Product Specification Thermal Print Head Model: MO-S2-12-1A

Transcription

1 Product Specification Thermal Print Head Model: MO-S2-2-A Thermal Print Head Page of 5 MO-S2-2-A (st edition / 2889)

2 . Description The specification is applicable to thermal print head, model MO-S2-2-A, on which CMOS driver IC s are mounted. 2. Structure and Appearance 2. Structure Two-inch wide side face type thermal print head comprises of a high-density thick film printing technologies on alumina substrate, electric connection method and protective metal shield mounted on an aluminum heat sink. 2.2 Appearance No scratches, stains and/or warps affecting printing quality are allowed. 3. Mechanical Features 3. Dimension () Outline drawing see Fig. (2) Flatness of heater not more than 2 μm 3.2 Heater Element () Number of heater element 576 dots (2) Size of heater element (X).683 mm (Y).84 mm (3) Pitch between each heater element.833 mm (4) Print width mm 4. Electrical Features 4. Circuitry () Schematic diagram see Fig. 2 (2) Timing chart see Fig. 3 (3) Specifications for driver ICs see Table (4) Number of driver ICs 64 bits x 9 (5) Logic supply voltage + 5 V (6) Data signal transfer clocked serial input (7) Clock rate 8 MHz Max. (8) Direction of print data inputs From left to right, Fig. (9) Number of print line separation 3 strobes, Note 3 () Thermistor 3ET-2 R 25 =. kω±3.% Thermal Print Head Page 2 of 5 MO-S2-2-A (st edition / 2889)

3 B 25 = 3,25 K ±.% Dissipation constant =.7 mw/ C Time constant = 3.4 s 4.2 Resistance of Heater Element (Single Dot) () Average resistance (R av ),4 Ω± % (2) R av Deviation within one individual dot line R av ± % 4.3 Pin Connection see Table 2 5. Operation Characteristics 5. Standard Mechanical Parameters () Platen pressure 4.7 ~ 9.6 N/head (.5 ~ 2. kgf/head) (2) Platen diameter 25. mm (3) Platen hardness 3. ~ 5. Shore hardness 5.2 Standard Operating Parameters () Pulse width (heating strobe) (P w ).2 ms (2) Total pulse duration.4 ms (3) Heater power consumption (P).37 W/dot (4) Heater voltage (Vpp) 24. V (5) Heater element (dot) current 6.35 ma/dot (6) Thermal paper TP5KS-4HM or equivalent (Nippon Paper Industries Co., Ltd.) 5.3 Absolute Maximum Rating () Heater energy consumption.8 mj/dot (2) Heater power consumption.4 W/dot (3) Heater voltage 25. V (4) Duty cycle 6 % (5) Heatsink temperature 8 C 6. Life Expectancy () Dot heating cycle (any one dot). x 8 pulse (Note ) (2) Abrasion life km Thermal Print Head Page 3 of 5 MO-S2-2-A (st edition / 2889)

4 Note : These figures result from life-test performed on MITANI-TPH s in unconditioned real world environment (see also section 5. and 5.2). Clean conditions (pollution free, heat controlled and/or anti-static discharge assembly or usage etc) can extend lifetime-figures significantly. 7. Environment () Operating temperature - ~ + 5 C (2) Operating humidity (non condensing) ~ 9 %RH (3) Storage temperature - 2 ~ + 8 C Table CMOS driver IC Parameter Symbol Min. Typ. Max. Unit Remarks Supply voltage V cc V Consumption current I cc ma V cc = 5. V f CLK = 8 MHz DI/DO fixed Input voltage V IH.7 V cc - V cc V V IL. -.3 V cc V Input current I IH μa V IH = V cc V cc = 5. V I IL μa V IL = 5. V V cc = 5. V Driver output V DO V = V TH Voltage Current V OLDO V at I OLDO = 5 ma I OLDO ma Thermal Print Head Page 4 of 5 MO-S2-2-A (st edition / 2889)

5 Table CMOS driver IC (continued) Parameter Symbol Min. Typ. Max. Unit Remarks Clock frequency f CLK MHz Clock pulse width t w(clk) ns Data setup time t su(d) ns Data -> Clock Latch setup time t su(l). - - ns Clock -> Latch Latch pulse width t w(l) ns Data hold time t hold. - - ns Clock -> Data In Output delay time t p μs Strobe -> Data Out t w(clk) Clock Data-In t su(d) t hold Latch t su(l) t w(l) Strobe t p Gate A to C Output Voltage Thermal Print Head Page 5 of 5 MO-S2-2-A (st edition / 2889)

6 Direction of printing-data input R Heat Sink Head Cover R576 G C F H Alumina Substrate R S R R576 A B P MITANI THERMAL PRINT HEAD N A E # #4 #3 #26 Cover Heatsink Alumina Substrate Capacitor 6 V- μf O #4 # Occupied by thread Q J J I #26 #3 Occupied by thread Thermistor D Connector PS-26PE-D4LT-PN Capacitor 35 V- μf 4-M3 x 3.5 (MAX) K L M Magnification Item Dimension (Unit in mm) A. ±.2 B 2. ±. C.5 ±.5 D 5.5 ±.5 E 5. ±. F ±. G 5.5 ±. H 6. ±. I 48. ±. J 3. ±. K 9. ±.2 L 5. ±. M 7. ±. N 35. ±.3 O 22. ±.3 P 4.5 ±. Q 4. ±.2 R 2. ±.2 S. +.5/-. Fig. Outline Thermal Print Head Page 6 of 5 MO-S2-2-A (st edition / 2889)

7 Table 2 Pin Connection Pin Description Pin Description Thermistor (TM) 4 Thermistor (TM) 2 V TH 5 V TH 3 GND 6 Clock 4 Gate B 7 Data In 5 Gate B3 8 Gate B2 6 V cc (+ 5 V) 9 V cc (+ 5 V) 7 Strobe 2 2 Strobe 8 Clock 2 Strobe 3 9 Gate C3 22 Latch Gate C 23 Gate C2 Data Out 24 Gate A 2 GND 25 GND 3 V TH 26 V TH Note 2. Connector model No. PS-26PE-D4LT-PN (JAE) or equivalent Note 3. To set Thermal Dots History Control (TDHC) inactive, all gate shall connected as shown below in order to prevent from noise- and/or crosstalk influences. Gate B, B2, B3, C, C2 and C3 : to Vcc (+5 V) Gate A : to GND Thermal Print Head Page 7 of 5 MO-S2-2-A (st edition / 2889)

8 R -R64 R65 - R28 R29 - R92 R93 - R256 R257 - R32 R32 - R384 R385 - R448 R449 - R52 R53 - R576 V TH GND + 35V μ F - IC # IC #2 IC #3 IC #4 IC #5 IC #6 IC #7 IC #8 IC #9 STROBE STROBE2 STROBE3 GATE A GATE B GATE B2 GATE B3 GATE C GATE C2 GATE C3 INPUT CONTROL THERMAL DOT HISTORY CONTROL LATCH LATCH LATCH LATCH DATA IN SHIFT REGISTER CLOCK V CC GND + - 6V μ F TM TM Fig.2 Schematic diagram Thermal Print Head Page 8 of 5 MO-S2-2-A (st edition / 2889)

9 Clock Data-In Latch t t 2 t 3 t 4 t 5 t 6 t 7 Strobe -3 Gate A Gate B Gate B2 Gate B3 Gate C Gate C2 Gate C3 Driver Output Off On Off Fig. 3 Signal Sequence Thermal Print Head Page 9 of 5 MO-S2-2-A (st edition / 2889)

10 8. General Precautions () Latch up prevention Latch-up conditions can cause failures and/or severe damage. To prevent latch-up each power should be applied to the thermal print head in the following sequences. Power On: 4.75 V (5 V) Power Off: (5 V) 4.75 V Vcc Vcc (V TH max.) (V TH max.) V TH. V max. V TH. V max. 2. ms min. 2. ms min. (2) Overload protection Strobes should always be at H level when the printline is not in contact with a media and/or during switch-off in order to prevent burn-out of the printing dots. (3) CMOS protection The unit is sensitive to static loads (CMOS IC s). Utmost care should therefore be taken in order to prevent from any static discharge to the thermal print head during storage and handling. Static discharge may deadly damage the thermal print head. (4) Protective head cover A metal cover is used to protect the IC s-area against mechanic force. It should never be removed nor should any high pressure or impact be loaded on the protective head cover. (5) Connector Misconnection or loose connection while operating the thermal print head might cause failures or even severe damages. (6) Mechanical protection The surface of the thermal print head must never be treated with objects hard enough to cause scratches. Penetration of the protective layers covering the heaters and/or the conductors may result in electrical shorts or conduction breaks. Thermal Print Head Page of 5 MO-S2-2-A (st edition / 2889)

11 9. Thermal Dot History Control (TDHC) 9. General Notes:. To read and understand the following requires some knowledge of Thermal Printing and the driving theory of thermal dot-line printer heads. 2. Strobes ~3 are usually connected to one common signal and are therefore just referred to as Strobe in the following. 3. If TDHC is not used, it is recommended to externally connect Gate B, Gate B2, Gate B3, Gate C, Gate C2 and Gate C3 to Vcc (+5 V) but Gate A to GND, in order to prevent from noise- and/or crosstalk influences. 9.2 DEFINITION Individual dots of a Thermal Print Head (TPH) have the tendency to accumulate heat after successive print cycles in fast sequence. Once this excess heat reaches the reaction temperature of the receiving substrate (i.e. thermal paper) the produced image will smear. To eliminate this phenomenon, the energy applied to a dot per printing cycle has to be limited. Besides simply slowing down the print speed (which is not really an acceptable option for demanding applications such as label- or ticket-printers), there are numerous methods to adjust the dot heating duration. One method is to track the thermal history of each individual dot and limit the dot energy per printing cycle relative to the so determined thermal status. That method is called Thermal Dots History Control (TDHC). 9.3 INTERNAL TDHC General MITANI s MO-series TPH s features internal 3-level TDHC driver IC s. Sufficient design freedom for nearly all standard system demands is provided, limiting the otherwise necessary effort for external software and hardware configuration. Further advantages are enhanced image appearance at higher print speeds and potentially less power consumption (smaller power supplies). Activating the TDHC-feature is not mandatory, so that conventional external sequencing methods can be used in existing applications or for complex requirements. Thermal Print Head Page of 5 MO-S2-2-A (st edition / 2889)

12 Printing Direction Product Specification Theory of operation The internal TDHC controls the energy of each individual dot relative to the present output data and the data history of the 2 previous print cycles. The combination of that data is stored in a 3-stage Latch register stack, and is present at the dot history control circuit as Present Data, Previous Data and 2nd Previous Data (see Fig. 4). There is one register stack for each dot. The internal TDHC also control the energy of each dot affected from adjacent dots. Q means a dot fired now. But an energy diverging from the dot Q is determined by not only the energy applied to relevant dot but the energy transferred from adjacent dots. The internal TDHC mounted can control the energy from adjacent 6 dots, QR, QL, Q2L, Q2, Q2R and Q3. Q3 2nd Previous Data Q2L Q2 Q2R Previous Data QL Q QR Present Data Fig. 4 Energy transferred from adjacent dots 8 different control signals are used to determine the Driver Output = On duration (heating energy) for each dot, Strobe, Gate A, Gate B, Gate B2, Gate B3, Gate C, Gate C2 and Gate C3. The signal sequence of all 8 signals is user defined as shown in Fig.3 and each Driver Out is controlled as shown in the following truth table and logic circuit. Thermal Print Head Page 2 of 5 MO-S2-2-A (st edition / 2889)

13 Strobe Gate A * * Q QL QR * * Q2 Q2L Q2R * * Q3 * * Gate B * Gate B2 * Gate B3 * Gate C * Gate C2 * Gate C3 * Driver Output off on off on off on on off on off on off on off off off Time Note 4 Note 4: See Fig.3 Q Q2 Q2L QL GateB GateB2 t t2 t3 t4 t5 t6 t GateB3 GateC Driver Output becomes ON at H GateC2 GateC3 Q3 Q2R QR Thermal Print Head Page 3 of 5 MO-S2-2-A (st edition / 2889)

14 Gate A and Strobe Like with conventional TPH driving methods, Strobe simultaneously release all outputs of each threes driver-ics. See Fig. 2. The Gate A signal of the internal TDHC, however, overwrites Strobe on each individual driver output position. Whenever the signal level of Gate A is high for one output, the respective dot is Off, or vice versa, whenever the signal level of Gate A is low, all respective -addressed outputs are On while Strobe is low. That means, when the internal TDHC is used, the low signal-duration of Gate A is the time-window for the Power Out activity determined by the Gate B to B3 and Gate C to C3 signals. As the Gate A is connected GND and Gate B to B3 and Gate C to C3 are connected Vcc ( + 5. V), (see connector-pin assignment), TDHC is then inactive and conventional methods are required to provide external dot-energy control. Gate B to B3 and Gate C to C3 Gate B to B3 and Gate C to C3 can control duration of Driver Output. Thermal Dot History Control Chart shows typical 2 cases of timing and sequencing variations of dot heating duration when each adjacent dot is fired. Intelligent settings of Gate B to B3 and Gate C to C3 allow numerous setting of dot heating duration to manage the dot energy requirements in versatile applications. Please see 9.4 Thermal Dot History Control Chart for detailed examples. Thermal Print Head Page 4 of 5 MO-S2-2-A (st edition / 2889)

15 9.4 Thermal Dot History Control Chart Q QL QR Q2 Q2L Q2R Q3 * - Strobe Gate A Gate B Gate B2 Gate B3 Gate C Gate C2 Gate C3 Case Case 2 Case 3 * ( or ) * ( or ) * ( or ) * ( or ) * ( or ) * ( or ) Case 4 Driver Out Off Off On Off Off On Off Off Off Q QL QR Q2 Q2L Q2R Q3 * - Strobe Gate A Gate B Gate B2 Gate B3 Gate C Gate C2 Gate C3 Case 5 Case 6 Case 7 Case 8 Driver Out Off On Off Off On Off Off On Off Off On Off Q QL QR Q2 Q2L Q2R Q3 * - Strobe Gate A Gate B Gate B2 Gate B3 Gate C Gate C2 Gate C3 Case 9 Case Case Case 2 Driver Out Off On Off Off On Off Off On Off On Off Thermal Print Head Page 5 of 5 MO-S2-2-A (st edition / 2889)