AM3024B Filter Bank. Miniature Sub-Octave. Features. Typical Performance

Transcription

1 AM3024B Filter Bank AM3024B is a miniature filter bank module with sub-octave filters covering the 100 MHz to 6000 MHz frequency range. he device contains a bypassable amplifier section, a low-pass roofing filter section and can be used for both receive and transmit applications. he module is mounted to a circuit board as a surface mount device and provides an excellent front-end/ back-end for a broadband receiver or transmitter requiring high dynamic range and small size, weight and power consumption. Features ub-octave Filter Bank Bypassable Amplifier tage Low ass Roofing Filters 12 db Gain +5.0V DC upply 0.50 Watts ower Consumption 20.5 mm L x 19.0 mm W x 4.0 mm H (0.807 L x W x H) 0.5 oz Weight -40C to +85C Operation ypical erformance 1

2 AM3024B Filter Bank Functional Diagram RF In D D RF Out Bypassable Amplifier Low ass Filter Bank ub-octave Filter Bank 2

3 ypical erformance 3

4 ypical erformance 4

5 pecifications pecifications Minimum ypical Maximum Frequency Range 100 MHz 6000 MHz RF In to RF Out, Amplifier Engaged: Gain (mid-band) 12 db Gain (band-edge) 9 db Noise Figure 3 db Input I3 +12 dbm RF In to RF Out, Amplifier Bypassed: Gain -10 db Gain (band-edge) -13 db Noise Figure 10 db Input I3 +40 dbm Rejection 70 db RF Input Level (Amplifier Engaged) +13 dbm RF Input Level (Amplifier Bypassed) +20 dbm Filter Bank witching peed 10 us Control Logic Level Low -0.1V +0.4V Control Logic Level High +2.7V +3.3V ackage ize 20.5 x 19.0 x 4.5mm DC upply Voltage +4.7V +5.0 V +5.2V DC upply Current 100 ma ower Consumption 0.50 W Operating emperature -40 C +85 C torage emperature -50 C +125 C 5

6 ypical Gain, Noise Figure, II3 erformance Amplifier Engaged: Frequency (GHz) Gain (db) NF (db) II3 (dbm) Amplifier Bypassed: Frequency (GHz) Gain (db) NF (db) II3 (dbm)

7 in Definitions in Number Name Function 1 Band el 2# ub-octave Filter Band elect 2# 2 Band el 3# ub-octave Filter Band elect 3# 3 Band el 4# ub-octave Filter Band elect 4# 4 LF el 0 Low ass Filter elect 0 5 LF el 1 Low ass Filter elect 1 6 LF el 2 Low ass Filter elect 2 7 Amp el Amplifier ath elect. Add a 10K ohm resistor from this pin to ground. 8 Amp el# Legacy Control Bit - Not connected in AM3024B 9 GND Ground - Common 10 RF In RF In MHz to 6 GHz 50 ohms AC coupled. 11 Vcc +5.0V DC ower Input 12 Band el 0 ub-octave Filter Band elect 0 13 Band el 1 ub-octave Filter Band elect 1 14 Band el 0# ub-octave Filter Band elect 0# 15 Band el 1# ub-octave Filter Band elect 1# 16 RF Out RF Out MHz to 6 GHz 50 ohms AC coupled. 17 GND Ground - Common 18 Band el 2 ub-octave Filter Band elect 2 19 Band el 3 ub-octave Filter Band elect 3 20 Band el 4 ub-octave Filter Band elect 4 7

8 Control ables Filter Bands: Band elect Control Line 0 0# 1 1# 2 2# 3 3# 4 4# Filter Band MHz MHz MHz MHz MHz MHz MHz MHz MHz MHz * Note: Filter Band control table is not the same as AM3024/ AM3024A Lowpass Filter ath elect: Control Line LF el 0 LF el 1 LF el 2 Lowpass Filter ath MHz Bypass MHz 8

9 Amplifier ath: Control Line Amplifier Amp el Amp el# 1 X Enabled 0 X Bypassed Note: Amp el# is unnecessary in the AM3024B. It is a legacy control bit that was required for AM3024 and AM3024A. 9

10 ackage Details in 1 Marking op View ide View /-0.25 mm ( /-0.01 in) 18.0 mm (0.709 in) Bottom ide Exposed GND 1.25mm (4 L) (0.049in) 18.0mm (0.709 in) /-0.25 mm ( /-0.01 in) in 1 1.1mm (0.043in) Bottom View 4.50mm (2 L) (0.177 in) 0.35mm (0.014in) /-0.25mm ( / in) 1.00mm (0.039in) ad and pacing Detail 1.50mm (0.059in) 0.60mm (0.024in) Notes: 1. Lead finish: ENEIG 10

11 Recommended C Board Footprint op View 1.25mm 4L (0.049in) Ground ad C Board Outline 1.10mm (0.043in) metal pullback from board edge. Apply soldermask between pins and between pins and ground pad. ad and pacing Detail in mm (0.043in) 4.50mm 2L (0.177in) 10.25mm (0.404in) 3.50mm 4L (0.138in) 16.50mm (0.650in) 19.0mm (0.748in) 1.00mm (0.039in) 1.50mm (0.059in) ads Centered on C Board Outline 20.50mm (0.807in) Notes: 1. he ground pad should be connected to a plane that provides a DC and RF electrical ground for the system as well as a heat dissipation path for thermal management. Recommended Assembly rocedure It is recommended to attach the bottom side ground pad to the printed circuit board using a highly conductive silver epoxy and then hand solder the 20 pins along the part s perimeter to their intended printed circuit board pads using lead-free solder. he recommended silver epoxy is MG Chemicals part 8331 and the recommended assembly thickness is 3 to 5 mils. If the part is attached, both the ground pad and perimeter pins, to the circuit board using a typical lead-free solder reflow process reaching temperatures of 260C, the excessive temperature can cause internal parts to the filter bank to reflow and possibly cause damage to the part. If a solder reflow process must be used, it is recommended to use a lower temperature leaded solder profile, typically 225C maximum. 11