μa μa IB = μa R9DSEJ Jun, Rev.. Page of
4 NESGM DC CURRENT GAIN vs. COLLECTOR CURRENT VCE = V DC CURRENT GAIN vs. COLLECTOR CURRENT VCE = V DC Current in hfe DC Current in hfe.. DC CURRENT GAIN vs. COLLECTOR CURRENT DC Current in hfe. R9DSEJ Jun, Rev.. Page of
5 NESGM in Bandwidth Product ft (GHz) in Bandwidth Product ft (GHz) Insertion Power in Se (db) GAIN BANDWIDTH PRODUCT VCE = V f = GHz GAIN BANDWIDTH PRODUCT f = GHz INSERTION POWER GAIN,, vs. FREQUENCY Se VCE = V IC = ma. Frequency f (GHz) in Bandwidth Product ft (GHz) Insertion Power in Se (db) Insertion Power in Se (db) GAIN BANDWIDTH PRODUCT VCE = V f = GHz INSERTION POWER GAIN,, vs. FREQUENCY Se Frequency f (GHz) VCE = V IC = ma. INSERTION POWER GAIN,, vs. FREQUENCY Se Frequency f (GHz) IC = ma. R9DSEJ Jun, Rev.. Page of
6 NESGM Insertion Power in Se (db) Insertion Power in Se (db) Insertion Power in Se (db) INSERTION POWER GAIN,, VCE = V f = GHz Se INSERTION POWER GAIN,, VCE = V f = GHz Se INSERTION POWER GAIN, VCE = V f = GHz Se Insertion Power in Se (db) Insertion Power in Se (db) Insertion Power in Se (db) INSERTION POWER GAIN,, VCE = V f = GHz Se INSERTION POWER GAIN, VCE = V f = GHz Se INSERTION POWER GAIN,, VCE = V f = GHz Se R9DSEJ Jun, Rev.. Page of
7 NESGM Insertion Power in Se (db) Insertion Power in Se (db) Insertion Power in Se (db) INSERTION POWER GAIN,, VCE = V f = GHz Se INSERTION POWER GAIN, f = GHz Se INSERTION POWER GAIN,, f = GHz Se Insertion Power in Se (db) Insertion Power in Se (db) Insertion Power in Se (db) INSERTION POWER GAIN,, f = GHz Se INSERTION POWER GAIN, f = GHz INSERTION POWER GAIN, VCE = V f = GHz Se Se R9DSEJ Jun, Rev.. Page 7 of
8 NESGM Output Power Pout (dbm) Output Power Pout (dbm) OUTPUT POWER, COLLECTOR CURRENT vs. INPUT POWER, f = GHz Icq = ma (RF OFF) Pout Input Power Pin (dbm) OUTPUT POWER, COLLECTOR CURRENT vs. INPUT POWER, f = GHz Icq = ma (RF OFF) Pout Input Power Pin (dbm) IC IC Output Power Pout (dbm) Output Power Pout (dbm) OUTPUT POWER, COLLECTOR CURRENT vs. INPUT POWER, f = GHz Icq = ma (RF OFF) Pout IC Input Power Pin (dbm) OUTPUT POWER, COLLECTOR CURRENT vs. INPUT POWER, f =. GHz Icq = ma (RF OFF) Input Power Pin (dbm) Pout IC R9DSEJ Jun, Rev.. Page 8 of
9 NESGM VCE = V f = GHz VCE = V f = GHz VCE = V f =. GHz 8 Associated in (db) Associated in (db) Associated in (db) VCE = V f = GHz VCE = V f = GHz VCE = V f =. GHz 8 Associated in (db) Associated in (db) Associated in (db) R9DSEJ Jun, Rev.. Page 9 of
10 NESGM f = GHz f = GHz f =. GHz Remark 8 Associated in (db) Associated in (db) Associated in (db) The graphs indicate nominal characteristics. R9DSEJ Jun, Rev.. Page of
11 NESGM <R> S-PARAMETERS S-parameters and noise parameters are provided on our web site in a form (SP) that enables direct import of the parameters to microwave circuit simulators without the need for keyboard inputs. Click here to download S-parameters. [Products] [RF Devices] [Device Parameters] URL R9DSEJ Jun, Rev.. Page of
12 NESGM PACKAGE DIMENSIONS <R> FLAT-LEAD -PIN THIN-TYPE SUPER MINIMOLD (M, PKG) (UNIT: mm).±...9±. (.). PIN CONNENTION. Base. Emitter. Collector. Emitter (Top View).±..±. TH Remark ( ) : Reference value (Bottom View) (.) R9DSEJ Jun, Rev.. Page of
13 Revision History NESGM Data Sheet Description Rev. Date Page Summary Sep Previous No. : PU89EJVDS. Jun, p. Modification of ORDERING IORMATION p. Modification of ELECTRICAL CHARACTERISTICS Modification of h FE CLASSIFICATION p. Modification of S-PARAMETERS p. Modification of PACKAGE DIMENSIONS All trademarks and registered trademarks are the property of their respective owners. C -
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