Anti-Surge Thick Film Chip Resistors

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Magdalene Elliott
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1 Anti-Surge Thick Film Chip Resistors Anti-Surge Thick Film Chip Re sis tors Type: ER PA, P3, PA3, P, P8, P Features ESD surge characteristics superior to standard metal fi lm resistors High reliability Metal glaze thick fi lm resistive element and three layers of electrodes Suitable for both refl ow and fl ow soldering High power. W : inch / 5 mm size (ERPA), 3 inch / 8 mm size (ERP3).5 W : 3 inch / 8 mm size (ERPA3).5 W : 85 inch / mm size (ERP), inch / 35 mm size (ERP). W : inch / 3 mm size (ERP8) Reference Standards IEC 5-8, IS C 5-8, EIA RC-3B AEC-Q qualifi ed RoHS compliant As for Packaging Methods, and Pattern, Soldering Conditions and Safety Precautions, Please see Data Files Explanation of Part Numbers E R P D Product Thick Film Chip Resistors Size, Power Rating PA P3 PA3 P P8 P Inch Power R.. W. W.5 W.5 W. W.5 W D F ±.5 % ± % ± 5 % The first two or three digits are significant figures of resistance and the third or th one denotes number of zeros following. Three digit type (±5 %), four digit type (± %, ±.5 %) Example:.k Ω, k Ω U Packaging Methods Packaging Punched Carrier Taping X mm pitch,, pcs. Punched Carrier Taping mm pitch, 5, pcs. Embossed Carrier Taping mm pitch, 5, pcs. ERPA ERP3 ERPA3 ERP ERP8 ERP Construction Dimensions in mm (not to scale) a Protective coating Electrode (Inner) W Alumina substrate t Thick fi lm resistive element Electrode (Between) Electrode (Outer) ERPA () ERP3 (3) ERPA3 (3) ERP (85) ERP8 () ERP () b Dimensions (mm) W a b t Mass (Weight) [g/ pcs.]. ±.5.5 ±.5. ±.5.5 ±.5.35 ±.5.8. ± ±.5.5 ±..5.. ± ±..5 ±..5.. ±..5 ±..5 ±.. ±.. ± ±..5 ±.. ±. 3. ±..5 ±..35 ±..5 ±.. ±. Feb.

2 Anti-Surge Thick Film Chip Resistors Ratings ERPA () ERP3 (3) ERPA3 (3) ERP (85) ERP8 () ERP () Power Rating (3) at C (W) imiting Element oltage () Maximum Overload oltage () (%) Range (Ω) T.C.R. ( / C) ±.5, ± to M (E, E9) ± ±5 to M (E) ± ±.5 to M (E, E9) ±5 ± to M (E, E9) ± ±5 to M (E) R < Ω : 5 to + Ω < R : ± ±.5, ± to M (E, E9) ± ±5 to.5m (E) ± ±.5, ± to M (E, E9) R < 33 Ω : ±3 33 Ω < R : ± R < Ω : to + ±5 to 3.3M (E) Ω < R < 33 Ω : ±3 33 Ω < R : ± ±.5, ± to M (E, E9) ± ±5 to M (E) R < Ω : to + Ω < R : ± ±.5, ± to M (E, E9) ± ±5 to M (E) R < Ω : to + Ω < R : ± Category Temperature Range ( C) 55 to to to to to to +55 () Rated Continuous Working oltage (RCW) shall be de ter mined from RCW= Power Rating Re sis tance alues, or imiting Element oltage list ed above, whichever less. () Overload (Short-time Overload) Test oltage (SOT) shall be de termined from SOT=.5 RCW or max. Over load olt age list ed above which ev er less. (3) Use it on the condition that the case temperature is below 55 C. Power Derating Curve For resistors operated in ambient temperatures above C, power rating shall be derated in accordance with the fi gure on the right. When the temperature of ERP is 55 C or less, the derating start temperature can be changed to 5 C. (See the dotted line) Rated oad (%) 55 C 8 C ER PA, P3, PA3, P 5 C ER P, P8 55 C 8 8 Ambient Temperature ( C) Feb.

3 Anti-Surge Thick Film Chip Resistors ESD Characteristic R= Ω(<.5k Ω)/5 Ω(>.5k Ω) E C=5p F Sample inch size : E=±k 3, 85,, inch size : E=±3k Anti-Surge Thick Film Chip Resistors(ERP Type) Thick Film Chip Resistors(ER Type) % - -% - -% - -3% ERPA ( inch /5 mm size) ERPA ERG Ω Ω k Ω k Ω k Ω M Ω % - -% - -% - -3% ERP3, PA3 (3 inch /8 mm size) ERPA3 ERP3 ER3G Ω Ω k Ω k Ω k Ω M Ω % - -% - -% - -3% ERP (85 inch / mm size) ERP ERG Ω Ω k Ω k Ω k Ω M Ω % - -% - -% - -3% ERP8 ( inch / 3 mm size) ERP8 ER8G Ω Ω k Ω k Ω k Ω M Ω % - -% - -% - -3% ERP ( inch / 35 mm size) ERP ER Ω Ω k Ω k Ω k Ω M Ω Feb.

4 Anti-Pulse Thick Film Chip Resistors Anti-Pulse Thick Film Chip Re sis tors Type: ER T, T8, T ER T Features Anti-Pulse characteristics High pulse characteristics achieved by the optimized trimming specifi cations (ERT, T8, T) Further high pulse characteristics achieved by trimming-less specifi cations (ERT) High reliability Metal glaze thick fi lm resistive element and three layers of electrodes Suitable for both refl ow and fl ow soldering High power.5w : 85 inch / mm size (ERT).33W : inch / 3 mm size (ERT8).5W : inch / 35 mm size (ERT, ERT) Reference Standards IEC 5-8, IS C 5-8, EIA RC-3B AEC-Q qualifi ed RoHS compliant As for Packaging Methods, and Pattern, Soldering Conditions and Safety Precautions, Please see Data Files Explanation of Part Numbers ERT, T8, T Type E R T Product Thick Film Chip Resistors T T8 T Size, Power Rating Inch 85 Power R..5 W.33 W.5 W ± 5 % U Packaging Methods Packaging Punched Carrier Taping mm pitch, 5, pcs. Embossed Carrier Taping mm pitch, 5, pcs. ERT ERT8 ERT The first two digits are significant figures of resistance and the third one denotes number of zeros following. Example:. kω ERT Type E R T M U Product Thick Film Chip Resistors T Size, Power Rating Inch Power R..5 W Product specifications Specifications Trimming-less K M ± % ± % U Packaging Methods Packaging Embossed Carrier Taping mm pitch, 5, pcs. ERT The first two digits are significant figures of resistance and the third one denotes number of zeros following. Example:. kω Please contact us for (mm) and 3 (mm) size trimming-less types. Nov. 5

5 Anti-Pulse Thick Film Chip Resistors Construction Dimensions in mm (not to scale) Protective coating Alumina substrate Electrode (Inner) W a t Electrode (Between) b ERT (85) Dimensions (mm) W a b t Mass (Weight) [g/ pcs.]. ±..5 ±..5 ±.. ±.. ±. Thick fi lm resistive element Electrode (Outer) ERT8 () ERT ERT () ±..5 ±.. ±. 3. ±..5 ±..35 ±..5 ±.. ±. Ratings ERT (85) Power Rating at C (W) imiting Element oltage () Maximum Overload oltage () (%).5 5 ±5 Range (Ω) to M (E) T.C.R. ( / C) ess than Ω : to + ess than 33 Ω : ±3 More than 33 Ω : ± Category Temperature Range ( C) 55 to +55 ERT8 ().33 ±5 to M (E) ess than Ω : to + More than Ω : ± 55 to +55 ERT ().5 ±5 to M (E) ess than Ω : to + More than Ω : ± 55 to +55 ERT ().5 ± ± to M (E) ess than Ω : to + More than Ω : ± 55 to +55 () Rated Continuous Working oltage (RCW) shall be de ter mined from RCW= Power Rating Re sis tance alues, or imiting Element oltage list ed above, whichever less. () Overload (Short-time Overload) Test oltage (SOT) shall be de termined from SOT=.5 RCW or max. Over load olt age list ed above which ev er less. Power Derating Curve For resistors operated in ambient temperatures above C, power rating shall be derated in accordance with the figure on the right. Rated oad (%) 55 C C 8 55 C 8 8 Ambient Temperature ( C) Nov. 5

6 Anti-Pulse Thick Film Chip Resistors imiting Power Curve In rush pulse Characteristic Pp imiting Power Pulse duration : t Period time : s Test cycle : cycles Spec : value = within ± : Anti-Pulse Thick Film Chip Resistors (ERT Type) : Anti-Pulse Thick Film Chip Resistors (ERT Type) : Thick Film Chip Resistors (ER Type) ERT (85 inch/ mm size) ERT8 ( inch/3 mm size) ERT,ERT ( inch/35 mm size) imiting Power : Pp (W) Pulse duration t (msec) imiting Power : Pp (W) Pulse duration t (msec) imiting Power : Pp (W) Pulse duration t (msec) Please contact us for (mm) and 3 (mm) size trimming-less types. Nov. 5

7 Anti-Surge Thick Film Chip Resistors (Double-sided resistive elements structure) Anti-Surge Thick Film Chip Re sis tors (Double-sided resistive elements structure) 85 Type: ER PW Features ESD surge characteristics superior to standard metal fi lm resistors High reliability Metal glaze thick fi lm resistive element and three layers of electrodes Suitable for both refl ow and fl ow soldering High power.5 W : (85) size(erpw) High pulse characteristics.5 times higher than 85 inch size Anti-Surge Thick Film Chip Resistors (ERP) Reference Standards IEC 5-8, IS C 5-8, EIA RC-3B RoHS compliant Packaging Methods, and Pattern, Soldering Conditions and Safety Precautions Please see Data Files Explanation of Part Numbers Product Thick Film Chip Resistors Size, Power Rating Type: inch Power R. PW : 85.5 W F ± % ± 5 % The first two or three digits are significant figures of resistance and the third or th one denotes number of zeros following. Three digit type (±), four digit type (±%) Example:. k, k Packaging Methods Packaging Punched Carrier Taping mm pitch, 5, pcs. Construction Dimensions in mm (not to scale) Protective coating Electrode (Inner) a Alumina substrate W Electrode (Between) t a Electrode (Outer) Thick fi lm resistive element Bottom side element Type ERPW (85) Dimensions (mm) W a t Mass (Weight) [g/ pcs.]. ±..5 ±..35 ±..5 ±. Feb.

8 Anti-Surge Thick Film Chip Resistors (Double-sided resistive elements structure) Ratings Type ERPW (85) Power Rating (3) at C (W) imiting Element oltage () Maximum Overload oltage ().5 5 (%) ± ±5 Range (Ω) to M (E, E9) to M (E) T.C.R. ( / C) ± R < Ω to + Ω < R± Category Temperature Range ( C) 55 to +55 () Rated Continuous Working oltage (RCW) shall be de ter mined from RCW= Power Rating Re sis tance alues, or imiting Element oltage list ed above, whichever less. () Overload (Short-time Overload) Test oltage (SOT) shall be de termined from SOT=.5 Power Rating or max. Over load olt age list ed above which ev er less. (3) Use it on the condition that the case temperature is below 55 C. Power Derating Curve For resistors operated in ambient temperatures above C, power rating shall be derated in accordance with the fi gure on the right. ESD Characteristic R=(.5 k)/5(>.5 k) Rated oad (%) 55 C C 8 55 C 8 8 Ambient Temperature ( C) ±3.k C=5pF Sample Anti-Surge Thick Film Chip Resistors(ERPW Type) Thick Film Chip Resistors(ERG Type) % - -% - -% - -3% k k k M imiting Power Curve In rush pulse Characteristic Pp imiting Power Pulse duration : t Test cycle : cycles Spec : value = within ±% Anti-Surge Thick Film Chip Resistors(ERPW Type) Anti-Surge Thick Film Chip Resistors(ERP Type) imiting Power : Pp (W) Pulse duration t (msec) Feb.

Anti-Surge Thick Film Chip Resistors

Anti-Surge Thick Film Chip Resistors Anti-Surge Thick Film Chip Re sis tors Type: ER PA, P3, PA3, P, P8, P4 Fetures ESD surge chrcteristics superior to stndrd metl fi lm resistors High relibility Metl