FEATURES PACKAGE TYPICAL PERFORMANCE DESCRIPTION ORDERING INFORMATION
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1 FEATURES PACKAGE High Power Gain Excellent Ruggedness 50V Supply Voltage Operation from 24v- 50v high Power Gain Extremely Rugged Internal Input and Output Matching Pb-free and RoHS Compliant TYPICAL PERFORMANCE DESCRIPTION ORDERING INFORMATION REV. B
2 ABSOLUTE MAXIMUM RATING (IEC 134) Symbol Parameter Value Unit VDSS Drain-Source Voltage 95 V V GSS Gate-Source Voltage -10, 10 V I DS(max) Drain Current 20 A P D1 Power Dissipation 875 W P in Input Power 7.5 W T S Storage Temperature -40 to +150 C TJ Junction Temperature 200 C THERMAL/RUGGEDNESS PERFORMANCE Symbol Parameter Max Unit 0JC 2 Thermal Resistance 0.20 C/W Symbol Parameter Test Condition Max Units LMT 2 Load Mismatch Tolerance F = 1090 MHz 20:1 VSWR ELECTRICAL CHARACTERISTICS Symbol Parameter Conditions Min Typical Max Unit VBR(DSS) Drain-Source Breakdown VGS=0V,ID=5mA V IDSS Drain Leakage Current VGS=0V,VDS=50V A IGSS Gate Leakage Current VGS=5V,VDS=0V A GP 2 Power Gain F=1090MHz db IRL 2 Input Return Loss F=1090MHz db D 2 F=1090MHz % VGS(Q) 3 Gate Quiescent Voltage VDD=50V,IDQ=100mA V VTH Threshold Voltage VDD=5V, ID=300 A V NOTES: PULSE CHARACTERISTICS Symbol Parameter Conditions Min Typical Max Unit t r 4 Rise Time F=1090MHz - <35 50 ns t f 4 Fall Time F=1090MHz - <15 50 ns PD 4 Pulse Droop F=1090MHz db 1) Rated at TCASE = 25 C 2) All parameters measured under pulsed conditions at 275W output power measured at the 10% point of the pulse with pulse width = 50µsec, duty cycle = 5% and VDD = 50V, IDQ = 100mA in a broadband matched test xture. 3) Amount of gate voltage required to attain nominal quiescent current. 4) Guaranteed by design
3 HVV HIGH VOLTAGE, HIGH RUGGEDNESS
4
5
6 - Z o = 10 * Z IN 1030MHz * Z OUT 1030MHz Test Circuit Impedances Frequency Zin* (ohms) Zout* (ohms) 1030MHz 2.01-j j MHz 1.99-j j MHz 2.0-j j3.46 Zin* Zout* Input Impedance Matching Network Output Impedance Matching Network
7 "#$ %&'()*(+%&,%*)-./(0+&# Demonstration Board Outline Demonstration Circuit Board Picture Part Description C1, C2: C3,C4: C5: C6,C9: C7,C8: C10: C11: C12: C13, C14: C15, C16: C17, C18: C19: C20, C21: R1: R2: RF Connectors DC Drain Conn DC Ground Conn. DC Gate Conn. PCB Board Device Clamp Heat Sink S.S. Screws (4) Alloy Screws (4) Metal Washer (6) Alloy Screws (2) 100 pf 100B Chip Capacitor 100B101JP500X 3.9 pf 100B Chip Capacitor 100B3R9JP500X 5.6 pf 100B Chip Capacitor 100B5R6JP500X 4.7 pf 100B Chip Capacitor 100B4R7JP500X 2.0 pf 100B Chip Capacitor 100B2R0JP500X 2.4 pf 100B Chip Capacitor 100B2R4JP500X 15 pf 100B Chip Capacitor 100B150JP500X 100B270JP500X 27 pf 100B Chip Capacitor 47 pf 100B Chip Capacitor 100B470JP500X 10K pf 100V Chip Capacitor (X7R 1206) C1206C103K1RACTU 1K pf 100V Chip Capacitor (X7R 1206) C1206C102K1RACTU 10 uf 63V Elect FK SMD PCE3479CT-ND 100 uf 63V Elect FK SMD PCE3483CT-ND 10 Ohms Chip Resistor (1206) ERJ8GEYJ100V ERJ8GEYJ102V 1.0 K Ohms Chip Resistor (1206) Type "N" RF connectors 5919CC-TB-7 Connector Jack Banana Nylon Red J151-ND Connector Jack Banana Nylon Black J152-ND Connector Jack Banana Nylon Green J153-ND PCB: Arlon, 30 mils thick, 2.55 Dielectric, 2 oz Copper Kemet Kemet Digi Key Digi Key Panasonic Panasonic Coaxicom DIGI-KEY DIGI-KEY DIGI-KEY Cool Innovation Nylon Clamp Foot Cool Innovations Aluminum Heat Sink FXT Cool Innovation RS3394 Cool Innovation 4-40 X 1/4 Stainless Steel Socket Hex Head Part Number P X 1/2 Alloy Socket Cap screw Hex He SCAS C #4 Washer Zinc PLTD Steel Lock ZSLW-004-M 4-40 X 3/4 Alloy Socket Cap Screw Head SCAS M Manufacturer DS Electronics Copper State Bolt Small Parts Inc Small Parts Inc Small Parts Inc
8 PACKAGE DIMENSIONS DRAIN ASI PART NUMBER JDATE CODE GATE SOURCE inches mm Note: Drawing is not actual size. ASI Semiconductor, Inc. (ASI) reserves the right to make changes to information published in this document at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Information in this document is believed to be accurate and reliable. However, ASI does not give any representations or warranties, either express or implied, as to the accuracy or completeness of such information and shall have no liability no liability for conse- -quences resulting from the use of such information. No license, either expressed or implied, is conveyed under any ASI intellectual property rights, including any patent rights.
High voltage vertical technology is well suited for high power pulsed applications in the L-Band including IFF, TCAS and Mode-S applications.
H FEATURES GE PACKAGE Silicon MOSFET Technology Operation from 24V to 50V High Power Gain Extreme Ruggedness Internal Input and Output Matching Excellent Thermal Stability All Gold Bonding Scheme Pb-free
MQ1271VP LDMOS TRANSISTOR
700W, 50V High Power RF LDMOS FETs Description The MQ1271VP is a 700-watt, high performance, internally matched LDMOS FET, designed for multiple applications with frequencies 960 to 1215MHz. It is featured
MQ1470VP LDMOS TRANSISTOR
750W, 50V High Power RF LDMOS FETs Description The MQ1470VP is a 750-watt, high performance, internally matched LDMOS FET, designed for L band pulse application with frequencies 1.2 to 1.4GHz full band
Innogration (Suzhou) Co., Ltd.
7MHz-27MHz, W, 28V RF Power LDMOS FETs Description The ITCH225E2 is a -watt, internally matched LDMOS FET, designed for cellular base station and ISM applications with frequencies from 7MHz to 27 MHz ITCH225E2
Innogration (Suzhou) Co., Ltd.
3400-3600MHz, 40W, 28V RF LDMOS FETs Description The is a 40-watt, internally-matched LDMOS FETs, designed for cellular application with frequencies from 3400 to 3600MHz. It can biased at class AB or Class
Innogration (Suzhou) Co., Ltd.
2400-2500MHz, 350W, High Power RF LDMOS FETs Description The ITCH25350D4 is a 350-watt, internally matched LDMOS FETs, designed for Multiple use especially RF Energy application including cooking, heating
MHz. The package options are ceramic/metal flange and pill package. Package Type: , PN: CGHV14250F, CGHV14250P
CGHV1425 25 W, 12-14 MHz, GaN HEMT for L-Band Radar Systems Cree s CGHV1425 is a gallium nitride (GaN) high electron mobility transistor (HEMT) designed specifically with high efficiency, high gain and
MQ1270VP LDMOS TRANSISTOR
700W, 50V High Power RF LDMOS FETs Description The MQ1270VP is a 700-watt, high performance, internally matched LDMOS FET, designed for avionics applications with frequencies 960 to 1215MHz. It is featured
MHz. The package options are ceramic/metal flange and pill package. Package Type: , PN: CGHV14250F, CGHV14250P
CGHV1425 25 W, 12-14 MHz, GaN HEMT for L-Band Radar Systems Cree s CGHV1425 is a gallium nitride (GaN) high electron mobility transistor (HEMT) designed specifically with high efficiency, high gain and
Innogration (Suzhou) Co., Ltd.
3400-3600MHz, 75W, 28V RF LDMOS FETs Description The ITCH36075B2 is a 75-watt, internally-matched LDMOS FETs, designed for cellular application with frequencies from 3400 to 3600MHz. It can biased at class
PRELIMINARY. Parameter 500 MHz 1.0 GHz 1.5 GHz 2.0 GHz 2.5 GHz Units. Small Signal Gain db
CGH49PP 9 W, RF Power GaN HEMT PRELIMINARY Cree s CGH49PP is an unmatched, gallium nitride (GaN) high electron mobility transistor (HEMT). The CGH49PP, operating from a 28 volt rail, offers a general purpose,
Watts W/ C Storage Temperature Range Tstg 65 to +150 C Operating Junction Temperature TJ 200 C
SEMICONDUCTOR TECHNICAL DATA Order this document by MRF184/D The RF MOSFET Line N Channel Enhancement Mode Lateral MOSFETs Designed for broadband commercial and industrial applications at frequencies to
DC35GN-15-Q4 15 Watts 50 Volts Pulsed & CW GaN on SiC Wideband Transistor QFN 4x4 mm
GENERAL DESCRIPTION The DC35GN-15-Q4 is a COMMON SOURCE, class -AB, GaN on SiC HEMT transistor capable of broadband pulsed and CW RF power applications. This transistor utilizes gold metallization, air-cavity
350 W, MHz, 50-Ohm Input/Output Matched, GaN HEMT for C-Band Radar Systems. = 25 C) of Demonstration Amplifier
CGHV5935 35 W, 52-59 MHz, 5-Ohm Input/Output Matched, GaN HEMT for C-Band Radar Systems Cree s CGHV5935 is a gallium nitride (GaN) high electron mobility transistor (HEMT) designed specifically with high
Innogration (Suzhou) Co., Ltd.
Gallium Nitride 28V 50W, RF Power Transistor Description The GTAH58050GX is a 50W internally matched, GaN HEMT, designed from 5 to 6GHz, especially point-to-point communication, broadband wireless access,
Watts W/ C Storage Temperature Range Tstg 65 to +200 C Operating Junction Temperature TJ 200 C. Test Conditions
SEMICONDUCTOR TECHNICAL DATA The RF Sub Micron MOSFET Line N Channel Enhancement Mode Lateral MOSFETs Designed for broadband commercial and industrial applications at frequencies in the 865 895 MHz band.
Preliminary GTVA126001EC/FC
g126001efc-gr1 Thermally-Enhanced High Power RF an on SiC HEMT 600 W, 50 V, 10 1400 MHz Description The TVA126001EC and TVA126001FC are 600-watt an on SiC high electron mobility transistors (HEMT) for
MR2003C LDMOS TRANSISTOR
18W, 12.5V High Power RF LDMOS FETs Description The MR2003C is a 18-watt, Push-Pull configuration, unmatched LDMOS FETs, designed for ISM and Mobile radio applications with frequencies under 2GHz. It can
PRELIMINARY. Cree s CGHV59070 is an internally matched gallium nitride (GaN) high electron mobility transistor
PRELIMINARY CGHV597 7 W, 4.4-5.9 GHz, 5 V, RF Power GaN HEMT Cree s CGHV597 is an internally matched gallium nitride (GaN) high electron mobility transistor (HEMT). The CGHV597, operating from a 5 volt
CGH55030F2 / CGH55030P2
Rev 3.2 April 2012 CGH55030F2 / CGH55030P2 25 W, C-band, Unmatched, GaN HEMT Cree s CGH55030F2/CGH55030P2 is a gallium nitride (GaN) high electron mobility transistor (HEMT) designed specifically for high
MR2006C LDMOS TRANSISTOR
24W, 12.5V High Power RF LDMOS FETs Description The MR2006C is a 24-watt, Push-Pull configuration, unmatched LDMOS FETs, designed for ISM and Mobile radio applications with frequencies under 2GHz. It can
GTVA123501FA. Thermally-Enhanced High Power RF GaN on SiC HEMT 350 W, 50 V, MHz. Description. Features. RF Characteristics
g123501fa_gr300-1 Thermally-Enhanced High Power RF GaN on SiC HEMT 350 W, 50 V, 10 1400 MHz Description The is a 350-watt GaN on SiC high electron mobility transistor (HEMT) for use in the 10 to 1400 MHz
CGH40120P. 120 W, RF Power GaN HEMT FEATURES APPLICATIONS
Rev 3.1 - November 2017 CGH40120P 120 W, RF Power GaN HEMT Cree s CGH40120P is an unmatched, gallium nitride (GaN) high electron mobility transistor (HEMT). The CGH40120P, operating from a 28 volt rail,
Rating Symbol Value Unit Drain Source Voltage VDSS 65 Vdc Gate Source Voltage VGS ±20 Vdc Total Device TC = 25 C Derate above 25 C
SEMICONDUCTOR TECHNICAL DATA Order this document from WISD RF Marketing The RF Sub Micron MOSFET Line N Channel Enhancement Mode Lateral MOSFETs Designed for PCN and PCS base station applications at frequencies
BLF6G10LS-135R. 1. Product profile. Power LDMOS transistor. 1.1 General description. 1.2 Features
Rev. 01 17 November 2008 Product data sheet 1. Product profile 1.1 General description 135 W LDMOS power transistor for base station applications at frequencies from 800 MHz to 1000 MHz. Table 1. Typical
CGH40006P. 6 W, RF Power GaN HEMT APPLICATIONS FEATURES
Rev 3. May 15 CGHP W, RF Power GaN HEMT Cree s CGHP is an unmatched, gallium nitride (GaN) high electron mobility transistor (HEMT). The CGHP, operating from a volt rail, offers a general purpose, broadband
BLF6G10LS Product profile. Power LDMOS transistor. 1.1 General description. 1.2 Features
Rev. 1 18 January 8 Preliminary data sheet 1. Product profile 1.1 General description W LDMOS power transistor for base station applications at frequencies from 8 MHz to 1 MHz. Table 1. Typical performance
BLF6G10-135RN; BLF6G10LS-135RN
BLF6G0-5RN; BLF6G0LS-5RN Rev. 0 January 00 Product data sheet. Product profile. General description 5 W LDMOS power transistor for base station applications at frequencies from 700 MHz to 000 MHz. Table.
PTFC270051M. High Power RF LDMOS Field Effect Transistor 5 W, 28 V, MHz. Description. Features. RF Characteristics, 2170 MHz
c271m-gr1.3 High Power RF LDMOS Field Effect Transistor W, 28 V, 9 27 MHz Description The is an unmatched -watt LDMOS FET suitable for power amplifier applications with frequencies from 9 MHz to 27 MHz.
BLL6G1214L Product profile. LDMOS L-band radar power transistor. 1.1 General description. 1.2 Features and benefits. 1.
BLL6G1214L-25 Rev. 1 16 February 212 Preliminary data sheet 1. Product profile 1.1 General description 25 W LDMOS power transistor intended for L-band radar applications in the 1.2 GHz to 1.4 GHz range.
CGH55015F2 / CGH55015P2
Rev 4.0 May 2015 CGH55015F2 / CGH55015P2 10 W, C-band, Unmatched, GaN HEMT Cree s CGH55015F2/CGH55015P2 is a gallium nitride (GaN) high electron mobility transistor (HEMT) designed specifically for high
Efficiency (%) 1215 MHz 15. Characteristic Symbol Min Typ Max Unit
Thermally-Enhanced High Power RF LDMOS FET 0 W, 50 V, 960 1215 MHz Description The PTVA1001EH LDMOS FET is designed for use in power amplifier applications in the 960 to 1215 MHz frequency band. Features
Drain Efficiency (%) 1300 MHz 1400 MHz 15. Characteristic Symbol Min Typ Max Unit
Thermally-Enhanced High Power RF LDMOS FET 700 W, 50 V, 1200 Description The PTVA127002EV LDMOS FET is designed for use in power amplifier applications in the 1200 to frequency band. Features include high
CG2H W, DC - 6 GHz, RF Power GaN HEMT APPLICATIONS FEATURES
Rev 0.0 May 2017 CG2H40010 10 W, DC - 6 GHz, RF Power GaN HEMT Cree s CG2H40010 is an unmatched, gallium nitride (GaN) high electron mobility transistor (HEMT). The CG2H40010, operating from a 28 volt
Өjc Thermal Resistance Pulse Width=128uS, Duty=10% 0.2 C/W Bias Condition: Vdd=+65V, Idq=1000mA peak current (Vgs= -2.0 ~ -4.
Preliminary 0912GN-600 GENERAL DESCRIPTION The 0912GN-600 is an internally matched, COMMON SOURCE, class AB, GaN on SiC HEMT transistor capable of providing over 18dB gain, 600 Watts of pulsed RF output
BLA6H LDMOS avionics radar power transistor
Rev. 4 1 May 21 Product data sheet 1. Product profile 1.1 General description 5 W LDMOS power transistor intended for avionics transmitter applications in the 96 MHz to 1215 MHz range such as Mode-S, TCAS,
= 25 C) Parameter 6.0 GHz 7.5 GHz 9.0 GHz 10.5 GHz 12.0 GHz Units Small Signal Gain db P OUT
CMPA601C025F 25 W, 6.0-12.0 GHz, GaN MMIC, Power Amplifier The CMPA601C025F is a gallium nitride (GaN) High Electron Mobility Transistor (HEMT) based monolithic microwave integrated circuit (MMIC) on a
RF Power LDMOS Transistors N--Channel Enhancement--Mode Lateral MOSFETs
Freescale Semiconductor Technical Data RF Power LDMOS Transistors N--Channel Enhancement--Mode Lateral MOSFETs These high ruggedness devices are designed for use in high VSWR military, aerospace and defense,
Part Number: ILD1011M160HV
Avionics Band RF Power LDMOS FET The high power transistor part number ILD1011M160HV is designed for Avionics systems operating at 1030-1090 MHz. Operating at 50µs, 2% pulse conditions this LDMOS FET device
Features. Description. Table 1: Device summary Order code Marking Package Packing SD2942W SD2942 (1) M244 Tube
HF/VHF/UHF RF power N-channel MOSFET Datasheet - production data Features Gold metallization Excellent thermal stability Common source push-pull configuration POUT = 350 W min. with 15 db gain @ 175 MHz
Symbol Parameter VRF161(MP) Unit V DSS Drain-Source Voltage 170 V I D Continuous Drain T C
V161(MP) 5V, 2W, 15MHz POWER VERTICAL MOSFET The V161 is a gold-metallized silicon n-channel power transistor designed for broadband commercial and military applications requiring high power and gain without
NME6003H GaN TRANSISTOR
Gallium Nitride 28V 25W, RF Power Transistor Description The NME6003H is a 25W, unmatched GaN HEMT, designed for multiple applications with frequencies up to 6GHz. NME6003H There is no guarantee of performance
CMPA F. 25 W, GHz, GaN MMIC, Power Amplifier. Typical Performance Over GHz (T C. Applications. Features
CMPA558525F 25 W, 5.5-8.5 GHz, GaN MMIC, Power Amplifier Cree s CMPA558525F is a gallium nitride (GaN) High Electron Mobility Transistor (HEMT) based monolithic microwave integrated circuit (MMIC). GaN
1011GN-1600VG 1600 Watts 50/52 Volts 32us, 2% L-Band Avionics 1030/1090 MHz
GENERAL DESCRIPTION The 1030/1090MHz, 50V or 52V 1011GN-1600VG is an internally matched, common source, class AB, GaN on SiC HEMT transistor capable of providing greater than 1600 Watts of pulsed output
Drain Efficiency (%) c262157sh-gr1. Characteristic Symbol Min Typ Max Unit. Gain Gps db. Adjacent Channel Power Ratio ACPR 31.
c2657sh-gr1 Thermally-Enhanced High Power RF LDMOS FET W, 28 V, 26 269 MHz Description The LDMOS FET is designed for use in Doherty cellular power applications in the 26 MHz to 269 MHz frequency band.
DISCRETE SEMICONDUCTORS DATA SHEET M3D438. BLF1043 UHF power LDMOS transistor. Product specification Supersedes data of 2002 November 11.
DISCRETE SEMICONDUCTORS DATA SHEET M3D438 Supersedes data of 2002 November 11 2003 Mar 13 FEATURES Typical 2-tone performance at a supply voltage of 26 V and I DQ of 85 ma Output power = 10 W (PEP) Gain
Drain Efficiency (%) 10 a120501ea_g1-1. Characteristic Symbol Min Typ Max Unit. Return Loss IRL 10 7 db
PTVA1201EA Thermally-Enhanced High Power RF LDMOS FET W, V, 1200 10 MHz Description The PTVA1201EA LDMOS FET is designed for use in power amplifier applications in the 1200 to 10 MHz frequency band. Features
transistor is available in a flange and pill package. Package Types: & PN s: CGH40045F & CGH40045P
Rev 4.0 - May 2015 CGH40045 45 W, DC - 4 GHz RF Power GaN HEMT Cree s CGH40045 is an unmatched, gallium nitride (GaN) high electron mobility transistor (HEMT). The CGH40045, operating from a 28 volt rail,
AGR09085E 85 W, 865 MHz 895 MHz, N-Channel E-Mode, Lateral MOSFET
Introduction The AGR09085E is a high-voltage, laterally diffused metal oxide semiconductor (LDMOS) RF power transistor suitable for cellular band, code division multiple access (CDMA), global system for
Features. Description. Table 1: Device summary Order code Marking Package Packing SD2932W SD2932 (1) M244 Tube
HF/VHF/UHF RF power N-channel MOSFET Datasheet - production data Features Gold metallization Excellent thermal stability Common source push-pull configuration POUT = 300 W min. with 15 db gain @ 175 MHz
RF Power LDMOS Transistors High Ruggedness N--Channel Enhancement--Mode Lateral MOSFETs
Freescale Semiconductor Technical Data RF Power LDMOS Transistors High Ruggedness N--Channel Enhancement--Mode Lateral MOSFETs These 1300 W RF power transistors are designed for applications operating
RF Power Field Effect Transistors N--Channel Enhancement--Mode Lateral MOSFETs
Technical Data RF Power Field Effect Transistors N--Channel Enhancement--Mode Lateral MOSFETs RF power transistors designed for CW and pulse applications operating at 1300 MHz. These devices are suitable
SD MR. 150 W 50 V moisture resistant HF/VHF DMOS transistor. Datasheet. Features. Description
Datasheet 15 W 5 V moisture resistant HF/VHF DMOS transistor M174MR epoxy sealed 4 1. Drain 2. Source 3. Gate 4. Source 3 1 2 Features Gold metallization Excellent thermal stability Common source push-pull
NPT2018. Preliminary Information W GaN Wideband Transistor DC GHz. Preliminary - Rev. V4P. Features. Functional Schematic.
Features GaN on Si HEMT D-Mode Transistor Suitable for Linear and Saturated Applications Tunable From 48 V Operation 16 db Gain @ 2.5 GHz 56 % Drain Efficiency @ 2.5 GHz 100 % RF Tested Lead-Free 3x6 mm
PD Storage Temperature Range Tstg 65 to +200 C Operating Junction Temperature TJ 200 C
SEMICONDUCTOR TECHNICAL DATA Order this document by MRF187/D Product Is Not Recommended for New Design. The next generation of higher performance products are in development. Visit our online Selector
Features. Description. Table 1: Device summary Order code Marking Package Packing STD20NF06LAG D20N6LF6 DPAK Tape and Reel
Automotive-grade N-channel 60 V, 32 mω typ., 24 A STripFET II Power MOSFET in a DPAK package Datasheet - production data Features Order code VDS RDS(on) max. ID PTOT STD20NF06LAG 60 V 40 mω 24 A 60 W AEC-Q101
Symbol Parameter VRF152(MP) Unit V DSS Drain-Source Voltage 130 V I D Continuous Drain T C
VRF52 VRF52MP 5V, 5W, 75MHz RF POWER VERTICAL MOSFET The VRF52 is a gold-metallized silicon n-channel RF power transistor designed for broadband commercial and military applications requiring high power
Symbol Parameter VRF148A(MP) Unit V DSS Drain-Source Voltage 170 V I D Continuous Drain T C
VRF48A VRF48AMP 5V, 3W, 75MHz RF POWER VERTICAL MOSFET The VRF48A is a gold-metallized silicon n-channel RF power transistor designed for broadband commercial and military applications requiring high power
RF Power GaN Transistor
Technical Data Document Number: A2G22S190--01S Rev. 0, 09/2018 RF Power GaN Transistor This 36 W RF power GaN transistor is designed for cellular base station applications covering the frequency range
transistor is available in a flange and pill package. Package Types: & PN s: CG2H40045F & CG2H40045P
Rev 0.0 - May 2017 CG2H40045 45 W, DC - 4 GHz RF Power GaN HEMT Cree s CG2H40045 is an unmatched, gallium nitride (GaN) high electron mobility transistor (HEMT). The CG2H40045, operating from a 28 volt
MAGX MAGX S
Features GaN on SiC Depletion Mode Transistor Common-Source Configuration Broadband Class AB Operation Thermally Enhanced Package (Flanged: Cu/W, Flangeless: Cu) RoHS* Compliant +50V Typical Operation
Drain Efficiency (%) b092707fh-gr1a. Characteristic Symbol Min Typ Max Unit
b9277fh-gr1a PTFB9277FH Thermally-Enhanced High Power RF LDMOS FET 27 W, 28 V, 925 96 MHz Description The PTFB9277FH is a 27-watt LDMOS FET intended for use in multi-standard cellular power amplifier applications
Efficiency (%) c261402fc_gr1. Adjacent Channel Power Ratio ACPR dbc All published data at T CASE = 25 C unless otherwise indicated
c26142fc_gr1 Thermally-Enhanced High Power RF LDMOS FET 14 W, 28 V, 26 269 MHz Description The is a 14-watt LDMOS FET intended for use in multi-standard cellular power amplifi er applications in the 26
STAC LDMOS avionics radar transistor. Features. Description
LDMOS avionics radar transistor Features Datasheet - production data Excellent thermal stability Common source configuration push-pull P OUT = 250 W with 16 db gain over 960-1215 MHz ST Air Cavity / STAC
Efficiency (%) g261701fa-gr1a. Characteristic Symbol Min Typ Max Unit. Adjacent Channel Power Ratio ACPR dbc
g26171fa-gr1a GTVA26171FA Thermally-Enhanced High Power RF GaN on SiC HEMT 17 W, 5 V, 26 269 MHz Description The GTVA26171FA is a 17-watt (P 3dB ) GaN on SiC high electron mobility transistor (HEMT) for
NPT2018. Preliminary Information W GaN Wideband Transistor DC GHz. Preliminary - Rev. V6P. Features. Functional Schematic.
Features GaN on Si HEMT D-Mode Transistor Suitable for Linear and Saturated Applications Tunable from V Power Operation 16 db Gain @ 2.5 GHz 56% Drain Efficiency @ 2.5 GHz 100% RF Tested Lead-Free 3 x
CMPA F. 30 W, GHz, GaN MMIC, Power Amplifier. Typical Performance Over GHz (T C. Features. Applications
CMPA83F 3 W,. - 8. GHz, GaN MMIC, Power Amplifier Cree s CMPA83F is a gallium nitride (GaN) High Electron Mobility Transistor (HEMT) based monolithic microwave integrated circuit (MMIC). GaN has superior
SSG4501-C N & P-Ch Enhancement Mode Power MOSFET N-Ch: 7A, 30 V, R DS(ON) 28mΩ P-Ch: -5.3A, -30 V, R DS(ON) 50mΩ
RoHS Compliant Product A suffix of -C specifies halogen & lead-free DESCRIPTION The provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness.
Symbol Parameter VRF148A(MP) Unit V DSS Drain-Source Voltage 170 V I D Continuous Drain T C
VRF48A VRF48AMP 5V, 3W, 75MHz RF POWER VERTICAL MOSFET The VRF48A is a gold-metallized silicon n-channel RF power transistor designed for broadband commercial and military applications requiring high power
PTFB211503FL. Thermally-Enhanced High Power RF LDMOS FET 150 W, MHz. Description. Features. RF Characteristics
PTFB50FL Thermally-Enhanced High Power RF LDMOS FET 50 W, 0 70 MHz Description The PTFB50FL is a thermally-enhanced, 50-watt, LDMOS FET designed for cellular power amplifier applications in the 0 to 70
IS-95, 9 Ch Fwd, Offset=750KHz, ACPR Integrated Bandwidth, ACPR=-55dB
Product Description Sirenza Microdevices SLD-283CZ is a robust 12 Watt high performance LDMOS transistor designed for operation to 27MHz. It is an excellent solution for applications requiring high linearity
transistor is available in a flange and pill package. Package Types: & PN s: CG2H40045P & CG2H40045F
Rev 0.0 - May 2017 CG2H40045 45 W, DC - 4 GHz RF Power GaN HEMT Cree s CG2H40045 is an unmatched, gallium nitride (GaN) high electron mobility transistor (HEMT). The CG2H40045, operating from a 28 volt
15 W, 28V, GaN HEMT for Linear Communications ranging from VHF to 3 GHz = 25 C) Parameter 2.3 GHz 2.4 GHz 2.5 GHz 2.6 GHz 2.
CGH27015 15 W, 28V, GaN HEMT for Linear Communications ranging from VHF to 3 GHz Cree s CGH27015 is a gallium nitride (GaN) high electron mobility transistor designed specifically for high efficiency,
Features. Description. Table 1: Device summary Order code Marking Package Packing STL140N6F7 140N6F7 PowerFLAT 5x6 Tape and reel
N-channel 60 V, 2.4 mω typ., 140 A STripFET F7 Power MOSFET in a PowerFLAT 5x6 package Datasheet - production data Features Order code VDS RDS(on) max. ID PTOT STL140N6F7 60 V 2.8 mω 140 A 125 W Among
P-channel -30 V, 0.01 Ω typ., A, STripFET H6 Power MOSFET in an SO-8 package. Features. Description
P-channel -30 V, 0.01 Ω typ., -12.5 A, STripFET H6 Power MOSFET in an SO-8 package Datasheet - production data Features Order code VDS RDS(on) max ID STS10P3LLH6-30 V 0.012 Ω -12.5 A Very low on-resistance
RF Power GaN Transistor
Freescale Semiconductor Technical Data Document Number: A2G35S2--1S Rev., 5/216 RF Power GaN Transistor This 4 W RF power GaN transistor is designed for cellular base station applications requiring very
RF Power Field Effect Transistor LDMOS, MHz, 15W, 26V
RF Power Field Effect Transistor LDMOS, 8 17, 15W, 26V Features Designed for broadband commercial applications up to 1.7GHz High, High Efficiency and High Linearity Typical P1dB performance at 96, 26Vdc,
which offers high efficiency, high gain and wide bandwidth capabilities. The CGHV27030S GaN
Rev 4.1 May 2017 CGHV27030S 30 W, DC - 6.0 GHz, GaN HEMT The CGHV27030S is an unmatched, gallium nitride (GaN) high electron mobility transistor (HEMT) which offers high efficiency, high gain and wide
= 25 C) Note: Measured in CGHV96100F2-TB (838179) under 100 µs pulse width, 10% duty, Pin 42.0 dbm (16 W) Applications. Marine Radar.
CGHV96100F2 100 W, 8.4-9.6 GHz, 50-ohm, Input/Output Matched GaN HEMT Cree s CGHV96100F2 is a gallium nitride (GaN) High Electron Mobility Transistor (HEMT) on Silicon Carbide (SiC) substrates. This GaN
Efficiency (%) Characteristic Symbol Min Typ Max Unit. Adjacent Channel Power Ratio ACPR dbc. Output 0.01% CCDF OPAR 7 7.
Thermally-Enhanced High Power RF GaN on SiC HEMT W, 48 V, 34 36 MHz Description The is a -watt (P3dB) GaN on SiC high electron mobility transistor (HEMT) designed for use in multi-standard cellular power
INDEX MARK (Gate) Terminal No. For output stage of high power amplifiers in 1.Drain (output)
DESCRIPTION OUTLINE DRAWING is a MOS FET type transistor.+/-.5 specifically designed for VHF RF power 3.3+/-.5.+/-.15.+/-.5.+/-.5 amplifiers applications. FEATURES High Power Gain: Pout>11.5W, Gp>1dB@Vdd=7.V,f=175MHz
STB33N60DM2, STP33N60DM2, STW33N60DM2
STB33N60DM2, STP33N60DM2, STW33N60DM2 N-channel 600 V, 0.110 Ω typ., 24 A MDmesh DM2 Power MOSFET in D²PAK, TO-220 and TO-247 packages Datasheet - production data Features Order code VDS @ TJmax. RDS(on)
ra097008nb-gr1a. Characteristic Symbol Min Typ Max Unit. Adjacent Channel Power Ratio ACPR dbc. Output 0.01% CCDF OPAR
ra097008nb-gr1a Thermally-Enhanced High Power RF LDMOS FET 630 W, 48 V, 9 960 MHz Description The is a 630-watt LDMOS FET intended for use in multi-standard cellular power amplifier applications in the
PTFB213004F. High Power RF LDMOS Field Effect Transistor 300 W, MHz. Description. Features. RF Characteristics
High Power RF LDMOS Field Effect Transistor W, 7 MHz Description The is a -watt LDMOS FET designed for class AB operation in cellular amplifiers covering the to 7 MHz frequency band. Features include high
Efficiency (%) c241002fc-gr1. Characteristic Symbol Min Typ Max Unit. Adjacent Channel Power Ratio ACPR dbc
c2412fc-gr1 Thermally-Enhanced High Power RF LDMOS FET 1 W, 28 V, 23 24 MHz Description The is a 1-watt LDMOS FET with an asymmetric design, intended for use in multi-stantdard cellular power amplifi er
Efficiency (%) gtra364002fc_g1. Characteristic Symbol Min Typ Max Unit. Adjacent Channel Power Ratio ACPR dbc
Thermally-Enhanced High Power RF GaN on SiC HEMT 0 W, 48 V, 30 30 MHz Description The is a 0-watt (PSAT) GaN on SiC high electron mobility transistor (HEMT) designed for use in multi-standard cellular
CMPA801B W, GHz, GaN MMIC, Power Amplifier. Typical Performance Over GHz (T C. Features. Applications
CMPA801B025 25 W, 8.5-11.0 GHz, GaN MMIC, Power Amplifier Cree s CMPA801B025 is a gallium nitride (GaN) High Electron Mobility Transistor (HEMT) based monolithic microwave integrated circuit (MMIC). GaN
Characteristic Symbol Min Typ Max Unit. Intermodulation Distortion IMD 35 dbc All published data at T CASE = 25 C unless otherwise indicated
PTFB950FL Thermally-Enhanced High Power RF LDMOS FET 40 W, 90 990 MHz Description The PTFB950FL is a 40-watt LDMOS FET intended for use in multi-standard cellular power amplifier applications in the 90
RF Power LDMOS Transistors High Ruggedness N--Channel Enhancement--Mode Lateral MOSFETs
Freescale Semiconductor Technical Data RF Power LDMOS Transistors High Ruggedness N--Channel Enhancement--Mode Lateral MOSFETs RF power transistors suitable for both narrowband and broadband CW or pulse
CPH6354. Power MOSFET 60V, 100mΩ, 4A, Single P-Channel. Features. Specifications
CPH64 Power MOSFET 6V, 1mΩ, 4A, Single P-Channel Features ON-resistance RDS(on)1=mW(typ.) 4V Drive ESD Diode - Protected Gate Pb-Free, Halogen Free and RoHS Compliance Specifications Absolute Maximum Ratings
Symbol Parameter VRF141(MP) Unit V DSS Drain-Source Voltage 80 V I D Continuous Drain T C
VRF4 VRF4MP 28V, 5W, 75MHz RF POWER VERTICAL MOSFET The VRF4 is a gold-metallized silicon n-channel RF power transistor designed for broadband commercial and military applications requiring high power
40W Power Packaged Transistor. GaN HEMT on SiC
Gain (db), Pout (dbm) & PAE (%) Id (A) Description 40W Power Packaged Transistor The is an unmatched packaged Gallium Nitride High Electron Mobility Transistor. It offers general purpose and broadband
PTFC270101M. High Power RF LDMOS Field Effect Transistor 10 W, 28 V, MHz. Description. Features. RF Characteristics
c271m-2.1-gr1c High Power RF LDMOS Field Effect Transistor W, 28 V, 9 27 MHz Description The is an unmatched -watt LDMOS FET suitable for power amplifier applications with frequencies from 9 MHz to 27
PD Characteristic Symbol Max Unit Thermal Resistance, Junction to Case RθJC 0.8 C/W
SEMICONDUCTOR TECHNICAL DATA Order this document by MRF173/D The RF MOSFET Line N Channel Enhancement Mode MOSFETs Designed for broadband commercial and military applications up to 2 MHz frequency range.
not recommended for new design
c262808fv-gr1 Thermally-Enhanced High Power RF LDMOS FET 280 W, 28 V, 26 2690 MHz Description The is a 280-watt LDMOS FET intended for use in multi-standard cellular power amplifier applications in the
SLD-1083CZ 4 Watt Discrete LDMOS FET in Ceramic Package
Product Description Sirenza Microdevices SLD-183CZ is a robust 4 Watt high performance LDMOS transistor designed for operation from to 27MHz. It is an excellent solution for applications requiring high
maintaining high gain and efficiency. Package Type: 3x4 DFN PN: CGHV1F025S Parameter 8.9 GHz 9.2 GHz 9.4 GHz 9.6 GHz Units = 37 dbm W
Rev.1 July 017 CGHV1F05S 5 W, DC - 15 GHz, 40V, GaN HEMT Cree s CGHV1F05S is an unmatched, gallium nitride (GaN) high electron mobility transistor (HEMT) designed specifically for high efficiency, high
Automotive-grade N-channel 40 V, 1.3 mω typ., 120 A STripFET F7 Power MOSFET in a PowerFLAT 5x6 package. Features. Description
Automotive-grade N-channel 40 V, 1.3 mω typ., 120 A STripFET F7 Power MOSFET in a PowerFLAT 5x6 package Datasheet - production data Features Order code V DS RDS(on) max ID STL210N4F7AG 40 V 1.6 mω 120
25W Power Packaged Transistor. GaN HEMT on SiC
25W Power Packaged Transistor GaN HEMT on SiC Description The is an unmatched packaged Gallium Nitride High Electron Mobility Transistor. It offers general purpose and broadband solutions for a variety
QPD W, 32V, DC 12 GHz, GaN RF Transistor
General Description The Qorvo is a W (P3dB) discrete GaN on SiC HEMT which operates from DC to 12 GHz. This wideband device is a single stage unmatched power amplifier transistor in an over-molded plastic