PFC-DCM IC TDA4862/TDA4862G. Power-Factor Controller (PFC) IC for High Power Factor and Active Harmonic Filter. Power Management & Supply

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1 Datasheet, 2., Dec 23 PFC-DCM IC TDA4862/TDA4862G Power-Factor Controller (PFC) IC for High Power Factor and Active Harmonic Filter Power Management & Supply Never stop thinking.

2 TDA4862/TDA4862G Revision History: Datasheet Previous ersion: Page Subjects (major changes since last revision) For questions on technology, delivery and prices please contact the Infineon Technologies Offices in Germany or the Infineon Technologies Companies and Representatives worldwide: see our webpage at Edition Published by Infineon Technologies AG, St.-Martin-Strasse 53, D-854 München Infineon Technologies AG 999. All Rights Reserved. Attention please! The information herein is given to describe certain components and shall not be considered as warranted characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. Infineon Technologies is an approved CECC manufacturer. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office in Germany or our Infineon Technologies Representatives worldwide (see address list). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.

3 Power-Factor Controller (PFC) TDA 4862 IC for High Power Factor and Active Harmonic Filter Advanced Information Bipolar IC Features IC for sinusoidal line-current consumption Power factor approaching Controls boost converter as an active harmonics filter Internal start-up with low current consumption Zero current detector for discontinuous operation mode High current totem pole gate driver Trimmed ±.4% internal reference Undervoltage lock-out with hysteresis ery low start-up current consumption Pin compatible to world standard Fast overvoltage regulator Current sense input with internal low pass filter P-DIP-8- P-DSO-8- P-DSO-8- Type Ordering Code Package TDA 4862 Q67-A8368 P-DIP-8- TDA 4862 G Q676-A8369 P-DSO-8- =New type ersion 2. 3 Dec 23

4 Description The TDA 4862 is excellent convenient for designing a preconverter in ballasts and switched mode power supplies with sinusoidal line current consumption and a power factor approaching unity. The TDA 4862 controls a boost converter as an active harmonics filter in a discontinuous mode (free oscillating triangular shaped current mode). The TDA 4862 comprises an internal start-up timer, a high gain voltage amplifier, an one quadrant multiplier for approaching unity power factor, a zero current detector, PWM and logic circuitry, and totem pole MOSFET gate driver. Protective features are: input undervoltage lockout with hysteresis, CC zener clamp, cycle-by-cycle current limiting, output voltage limiting for fast and slow load changes up to open circuit, and a sinking gate driver current activated whenever undervoltage mode occurs. The output voltage of this preconverter is regulated with high accuracy. Therefore the device can be used for world-wide line voltages without switches. The TDA 4862 is the improved version of the TDA 487 with a pinout equivalent to world standard. TDA 4862 G TDA 4862 SENSE AOUT MULTIN Ι SENSE IEP748 CC GTDR 6 GND DETIN SENSE AOUT MULTIN Ι SENSE CC GTDR GND DETIN IEP749 Figure Pin Configuration (top view) ersion 2. 4 Dec 23

5 Pin Definitions and Functions Pin Symbol Function SENSE oltage Amplifier Inverting Input; SENSE is connected via a resistive divider to the boost converter output. With a capacitor connected to AOUT it forms an integrator. 2 AOUT oltage Amplifier Output; AOUT is connected internally to the first multiplier input. To prevent overshoot the input voltage will be clamped at 5. During no load conditions output pulses are suppressed completely when AOUT falls below 2.2. If the current flowing into this pin is exceeding an internal defined margin the multiplier output voltage is reduced to prevent the MOSFET from overvoltage damage. 3 MULTIN Multiplier Input; MULTIN is the second multiplier input and connected via a resistive divider to the rectifier output voltage. 4 I SENSE Current Sense Minus; I SENSE is connected to a sense resistor controlling the MOSFET source current. The input is internally clamped at.3 to prevent negative input voltage interaction. An internal low pass filter suppresses voltage spikes when turning the MOSFET on. 5 DETIN Zero Current Detector Input; DETIN is connected to an auxiliary winding monitoring the zero crossing of the inductor current. 6 GND Ground; All voltages are measured with respect to GND. CC should be bypassed directly to GND with a. µf or larger ceramic capacitor. 7 GTDR Gate Drive Output; GTDR is the output of a totem-pole circuitry for direct driving a MOSFET. A clamping network bypasses low state source current and high state sink current. 8 CC Positive Supply oltage; CC should be connected to a stable source slightly above the CC turn-on threshold for normal operation. A nf or lager ceramic capacitor connected to CC absorbs supply current spikes required to charge external MOSFET gate capacitances. ersion 2. 5 Dec 23

6 Functional Description Introduction Conventional electronic ballasts and switching power supplies are designed with a bridge rectifier and bulk capacitor. Their disadvantage is that the circuit draws power from the line when the instantaneous AC voltage exceeds the capacitor s voltage. This occurs near the line voltage peak and causes a high charge current spike with following characteristics: the apparent power is higher than the real power that means low power factor condition, the current spikes are non-sinusoidal with a high content of harmonics causing line noise, the rectified voltage depends on load condition and requires a large bulk capacitor, special efforts in noise suppression are necessary. With the TDA 4862 preconverter a sinusoidal current is achieved which varies in direct instantaneous proportion to the input voltage half sine wave and means a power factor near. This is due to the appearance of almost any complex load like a resistive one at the AC line. The harmonic distortions are reduced and comply with the IEC555 standard. Operating Description The TDA 4862 contains a wide bandwidth voltage amplifier used in a feedback loop, an overvoltage regulator, an one quadrant multiplier with a wide linear operating range, a current sense comparator, zero current detector, a PWM and logic circuitry, a totem-pole MOSFET driver, an internal trimmed voltage reference, a restart timer and an undervoltage lockout circuitry. These functional blocks are described below. oltage Amplifier The voltage amplifier is internally compensated and yields a gain bandwidth of.8 MHz and a phase margin of 8 degrees. The non-inverting input is biased at 2.5 and is not pinned out. The inverting input is sensing the output voltage via a resitive devider. The voltage amplifier output AOUT and the inverting input SENSE are connected in a simplest way via an external capacitor. It forms an integrator which monitors the average output voltage over several line cycles. Typically the bandwidth is set below 2 Hz. ln order to keep the output voltage constant the voltage amplifier output is connected to the multiplier input for regulation. Overvoltage Regulator Fast changes of the output voltage can t be regulated by the integrator formed with the voltage amplifier This occurs during initial start-up, sudden load removal, or output arcing and leads to a current peak at the voltage amplifier input while the voltage amplifier s differential input voltages remains zero. The peak current is flowing through the external capacitor into AOUT. Exceeding an internal defined margin causes a regulation circuitry to reduce the multiplier output voltage. ersion 2. 6 Dec 23

7 Functional Description (cont d) MuItiplier A one quadrant multiplier is the crucial circuitry that regulates the gate driver with respect of the DC output voltage and the AC haversine input voltage of the preregulator. Both inputs are designed for good linearity over a wide dynamic range, to 4. for the MULTIN and 2.5 to 4. for the AOUT. Current Sense Comparator and RS Latch The multiplier output voltage is compared with the current sense voltage which represents the current through the MOSFET. The current sense comparator in addition with the logic ensures that only a single pulse appears at the drive output during a given cycle. The multiplier output and the current sense threshold are internally clamped at.3. So the gate drive MOSFET is protected against critical operating, as they occur during start up. To prevent the input from negative pulses a special protection circuitry is implemented. Switch-on current peaks are reduced by an internal RC-Filter. Zero Current Detector The zero current detector senses the inductor current via an auxiliary winding and ensures that the next on-time is initiated immediately when the inductor current has reached zero. This diminishes the reverse recovery losses of the boost converter diode. Output switch conduction is terminated when the voltage drop of the shunt resistor reaches the threshold level of the multiplier output. So the boost current waveform has a triangular shape and there are no deadtime gaps between the cycles. This leads to a continuous AC line current limiting the peak current to twice of the average current. To prevent false tripping the zero current detector is designed as a Schmitt trigger with a hysteresis of.6. An internal 5 clamp protects the input from overvoltage breakdown, a.6 clamp prevents substrate injection. An external resistor must be used in series with the auxiliary winding to limit the current through the clamps. Timer A restart timer function was added to the IC to eliminate the need for an oscillator when used in stand-alone applications. The timer starts or restarts the TDA 4862 if the drive output has been off for more than 5 µs after the inductor current reaches zero. ersion 2. 7 Dec 23

8 Functional Description (cont d) Undervoltage Lockout An undervoltage lockout circuitry enables the output stage when CC reaches the upper threshold CC and terminates the output stage when CC is falling below the lower threshold CCL. In the standby mode the supply current is typically 75 µa. An internal clamp has been added from CC to ground to protect the IC from an overvoltage condition. The external circuitry is created with a start-up resistor connected from CC to the input supply voltage and a storage capacitor from CC to ground. Bootstrap power supply is created with the previous mentioned auxiliary winding and a diode. Output The TDA 4862 totem pole output stage is MOSFET compatible. An internal protection circuitry is activated when CC is within the stand by mode and ensures that the MOSFET is turned-off. The totem pole output has been optimized to minimize cross conduction current during high speed operation. The addition of two 4 Ω resistors, one in series with the source output transistor and one in series with the sink output transistor, reduces the cross conduction current. ersion 2. 8 Dec 23

9 SENSE AOUT MULTIN Ι SENSE DETIN REF oltage Amplifier + Clamp Filter Clamp k Ω /.9 Over- oltage Regulation Multiplier pf Detector CC Undervoltage Lockout / 8.5 Clamp.3 Current Comp + TDA 4862; G Reference oltage Driver and Logic CC- Z-Clamp IEB747 CC GTDR GND Figure 2 Block Diagram ersion 2. 9 Dec 23

10 IN AC 9-27 RF-Filter and Rectifier 25 µ H C Tr.22 µ F R R 3.3 M Ω k Ω R 8 Ω D N448 R 3 22 k Ω C 4 nf C 3 µ F 8 5 DETIN Detector TH + R 2 2 k Ω MULTIN 3 Multipler oltage OP Current OP + PWM Logic Driver GND + 6 Ref TDA 4862 G 2 AOUT C 6 47 nf 7 4 BYP OUT D2 C 5 47 µ F 4 Q GTDR BUZ 334 Ι SENSE SENSE R 5.6 M Ω R 7. Ω R 6 k Ω IES75 Figure 3 Application Circuit with TDA 4862; G ersion 2. Dec 23

11 Absolute Maximum Ratings Parameter Symbol Limit alues Unit Notes min. max. Supply voltage at CC Pin 8 supply + Z-current CC -GND Pin 8 Current into GTDR Pin 7 Clamping current into GTDR Pin 7 Clamping current into GTDR Pin 7 oltage at SENSE Pin oltage at AOUT Pin 2 oltage at MULTIN Pin 3 oltage at I SENSE Pin 4 Current into DETIN Pin 5 Current into DETIN Pin 5 Operating Range CC I CCZ I GTDR I GTDCH I GTDCL SENSE AOUT MULTIN ISENSE I DETINH I DETINL ma ma ma ma ma ma Junction temperature T j 4 5 C Storage temperature T stg 5 5 C Thermal resistance system-air TDA 4862 TDA 4862 G R thsa R thsa 8 K/W K/W observe P max observe P max GTDR > CC GTDR <.3 DETIN >6 DETIN <.9 P-DIP-8- P-DSO-8- Parameter Symbol Limit alues Unit Notes min. max. Supply voltage CC CCON Z ) Z-current I Z 5 ma observe P max Junction temperature T j 4 5 C oltage at I SENSE ISENSE 5 Z ) CCON means CCH has been exceeded but the supply voltage is still above CCL. The device has switched from standby to active. For CCH and CCL values see Electrical Characteristics. If < CC < CCON, the device is in standby and output GTDR is active low. ersion 2. Dec 23

12 Electrical Characteristics Unless otherwise stated, CC = 2, 4 C < T j < 5 C. Parameter Symbol Limit alues Unit Test Condition min. typ. max. Overall Supply current, OFF I CCL 75 2 µa < CC < CCH Supply current, ON I CCH 4 6 ma Output low Supply current, dynamic I CCDY ma f DETIN = 5 khz, C GTDR = nf CC turn-on threshold CCH.5 CC turn-off threshold CCL CC turn-on/off CCHY hysteresis CC clamp Z I CCZ = 5 ma oltage Amplifier oltage feedback threshold FB T j = 25 C, Pin to Pin 2 oltage feedback FB Pin to Pin 2 threshold Line regulation FBL 5 m CC = to 5 Input bias current I BSENSE µa Open loop voltage gain ) G 8 db Unity gain bandwidth ) B W.8 MHz Phase margin ) Φ M 8 Degr Inhibit threshold voltage AOUTI 2.2 Output current source I AOUTH 2 ma AOUT =, SENSE = 2.3 Output current sink I AOUTL 4 ma AOUT = 4, SENSE = 2.8 not subject to production test - verified by characterization. ersion 2. 2 Dec 23

13 Electrical Characteristics (cont d) Unless otherwise stated, CC = 2, 4 C < T j < 5 C. Parameter Symbol Limit alues Unit Test Condition Output voltage swing high state Output voltage swing low state min. typ. max. AOUTH I AOUT =.2 ma SENSE = 2.3 AOUTL.9 I AOUT =.5 A SENSE = 2.8 Overvoltage Regulator Regulation current I RAOUT µa AOUT = MULTIN = 4, ISENSE =.5 Current Comparator Input bias current I BISENSE µa Input offset voltage ISENSEO 25 m MULTIN =, AOUT = 2.4 Max threshold voltage ISENSEM Delay to output ) t PHL 25 ns ) Detector Upper threshold voltage DETINU ( DETIN increasing) Lower threshold voltage DETINL.5.9 ( DETIN decreasing) Hysteresis DETINHY.6 Input current I BDETIN µa.5 < DETIN < 2.75 Input clamp voltage High state Low state DETINHC 4 DETINLC ) not subject to production test - verified by characterization 5.6 I DETIN = 5 ma I DETIN = 5 ma ersion 2. 3 Dec 23

14 Electrical Characteristics (cont d) Unless otherwise stated, CC = 2, 4 C < T j < 5 C. Parameter Symbol Limit alues Unit Test Condition min. typ. max. Multiplier Input bias current I BMULTIN µa Dynamic voltage range MULTIN AOUT MULTIN AOUT to 3 FB to FB + to 4 FB to FB +.5 AOUT = 2.75 MULTIN =. Multiplier gain ) K / MULTIN = 2 AOUT = FB + Restart Timer Restart time delay t DLY µs Gate Driver Output voltage low state GTDRL.8.8 Output voltage high state Output voltage active shut down GTDRH I GTDR = 2 ma I GTDR = 2 ma I GTDR = 2 ma I GTDR = 2 ma GTDRU I GTDR = 5 ma CC increasing: < CC < CCH, CC decreasing: < CC < CCL Rise time 2) t r C GTDR = nf Fall time 2) t f 4 C GTDR = nf ) K = ISENSE / ( MULTIN ( AOUT FB )) 2) not subject to production test - verified by design ersion 2. 4 Dec 23

15 Supply Current I CC versus Supply oltage CC 6 ma Ι CC 5 IED75 Supply Current I CC versus Junction Temperature T j 6 ma Ι CC 5 IED SENSE = 3 AOUT = 3 MULTIN = ISENSE =.5 DETIN = 2 T j = 25 C 3 2 SENSE = 3 AOUT = 3 MULTIN = ISENSE =.5 DETIN = CC C T j 5 Turn-ON/-OFF Threshold oltage CC versus Junction Temperature T j 2 CC CCH IED753 Open Loop Gain G and Phase Φ versus Frequency f IED754 db CC = 2 deg 3. < G AOUT < 3.5 Φ 8 T j = 25 C 3 A Φ 9 8 CCL 2 Φ M C T j khz 4 f ersion 2. 5 Dec 23

16 Threshold oltage Change FB versus Junction Temperature T j m FB 5 IED755 CC = 2 Pin connected to Pin 2 Threshold oltage ISENSE versus Regulation Current I RAOUT IED756.4 ISENSE CC =2. -4 C C 25 C C T j µa 34 Ι RAOUT Threshold oltage DETIN versus Junction Temperature T j DETIN 3. / IED757 CC = 2 MULTIN = SENSE = GND ISENSE = GND DETINupper DETINlow 5 C T j 5 Current Sense Threshold ISENSE versus Multiplier Input MULTIN.4 ISENSE AOUT = 2.5 IED758 4 MULTIN 5 ersion 2. 6 Dec 23

17 Current Sense Threshold ISENSE versus oltage Amplifier Output AOUT.4 ISENSE. MULTIN = 3 2 IED759 Multiplier Gain K versus Junction Temperature T j K.2 /.9 CC MULTIN AOUT = 2 = 2 = FB + IED AOUT C T j 5 Restart Time Delay t DLY versus Junction Temperature T j 24 µ s t DLY 22 2 IED76 Output oltage Low/High State SAT versus Load Current I GTDR SAT CC = 2 T = ms t p = 2 µ s CC GTDRL at CC = 7 IED762 GTDRH GTDRL C T j ma 4 Ι GTDR ersion 2. 7 Dec 23

18 Package Outlines Plastic Package, P-DIP-8- (Plastic Dual In-line Package) GPD525 Sorts of Packing Package outlines for tubes, trays etc. are contained in our Data Book Package Information. Dimensions in mm ersion 2. 8 Dec 23

19 Plastic Package, P-DSO-8- (Plastic Dual Small Outline Package) GPS52 Sorts of Packing Package outlines for tubes, trays etc. are contained in our Data Book Package Information. SMD = Surface Mounted Device Dimensions in mm ersion 2. 9 Dec 23

20 Total Quality Management Qualität hat für uns eine umfassende Bedeutung. Wir wollen allen Ihren Ansprüchen in der bestmöglichen Weise gerecht werden. Es geht uns also nicht nur um die Produktqualität unsere Anstrengungen gelten gleichermaßen der Lieferqualität und Logistik, dem Service und Support sowie allen sonstigen Beratungs- und Betreuungsleistungen. Dazu gehört eine bestimmte Geisteshaltung unserer Mitarbeiter. Total Quality im Denken und Handeln gegenüber Kollegen, Lieferanten und Ihnen, unserem Kunden. Unsere Leitlinie ist jede Aufgabe mit Null Fehlern zu lösen in offener Sichtweise auch über den eigenen Arbeitsplatz hinaus und uns ständig zu verbessern. Unternehmensweit orientieren wir uns dabei auch an top (Time Optimized Processes), um Ihnen durch größere Schnelligkeit den entscheidenden Wettbewerbsvorsprung zu verschaffen. Geben Sie uns die Chance, hohe Leistung durch umfassende Qualität zu beweisen. Wir werden Sie überzeugen. Quality takes on an allencompassing significance at Semiconductor Group. For us it means living up to each and every one of your demands in the best possible way. So we are not only concerned with product quality. We direct our efforts equally at quality of supply and logistics, service and support, as well as all the other ways in which we advise and attend to you. Part of this is the very special attitude of our staff. Total Quality in thought and deed, towards co-workers, suppliers and you, our customer. Our guideline is do everything with zero defects, in an open manner that is demonstrated beyond your immediate workplace, and to constantly improve. Throughout the corporation we also think in terms of Time Optimized Processes (top), greater speed on our part to give you that decisive competitive edge. Give us the chance to prove the best of performance through the best of quality you will be convinced. Published by Infineon Technologies AG