Chip RC Networks EZADT EZAST/SS EZANT. Chip RC Networks

Transcription

1 Chip RC Networks Type: ZCT ZDT ZT/ ZNT Type: ZTB/B Features mallest MD R/C networks 4 popular noise reduction circuits made ZCT : 2. mm.2 mm. mm,.5 mm pitch (Flat terminal type) ZDT :.2 mm. mm.5 mm,.5 mm pitch (Concave terminal type) ZT/ : 4. mm 2. mm.5 mm,.8 mm pitch (Concave terminal type) ZTB/B : 4. mm 2. mm.5 mm,.5 mm pitch (Convex terminal type) ZNT :.4 mm. mm.8 mm,.2 mm pitch (Concave terminal type) Takes up less space than discrete chip resistor & chip capacitor ZCT:25 % of 42 inches (. mm.5 mm) chips placing area ZDT:5 % of 42 inches (. mm.5 mm) chips placing area ZT/, ZTB/B: % of 42 inches (. mm.5 mm) chips placing area ZNT:55 % of 85 inches (2. mm.2 mm) chips placing area <ffect of high density placing, PWB space saving> RC Low pass fi lter C Terminator Chip RC Network (ZCT, ZDT, ZT/, ZNT) Chip RC Network (ZCT, ZDT, ZT/, ZNT) Discrete Chips Discrete Chips Chip RC Network (ZTB/B) Chip RC Network (ZTB/B) Recommended pplications Digital equipment such as PCs, printers, HDD, PCMCI cards, PDs, and word processors Communication equipment, digital cordless phones, automobile phones, GM, PH, DCT Digital audio and video equipment lectronic musical instruments, and other digital devices Design and specifi cations are each subject to change without notice. sk factory for the current technical specifi cations before purchase and/or use. Feb. 2

2 xplanation of Part Numbers ZCT (R/C tandard Combination) Z C T J Common Code Dimension and Circuit R/C tandard Combination Design Resistance Tolerance uffix for pecial Requirement Thick Film Noise uppression and Filtering Components CT 2. mm.2 mm Chip RC Networks Resistance Value k ZDT ZT ZNT (R/C tandard Combination) Z T Capacitance Value 8 pf 22 pf 9 tandard J ±5 % 2 J Common Code Dimension and Circuit R/C tandard Combination Design Resistance Tolerance uffix for pecial Requirement Thick Film Noise uppression and Filtering Components ZCT ZDT Z ZNT (R/C xcept the standard Combination) DT T NT Z.2 mm. mm 4. mm 2. mm.4 mm. mm Chip RC Networks Resistance Value Capacitance Value k pf 4 pf pf 22 pf 4 pf pf 22 pf to pf available for ZNT, 9 Y tandard J ±5 % 22 pf to pf available for ZT, ZDT 2 J Common Code Dimension and Circuit Design Number Resistance Tolerance uffix for pecial Requirement Thick Film Noise uppression and Filtering Components CT DT NT 2. mm.2 mm.2 mm. mm 4. mm 2. mm.4 mm. mm ZTB (R/C tandard Combination) 2 4 Chip RC Networks 5 CT DT NT Resistance Value : to k Capacitance Value : pf to pf In above-mentioned range, it is possible to choose optional R/C. Resistance Value : to k Capacitance Value : pf to pf In above-mentioned range, it is possible to choose optional R/C. Resistance Value : to k Capacitance Value : pf to 8 pf In above-mentioned range, it is possible to choose optional R/C. Resistance Value : to k Capacitance Value : 22 pf to pf In above-mentioned range, it is possible to choose optional R/C. 8 9 J ±5 % 2 Z T B J Common Code Dimension and Circuit R/C tandard Combination Design Resistance Tolerance uffix for pecial Requirement Thick Film Noise uppression and Filtering Components TB 4. mm 2. mm Convex terminal type Chip RC Networks Resistance Value k Capacitance Value 2 22 pf 4 pf pf tandard J ±5 % Design and specifi cations are each subject to change without notice. sk factory for the current technical specifi cations before purchase and/or use. Feb. 2

3 xplanation of Part Numbers ZB (R/C xcept the standard Com bi na tion) Z B J Common Code Dimension and Circuit Design Number Resistance Tolerance uffix for pecial Requirement Thick Film Noise uppression and Filtering Components B 4. mm 2. mm Convex terminal type Chip RC Networks Resistance Value : to k Capacitance Value : pf to 8 pf In above-mentioned range, it is possible to choose optional R/C. J ±5 % Construction ZCT ZDT ZT/ Marking Protective coating lumina substrate lumina substrate Protective coating Marking lumina substrate Marking Protective coating ZNT ZTB/B lumina substrate Protective coating Marking Protective coating Marking lumina substrate Circuit Confi guration ZCT ZDT ZT/ ZNT ZTB/B R R2 R R4 C C2 C C4 R C R2 C2 R C R4 C4 R R2 R R4 C C2 C C R=R2=R=R4 C=C2=C=C R=R2=R=R4 C=C2=C=C R=R2=R=R4 C=C2=C=C4 Design and specifi cations are each subject to change without notice. sk factory for the current technical specifi cations before purchase and/or use. Feb. 2

4 in mm(not to scale) ZCT ZDT ±..4± ±..25±.5 2.±..55±..2±.5.±.5.25±..4±.5.5± ±.5.5±.5.5±..2±..± ±.5.4±.5.5± ±.2.4± ±. 4.±.2.45±.2.25±.2 2.± ±.2.2±..5± ±.2.5±.2.25±.2.5± ±.2.4±.2.9±.2.55±.2.4±.5.25±.5 ize : 85 inches Mass (Weight) [ pcs.] :4 g ize : 2 inches Mass (Weight) [ pcs.] : g ZT/ ZNT.±.2 ize : 8 inches Mass (Weight) [ pcs.] : g ize : 252 inches Mass (Weight) [ pcs.] :55 g ZTB/B.5±..58±.2.4±.2.25± ±.2.5±.2.±.2 2.2± ize : 8 inches Mass (Weight) [ pcs.] :8 g Design and specifi cations are each subject to change without notice. sk factory for the current technical specifi cations before purchase and/or use. Feb. 2

5 Ratings Item pecifi cation to k Resistance Values ZC tandard :, 22, 4,, 22, 4, k ZD//N tandard : 22, 4,, 22, 4, k Resistance Tolerance ±5 % Temperature Coeffi cient of Resistance (T.C.R.) ±2 / C(ppm/ C) Rated Power ZC :. W(< C () ) ZD//N :. W(< C () ) Limiting lement Voltage (Maximum Rated Continuous Working Voltage) 25 V (2) Resistor Capacitor ttenuation (db) ttenuation (db) M M M G G Frequency (Hz) 2 4 Capacitance Values (25 C, khz (), Vrms) () For resistors operated in ambient temperature above C, rated power shall be derated. ( Power Derating Curve is shown below) (2) Rated Voltage for resistor shall be determined from Rated Power Resistance Value, or Limiting lement Voltage (Max. Rated Continuous Working Voltage) whichever less. () In measuring at MHz, Capacitance and Dissipation Factor are different. Power Derating Curve For resistors operated in ambient temperatures above C, power rating shall be derated in accordance with the fi gure on the right. ttenuation Characteristics ZCT ZT ZTB /pf /22pF / pf /22pF /4pF 5 M M M G G Frequency (Hz) ttenuation (db) ttenuation (db) Rated Load (%) M C C mbient Temperature ( C) ZDT ZC : pf to pf tandard : pf, 22 pf ZD : pf to pf Z : pf to 8 pf tandard : 22 pf, 4 pf, pf ZN : 22 pf to pf tandard : 22 pf, 4 pf, pf Capacitance Tolerance + %/ 2 % Capacitance Temperature Characteristics Characteristic: +2 %/ 55 %( 25 to +85 C) Dissipation Factor Less than %(25, khz (), Vrms) ZC, ZD : 2 V Rated Voltage Z : 25 V ZN : 5 V Category Temperature Range (Operating Temperature Range) 25 C to +85 C ZNT M / pf M Frequency (Hz) k / pf /22pF /4pF k / pf M M M G Frequency (Hz) G G Measurement Circuit ~ 5 ZCT ZDT ZT ZTB ZNT 5 Design and specifi cations are each subject to change without notice. sk factory for the current technical specifi cations before purchase and/or use. Feb. 2

6 Packaging Methods (Taping) tandard Quantity Type Kind of Taping Pitch (P ) Quantity ZCT ZDT Punched Carrier Taping 5 pcs./reel ZT/ 4 mm ZTB/B ZNT mbossed Carrier Taping 4 pcs./reel Carrier Tape (Unit : mm) fd P P 2 P B W F T T fd (Only mboss) Type B W F P P 2 P fd T fd ZCT.5 ± ±.2 8. ±.2.5 ±.5.5 ±..85 ±.5 ZDT 2. ±.2. ±.2 ZT/ ZTB/B 4. ±. 2. ±.5 4. ± ± ±.2.5 ±.2 2. ±. 5.5 ±.2.5 ± ZNT.5 ±.2.8 ±.2. ±.2 Taping Reel f C T (Unit : mm) Type f fb fc W T ZCT ZDT 9. ±..4 ±2. ZT/ min.. ±. ZTB/B. ±. 5.4 ±2. ZNT f B f W Design and specifi cations are each subject to change without notice. sk factory for the current technical specifi cations before purchase and/or use. Feb. 2

7 f2 c older resistant Land pattern f f f Recommended Land Pattern Design ZCT b g P Land pattern a b c d d a e c h e h g P ZDT P b Land pattern a b c d.9 to..2 to. 2. to 2.8. to.4 d a c g f g P 2. to 2.. to ZT/ a b c d a e d.2 to.4.4. to..4 to.5 e f f2 P b P to. 4.8 to ZTB/B f2 Land pattern a b c d.4 to f a f f2 P c d b P 2. to ZNT b P Land pattern a b c d d a 2. to to. 5. to to.8 f g P c g 4. to 4.. to 8..2 Design to make pattern as large as possible, because high frequency noise is removed from terminals of chip RC network. Design and specifi cations are each subject to change without notice. sk factory for the current technical specifi cations before purchase and/or use. Feb. 2

8 Recommended oldering Conditions Recommendations and precautions are described below. Recommended soldering conditions for refl ow Refl ow soldering shall be performed a maximum of two times. Please contact us for additional information when used in conditions other than those specifi ed. Please measure the temperature of the terminals and study every kind of solder and printed circuit board for solderability be fore actual use. Temperature Peak Preheating Heating For soldering (xample : n/pb) Temperature Time Preheating 4 C to C s to2 s Main heating bove 2 C s to 4 s Peak 25 ± 5 C max. s For lead-free soldering (xample : n/g/cu) Temperature Time Preheating 5 C to 8 C s to 2 s Main heating bove 2 C s to 4 s Peak max. 2 C max. s This product has circuits on both sides. Therefore, do not use adhesives because they may impair the products characteristics. Time Flow oldering We do not recommend fl ow soldering to the prod uct, because solder bridging may occur due to the narrow pitch of the terminals and the characteristics of the product may be badly affected when using adhesive to affi x it to a circuit board. afety Precautions The following are precautions for individual products. Please also refer to the precautions common to MI Filters, Fuses, and ensors(mr lements) shown on page X2 of this catalog.. Take measures against mechanical stress during and after mounting of Chip RC Networks (hereafter called the RC networks) so as not to damage their electrodes and protective coatings. Be careful not to misplace the RC networks on the land patterns. Otherwise, solder bridging may occur. 2. Do not use halogen-based or other high-activity fl ux. Otherwise, the residue may impair the RC networks' performance and/or reliability.. Perform suffi cient preheating so that the difference of the solder temperature and the RC networks chip surface temperature becomes C or less. Maintain the temperature difference within C during rapid cooling by immersion into solvent after soldering. 4. When soldering with a soldering iron, never touch the RC networks' bodies with the tip of the soldering iron. When using a soldering iron with a high temperature tip, fi nish soldering as quickly as possible (within three seconds at 5 C max.). 5. s the amount of applied solder becomes larger, the mechanical stress applied to the RC networks increases, causing problems such as cracks and faulty characteristics. void applying an excessive amounts of solder.. Do not apply shock to the RC networks or pinch them with a hard tool (e.g. pliers and tweezers). Otherwise, the RC networks' protective coatings and bodies may be chipped, affecting their performance.. void excessive bending of printed circuit boards in order to protect the RC networks from abnormal stress. 8. The static capacitance may decrease by a few percent from the time of shipment due to the characteristics peculiar to dielectric materials having a high dielectric constant. Design and specifi cations are each subject to change without notice. sk factory for the current technical specifi cations before purchase and/or use. Feb. 2

9 afety Precautions (Common precautions for MI Filters, Fuses, and ensors[mr lements]) When using our products, no matter what sort of equipment they might be used for, be sure to make a written agreement on the specifi cations with us in advance. The design and specifi cations in this catalog are subject to change without prior notice. Do not use the products beyond the specifi cations described in this catalog. This catalog explains the quality and performance of the products as individual components. Before use, check and evaluate their operations when installed in your products. Install the following systems for a failsafe design to ensure safety if these products are to be used in equip ment where a defect in these products may cause the loss of human life or other signifi cant dam age, such as damage to vehicles (automobile, train, vessel), traffi c lights, medical equipment, aerospace equipment, electric heating appliances, combustion/gas equipment, rotating equipment, and disaster/crime prevention equipment. ystems equipped with a protection circuit and a protection device ystems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a sin gle fault () Precautions for use These products are designed and manufactured for general and standard use in general elec tron ic equipment (e.g. V equipment, home electric appliances, offi ce equipment, information and communication equipment) These products are not intended for use in the following special conditions. Before using the products, carefully check the effects on their quality and performance, and determine whether or not they can be used.. In liquid, such as water, oil, chemicals, or organic solvent 2. In direct sunlight, outdoors, or in dust. In salty air or air with a high concentration of corrosive gas, such as Cl2, H2, NH, O2, or NO2 4. lectric tatic Discharge (D) nvironment These components are sensitive to static electricity and can be damaged under static shock (D). Please take measures to avoid any of these environments. maller components are more sensitive to D environment. 5. lectromagnetic nvironment void any environment where strong electromagnetic waves exist.. In an environment where these products cause dew condensation. ealing or coating of these products or a printed circuit board on which these products are mounted, with resin or other materials These products generate Joule heat when energized. Carefully position these products so that their heat will not affect the other components. Carefully position these products so that their temperatures will not exceed the category temperature range due to the effects of neighboring heat-generating components. Do not mount or place heat-generating components or infl ammables, such as vinyl-coated wires, near these products (except Thermal Cutoffs). Note that non-cleaning solder, halogen-based highly active fl ux, or water-soluble fl ux may deteriorate the performance or reliability of the products. Carefully select a fl ux cleaning agent for use after soldering. n unsuitable agent may deteriorate the performance or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to leave water residues. Otherwise, the insulation performance may be deteriorated. (2) Precautions for storage The performance of these products, including the solderability, is guaranteed for a year from the date of ar riv al at your company, provided that they remain packed as they were when delivered and stored at a tem per a ture of 5 C to 5 C and a relative humidity of 45 % to 85 %. (Micro Chip Fuses: Guaranteed for months from the date of arrival at your company) The performance of MI Filters is guaranteed for months or a year from the out go ing inspection date indicated on the packages, provided that they are stored at a temperature of -5 C to +4 C and a relative humidity of 4 % to %. Check the guarantee period in the specifi cations. The performance of Thermal Cut offs is guaranteed for a year from the outgoing inspection date indicated on the packages, provided that they are stored at a temperature of - C to +4 C and a relative humidity of % to 5 %. ven within the above guarantee periods, do not store these products in the following conditions. Otherwise, their electrical performance and/or solderability may be deteriorated, and the packaging materials (e.g. taping materials) may be deformed or deteriorated, resulting in mounting failures.. In salty air or in air with a high concentration of corrosive gas, such as Cl2, H2, NH, O2, or NO2 2. In direct sunlight <Package markings> Package markings include the product number, quantity, and country of origin. In principle, the country of origin should be indicated in nglish. X2 Feb. 2

10 Mouser lectronics uthorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: Panasonic: Z-TJ Z-DTJ Z-DT22J Z-DT2J Z-DTJ Z-T22J Z- T2J Z-TJ Z-TJ Z-TJ Z-DT4J Z-DT52J Z-DT2J Z-TBJ Z-DTJ Z-CTJ Z-DT2J Z-DT2J Z-DT5J Z- DT2J Z-DTJ Z-CTJ Z-DT42J