DB Diode DB KEY PARAMETERS U RRM I F(AV) I FSM. up to 3000 V 4200 A A FEATURES APPLICATION ORDERING INFORMATION
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1 DB type DB are of modern design with pressure contacts, high alumina ceramic insulator and coldwelding encapsulation. Designed for use in power rectifying circuits and equipment under normal operating conditions. KEY PARAMETERS U RRM I FSM up to 3000 V 4200 A A FEATURES all diffused design high current capabilities high surge current capabilities high rated voltages low thermal impedance tested according to IEC standards APPLICATION High Voltage Power Supplies Motor Control Battery Chargers Free Wheeling Resistance Welding Outline type code: JEDEC DO-200AE See Package Details for further information Designed for use in high power industrial and commercial electronic circuits and equipment where high currents are encoutered and high reliability is essential. Low forward voltages let minimize energy loss. ORDERING INFORMATION When ordering please refer to device code builder presented below. Please use the complete part number when ordering, quote or in any future correspondence relating to your order. DB voltage class (hundreds of volts) 1/5
2 ELECTRICAL PARAMETERS Voltage ratings Voltage class U RRM U RSM I RRM V V ma Electrical properties Average forward case temperature Parameter Unit Test conditions Value ) A 4200 T c C 85 RMS forward current I F(RMS) A 6600 Surge current I FSM A T j=175 C, U R=0,8U RRM, t p=10ms I 2 t value I 2 t ka 2 s Forward voltage drop max. U FM V T j=25 C, I FM=4000A 1,13 Treshold voltage U F(T0) V 0,606 Slope resistance r F mω 0,105 Reverse recovery time t rr μs T j=25 C, I FM=2000A, di R/dt=25A/μs 25 Termal properties Thermal resistance, junction to case Thermal resistance, case to heatsink Parameter Unit Test conditions Value R thjc C/W two sided, DC 0,0115 R thcs C/W two sided 0,002 Operating junction temperature T jmin...t jmax C Storage temperature T stg C Mechanical properties Parameter Unit Value Clamping force F M kn Weight m g /5
3 Package details For further package information, please contact Sales & Marketing Department. All dimensions in mm, unless stated otherwise. Do not scale. 3/5
4 CHARACTERISTICS P F(AV), W Power loss characteristics o sin.180orec.180 rec.120 rec.60 o o DC T C, o C Case temperature ratings rec.60 o rec.120 o rec.180o sin.180 o DC U FM, V 4 I FSM, [ka] T j =T jmax T j =T jmax U R =0,8U RRM Forward characteristic I FM n Non-repetitive surge current rating 4/5
5 Z th(t), o C/W 0,1 0,01 0,001 0,0001 0,001 0,01 0, Transient thermal impedance t, s HEATSINKS LAMINA S.I. has its own proprietary range of extruded aluminium heatsinks designed to optimise the performance of our semiconductors with natural and forced air flow. High efficiency water cooled copper heatsinks are also available. DEVICE CLAMPS Disc devices require the correct clamping force to ensure their best operation. LAMINA S.I. offers a wide selection of clamps to suit all of our manufactured devices. POWER ASSEMBLY CAPABILITY LAMINA S.I. provides a support for those customers requiring more than a basic semiconductor and offers precisely assembled Power Blocks according to factory or customer standards. 5/5
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Datasheet of - DIODE ARRAY SCHOTTKY 5V 75A D60 Excellent Integrated System Limited Stocking Distributor Click to view price, real time Inventory, Delivery & Lifecycle Information: Vishay Semiconductor/Diodes
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