Thick Film Chip Resistors / Low Resistance Type

Transcription

1 Thick ilm Chip esistors / Low esistance Type Thick ilm Chip esistors / Low esistance Type Type: E LW, 3LW, 6LW BW, 3BW, 6BW, BW, 6CW, CW E B, 3B, 6D, 6B, B, B, 3, 6,,,, Z, T E L03, L06, L0, L, L, LD, LW eatures Current Sensing resistor Small size and lightweight ealize both low-resistance & High-precision by original thick film resistive element & special electrode structure Suitable for both refl ow and fl ow sol der ing ealize High-power by double-sided resistive elements structure that aimed to suppress temperature rising : ELW, 3LW, 6LW, BW, 3BW, 6BW, BW, 6CW, CW Low TC : ±5 0 6 / C (E6CW, CW) Low esistance alue : Thick fi lm resistors available from 5m Ω (E3LW, 6LW) eference Standards : IEC 60-, IS C 50-, EITA C- AEC-Q00 qualifi ed ohs compliant As for Packaging Methods, Land Pattern, Soldering Conditions and Safety Precautions, Please see Data iles Explanation of Part Numbers ELW, 3LW, 6LW, BW, 3BW, 6BW, BW, 6CW, CW <High power (double-sided resistive elements structure) type> E B W G 0 X Product Thick ilm Chip esistors LW 3LW 6LW BW 3BW 6BW BW 6CW CW Inch Power ating esistance alue 0. W 0m Ω 5m Ω,0m Ω 5, 6,,, 9m Ω m Ω to 00m Ω 0m Ω to 00m Ω 0m Ω to 00m Ω 0m Ω to 00m Ω 0m Ω to 30m Ω 0m Ω to 50m Ω esistance D G ± 0.5 % ± % ± % ± 5 % Please refer to the rating table for the resistance tolerance esistance alue Shown by digits or letters. (Ex.) 0 : 0.0 Ω=m Ω Packaging Methods Packaging X Pressed Carrier Taping mm pitch, 0,000 pcs. mm pitch, 5,000 pcs. ELW EBW E3LW E6LW E3BW E6BW EBW E6CW ECW eb. 0

2 Thick ilm Chip esistors / Low esistance Type EBS/BQ, 3BS/3BQ, 6BS/6BQ, BS/BQ, BS/BQ, 6D, 3, 6,,,, Z, T <High power type/standard type> E Q Product Thick ilm Chip esistors Size, Power ating Type Inch Power. B 3B 3 6D 6B 6 B B Z T W W esistance alue es. alue S Q 0. Ω to 0. Ω 0. Ω to 9. Ω B : 0. Ω to.0 Ω esistance D G ± 0.5 % ± % ± % ± 5 % Please refer to the rating table for the resistance tolerance esistance alue Shown by 3 digits or letters. Only when it is D (E,E96) or (E96), shown by digits or letters. (Ex.) : 0. Ω 0 : 0.0 Ω Packaging Methods Packaging X U mm pitch, 0,000 pcs. mm pitch, 5,000 pcs. mm pitch, 5,000 pcs. mm pitch,,000 pcs. EB E3B/3 E6D/6B/6 EB/ EB/ E EZ ET EL03, L06, L0, L, L, LD, LW <Low TC type> E L K 5 0 M U Product Thick ilm Chip esistors Size, Power ating Type Inch Power. L03 L06 L0 L L LD LW W es. alue Std. K 0m Ω, m Ω, 33m Ω, 39m Ω, m Ω, 50m Ω, 00m Ω U 0m Ω to 00m Ω L03, L06, L0 : m Ω to 00m Ω LD, LW : 0m Ω to 00m Ω esistance ± % ± 5 % esistance alue Shown by 3 digits or letters. (Ex.) 50M:50m Ω, 0 C:00m Ω U Packaging Methods Packaging mm pitch, 5,000 pcs. mm pitch, 5,000 pcs. mm pitch, 3,000 pcs. EL03 EL06 EL0 EL EL ELD ELW atings <High power (double-sided resistive elements structure) type> Power ating () at 0 C esistance esistance () ange T.C.. ( 0 6 / C) Temperature ange AEC-Q00 ELW (00) 0. ±, ±, ±5 0m 0 to to + E3LW () 0.5 ±, ±, ±5 5m 0 to to + 0m 0 to to + E6LW () 0.5 ±, ±, ±5 5, 6,,, 9m 0 to to + EBW (00) 0.5 ±, ±, ±5 m to 00m (E) ±300 E3BW () 0.33 ±, ±, ±5 0m to 00m (E) 0m Ω < 39m Ω : ±50 39m Ω 00m Ω : ±0 E6BW () 0.5 ±, ±, ±5 0m to 00m (E) 0m Ω < m Ω : ±300 m Ω 00m Ω : ±00 EBW (06) ±, ±, ±5 0m to 00m (E) 0m Ω < 0m Ω : ±00 0m Ω < m Ω : ±0 m Ω 00m Ω : ±00 E6CW () 0.5 ±0.5, ±, ±, ±5 0m to 30m (E) ±5 55 to + ECW (06) ±, ±, ±5 0m to 50m (E) ±5 55 to + () Please contact us when resistors of irregular series are needed. () Use it on the condition that the case temperature is below the upper category temperature. ated Continuous Working oltage (CW) shall be determined from CW = Power ating esistance alues. Overload Test oltage (OT) shall be determined from OT = Specified Magnification (refer to performance) CW. eb. 0

3 Thick ilm Chip esistors / Low esistance Type atings <High power type> Power ating () at 0 C esistance (3) esistance () ange T.C.. ( 0 6 / C) Temperature ange AEC-Q00 EBS (00) ± ±, ±, ±5 EBQ (00) 0. to.0 (E) ±50 E3BS () ± ±, ±, ±5 E3BQ ().0 to 9. (E) ±00 E6DS () ±0.5, ±, 0.0 to 0.0 (E, E96) ±0 0.5 E6DQ () ±, ±5 0. to 9. (E, E96) ±00 E6BS () ± ±, ±, ±5 E6BQ ().0 to 9. (E) ±00 EBS (06) ± ±, ±, ±5 EBQ (06).0 to 9. (E) ±00 EBS (0) ± ±, ±, ±5 EBQ (0).0 to 9. (E) ±00 () Please contact us when resistors of irregular series are needed. () Use it on the condition that the case temperature is below the upper category temperature. (3) E96 series also have ±0.5 %, ± % line-up. ated Continuous Working oltage (CW) shall be determined from CW = Power ating esistance alues. Overload Test oltage (OT) shall be determined from OT = Specified Magnification (refer to performance) CW. <Standard type> E3S () E3Q () E6S () E6Q () ES (06) EQ (06) ES (0) EQ (0) ES () EQ () EZS (00) EZQ (00) ETS (5) ETQ (5) Power ating () at 0 C esistance 0. ±, ±, ±5 0. ±, ±, ±5 0.5 ±, ±, ±5 0.5 ±, ±, ±5 0.5 ±, ±, ±5 0.5 ±, ±, ±5 ±, ±, ±5 esistance () ange T.C.. ( 0 6 / C) ±300.0 to 9. (E) ±00 ±50.0 to 9. (E) ±00 ±50.0 to 9. (E) ±00 ±00.0 to 9. (E) ±00 ±00.0 to 9. (E) ±00 ±00.0 to 9. (E) ±00 ±00.0 to 9. (E) ±00 Temperature ange AEC-Q00 () Please contact us when resistors of irregular series are needed. () Use it on the condition that the case temperature is below the upper category temperature. ated Continuous Working oltage (CW) shall be determined from CW = Power ating esistance alues. Overload Test oltage (OT) shall be determined from OT = Specified Magnification (refer to performance) CW. eb. 0

4 Thick ilm Chip esistors / Low esistance Type <Low TC type> Power ating () at 0 C esistance esistance () ange T.C.. ( 0 6 / C) Temperature ange AEC-Q00 EL03 () 0. ±, ±5 m to 00m ±00 55 to + EL06 () 0.5 ±, ±5 m to 00m ±00 55 to + EL0 (06) 0.33 ±, ±5 m to 00m ±00 55 to + EL (0) 0.33 ±, ±5 0m to 00m 55 to + EL () 0.5 ±, ±5 0m to 00m < m Ω : ± to + ELD (00) 0.5 ±, ±5 0m to 00m m Ω : ±00 55 to + ELW (5) ±, ±5 0m to 00m 55 to + () Standard.. : 0m Ω, m Ω, 33m Ω, 39m Ω, m Ω, 50m Ω, 00m Ω, Custom.. : Each m Ω within upper range. () Use it on the condition that the case temperature is below the upper category temperature. ated Continuous Working oltage (CW) shall be determined from CW = Power ating esistance alues. Overload Test oltage (OT) shall be determined from OT = Specified Magnification (refer to performance) CW. Construction Protective coating Alumina substrate Thick film resistive element Electrode (Inner) Electrode (Between) Electrode (Outer) Power Derating Curve or resistors operated in ambient temperatures above 0 C, power rating shall be derated in accordance with the figure below. ated Load 55 C C 0 5 C 0 C Ambient Temperature Dimensions in mm (not to scale) a L W t Dimensions (mm) Mass(Weight) L W a b t [g/000 pcs.] ELW.00 ± ± ± ± EBW.00 ± ± ± ± EBS EBQ.00 ± ± ± ± E3LW (5m Ω).60 ± ± ± ± ±0.0 3 E3LW (0m Ω).60 ± ± ± ± ±0.0 3 E3BW E3 E3B EL03 E6LW.60 ±0..00 ± ± ± ± ± ± ± ±0.0 6 E6BW.00 ±0.0.5 ± ± ± ±0.0 6 E6CW 0.60 (0 to 3m Ω) 0.60 ± ± ±0.0 E6CW 0.5 ( to 30m Ω) 0.5 ± ±0.0 6 E6D.00 ±0.0.5 ± ± ± ±0.0 5 E6 E6B EL06.00 ±0.0.5 ± ± ± ±0.0 5 b Dimensions (mm) Mass(Weight) L W a b t [g/000 pcs.] EBW 3.0 ± ± ± ± ±0.0 3 ECW (0 to 6m Ω) 3.0 ± ±0.0.0 ±0.0.0 ± ±0.0 3 ECW ( to 50m Ω) 3.0 ± ± ± ± ±0.0 3 E EB EL0 E ± ± ±0.0 0 EB EL E EL 3.0 ± ± ± ± ± ± ± ± ± ±0.0 6 EZ ELD 5.00 ± ± ± ± ±0.0 ET 6.0 ± ± ± ± ±0.0 5 ELW 6.0 ± ± ± ±0.0.0 ±0.0 9 eb. 0

5 Thick ilm Chip esistors / Low esistance Type ELW, 3LW, 6LW, BW, 3BW, 6BW, BW, 6CW, CW <High power (double-sided resistive elements structure) type> Test Item equirements Test Conditions esistance 0 C T. C.. T. C.. +5 C/+ C Overload ±% ated oltage.0, 5 s E6LW :., 5 s EBW ( > 0.05 Ω) :., 5 s esistance to Soldering Heat ±% 0 C, 0 s apid Change of Temperature ±% ELW : ±% 55 C (30 min.) / +5 C (E LW, E CW : + C) (30 min.) 00 cycles High Temperature Exposure ±% +5 C (E LW, E CW : + C), 000 h Damp Heat, Steady State ±% 60 C, 90% to 95%H, 000 h Load Life in Humidity ±3% 60 C, 90% to 95%H, ated oltage,.5 h ON/0.5 h O cycle, 000 h Endurance at 0 C ±3% 0 C, ated oltage,.5 h ON/0.5 h O cycle, 000 h EBS/BQ, 3BS/3BQ, 6BS/6BQ, BS/BQ, BS/BQ, 6D, 3, 6,,,, Z, T <High power type/standard type> Test Item equirements Test Conditions esistance 0 C T. C.. T. C.. +5 C/+ C Overload ±% ated oltage.5 (E6D :.), 5 s esistance to Soldering Heat ±% 0 C, 0 s apid Change of Temperature ±% 55 C (30 min. / +5 C (30 min.), 00 cycles High Temperature Exposure ±% +5 C, 000 h Damp Heat, Steady State ±% 60 C, 90% to 95%H, 000 h Load Life in Humidity ±3% 60 C, 90% to 95%H, ated oltage,.5 h ON/0.5 h O cycle, 000 h Endurance at 0 C ±3% 0 C, ated oltage,.5 h ON/0.5 h O cycle, 000 h EL03, L06, L0, L, L, LD, LW <Low TC type> Test Item equirements esistance 0 C T. C.. T. C.. +5 C/+ C Overload ±% ated oltage.5, 5 s Test Conditions esistance to Soldering Heat ±% 0 C, 0 s apid Change of Temperature ±% 55 C (30 min. / + C (30 min.), 00 cycles High Temperature Exposure ±% + C, 000 h Damp Heat, Steady State ±% 60 C, 90% to 95%H, 000 h Load Life in Humidity ±3% 60 C, 90% to 95%H, ated oltage,.5 h ON/0.5 h O cycle, 000 h Endurance at 0 C ±3% 0 C, ated oltage,.5 h ON/0.5 h O cycle, 000 h eb. 0

6 Surface Mount esistors Safety precautions Safety Precautions (Common precautions for Surface Mount esistors) The following are precautions for individual products. Please also refer to the common precautions for ixed esistors in this catalog.. Take measures against mechanical stress during and after mounting of Surface Mount esistors (hereafter called the resistors) so as not to damage their electrodes and protective coatings. Be careful not to misplace the resistors on the land patterns. Otherwise, solder bridging may occur.. Keep the rated power and ambient temperature within the specified derating curve. Some circuit boards, wiring patterns, temperatures of heat generated by adjacent components, or am bi ent tem per a tures can become factors in the rise of the temperature of the re sis tors, regardless of the level of power applied. Therefore, check the conditions before use and op ti mize them so as not to damage the boards and peripheral components. Make sure to contact us before using the resistors under special conditions. 3. If a transient load (heavy load in a short time) like a pulse is expected to be applied, check and evaluate the operations of the resistors when installed in your products before use. Never exceed the rated power. Otherwise, the performance and/or reliability of the resistors may be impaired.. Before using halogen-based or other high-activity flux, check the possible effects of the flux residues on the per for mance and reliability of the resistors. 5. When soldering with a soldering iron, never touch the resistors'bodies with the tip of the soldering iron. When using a soldering iron with a high temperature tip, finish soldering as quickly as possible (within three seconds at 350 C max.). 6. As the amount of applied solder becomes larger, the mechanical stress applied to the resistors increases, causing problems such as cracks and faulty characteristics. Avoid applying an excessive amounts of solder.. When the resistors' protective coatings are chipped, flawed, or removed, the characteristics of the resistors may be impaired. Take special care not to apply mechanical shock during automatic mounting or cause damage during handling of the boards with the resistors mounted.. Do not apply shock to the resistors or pinch them with a hard tool (e.g. pliers and tweezers). Otherwise, the resistors' protective coatings and bodies may be chipped, affecting their performance. 9. Avoid excessive bending of printed circuit boards in order to protect the resistors from abnormal stress. 0. Do not immerse the resistors in solvent for a long time. Before using solvent, carefully check the effects of im mer sion.. Transient voltage If there is a possibility that the transient phe nom e non (significantly high voltage ap plied in a short time) may oc cur or that a high voltage pulse may be applied, make sure to evaluate and check the char ac ter is tics of ixed Metal (Oxide) ilm esistors mounted on your product rather than only depending on the calculated pow er limit or steady-state conditions to complete the de sign or decide to use the resistors.. Do not apply excessive tension to the terminals. 0 Sep. 0

7 Safety Precautions (Common precautions for ixed esistors) When using our products, no matter what sort of equipment they might be used for, be sure to make a written agreement on the specifications with us in advance. The design and specifications in this catalog are subject to change without prior notice. Do not use the products beyond the specifications described in this catalog. This catalog explains the quality and performance of the products as individual components. Before use, check and evaluate their operations when installed in your products. Install the following systems for a failsafe design to ensure safety if these products are to be used in equip ment where a defect in these products may cause the loss of human life or other significant dam age, such as damage to vehicles (automobile, train, vessel), traffic lights, medical equipment, aerospace equipment, electric heating appliances, combustion/gas equipment, rotating equipment, and disaster/crime prevention equipment. Systems equipped with a protection circuit and a protection device Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a sin gle fault () Precautions for use These products are designed and manufactured for general and standard use in general elec tron ic equipment (e.g. A equipment, home electric appliances, office equipment, information and communication equipment) These products are not intended for use in the following special conditions. Before using the products, carefully check the effects on their quality and performance, and determine whether or not they can be used.. In liquid, such as water, oil, chemicals, or organic solvent. In direct sunlight, outdoors, or in dust 3. In salty air or air with a high concentration of corrosive gas, such as Cl, H S, NH 3, SO, or NO. Electric Static Discharge (ESD) Environment These components are sensitive to static electricity and can be damaged under static shock (ESD). Please take measures to avoid any of these environments. Smaller components are more sensitive to ESD environment. 5. Electromagnetic Environment Avoid any environment where strong electromagnetic waves exist. 6. In an environment where these products cause dew condensation. Sealing or coating of these products or a printed circuit board on which these products are mounted, with resin or other materials These products generate oule heat when energized. Carefully position these products so that their heat will not affect the other components. Carefully position these products so that their temperatures will not exceed the category temperature range due to the effects of neighboring heat-generating components. Do not mount or place heat-generating components or inflammables, such as vinyl-coated wires, near these products. Note that non-cleaning solder, halogen-based highly active flux, or water-soluble flux may deteriorate the performance or reliability of the products. Carefully select a flux cleaning agent for use after soldering. An unsuitable agent may deteriorate the performance or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to leave water residues. Otherwise, the insulation performance may be deteriorated. () Precautions for storage The performance of these products, including the solderability, is guaranteed for a year from the date of ar riv al at your company, provided that they remain packed as they were when delivered and stored at a tem per a ture of 5 C to 35 C and a relative humidity of 5 % to 5 %. Even within the above guarantee periods, do not store these products in the following conditions. Otherwise, their electrical performance and/or solderability may be deteriorated, and the packaging materials (e.g. taping materials) may be deformed or deteriorated, resulting in mounting failures.. In salty air or in air with a high concentration of corrosive gas, such as Cl, H S, NH 3, SO, or NO. In direct sunlight <Package markings> Package markings include the product number, quantity, and country of origin. In principle, the country of origin should be indicated in English. 0 Sep. 0