Accu-L AEC-Q200 Qualified

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Accu- AEC-200 ualified High- RF Inductors - 0402 & ACCU- ECHNOOGY he 0402 GA Inductor and the Accu- SMD Inductor are based on thin-film multilayer technology.

1 Accu- AEC-200 ualified High- RF Inductors & ACCU- ECHNOOGY he 0402 GA Inductor and the Accu- SMD Inductor are based on thin-film multilayer technology. his technology provides a level of control on the electri cal and physical characteristics of the com ponent which gives consistent characteristics within a lot and lot-to-lot. he original design provides small size, excellent high-frequency performance and rugged construction for reli able automatic assembly. he AEC-200 ualified Accu- Series is designed to meet the demanding performance specifications in automotive signal and power applications and Inductors FEAURES APPICAIONS High RF Power Capability High SRF ow DC Resistance Ultra-ight Inductance olerance Standard 0402 and Chip Sizes ow Profile Rugged Construction aped and Reeled Vehicle to Vehicle Communications Infotainment elematics GPS Radar Vehicle ocations Systems Keyless Entry Filters Matching Networks Operating/Storage emp. Range: -55 C to +25 C 0402 DIMENSIONS: millimeters (inches) DIMENSIONS: millimeters (inches) (ottom View) S A H 2.±0.0 (0.083±0.004).5±0.0 (0.059±0.004) 0.9±0.3 (0.036±0.005) 0.25±0.5 (0.00±0.006).00±0.0 (0.039±0.004) 0.58±0.07 (0.023±0.003) 0.35±0.0 (0.04±0.004) A S, H 0.48±0.05 (0.09±0.002) ±0.05 (0.007±0.002) 0.064±0.05 (0.003±0.002)

2 Accu- AEC-200 ualified High- RF Inductors & HO O ORDER 4R7 D 4 S R Product Inductor EAD-FREE COMPAIE COMPONEN Size 0402 Inductance Expressed in nh (2 significant digits + number of zeros) for values <0nH, letter R denotes decimal point. Example: 22nH = nH = 4R7 olerance A = ±0.05nH = ±0.nH C = ±0.2nH D = ±0.5nH G = ±2% J = ±5% Specification 4 = AEC-200 ualified Accu- ermination S = Nickel/ Sn00 ead Free Solder coated () N=Nickel/ Sn00 ead Free Solder coated (0402) Packaging R = ape and Reel Engineering Kits Available EECRICA SPECIFICAIONS AE FOR ACCU MHz 900MHz 900MHz 2400MHz SRF RDC IDC olerance min. max. max. (nh) A=±0.05nH, =±0.nH, (min) (yp) (yp) (yp) (yp) (MHz) ( ) (ma) C=±0.2nH, D=±0.5nH 0.56 ± 0.05nH, ± 0.nH ± 0.05nH, ± 0.nH ± 0.05nH, ± 0.nH ± 0.05nH, ± 0.nH ± 0.05nH, ± 0.nH, ± 0.2nH ± 0.05nH, ± 0.nH, ± 0.2nH ± 0.05nH, ± 0.nH, ± 0.2nH ± 0.05nH, ± 0.nH, ± 0.2nH ± 0.05nH, ± 0.nH, ± 0.2nH ± 0.nH, ± 0.2nH, ± 0.5nH ± 0.nH, ± 0.2nH, ± 0.5nH ± 0.nH, ± 0.2nH, ± 0.5nH ± 0.nH, ± 0.2nH, ± 0.5nH ± 0.nH, ± 0.2nH, ± 0.5nH Please contact factory for intermediate inductance values within the indicated range. EECRICA SPECIFICAIONS AE FOR ACCU- 450 MHz 900 MHz 700 MHz 2400 MHz IDC max est Frequency est Frequency est Frequency est Frequency SRF min RDC max (ma) Inductance Available Inductance (nh) (nh) (nh) (MHz) (Ω) = 5 C = 70 C (nh) olerance ypical ypical ypical ypical () (2).2 ±0.nH, ±0.2nH, ±0.5nH ±0.nH, ±0.2nH, ±0.5nH ±0.nH, ±0.2nH, ±0.5nH ±0.nH, ±0.2nH, ±0.5nH ±0.nH, ±0.2nH, ±0.5nH ±0.nH, ±0.2nH, ±0.5nH ±0.nH, ±0.2nH, ±0.5nH ±0.nH, ±0.2nH, ±0.5nH ±0.5nH ±0.5nH ±0.5nH ±2%, ±5% ±2%, ±5% ±2%, ±5% ±2%, ±5% ±2%, ±5% () I DC measured for 5 C rise at 25 C ambient temperature (2) I DC measured for 70 C rise at 25 C ambient temperature,, SRF measured on HP 429A, oonton 34A and iltron 360 Vector Analyzer, R DC measured on Keithley 580 micro-ohmmeter.

3 Accu- AEC-200 ualified High- RF Inductors & 40 ypical vs. Frequency 00 ypical Inductance vs. Frequency nH.5nH.8nH 5.6nH Inductance (nh) 0 22nH 5nH 0nH 5.6nH nH 0nH 5nH Frequency (GHz) Measured on HP429A and oonton 34A Coaxial ine 0.8nH Frequency (GHz) 0 Measured on HP429A and iltron 360 Vector Analyzer Maximum emperature Rise at 25 C ambient temperature (on FR-4) nH 0nH 6.8nH4.7nH 2.7nH Δ ( C) Current (A) emperature rise will typically be no higher than shown by the graph

4 Accu- AEC-200 ualified High- RF Inductors & FINA UAIY INSPECION Finished parts are tested for electrical parameters and visual/ mechanical characteristics. Parts are 00% tested for inductance at 450MHz. Parts are 00% tested for R DC. Each pro duc tion lot is eval u at ed on a sample basis for: at test frequency Static Humidity Resistance: 85 C, 85% RH, 60 hours Endurance: 25 C, I R, 4 hours ENVIRONMENA CHARACERISICS ES CONDIIONS REUIREMEN Solderability Components completely immersed in a solder bath at 235 ± 5 C for 2 secs. erminations to be well tinned. No visible damage. each Resistance Components completely immersed in Dissolution of termination faces a solder bath at 260 ±5 C for 60 secs. 5% of area. Dissolution of termination edges 25% of length. Storage 2 months minimum with components stored in as received packaging. Good solderability Shear Components mounted to a substrate. No visible damage A force of 5N applied normal to the line joining the terminations and in a line parallel to the substrate. Rapid Change of emperature Components mounted to a substrate. 5 cycles -55 C to +25 C. No visible damage ested as shown in diagram end Strength No visible damage mm deflection 45mm emperature Component placed in +0 to +25 ppm/ C Coefficient of environmental chamber (typical) C = Inductance -55 C to +25 C. (C) = 25 C ( 2 - ) 45mm

Accu- AEC-200 ualified High- RF Inductors - 0402 & HANDING SMD chips should be handled with care to avoid dam age or contamination from perspiration and skin oils.

5 Accu- AEC-200 ualified High- RF Inductors & HANDING SMD chips should be handled with care to avoid dam age or contamination from perspiration and skin oils. he use of plastic tipped tweezers or vacuum pick-ups is strongly recommended for individual components. ulk handling should ensure that abrasion and mechanical shock are minimized. For automatic equipment, taped and reeled product is the ideal medium for direct presentation to the placement machine. CIRCUI OARD YPE All flexible types of circuit boards may be used (e.g. FR-4, G-0) and also alumina. For other circuit board materials, please consult factory. COMPONEN PAD DESIGN Component pads must be designed to achieve good joints and minimize component movement during sol der ing. Pad designs are given below for both wave and reflow soldering. he basis of these designs is: a. Pad width equal to component width. It is per mis si ble to decrease this to as low as 85% of component width but it is not advisable to go be low this. b. Pad overlap about 0.3mm. c. Pad extension about 0.3mm for reflow. Pad ex ten sion about 0.8mm for wave soldering. REFO SODERING DIMENSIONS: millimeters (inches) 0402 Accu- 0.6 (0.024).6 (0.063) 0.4 (0.05) 0.6 (0.024) (0.0) (0.055) Accu- HAND SODERING & REORK Hand soldering is permissible. Preheat of the PC to 00 C is required. he most preferable technique is to use hot air soldering tools. here a soldering iron is used, a tem per a - ture controlled model not exceeding 30 watts should be used and set to not more than 260 C. Max i mum al lowed time at temperature is minute. hen hand sol der ing, the base side (white side) must be sol dered to the board. COOING After soldering, the assembly should preferably be al lowed to cool naturally. In the event of assisted cool ing, similar conditions to those rec om mend ed for pre heat ing should be used. CEANING RECOMMENDAIONS Care should be taken to ensure that the devices are thor - ough ly cleaned of flux residues, especially the space be neath the device. Such residues may otherwise be come conductive and effectively offer a lossy bypass to the de vice. Various recommended cleaning conditions (which must be optimized for the flux system being used) are as follows: Cleaning liquids i-propanol, ethanol, acetylacetone, water, and other standard PC cleaning liquids. Ultrasonic conditions.. power 20w/liter max. frequency 20kHz to 45kHz. emperature C maximum (if not oth er wise limited by chosen sol vent system). ime minutes max. SORAGE CONDIIONS Recommended storage conditions for Accu- prior to use are as follows: emperature C to 35 C Humidity % Air Pressure mbar to 060mbar RECOMMENDED SODERING PROFIE PREHEA & SODERING he rate of preheat in production should not exceed 4 C/second. It is recommended not to exceed 2 C/sec ond. emperature differential from preheat to soldering should not exceed 50 C. For further specific application or process advice, please consult AVX..5 (0.059)

Thin-Film RF/Microwave Inductor Technology. Accu-L

Thin-Film RF/Microwave Inductor Technology. Accu-L hin-film RF/Microwave Inductor echnology Accu- 31 Accu- 001 ight olerance SMD RF hin Film uning Inductor ACCU- ECHNOOGY he 001 SMD uning Inductor is based on thin-film multilayer technology. he technology