Compact SMD type high output LED

Transcription

1 Compact SMD type high output LED The is a small-size LED available in a surface mount COB package. Its size is drastically reduced compared to the previous premolded type. Features Applications High output Compact, surface mount type package ( t mm) High reliability Low cost Supports lead-free reflow soldering Optical switches Absolute maximum ratings (Ta=25 C unless otherwise noted) Parameter Symbol Condition Rating Unit Reverse voltage VR max 5 V Forward current IF max 8 ma Forward current decrease rate IF Ta > 25 C.7 ma/ C Pulse forward current IFP max Pulse width= μs Duty ratio=%.5 A Pulse forward current decrease rate IFP Ta > 25 C 4.6 ma/ C Power dissipation Pd max 5 mw Operating temperature Topr No dew condensation* -3 to +9 C Storage temperature Tstg No dew condensation* -4 to +5 C Reflow soldering conditions - JEDEC level 2a Peak temperature 25 C, twice - *: When there is a temperature difference between a product and the surrounding area in high humidity environment, dew condensation may occur on the product surface. Dew condensation on the product may cause deterioration in characteristics and reliability. Note: Exceeding the absolute maximum ratings even momentarily may cause a drop in product quality. Always be sure to use the product within the absolute maximum ratings. Electrical and optical characteristics (Ta=25 C) Parameter Symbol Condition Min. Typ. Max. Unit Peak emission wavelength λp IF=5 ma nm Spectral half width λ IF=5 ma nm Radiant flux ϕe IF=5 ma mw Forward voltage VF IF=5 ma V Reverse current IR VR=5 V µa Cutoff frequency* 2 fc IF=5 ma ± map-p MHz *2: Frequency at which the optical output drops by 3 db relative to the output at khz

2 Emission spectrum (Typ. Ta=25 C, IF=5 ma) Radiant flux vs. pulse forward current (Typ. Ta=25 C, tw= µs, %) 8 Relative light output (%) Radiant flux (mw) Wavelength (nm) KLEDB357EA Pulse forward current (ma) KLEDB483EA Pulse forward current vs. pulse forward voltage (Typ. Ta=25 C, tw= µs, %) Pulse forward current (ma) Pulse forward voltage (V) KLEDB484EA 2

3 Directivity (Typ. Ta=25 C) Relative light output (%) KLEDB46EB Light output vs. ambient temperature 3 (Typ. IF=5 ma) Allowable forward current vs. ambient temperature 2 2 Relative light output (db) Relative forward current (%) Ambient temperature ( C) Ambient temperature ( C) KLEDB485EA KLEDB362EA 3

4 Allowable forward current vs. duty ratio Recommended soldering reflow conditions (Typ. Ta=25 C) Pulse width= μs 3 Peak temperature: 25 C max. Pulse width= μs 25 Allowable forward current (ma) Pulse width= μs Temperature ( C) Duty ratio (%) KLEDB486EA Time (s) After unpacking, store the device in an environment with temperature ranging from 5 to 3 C and humidity no more than 6%, and perform reflow soldering within 72 hours. The thermal stress applied to the device during reflow soldering varies depending on the circuit board and the reflow oven in use. When setting reflow conditions, make sure that the reliability of the device is not compromised due to the reflow soldering process. KLEDB37EA 4

5 Dimensional outline (unit: mm) Recommended land pattern (.) Resin Emitter ± Cathode.5.5 Anode Electrode Position accuracy with respect to package center -.25 X Y +.5 Tolerance unless otherwise noted: ±. Standard packing type: Reel (2 pcs/roll) KLEDA6EA Related information Precautions Disclaimer Surface mount type products Technical information LED Information described in this material is current as of January 28. Product specifications are subject to change without prior notice due to improvements or other reasons. This document has been carefully prepared and the information contained is believed to be accurate. In rare cases, however, there may be inaccuracies such as text errors. Before using these products, always contact us for the delivery specification sheet to check the latest specifications. The product warranty is valid for one year after delivery and is limited to product repair or replacement for defects discovered and reported to us within that one year period. However, even if within the warranty period we accept absolutely no liability for any loss caused by natural disasters or improper product use. Copying or reprinting the contents described in this material in whole or in part is prohibited without our prior permission. HAMAMATSU PHOTONICS K.K., Solid State Division 26- Ichino-cho, Higashi-ku, Hamamatsu City, Japan, Telephone: (8) , Fax: (8) U.S.A.: Hamamatsu Corporation: 36 Foothill Road, Bridgewater, N.J. 887, U.S.A., Telephone: () , Fax: () , usa@hamamatsu.com Germany: Hamamatsu Photonics Deutschland GmbH: Arzbergerstr., D-822 Herrsching am Ammersee, Germany, Telephone: (49) , Fax: (49) , info@hamamatsu.de France: Hamamatsu Photonics France S.A.R.L.: 9, Rue du Saule Trapu, Parc du Moulin de Massy, 9882 Massy Cedex, France, Telephone: 33-() , Fax: 33-() , infos@hamamatsu.fr United Kingdom: Hamamatsu Photonics UK Limited: 2 Howard Court, Tewin Road, Welwyn Garden City, Hertfordshire AL7 BW, United Kingdom, Telephone: (44) , Fax: (44) , info@hamamatsu.co.uk North Europe: Hamamatsu Photonics Norden AB: Torshamnsgatan Kista, Sweden, Telephone: (46)8-59 3, Fax: (46)8-59 3, info@hamamatsu.se Italy: Hamamatsu Photonics Italia S.r.l.: Strada della Moia, int. 6, 22 Arese (Milano), Italy, Telephone: (39) , Fax: (39) , info@hamamatsu.it China: Hamamatsu Photonics (China) Co., Ltd.: B2, Jiaming Center, No.27 Dongsanhuan Beilu, Chaoyang District, Beijing 2, China, Telephone: (86) , Fax: (86) , hpc@hamamatsu.com.cn Taiwan: Hamamatsu Photonics Taiwan Co., Ltd.: 8F-3, No. 58, Section2, Gongdao 5th Road, East District, Hsinchu, 3, Taiwan R.O.C. Telephone: (886) , Fax: (886) , info@hamamatsu.com.tw Cat. No. KLED76E Jan. 28 DN 5