Sub1GHz FSK/GFSK Transmitter. A7328 Data Sheet, Sub 1GHz FSK/GFSK Transmitter with 2K~2Mbps data rate

Transcription

1 Document Title Data Sheet, Sub 1GHz FSK/GFSK Transmitter with 2K~2Mbps data rate Revision History Rev. No. History Issue Date Remark 0.0 Initial issue. Dec., 2009 Objective 0.1 Update register, pin order, etc. Feb., 2010 Objective 0.2 Update RF parameters Nov., 2010 Preliminary 0.3 Update recommended setting of Freq. deviation Jan., 2011 Preliminary 0.4 Modify the tape reel information and the add Shenzhen office address. Jul Preliminary 1.0 Full production. Jan., 2012 Important Notice: AMICCOM reserves the right to make changes to its products or to discontinue any integrated circuit product or service without notice. AMICCOM integrated circuit products are not designed, intended, authorized, or warranted to be suitable for use in life-support applications, devices or systems or other critical applications. Use of AMICCOM products in such applications is understood to be fully at the risk of the customer. 1

2 Table of Contents 1. Typical Application General Description Feature PIN Configuration PIN Description (I: Input, O: Output, I/O: Input or Output, G: Ground, D: Digital) Block Diagram Absolution Maximum Rating Electrical Specifications General Phase Locked Loop Transmitter Digital IO DC characteristics Control Register Control Register Table Control Register Description Mode Register (Address: 00h) Mode Control Register (Address: 01h) Calibration Control Register (Address: 02h) FIFO Register I (Address: 03h) FIFO Register II (Address: 04h) FIFO DATA Register II (Address: 05h) ID DATA Register (Address: 06h) RC OSC Register I (Address: 07h) RC OSC Register II (Address: 08h) RC OSC Register III (Address: 09h) CKO Pin Control Register (Address: 0Ah) GIO1 Pin Control Register (Address: 0Bh) Data Rate Clock Register (Address: 0Ch) PLL Register I (Address: 0Dh) PLL Register II (Address: 0Eh) PLL Register III (Address: 0Fh) PLL Register IV (Address: 10h) PLL Register V (Address: 11h) Channel Group Register I (Address: 12h) Channel Group Register II (Address: 13h) TX Register I (Address: 14h) TX Register II (Address: 15h) Delay Register I (Address: 16h) Delay Register II (Address: 17h) XTAL load (Address: 18h) PLL component (Address: 19h) ADC control Register I (Address: 1Ah) ADC control Register II (Address: 1Bh) Code Register I (Address: 1Ch) Code Register II (Address: 1Dh) PA Timing Control Register (Address: 1Eh) VCO Current Calibration Register (Address: 1Fh) VCO Bank Calibration Register I (Address: 20h) VCO Bank Calibration Register II (Address: 21h) VCO Deviation Calibration Register I (Address: 22h) VCO Deviation Calibration Register II (Address: 23h) VCO Deviation Calibration Register III (Address: 24h) VCO Modulation Delay Register (Address: 25h) Battery Detect Register (Address: 26h) TX Test Register (Address: 27h) Charge Pump Current Register I (Address: 28h) Charge Pump Current Register II (Address: 29h) Crystal Test Register (Address: 2Ah) PLL Test Register (Address: 2Bh) VCO Test Register (Address: 2Ch) RF Analog Test Register (Address: 2Dh)

3 Channel Selct Register (Address: 2Eh) VRB Register (Address: 2Fh) Data Rate Divider Register (Address: 30h) FCR Register (Address: 31h) SPI SPI Format SPI Timing Characteristic SPI Timing Chart Timing Chart of 3-wire SPI Timing Chart of 4-wire SPI Strobe Commands Strobe Command - Sleep Mode Strobe Command - ldle Mode Strobe Command - Standby Mode Strobe Command - PLL Mode Strobe Command - TX Mode Strobe Command FIFO Write Pointer Reset Strobe Command Deep Sleep Mode Reset Command ID Accessing Command ID Write Command ID Read Command FIFO Accessing Command TX FIFO Write Command State machine Key states Standby mode Sleep mode ldle mode PLL mode TX mode CAL mode Normal FIFO Mode Crystal Oscillator Circuit Use External Crystal Use External Clock System Clock Derive System Clock Data Rate Transceiver Frequency LO Frequency Setting Calibration Calibration Procedure VCO Current Calibration VCO Bank Calibration VCO Deviation Calibration FIFO (First In First Out) Packet Format of FIFO mode Bit Stream Process Transmission Time Usage of TX FIFO Easy FIFO Segment FIFO FIFO Extension ADC (Analog to Digital Converter) Temperature Measurement External Voltage Measurement Battery Detect Application Circuit MD7328-B90 (915MHz Band) MD7328-B80 (868MHz Band) MD7328-B80 (868MHz Band) MD7328-B40 (434MHz Band) Ordering Information Package Information

4 Symbol Top Marking Information Reflow Profile Tape Reel Information Product Status Important Notice: AMICCOM reserves the right to make changes to its products or to discontinue any integrated circuit product or service without notice. AMICCOM integrated circuit products are not designed, intended, authorized, or warranted to be suitable for use in life-support applications, devices or systems or other critical applications. Use of AMICCOM products in such applications is understood to be fully at the risk of the customer. 4

5 1. Typical Application ISM band Communication System Wireless audio/vedio streaming Remote Control Wireless Toy and Gaming Wireless Home Automation Wireless Alarm and Security 2. General Description is a high performance and low cost sub 1GHz (433M / 868M / 915MHz) transmitter. With on chip fractional-n synthesizer, this device supports frequency hopping system in data rate (on-air) from 2Kbps up to 2Mbps. Additional device features such as built-in 64 bytes TX FIFO, CRC (CCITT CRC-16 or CRC-DNP), FEC (7, 4) Hamming code, Machester encoding and SPI interface are used to simplify system development and cost. In addition to FIFO mode, also supports direct mode with TX data clock. All features make this device easy to be used together with a low cost MCU (micro-controller). For packet handling, has built-in 64-bytes TX FIFO (could be extended to 256 bytes) for data buffering and burst transmission, thermal sensor for monitoring relative temperature, one channel 8-bits ADC. Those functions are very easy to use while developing a wireless system. All features are integrated in a small QFN 4X4 16 pins package. s data rate is up to 2Mbps programmed by 3-wire or 4-wire SPI.For power saving, supports deep sleep mode, sleep mode, idle mode, and standby mode. For easy-to-use, has a unique SPI command set called Strobe command that are used to control s state machine and registers. Based on Strobe commands, from power saving, TX delivery, frequency hopping to auto calibrations, MCU only needs to control s registers and to send Strobe commands via SPI. In addition, has two general purpose I/O pins (GIO1 and CKO) to inform MCU its status so that MCU could either use polling or interrupt scheme to do radio control. Interface between MCU and is digital, it leads a simple way to develop a wireless system as well as transmission status. 3. Feature Small size (QFN4 X4, 16 pins). Support 433/868/915 MHz band. Support FSK/GFSK modulation. Programmable data rate from 2kbps to 2Mbps. Deelp sleep current (TBD). Sleep current (1.5 ua). TX current 10 dbm, 915MHz) TX current 10 dbm, MHz) On-Chip VCO and Fractional-N PLL. Programmable RF output power -20dBm ~ 10dBm. On chip regulator, supports input voltage 2.2 ~ 3.6V. Easy to use u Support 3-wire or 4-wire SPI. u Unique Strobe command via SPI. u Change frequency channel by ONE register setting. u Auto Calibrations. u Auto FEC by (7, 4) Hamming code. u Auto Manchester encoding. u Data Whitening for packet encryption. u 64 bytes TX FIFO. u Dynamic FIFO Length u Easy FIFO / Segment FIFO / FIFO Extension (up to 256 bytes). Support low cost crystal ( 12 / 16 MHz). Support low accuracy crystal within ± 50 ppm. Support crystal sharing ( 1 / 2 / 4 / 8MHz) to MCU. Built-in thermal sensor to monitor relative temperature. Built-in 1 channel 8-bits ADC (range 0.3 V ~ 1.5 V). Built-in Battery Detector. 5

6 4. PIN Configuration 433/868/915MHz TX 433/868/915MHz TRX Figure 4.1 QFN 4x4 Package Top View 6

7 5. PIN Description (I: Input, O: Output, I/O: Input or Output, G: Ground, D: Digital) Pin No. Symbol I/O Function Description 1 BP_BG O Band-gap bypass. Connect to bypass capacitor. 2 VDD_A O Analog supply voltage output. Connect to bypass capacitor. 3 RFO O RF output. Connect to PA matching circuit. 4 VDD_VCO I VCO power supply input. Connect to VDD_A. 5 CP O Charge-pump output. Connect to loop filter. 6 XI I Crystal oscillator input. 7 XO O Crystal oscillator output. 8 VDD_PLL O PLL power supply input. Connect to VDD_A. 9 VDD_D O Digital supply voltage output. Connect to bypass capacitor. 10 SCS DI SPI chip select input. 11 SCK DI SPI clock input. 12 SDIO DI/O SPI data In/Out. 13 GIO1 DI/O Multi-function IO / SPI data output. 14 CKO DO Multi-function clock output / WTR output. 15 REGI I Regulator input. Connect to VDD supply. 16 EXAD I External ADC input. Back side plate G Ground. Back side plate shall be well-solder to ground; otherwise, it will impact RF performance. 7

8 6. Block Diagram Figure 6.1 Block Diagram 8

9 7. Absolution Maximum Rating Parameter With respect to Rating Unit Supply voltage range (VDD) GND -0.3 ~ 3.9 V Other I/O pins range GND -0.3 ~ VDD+0.3 V Storage Temperature range -55 ~ 125 C ESD Rating HBM * ± 2K V MM * ± 100 V *Stresses above those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings only; functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. *Device is ESD sensitive. Use appropriate ESD precautions. HBM (Human Body Mode) is tested under MIL-STD-883F Method MM (Machine Mode) is tested under JEDEC EIA/JESD22-A115-A. *Device is Moisture Sensitivity Level III (MSL 3). 9

10 8. Electrical Specifications (Ta=25, VDD=3.3V, F XTAL =16MHz, RF = 915MHz, with Matching Network and low pass filter, On Chip Regulator = 1.8V, unless otherwise noted.) Parameter Description Minimum Typical Maximum Unit General Operating Temperature C Supply Voltage (VDD) Regulator supply input V Current Consumption Deep sleep Mode (1*) TBD ua (no register retention) Sleep Mode (regulator on) (1*) 1.5 ua Idle Mode (1*) 0.15 ua Standby Mode (XOSC on, 2 ma Clock generator on) PLL Mode 10 ma TX 10dBm 32 ma TX 10dBm 31 ma TX 10dBm 32 ma TX 1dBm 22 ma TX 1dBm 20 ma TX 1dBm 19 ma Phase Locked Loop X TAL Start-up Time (2*) 400 ms PLL settling time 60 ms X TAL Frequency (F XTAL) 12, 16 MHz Xtal Series Resistance (ESR) Cload =18pF 80 ohm VCO Operation Frequency MHz Offset 100k (RBW = 1KHz, VBW=30Hz) -85 dbc PLL phase noise Offset 500k (RBW = 1KHz, VBW=100Hz) -105 dbc Offset 2M (RBW = 1KHz, VBW=300Hz) -110 dbc Transmitter TX Power Range dbm Data rate 2K 500K 2M bps Frequency Deviation 2Mbps 500 KHz 1Mbps 500 KHz 500Kbps KHz 100Kbps or KHz Out Band Spurious Emission (4*) With HPF 25MHz~470MHz MHz~862MHz MHz~ 1GHz -36 above 1GHz nd harmonic With LPF -30 dbm 3 rd harmonic With LPF -30 dbm TX Settling Time 80 ms Digital IO DC characteristics High Level Input Voltage (V IH) 0.8*VDD VDD V Low Level Input Voltage (V IL) 0 0.2*VDD V High Level Output Voltage (V OH= -0.5mA VDD-0.4 VDD V Low Level Output Voltage (V OL= 0.5mA V dbm 10

11 Note 1: In deep sleep mode, registers (data) have no retention. When digital I/O pins are configed as input, those pins shall NOT be floating but pull either high or low (SCS shall be pulled high only); otherwise, more leakage current will be occured. Note 2: Refer to Delay Register II (17h) to set up crystal settling delay. Note 3: Refer to Delay Register I (16h) to set up PDL (PLL settling delay). Note 4: Measured with on board filter. Note 5: Refer to Delay Register I (16h) to set up TDL delay 11

12 9. Control Register has totally built-in 52 control registers that cover all radio control. MCU can access those control registers via 3-wire or 4-wire SPI (max. SPI data rate up to 10 Mbps). User can refer to chapter 10 for details about SPI interface. is simply controlled by registers and outputs its status to MCU by GIO1 pin or CKO pin (WTR). 9.1 Control Register Table Address / Name R/W Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 00h Mode 01h Mode control W RESETN RESETN RESETN RESETN RESETN RESETN RESETN RESETN R - CER XER PLLER TRER W DDPC SPSS WOTE FMS ADCM R DDPC WOTE FMS ADCM 02h Calc R/W VCC VBC VDC 03h FIFO I W FEP7 FEP6 FEP5 FEP4 FEP3 FEP2 FEP1 FEP0 04h FIFO II W FPM1 FPM0 PSA5 PSA4 PSA3 PSA2 PSA1 PSA0 05h FIFO Data R/W FIFO7 FIFO6 FIFO5 FIFO4 FIFO3 FIFO2 FIFO1 FIFO0 06h ID Data R/W ID7 ID6 ID5 ID4 ID3 ID2 ID1 ID0 07h RC OSC I W WWS_SL7 WWS_SL6 WWS_SL5 WWS_SL4 WWS_SL3 WWS_SL2 WWS_SL1 WWS_SL0 R CALWR RCOC6 RCOC5 RCOC4 RCOC3 RCOC2 RCOC1 RCOC0 08h RC OSC II W WWS_SL9 WWS_SL8 WWS_AC5 WWS_AC4 WWS_AC3 WWS_AC2 WWS_AC1 WWS_AC0 09h RC OSC III W BBCKS1 BBCKS0 RCOT1 RCOT0 CALWR RCOSC_E TSEL TWWS_E 0Ah CKO Pin W ECKOE CKOS3 CKOS2 CKOS1 CKOS0 CKOI CKOE SCKI 0Bh GIO1 Pin I W - - GIO1S3 GIO1S2 GIO1S1 GIO1S0 GIO1I GIO1OE 0Ch Data Rate Clock W IFS -- GRC3 GRC1 GRC1 GRC0 CGS XS R IFS -- GRC3 GRC2 GRC1 GRC Dh PLL I R/W CHN7 CHN6 CHN5 CHN4 CHN3 CHN2 CHN1 CHN0 0Eh PLL II 0Fh PLL III 10h PLL IV 11h PLL V W DBL RRC1 RRC0 CHR3 CHR2 CHR1 CHR0 IP8 R DBL RRC1 RRC0 CHR3 CHR2 CHR1 CHR0 BIP8 W BIP7 BIP6 BIP5 BIP4 BIP3 BIP2 BIP1 BIP0 R IP7 IP6 IP5 IP4 IP3 IP2 IP1 IP0 W BFP15 BFP14 BFP13 BFP12 BFP11 BFP10 BFP9 BFP8 R 0 AC14-FP14 AC13-FP13 AC12-FP12 AC11-FP11 AC10-FP10 AC9-FP9 AC8-FP8 W BFP7 BFP6 BFP5 BFP4 BFP3 BFP2 BFP1 BFP0 R AC7-FP7 AC6-FP6 AC5-FP5 AC4-FP4 AC3-FP3 AC2-FP2 AC1-FP1 AC0-FP0 12h Channel Group I R/W CHGL7 CHGL6 CHGL5 CHGL4 CHGL3 CHGL2 CHGL1 CHGL0 13h Channel Group II R/W CHGH7 CHGH6 CHGH5 CHGH4 CHGH3 CHGH2 CHGH1 CHGH0 14h TX I W GDR GF TMDE TXDI TME FDP2 FDP1 FDP0 15h TX II W FD7 FD6 FD5 FD4 FD3 FD2 FD1 FD0 16h Delay I W DPR2 DPR1 DPR0 TDL1 TDL0 PDL2 PDL1 PDL0 17h Delay II W WSEL2 WSEL1 WSEL0 WOTS1 WOTS0 18h Xtal Load W CSXTL4 CSXTL3 CSXTL2 CSXTL1 CSXTL0 INTXC 19h PLL component W EDRL HECS STS RGC1 RGC0 VRPL1 VRPL0 INTPRC 12

13 1Ah ADC control I W AVSEL1 AVSEL0 MVSEL1 MVSEL0 RMP1 RMP0 1Bh ADC Control II W --- CELS XADPS --- RADC FSARS XADS CDM R ADC7 ADC6 ADC5 ADC4 ADC3 ADC2 ADC1 ADC0 1Ch Code I W MCS WHTS FECS CRCS IDL1 IDL0 PML1 PML0 1Dh Code II W HWCKS WS6 WS5 WS4 WS3 WS2 WS1 WS0 1Eh PA Timing W - TRT2 TRT1 TRT0 ASMV2 ASMV1 ASMV0 AMVS 1Fh W --- VCRLS VBS MVCS VCOC3 VCOC2 VCOC1 VCOC0 VCO current Calibration R VCCF VCB3 VCB2 VCB1 VCB0 20h W DDC1 DDC0 MDAGS CWS MVBS MVB2 MVB1 MVB0 VCO band Calibration I R VBCF VB2 VB1 VB0 21h W MDAG7 MDAG6 MDAG5 MDAG4 MDAG3 MDAG2 MDAG1 MDAG0 VCO band Calibration II R ADAG7 ADAG6 ADAG5 ADAG4 ADAG3 ADAG2 ADAG1 ADAG0 22h W DEVS3 DEVS2 DEVS1 DEVS0 DAMR_M VMTE_M VMS_M MSEL VCO deviation Calibration I R DEVA7 DEVA6 DEVA5 DEVA4 DEVA3 DEVA2 DEVA1 DEVA0 23h W MVDS MDEV6 MDEV5 MDEV4 MDEV3 MDEV2 MDEV1 MDEV0 VCO deviation Calibration II R ADEV7 ADEV6 ADEV5 ADEV4 ADEV3 ADEV2 ADEV1 ADEV0 24h VCO deviation Calibration III 25h VCO modulation Delay 26h Battery detect W VMG7 VMG6 VMG5 VMG4 VMG3 VMG2 VMG1 VMG0 W DMV1 DMV0 DEVFD2 DEVFD1 DEVFD0 DEVD2 DEVD1 DEVD0 W ECKS RGV1 RGV0 QDS BVT2 BVT1 BVT0 BD_E R - RGV1 RGV0 BDF BVT2 BVT1 BVT0 BD_E 27h TX test W ASKS PAC1 PAC0 TDC1 TDC0 TBG2 TBG1 TBG0 28h Charge Pump Current I 29h Charge Pump Current II W CPM3 CPM2 CPM1 CPM0 CPT3 CPT2 CPT1 CPT0 W CPTX3 CPTX2 CPTX1 CPTX0 2Ah Crystal test W LVR RGS MD1 MD0 DBD XCC XCP1 XCP0 2Bh PLL test W SDMS CPS PRIC1 PRIC0 PRRC1 PRRC0 SDPW NSDO 2Ch VCO test W DEVGD2 DEVGD1 DEVGD0 LOB1 LOB0 DIVRF1 DIVRF0 VCBS 2Dh RF Analog test W MDEN OLM CPH CPCS RFT2 RFT1 RFT0 2Eh Channel Select W DMGS RSIS ROSCS CHD3 CHD2 CHD1 CHD0 2Fh VRB W VTRB3 VTRB2 VTRB1 VTRB0 VMRB3 VMRB2 VMRB1 VMRB0 30h SDR W SDR7 SDR6 SDR5 SDR4 SDR3 SDR2 SDR1 SDR0 31h FCR W FCL1 FCL0 CRCINV CRCDNP Eh FCB W FCB7 FCB6 FCB5 FCB4 FCB3 FCB2 FCB1 FCB0 Legend: - = unimplemented 13

14 9.2 Control Register Description Mode Register (Address: 00h) R CER XER PLLER TRER Name W RESETN RESETN RESETN RESETN RESETN RESETN RESETN Reset RESETN: Write to this register by 0x00 to issue reset command, then it is auto clear CER: Chip Status. (Read only) [0]: Chip is disabled. [1]: Chip is enabled. XER: Xtal Status. (Read only) [0]: Crystal oscillator is disabled. [1]: Crystal oscillator is enabled. PLLER: PLL Status. (Read only) [0]: PLL is disabled. [1]: PLL is enabled after PLL strobe command. TRER: TRX Status I. (Read only) [0]: TRX is disabled. [1]: TRX is enabled Mode Control Register (Address: 01h) R DDPC WOTE FMS ADCM Name W DDPC SPSS WOTE FMS ADCM Reset DDPC (Direct mode data pin control): Direct mode modem data can be accessed via SDIO pin. [0]: Disable. [1]: Enable. WOTE: Reserved for internal usage, shall be set to [0]. FMS: Direct/FIFO mode select. [0]: Direct mode. [1]: FIFO mode. ADCM: ADC measurement (Auto clear when done). [0]: Disable. [1]: Enable. Standby mode [0] Disable ADC [1] Measure thermal sensor. Refer to chapter 17 for details Calibration Control Register (Address: 02h) Name R/W VCC VBC VDC Reset VCC: VCO Current calibration enable (Auto clear when done). [0]: Disable. [1]: Enable. VBC: VCO Bank calibration enable (Auto clear when done). [0]: Disable. [1]: Enable. VDC: VCO Deviation calibration enable (Auto clear when done). [0]: Disable. [1]: Enable FIFO Register I (Address: 03h) Name W FEP7 FEP6 FEP5 FEP4 FEP3 FEP2 FEP1 FEP0 R 14

15 Reset FEP [7:0]: FIFO End Pointer for TX FIFO FIFO Register II (Address: 04h) Name W FPM1 FPM0 PSA5 PSA4 PSA3 PSA2 PSA1 PSA0 Reset FPM [1:0]: FIFO Pointer Margin. Used in FIFO extension mode. PSA [5:0]: Used for Segment FIFO. Used in FIFO segment mode. Refer to chapter 16 for details FIFO DATA Register II (Address: 05h) Name R/W FIFO7 FIFO6 FIFO5 FIFO4 FIFO3 FIFO2 FIFO1 FIFO0 Reset FIFO [7:0]: TX FIFO TX FIFO is ok to do read and write. Refer to chapter 16 for details ID DATA Register (Address: 06h) Name R/W ID7 ID6 ID5 ID4 ID3 ID2 ID1 ID0 Reset ID [7:0]: ID Data. Programmble to 2 / 4 / 6 / 8 bytes according to IDL[1:0] (1Ch). ID data is ok to do read and write. Refer to section 10.6 and chapter 16 for details RC OSC Register I (Address: 07h) R -- RCOC6 RCOC5 RCOC4 RCOC3 RCOC2 RCOC1 RCOC0 Name W WWS_SL7 WWS_SL6 WWS_SL5 WWS_SL4 WWS_SL3 WWS_SL2 WWS_SL1 WWS_SL0 Reset RCOC [6:0]: RC Oscillator Calibration result (read only). WWS_SL [7:0]: Reserved RC OSC Register II (Address: 08h) Name W WWS_SL9 WWS_SL8 WWS_AC5 WWS_AC4 WWS_AC3 WWS_AC2 WWS_AC1 WWS_AC0 R Reset WWS_AC [5:0]: Reserved. WWS_SL [9:8]: Reserved. 15

16 RC OSC Register III (Address: 09h) Name W BBCKS1 BBCKS0 RCOT1 RCOT0 CALWR RCOSC_E TSEL TWWS_E Reset BBCKS [1:0]: Clock select for digital block. Recommend BBCKS = [00]. [00]: F SYCK. [01]: F SYCK / 2. [10]: F SYCK / 4. [11]: F SYCK / 8. RCOT [1:0]: RC OSC current select. [00]: 240nA [01]: 280nA [10]: 320nA [11]: 360nA CALWR: RC Oscillator Calibration Enable. [0]: Disable. [1]: Enable. RCOSC_E: RC Oscillator Enable. [0]: Disable. [1]: Enable. TSEL: Reserved. WWS_E: Reserved CKO Pin Control Register (Address: 0Ah) Name W ECKOE CKOS3 CKOS2 CKOS1 CKOS0 CKOI CKOE SCKI Reset ECKOE: CKO pin output enable. [0]: Disable. [1]: Enable. CKOS [3:0]: CKO pin output select. [0000]: DCK (TX data clock). [0001]: RCK (RX recovery clock). [0010]: FPF (FIFO pointer flag). [0011]: Logic OR gate by EOP, EOVBC, EOFBC, EOVCC, EOVDC and RSSC_OK. (Internal usage only). [0100]: F SYCK / 2. [0101]: F SYCK / 4. [0110]: F SYCK / 8. [0111]: F SYCK / 16. [1000]: WCK. [1001]: PF8M. [1010]: ROSC. [1011]: OKADCN. [1100]: BDF. [1101]: F SYCK. [1110]: WTR. [1111]: Reserved. CKOI: CKO pin output signal invert. [0]: Non-inverted output. [1]: Inverted output. CKOE: CKO pin Output Enable. [0]: High Z. [1]: Enable. SCKI: SPI clock input invert. [0]: Non-inverted input. [1]: Inverted input GIO1 Pin Control Register (Address: 0Bh) Name W GIO1S3 GIO1S2 GIO1S1 GIO1S0 GIO1I GIO1OE Reset GIO1S [3:0]: GIO1 pin function select. 16

17 GIO1S [3:0] TX state [0000] WTR (Wait until TX finish) [0001] EOAC (end of access code) [0010] TMEO or TMEOD output [0011] Reserved. [0100] Reserved. [0101] Reserved. [0110] SDO ( 4 wires SPI data out) [0111] Direct mode data input. [1000] FMTDO (FIFO mode Data out) [1001] TXD (Direct mode data out) [1010] PDN_TX [1011] Reserved. [1100] EOADC [1101] Reserved. [1110] BDF [11xx] Reserved. GIO1I: GIO1 pin output invert. [0]: Non-inverted output. [1]: Inverted output. GIO1OE: GIO1 pin output enable. [0]: High Z. [1]: Enable Data Rate Clock Register (Address: 0Ch) R IFS GRC3 GRC2 GRC1 GRC Name W IFS GRC3 GRC2 GRC1 GRC0 CGS XS Reset IFS: IF Frequency Select. [0]: 500KHz. [1]: 2MHz. GRC [3:0]: Generator Reference Counter. Clock generation reference = F CRYSTAL / (GRC+1) = 2MHz. Refer to chapter 13 for details. CGS: Clock generator enable. Recommend CGS = [1]. [0]: Disable. [1]: Enable. XS: Crystal oscillator select. Recommend XS = [1] [0]: Use external clock. [1]: Use external crystal PLL Register I (Address: 0Dh) Name R/W CHN7 CHN6 CHN5 CHN4 CHN3 CHN2 CHN1 CHN0 Reset CHN [7:0]: RF LO channel number. Refer to chapter 14 for details PLL Register II (Address: 0Eh) R DBL RRC1 RRC0 CHR3 CHR2 CHR1 CHR0 IP8 Name W DBL RRC1 RRC0 CHR3 CHR2 CHR1 CHR0 BIP8 Reset DBL: Crystal frequency doubler enable. [0]: Disable. F XREF = F XTAL. [1]: Enable. F XREF =2 * F XTAL. RRC [1:0]: RF PLL reference counter setting. 17

18 The PLL comparison frequency, F PFD = F CRYSTAL *(DBL+1) / (RRC+1). CHR [3:0]: PLL channel step setting. Refer to chapter 14 for details PLL Register III (Address: 0Fh) R IP7 IP6 IP5 IP4 IP3 IP2 IP1 IP0 Name W BIP7 BIP6 BIP5 BIP4 BIP3 BIP2 BIP1 BIP0 Reset BIP [8:0]: LO base frequency integer part setting (write only). BIP [8:0] are from address (0Eh) and (0Fh). IP [8:0]: LO frequency integer part value (read only). IP [8:0] are from address (0Eh) and (0Fh). The wanted RF formula F LO_BASE 1 BFP[15 : 0] = FPFD ( BIP[8: 0] + ) 16 n 2 1 F = ( DBL + 1) ( BIP[8: 0] n RRC[1: 0] + 1 where f dev XTAL + BFP[15 : 0] ) 16 2 is the wanted TX frequency deviation. Where n = 2 for MD = [10] or [11], 868M / 915MHz band Where n = 4 for MD = [01], 433M band Where n = 6 for MD = [00], 315MHz band MD[1:0] is located at address 2Ah [Bit5, Bit4]. DBL and RRC[1:0] are located at address 0Eh. Refer to chapter 14 for details PLL Register IV (Address: 10h) R AC14/FP14 AC13/FP13 AC12/P12 AC11/ FP11 AC10/FP10 AC9/FP9 AC8/FP8 Name W BFP15 BFP14 BFP13 BFP12 BFP11 BFP10 BFP9 BFP8 Reset PLL Register V (Address: 11h) R AC7/FP7 AC6/FP6 AC5/FP5 AC4/FP4 AC3/FP3 AC2/FP2 AC1/FP1 AC0/FP0 Name W BFP7 BFP6 BFP5 BFP4 BFP3 BFP2 BFP1 BFP0 Reset BFP [15:0]: LO base frequency fractional part setting. ( [0x0000] is forbidden.) BFP [15:0] are from address (10h) and (11h), AC [14:0]: Frequency compensation value (read only) Channel Group Register I (Address: 12h) Name R/W CHGL7 CHGL6 CHGL5 CHGL4 CHGL3 CHGL2 CHGL1 CHGL0 Reset

19 CHGL [7:0]: PLL channel group low boundary setting Channel Group Register II (Address: 13h) Name R/W CHGH7 CHGH6 CHGH5 CHGH4 CHGH3 CHGH2 CHGH1 CHGH0 Reset CHGH [7:0]: PLL channel group high boundary setting. PLL frequency is divided into 3 groups: Channel Group1 0 ~ CHGL-1 Group2 CHGL ~ CHGH-1 Group3 CHGH ~ 255 Note: Recommend to let each group have its own VCO current, bank and deviation calibration value to get the best RF performance TX Register I (Address: 14h) Name W GDR GF TMDE TXDI TME FDP2 FDP1 FDP0 Reset GDR: Gaussian Filter Oversampling Rate Select. [0]: BT= 0.7 [1]: BT= 0.5 GF: Gaussian Filter Select. [0]: Disable. [1]: Enable. TMDE: TX Modulation Enable for VCO Modulation. [0]: Disable. [1]: Enable. TXDI: TX data invert. Recommend TXDI = [0]. [0]: Non-invert. [1]: Invert. TME: TX modulation enable. [0]: Disable. [1]: Enable. FDP [2:0]: Frequency deviation power setting TX Register II (Address: 15h) Name W FD7 FD6 FD5 FD4 FD3 FD2 FD1 FD0 Reset FD [7:0]: Frequency deviation setting. For both Gaussian filter is on (GS =1) or off(gs = 0): 1 = f n f PFD 2 FD[7 : 0] ( FDP[2:0] -1) f (unit: Hz) dev where dev is the wanted TX frequency deviation. Where n = 2 for MD = [10] or [11], 868M / 915MHz band Where n = 4 for MD = [01], 433M band Where n = 6 for MD = [00], 315MHz band MD[1:0] is VCO divider located at address 2Ah [Bit5, Bit4]. FDP[2:0] is located at address 14h [Bit2, Bit1, Bit0] Freq. Band Data Rate FD[7:0] Fdev (KHz) 915MHz 2Mbps 0x

20 1Mbps 0x Kbps 0x Kbps 0x0C (larger Fdev setting) 100Kbps 0x (smaller Fdev setting) Freq. Band Data Rate FD[7:0] Fdev (KHz) 868MHz 500Kbps 0x Kbps 0x0C (larger Fdev setting) 100Kbps 0x (smaller Fdev setting) Freq. Band Data Rate FD[7:0] Fdev (KHz) 433MHz 2Mbps 0x Mbps 0x Kbps 0x Kbps 0x (larger Fdev setting) 100Kbps 0x0C (smaller Fdev setting) Delay Register I (Address: 16h) Name W DPR2 DPR1 DPR0 TDL1 TDL0 PDL2 PDL1 PDL0 Reset DPR [2:0]: Delay scale. Recommend DPR = [000]. TDL [1:0]: Delay for TRX settling from WPLL to TX/RX. Delay= 20 * (TDL [1:0]+1)*(DPR [2:0]+1) us. DPR [1:0] TDL [1:0] WPLL to TX Note us us us us Recommend PDL [2:0]: Delay for TX settling from PLL to WPLL. Delay= 20 * (PDL [2:0]+1)*(DPR [1:0]+1) us. DPR [1:0] PDL [2:0] PLL to WPLL Note (LO freq changed) us us Recommend us us GIO 1 Pin (WTR) RFO Pin PLL Mode TX Strobe TX Mode Packet (Preamble + ID + Payload) PDL TDL Delay Register II (Address: 17h) Name W WSEL2 WSEL1 WSEL0 WOTS1 WOTS0 Reset WSEL [2:0]: XTAL settling delay setting (200us ~ 2.5ms). Recommend WSEL = [010]. 20

21 [000]: 200us. [001]: 400us. [010]: 600us, [011]: 800us. [100]: 1ms. [101]: 1.5ms. [110]: 2ms. [111]: 2.5ms. Crystal Oscillator GIO1 Pin (WTR) Id le mode 350 us WSEL TX or RX mode RFO Pin PDL TDL Packet (Preamble + ID + Payload) WOTS [1:0]: Resered. Shall be set to [00] XTAL load (Address: 18h) Name R W CSXTL4 CSXTL3 CSXTL2 CSXTL1 CSXTL0 INTXC Reset CSXTAL[4:0]: Reserved. Shall be set to [00000] INTXC: Reseved. Shall be set to [0] PLL component (Address: 19h) Name W EDRL HECS STS RGC1 RGC0 VRPL1 VRPL0 INTPRC Reset EDRL: Enable Dynamic FIFO Length [0]: Disable. [1]: Enable. HECS: Header CRC-8 Enable. [0]: Disbale. [1]: enable If HECS = 1, HEC (one byte) is added into TX-Packet. Refer to chapter 16 for details. STS: Reserved for internal usage. Recommend STS = [0]. RGC[1:0]: Reserved. Recommend RGC = [00]. VRPL[1:0]: Reserved. Recommend VRPL = [00]. INTPRC: Reserved. Recommend INTPRC = [0] ADC control Register I (Address: 1Ah) R Name W AVSEL1 AVSEL0 MVSEL1 MVSEL0 RMP1 RMP0 Reset AVSEL [1:0]: ADC average mode. Recommend AVSEL = [10]. [00]: No average. [01]: 2. [10]: 4. [11]: 8. MVSEL [1:0]: ADC average mode for VCO calibration. Recommend MVSEL = [10]. [00]: 8. [01]: 16. [10]: 32. [11]: 64. RMP[1:0]: TX ramp up scaler. Recommend RMP= [00]. [00]: 1. [01]: 2. [10]: 4. [11]: 8. 21

22 ADC control Register II (Address: 1Bh) R ADC7 ADC6 ADC5 ADC4 ADC3 ADC2 ADC1 ADC0 Name W CELS XADPS RADC FSARS XADS CDM Reset ADC [7:0]: ADC digital output value (read only). ADC input voltage= * ADC [7:0] / 256 V. CELS: Bandgap Selection for Digital Regulator. Recommend CELS = [1]. [0]: Analog. [1]: Digital. XADPS: External ADC Input Pin Selection. [0]: Disable. [1]: Enable. RADC: ADC Read Out Average Mode. [0]: 1, 2, 4, 8 average mode. If RADC = 0, ADC average is set by AVSEL[1:0] (1Ah). [1]: 8, 16, 32, 64 average mode. If RADC = 1, ADC average is set by MVSEL[1:0] (1Ah). FSARS: ADC Clock Select. [0]: 4MHz. [1]: 8MHz. XADS: External ADC Input Signal Select. [0]: Disable. [1]: Enable. CDM: Temperature measurement mode. Recommend CDM = [0]. [0]: Single mode. [1]: Continuous mode Code Register I (Address: 1Ch) Name W MCS WHTS FECS CRCS IDL1 IDL0 PML1 PML0 Reset MSC: Manchester Enable. [0]: Disable. [1]: Enable. WHTS: Data Whitening (Data Encryption) Select. [0]: Disable. [1]: Enable (The data is whitening by multiplying PN7). FECS: FEC Select. [0]: Disable. [1]: Enable (The FEC is (7, 4) Hamming code). CRCS: CRC Select. [0]: Disable. [1]: Enable. The CRC is set by CRCDNP (31h) for either CCITT-16 CRC or CRC-DNP IDL[1:0]: ID Code Length Select. Recommend IDL= [01]. [00]: 2 bytes. [01]: 4 bytes. [10]: 6 bytes. [11]: 8 bytes. PML [1:0]: Preamble Length Select. Recommend PML= [11]. [00]: 1 byte. [01]: 2 bytes. [10]: 3 bytes. [11]: 4 bytes Code Register II (Address: 1Dh) Name W HWCKS WS6 WS5 WS4 WS3 WS2 WS1 WS0 Reset HWCKS: RTC clock select. [0]:4.096KHZ. [1]:2.048KHZ. WS [6:0]: Data Whitening Seed (data encryption key) PA Timing Control Register (Address: 1Eh) Name R

23 W TRT2 TRT1 TRT0 ASMV2 ASMV1 ASMV0 AMVS Reset TRT [2:0]: TX Ramp down discharge current select. Recommand TRT = [111]. ASMV [2:0]: TX Ramp up timing select. Recommand ASMV=[111]. [000]: 2us. [001]: 4us. [010]: 6us. [011]: 8us. [100]: 10us, [101]: 12us. [110]: 14us. [111]: 16us. Actual TX ramp up time = ASMV [2:0] x RMP[1:0] AMVS : TX Ramp Up Enable. Recommand AMVS=[1]. [0]: Disable. [1]: Enable VCO Current Calibration Register (Address: 1Fh) R VCCF VCB3 VCB2 VCB1 VCB0 Name W -- VCRLS VBS MVCS VCOC3 VCOC2 VCOC1 VCOC0 Reset VCCF : VCO Current Auto Calibration Flag. [0]: Pass. [1]: Fail. VCB [3:0]: VCO Current Bank Calibration result. If MVCS= 0, VCB[3:0] is auto calibration result. If MVCS= 1, VCB[3:0] is manual calibration setting. VCRLS : VCO Current Resistor Select. Recommand VCRLS=[0]. [0]: low current. [1]: high current. VBS : VCO Band Select. [0]: 915MHz. [1]: 868MHz / 433MHz. MVCS: VCO current calibration select. Recommend MVCS = [0]. [0]: Auto. [1]: Manual. VCOC [3:0]: VCO Current Bank Manual Calibration setting. Refer to chapter 15 for details VCO Bank Calibration Register I (Address: 20h) R VBCF VB2 VB1 VB0 Name W DCD1 DCD0 MDAGS CWS MVBS MVB2 MVB1 MVB0 Reset VBCF: VCO Band Auto Calibration Flag. [0]: Pass. [1]: Fail. VB [2:0]: VCO Bank Calibration Value (read only). If MVBS= 0, VB[2:0] is auto calibration result. If MVBS= 1, VB[2:0] is manual calibration setting. DCD [1:0]: VCO Deviation Calibration Delay. Delay time = PDL (Delay Register I, 17h) ( DCD + 1 ). Please refer to AMICCOM reference code for optimization in different RF band. CWS: Clock Disable for VCO Modulation. Recommend CWS = [0]. [0]: Enable. [1]: Disable. DAGS: DAG Calibration Value Select. Recommend DAGS = [0]. [0]: Auto. [1]: Manual. MVBS: VCO Bank Calibration Select. Recommend MVBS = [0]. [0]: Auto. [1]: Manual. MVB [2:0]: Manual VCO Band Setting. VCO frequency increases when MVB increases. 23

24 Refer to chapter 15 for details VCO Bank Calibration Register II (Address: 21h) R ADAG7 ADAG6 ADAG5 ADAG4 ADAG3 ADAG2 ADAG1 ADAG0 Name W MDAG7 MDAG6 MDAG5 MDAG4 MDAG3 MDAG2 MDAG1 MDAG0 Reset ADAG [7:0]: Auto DAG Calibration result. MDAG [7:0]: DAG Manual Setting Value. Recommend DAGM = [0x80] VCO Deviation Calibration Register I (Address: 22h) R DEVA7 DEVA6 DEVA5 DEVA4 DEVA3 DEVA2 DEVA1 DEVA0 Name W DEVS3 DEVS2 DEVS1 DEVS0 DAMR_M VMTE_M VMS_M MSEL Reset DEVA [7:0]: Deviation Calibration result (read only). If MVDS (23h) = 0, DEVA [7:0] is auto calibration result ((DEVC / 8) (DEVS + 1)). If MVDS (23h) = 1, DEVA [7:0] is manual calibration result (DEVM [6:0]). DEVS [3:0]: Deviation Output Scaling. Freq. Band Data Rate DEVS[3:0] 915MHz 2Mbps Mbps Kbps Kbps 0111 Freq. Band Data Rate DEVS[3:0] 868MHz 500Kbps Kbps 0111 Freq. Band Data Rate DEVS[3:0] 433MHz 2Mbps Mbps Kbps Kbps 0101 DAMR_M: DAMR Manual Enable. Recommend DAMR_M = [0]. [0]: Disable. [1]: Enable. VMTE_M: VMT Manual Enable. Recommend VMTE_M = [0]. [0]: Disable. [1]: Enable. VMS_M: VM Manual Enable. Recommend VMS_M = [0]. [0]: Disable. [1]: Enable. MSEL: VMS, VMTE and DAMR control select. Recommend MSEL = [0]. [0]: Auto control. [1]: Manual control VCO Deviation Calibration Register II (Address: 23h) R ADEV7 ADEV6 ADEV5 ADEV4 ADEV3 ADEV2 ADEV1 ADEV0 Name W MVDS MDEV6 MDEV5 MDEV4 MDEV3 MDEV2 MDEV1 MDEV0 Reset ADEV [7:0]: VCO Deviation Auto Calibration result (read only). MVDS: VCO Deviation Calibration Select. Recommend MVDS = [0]. 24

25 [0]: Auto. [1]: Manual. MDEV [6:0]: VCO Deviation Manual Calibration setting. Refer to chapter 15 for details VCO Deviation Calibration Register III (Address: 24h) Name W/R VMG7 VMG6 VMG5 VMG4 VMG3 VMG2 VMG1 VMG0 Reset VMG [7:0]: VM Center Value for Deviation Calibration. Recommend VMG[7:0] = [0x80] VCO Modulation Delay Register (Address: 25h) Name W DMV1 DMV0 DEVFD2 DEVFD1 DEVFD0 DEVD2 DEVD1 DEVD0 Reset DMV [1:0]: Demodulator D/A Voltage Range Select. [00]: 1/32*1.2. [01]: 1/16*1.2. [10]: 1/8*1.2. [11]: 1/4*1.2. DEV2:0]: VCO Modulation Data Delay by 8x over-sampling Clock. DEVD [2:0]: VCO Modulation Data Delay by XCPCK Clock. Recommend DEVD = [001]. RF Band Data Rate DMV[1:0] DEVFD[2:0] DEVD[2:0] 915MHz 2Mbps Mbps Kbps Kbps RF Band Data Rate DMV[1:0] DEVFD[2:0] DEVD[2:0] 868MHz 500Kbps Kbps RF Band Data Rate DMV[1:0] DEVFD[2:0] DEVD[2:0] 433MHz 2Mbps Mbps Kbps Kbps Battery Detect Register (Address: 26h) R -- RGV1 RGV0 BDF BVT2 BVT1 BVT0 BD_E Name W ECKS RGV1 RGV0 QDS BVT2 BVT1 BVT0 BD_E Reset ECKS : Clock phae delay selection. Recommend ECKS = [0]. [0]: no delay. [1]: delay 1/2 cycle. RGV [1:0]: Regulator Voltage Select. Recommend RGV = [11]. [00]: 2.1V. [01]: 2.0V. [10]: 1.9V. [11]: 1.8V. To gain a little bit more TX power, user can set RGV larger than 1.8V BDF : Low Battery Detection Flag (read only). [0]: battery low. [1]: battery high. QDS: VDD_A Quick Discharge Select. Recommend QDS = [1]. [0]: Disable. [1]: Enable. BVT [2:0]: Battery Voltage Threshold Select. 25

26 [000]: 2.1V, [001]: 2.2V. [010]: 2.3V. [011]: 2.4V. [100]: 2.5V. [101]: 2.6V. [110]: 2.7V. [111]: 2.8V. ( Typical +-0.1V detection inaccuracy.) BD_E: Battery Detect Enable. [0]: Disable. [1]: Enable. It will be clear after battery detection is triggered TX Test Register (Address: 27h) Name W ASKS PAC1 PAC0 TDC1 TDC0 TBG2 TBG1 TBG0 Reset PAC [1:0]: PA Current Setting. TDC [1:0]: TX Current Setting. TBG [2:0]: TX Buffer Gain Setting. RF Band Typical power (dbm) TBG TDC PAC Typical current 915MHz ma ma ma ma ma ma ma RF Band Typical power (dbm) TBG TDC PAC Typical current 868MHz ma ma ma ma ma ma ma ma ma ma RF Band Typical power (dbm) TBG TDC PAC Typical current 433MHz ma ma ma ma ma ma ma ma 26

27 ma ma ma Also, refer to App. Note for more details Charge Pump Current Register I (Address: 28h) Name W CPM3 CPM2 CPM1 CPM0 CPT3 CPT2 CPT1 CPT0 Reset CPM [3:0]: Charge Pump Current Setting for VM loop. Recommend CPM = [1111]. Charge pump current = (CPM + 1) / 16 ma. CPT [3:0]: Charge Pump Current Setting for VT loop. Recommend CPT = [0100]. Charge pump current = (CPT + 1) / 16 ma Charge Pump Current Register II (Address: 29h) Name W CPTX3 CPTX2 CPTX1 CPTX0 Reset CPTX [3:0]: Charge Pump Current Setting for TX mode. Charge pump current = (CPTX + 1) / 16 ma. RF Band Data Rate CPTX[3:0] 915MHz 2Mbps Mbps Kbps Kbps 1111 RF Band Data Rate CPTX[3:0] 868MHz 500Kbps Kbps 1111 RF Band Data Rate CPTX[3:0] 433MHz 2Mbps Mbps Kbps Kbps Crystal Test Register (Address: 2Ah) Name W LVR RGS MD1 MD0 DBD XCC XCP1 XCP0 Reset LVR : Low Power Bandgap Select. RGS : Low Power Regulator Voltage Select. LVR RGS Low Power Regulator Voltage Note 0 0 3/5 *REGI 0 1 3/4 * REGI V Recommended V MD [1:0]: VCO Divider Select. [00]: 1/6. [01]: 1/4. [10]: 1/2. [11]: 1/2. RF Band VBS (25h) MD [1:0] Note 27

28 315MHz MHz MHz 1 11or MHz 0 11 or 10 DBD : Crystal Frequency Doubler High Level Pulse Width Select. Recommend DBD = [0]. [0]: about 8 ns. [1]: about 16 ns. XCC : Crystal Startup Current Selection. Recommend XCC = [1]. [0]: 0.7 ma. [1]: 1.5 ma. XCP [1:0]: Crystal Oscillator Regulated Couple Setting. Recommend XCP = [00]. [00]: 1.5mA. [01]: 0.5mA. [10]: 0.35mA. [11]: 0.3mA PLL Test Register (Address: 2Bh) Name W SDMS CPS PRIC1 PRIC0 PRRC1 PRRC0 SDPW NSDO Reset SMDS: Reserved. Shall be set to [0]. CPS : Charge Pump Select. Shall be set to [1]. [0]: charge-pump tri-state. [1]: Normal. PRIC [1:0]: Prescaler IF Part Current Setting. Shall be set to [01]. [00]: 0.95mA. [01]: 1.05mA. [10]: 1.15mA. [11]: 1.25mA. PRRC [1:0]: Prescaler RF Part Current Setting. Shall be set to [00]. [00]: 1.0mA. [01]: 1.2mA. [10]: 1.4mA. [11]: 1.6mA. SDPW : Clock Delay For Sigma Delta Modulator. Shall be set to [0]. [0]: 13 ns. [1]: 26 ns. NSDO : Sigma Delta Order Setting. Shall be set to [1]. [0]: order 2. [1]: order VCO Test Register (Address: 2Ch) Name W DEVGD2 DEVGD1 DEVGD0 LOB1 LOB0 DIVRF1 DIVRF0 VCBS Reset DEVGD [2:0]: Sigma Delta Modulator Data Delay Setting. Recommend DEVGD = [000]. LOB [1:0]: LO Buffer Current Select. Shall be set to [10]. [00]: 0.6mA. [01]: 0.75mA. [10]: 0.9mA. [11]: 1.05mA. DIVRF [1:0]: RF divider Current Select. Shall be set to [00]. [00]: 1.2mA. [01]: 1.5mA. [10]: 1.8mA. [11]: 2.1mA. VCBS : VCO Buffer Current Setting. Shall be set to [0]. [0]: 1mA. [1]: 1.5mA RF Analog Test Register (Address: 2Dh) Name W MDEN OLM CPH CPCS RFT2 RFT1 RFT0 Reset MDEN : Use for Manual VCO Calibration. Shall be set to [0]. OLM : Open Loop Modulation Enable. Shall be set to [0]. [0]: Disable. [1]: Enable. CPH : Charge Pump High Current. Shall be set to [0]. [0]: Normal. [1]: High. CPCS : Charge Pump Current Select. Shall be set to [1]. RFT [2:0]: RF Analog Pin Configuration. Recommend RFT= [000]. 28

29 {XADS, RFT[2:0]} BP_BG (Pin 1) XADI [000] Band-gap voltage For external AD input. [001] Analog temperature voltage Analog temperature voltage [010] External ADC input source For external AD input. [011] Internal DA output Internal DA output [100] Reserved Reserved [101] Reserved Reserved [110] Reserved Reserved [111] Reserved Reserved Channel Selct Register (Address: 2Eh) Name W CHI3 CHI2 CHI1 CHI0 CHD3 CHD2 CHD1 CHD0 Reset CHI [3:0]: Auto IF Offset Channel Number Setting. CHI = [0001] for 500K mode. CHI = [0111] for 2M mode. F CHSP ( CHI + 1 ) = F IF CHD [3:0]: Channel Frequency Offset for Deviation Calibration. CHD = [0101] for 500K mode. CHD = [0111] for 2M mode. Offset channel number = +/- (CHD + 1) VRB Register (Address: 2Fh) Name W VTRB3 VTRB2 VTRB1 VTRB0 VMRB3 VMRB2 VMRB1 VMRB0 Reset VTRB [3:0]: Resistor Bank for VT RC Filtering. Shall be set to [0000]. VMRB [3:0]: Resistor Bank for VM RC Filtering. Shall be set to [0000] Data Rate Divider Register (Address: 30h) Name W SDR7 SDR6 SDR5 SDR4 SDR3 SDR2 SDR1 SDR0 Reset SDR [1:0]: Data Rate Setting. Data rate = F IF / (SDR+1). IFS (0Dh) F IF (Hz) SDR [7:0] Data Rate 1 2M 0x00 2M 1 2M 0x01 1M 0 500K 0x00 500K 0 500K 0x01 250K 0 500K 0x03 125K 0 500K 0x04 100K FCR Register (Address: 31h) Name W FC1 FC0 CRCINV CRCDNP TXCS VTBS Reset

30 FCL [1:0] : Frame Control Length. [00]: No Frame Control [01]: 1 byte Frame Control. (FCB0), refer to 3Dh. [10]: 2 byte Frame control. (FCB0+FCB1), refer to 3Dh. [11]: 4 byte Frame control. (FCB0+FCB1+FCB2+FCB3), refer to 3Dh. CRCINV: CRC Inverted Select. [0]: normal. [1]: inverted. CRCDNP: CRC Mode Select. [0]: CRC-CCITT (X 16 + X 12 + X 5 + 1). [1]: CRC-DNP (X 16 + X 13 + X 12 + X 11 + X 10 + X 8 + X 6 + X 5 + X 2 + 1). 30

31 10. SPI only supports one SPI bus with maximum data rate 10Mbps. MCU should assert SCS pin low (SPI chip select) to active accessing of. Via SPI bus, user can access control registers and issue Strobe command. Figure 10.1 gives an overview of SPI access manners. 3-wire SPI (SCS, SCK and SDIO) or 4-wire SPI (SCS, SCK, SDIO and GIO1) configuration is provided. For 3-wire SPI, SDIO pin is configured as bi-direction to be data input and output. For 4-wire SPI, SDIO pin is data input and GIO1 pin is data output. In such case, GIO1S (0bh) should be set to [0110]. For SPI write operation, SDIO pin is latched into at the rising edge of SCK. For SPI read operation, if input address is latched by, data output is aligned at falling edge of SCK. Therefore, MCU can latch data output at the rising edge of SCK. To control s internal state machine, it is very easy to send Strobe command via SPI bus. The Strobe command is a unique command set with total 8 commands. See section 10.3, 10.4 and 10.5 for details. SPI chip select Data In Data Out 3-Wire SPI SCS pin = 0 SDIO pin SDIO pin 4-Wire SPI SCS pin = 0 SDIO pin GIO1 (GIO1S=0110) SCS Read/Write register ADDR reg DataByte ADDR reg DataByte ADDR reg DataByte Read/Write RF FIFO Read/Write ID register Sleep Mode Idle Mode STBY Mode PLL Mode ADDR FIFO DataByte 0 DataByte 1 DataByte 2 DataByte 3 ADDR ID DataByte 0 DataByte 1 DataByte 2 DataByte 3 Strobe Command Sleep Mode Strobe Command Idle Mode Strobe Command STBY Mode Strobe Command PLL Mode DataByte n TX Mode FIFO Write Reset FIFO Read Reset Strobe Command TX Mode Strobe Command FIFO Write Reset Strobe Command FIFO Read Reset Figure 10.1 SPI Access Manners 31

32 10.1 SPI Format The first bit (A7) is critical to indicate the following instruction is Strobe command or control register. See Table 10.1 for SPI format. Based on Table 10.1, if A7=0, is informed for control register accessing. So, A6 bit is used to indicate read (A6=1) or write operation (A6=0). See Figure 10.2 and Figure 10.3 for details. Address Byte (8 bits) Data Byte (8 bits) CMD R/W Address Data A7 A6 A5 A4 A3 A2 A1 A Address byte: Bit 7: Command bit [0]: Control register command. [1]: Strobe command. Table 10.1 SPI Format Bit 6: R/W bit [0]: Write data to control register. [1]: Read data from control register. Bit [5:0]: Address of control register Data Byte: Bit [7:0]: SPI input or output data, see Figure 10.2 and Figure 10.3 for details SPI Timing Characteristic No matter 3-wire or 4-wire SPI bus is configured, the maximum SPI data rate is 10 Mbps. To active SPI bus, SCS pin must be set to low. For correct data latching, user has to take care hold time and setup time between SCK and SDIO. See Table 10.2 for details. Parameter Description Min. Max. Unit F C FIFO clock frequency. 10 MHz T SE Enable setup time. 50 ns T HE Enable hold time. 50 ns T SW TX Data setup time. 50 ns T HW TX Data hold time. 50 ns T DR RX Data delay time ns Table 10.2 SPI Timing Characteristic 10.3 SPI Timing Chart In this section, 3-wire and 4-wire SPI bus read / write timing are described. 32

33 Timing Chart of 3-wire SPI SCS SCK SDIO A7 A6 A5 A4 A3 A2 A1 A0 D W 7 D W 6 D W 5 D W 1 D W 0 RF IC will latch address bit at rising edge of SCK RF IC will latch data bit at the rising edge of SCK 3-Wire serial interface - Write operation SCS SCK SDIO A7 A6 A5 A4 A3 A2 A1 A0 D R 7 D R 6 D R 5 D R 1 D R 0 RF IC will latch address bit at rising edge of SCK RF IC will change the data when falling edge of SCK MCU can latch data at rising edge of SCK 3-Wire serial interface - Read operation Figure 10.2 Read/Write Timing Chart of 3-Wire SPI Timing Chart of 4-wire SPI SCS SCK SDIO A7 A6 A5 A4 A3 A2 A1 A0 D W 7 D W 6 D W 5 D W 1 D W 0 RF IC will latch address bit at rising edge of SCK RF IC will latch data bit at rising edge of SCK 4-Wire serial interface - Write operation SCS SCK SDI A7 A6 A5 A4 A3 A2 A1 A0 x x GIO1 D R 7 D 6 D R 5 D 2 D R 1 D R 0 R R RF IC will latch address bit at rising edge of SCK RF IC will change the data when falling edge of SCK MCU can latch data at the rising edge of SCK 4-Wire serial interface - Read operation Figure 10.3 Read/Write Timing Chart of 4-Wire SPI 33

34 10.4 Strobe Commands supports 8 Strobe commands to control internal state machine for chip s operations. Table 10.3 is the summary of Strobe commands. Be notice, Strobe command could be defined by 4-bits (A7~A4) or 8-bits (A7~A0). If 8-bits Strobe command is selected, A3 ~ A0 are don t care conditions. In such case, SCS pin can be remaining low for asserting next commands. Strobe Command Strobe Command A7 A6 A5 A4 A3 A2 A1 A0 Description x x x x Sleep mode x x x x Idle mode x x x x Standby mode x x x x PLL mode x x x x TX mode x x x x FIFO write pointer reset Deep sleep mode (Tri-state of GIO1) Deep sleep mode (Internal Pull-High of GIO1) Table 10.3 Strobe Commands by SPI bus Strobe Command - Sleep Mode Refer to Table 10.3, user can issue 4 bits (1000) Strobe command directly to set into Sleep mode. Below are the Strobe command table and timing chart. Strobe Command Strobe Command A7 A6 A5 A4 A3 A2 A1 A0 Description Sleep mode Figure 10.4 Sleep mode Command Timing Chart Strobe Command - ldle Mode Refer to Table 10.3, user can issue 4 bits (1001) Strobe command directly to set into Idle mode. Below are the Strobe command table and timing chart. Strobe Command Strobe Command A7 A6 A5 A4 A3 A2 A1 A0 Description x x x x Idle mode 34

35 SCS SCS SCK SCK SDIO A7 A6 A5 A4 SDIO A7 A6 A5 A4 A3 A2 A1 A0 Idle mode Idle mode Figure 10.5 Idle mode Command Timing Chart Strobe Command - Standby Mode Refer to Table 10.3, user can issue 4 bits (1010) Strobe command directly to set into Standby mode. Below are the Strobe command table and timing chart. Strobe Command Strobe Command A7 A6 A5 A4 A3 A2 A1 A0 Description x x x x Standby mode Figure 10.6 Standby mode Command Timing Chart Strobe Command - PLL Mode Refer to Table 10.3, user can issue 4 bits (1011) Strobe command directly to set into PLL mode. Below are the Strobe command table and timing chart. Strobe Command Strobe Command A7 A6 A5 A4 A3 A2 A1 A0 Description x x x x PLL mode Figure 10.7 PLL mode Command Timing Chart 35

36 Strobe Command - TX Mode Refer to Table 10.3, user can issue 4 bits (1101) Strobe command directly to set into TX mode. Below are the Strobe command table and timing chart. Strobe Command Strobe Command A7 A6 A5 A4 A3 A2 A1 A0 Description x x x x TX mode Figure 10.8 TX mode Command Timing Chart Strobe Command FIFO Write Pointer Reset Refer to Table 10.3, user can issue 4 bits (1110) Strobe command directly to reset FIFO write pointer. Below are the Strobe command table and timing chart. Strobe Command Strobe Command A7 A6 A5 A4 A3 A2 A1 A0 Description x x x x FIFO write pointer reset Figure 10.9 FIFO write pointer reset Command Timing Chart Strobe Command Deep Sleep Mode Refer to Table 10.3, user can issue 8 bits ( ) Strobe command directly to switch off power supply to.in this mode, is staying minimum current comsuption and all registers are no data retention. Below are the Strobe command table and timing chart. Strobe Command Strobe Command A7 A6 A5 A4 A3 A2 A1 A0 Description Tri-state of GIO1 (no register retention) Internal Pull-High of GIO1 / GIO2 (no register retention) 36

37 Figure Deep Sleep Mode Timing Chart 10.5 Reset Command In addition to power on reset (POR), MCU could issue software reset to by setting Mode Register (00h) through SPI bus as shown below. As long as 8-bits address (A7~A0) are delivered zero and data (D7~D0) are delivered zero, is informed to generate internal signal RESETN to initial itself. After reset command, is in standby mode. SCS SCK SDIO A7 A6 A5 A4 A3 A2 A1 A0 D W 7 D W 6 D W 5 D W 1 D W 0 RESETN Reset RF chip Figure Reset Command Timing Chart 10.6 ID Accessing Command has built-in 32-bits ID Registers for customized identification code. It is accessed via SPI bus. ID length is recommended to be 32 bits by setting IDL (20h). Figure and are timing charts of 32-bits ID accessing via 3-wire SPI ID Write Command User can refer to Figure 10.2 for SPI write timing chart. Below is the procedure of ID write command. Step1: Deliver A7~A0 = (A7=0 for control register, A6=0 for write operation, ID addr = 06h). Step2: Via SDIO pin, 32-bits ID are written in sequence by Data Byte 0, 1, 2 and 3. Step3: Toggle SCS pin to high when step2 is completed. 37

38 Figure ID Write Command Timing Chart ID Read Command User can refer to Figure 10.2 for SPI read timing chart in details. Below is the procedure of ID read command. Step1: Deliver A7~A0 = (A7=0 for control register, A6=1 for read operation, ID addr = 06h). Step2: Via SDIO pin, 32-bits ID are read in sequence by Data Byte 0, 1, 2 and 3. Step3: Toggle SCS pin to high when step2 is completed. Figure ID Read Command Timing Chart 10.7 FIFO Accessing Command has 64 bytes TX FIFO, user just needs to set FMS (01h) =1 to enable FIFO mode. In FIFO mode, before packet is delivered, write wanted data into TX FIFO and issue TX strobe command. User can choose polling or interrupt scheme for FIFO accessing. FIFO status is output via GIO1 pin by setting GIO1 (0Bh) TX FIFO Write Command User can refer to Figure 10.2 for SPI write timing chart. Below is the procedure of TX FIFO write command. Step1: Deliver A7~A0 = (A7=0 for control register, A6=0 for write operation, FIFO addr = 05h). Step2: Via SDIO pin, write (n+1) bytes TX data into TX FIFO in sequence by Data Byte 0, 1, 2 to n. Step3: Toggle SCS pin to high when step2 is completed. Step4: Send TX Strobe command for packet transmitting. Refer to Figure Figure TX FIFO Write Command Timing Chart 38

39 11. State machine In chapter 9 and chapter 10, user can learn both accessing s control registers as well as issuing Strobe commands. From section 10.2 ~ 10.6, it is clear to know configurations of 3-wire SPI and 4-wire SPI, Strobe command, software reset, and how to access ID Registers and TX FIFO. In section 11.1, built-in state machine is introduced. Then, combined with Strobe command, software reset and s control registers, section 11.2, 11.3 and 11.4 demonstrate 3 state diagrams to explain how transitions of s operation. From accessing data point of view, if FMS=1 (01h), FIFO mode is enabled, otherwise, is in direct mode. If FMS=1 and FIFO Read/Write at standby mode, we call it is Normal FIFO mode. Otherwise, If FMS=1 and FIFO Read/Write at PLL mode, we called it is Quick FIFO mode due to the reduction of PLL settling time. If FMS=1 and FIFO Read/Write at IDLE mode, we called it is Power Saving FIFO mode due to the reduction of average current. SPI chip select Data In Data Out Operation Mode Clock Recovery for Direct Mode 3-Wire SPI SCS pin = 0 SDIO pin SDIO pin FIFO (FMS=1) Direct(FMS=0) CKO pin (CKOS = 0001) 4-Wire SPI SCS pin = 0 SDIO pin GIO1 (GIO1S=0110) FIFO (FMS=1) Direct(FMS=0) CKO pin (CKOS = 0001) (1) Normal FIFO Mode (FMS=1 and FIFO Standby mode) (2) Quick FIFO Mode (FMS=1 and FIFO PLL mode) (3) Power Saving FIFO Mode (FMS=1 and FIFO IDLE mode) (4) Quick Direct Mode (FMS=0 and FIFO ignored, write TX mode, read RX mode) 11.1 Key states supports 6 key operation states. Those are, (1) Standby mode (2) Sleep mode (3) Idle mode (4) PLL mode (5) TX mode (6) CAL mode After power on reset or software reset, is automatically into standby mode. Then, user has to do calibration process because all control registers are in initial values. The calibration process of is very easy, user only needs to issue Strobe commands and enable calibration registers. If so, the calibrations are automatically completed by s internal state machine. See 11.2, 11.3, 11.4 and chapter 15 for details. After calibration, is ready to do TX operation. User can start wireless transmission Standby mode When Standby Strobe is issued, enters standby mode automatically. Internal power management is listed below. Be noted that is in standby mode after power on reset or software reset. On Chip Regulator Crystal Oscillator Standby mode VCO PLL RX Circuitry TX Circuitry ON ON OFF OFF OFF OFF Strobe Command (1010xxxx)b See Figure

40 Sleep mode When Sleep Strobe is issued, enters sleep mode automatically. In sleep mode, still can accept other strobe commands via SPI bus. But, can not support Read/Write FIFO in sleep mode. Internal power management is listed below. On Chip Regulator Crystal Oscillator VCO Sleep mode PLL RX Circuitry TX Circuitry OFF OFF OFF OFF OFF OFF Strobe Command (1000xxxx)b See Figure ldle mode When Idle Strobe is issued, enters idle mode automatically. In idle mode, can accept other strobe commands as well as supporting Read/Write FIFO. Internal power management is listed below. On Chip Regulator Crystal Oscillator VCO ldle mode PLL RX Circuitry TX Circuitry ON OFF OFF OFF OFF OFF Strobe Command (1001xxxx)b See Figure PLL mode When PLL Strobe is issued, enters PLL mode automatically. In PLL mode, internal PLL and VCO are both turned on to generate LO (local oscillator) frequency before TX and RX operation. Internal power management is listed below. According to PLL Register I, II, III, IV and V, PLL circuitry is easy to control by user s definition. On Chip Regulator Crystal Oscillator VCO PLL mode PLL RX Circuitry TX Circuitry ON ON ON ON OFF OFF Strobe Command (1011xxxx)b See Figure TX mode When TX Strobe is issued, enters TX mode automatically for data delivery. Internal power management is listed. (1) If is in FIFO mode, TX data packet (Preamble + ID + Payload) is delivered through TX circuitry. Then, supports auto-back function to previous state for the next packet. (2) If is in direct mode, TX data packet is also delivered through TX circuitry. Then, stays in TX mode. User has to issue Strobe command to back to previous state. On Chip Regulator Crystal Oscillator VCO TX mode PLL RX Circuitry TX Circuitry ON ON ON ON OFF ON Strobe Command (1101xxxx)b See Figure CAL mode Calibration process shall be done after power on reset or software reset. Calibration items include VCO band and VCO current. It is easy to implement calibration process by Strobe command and enable CALC (02h) control register. See chapter 15 for details. Be noted that VCO Calibration is executed in PLL mode only. 40

41 11.2 Normal FIFO Mode This mode is suitable for requirement of general purpose applications. After calibration, user can issue Strobe command to enter standby mode where write TX FIFO. From standby mode to packet data transmitting, only one Strobe command is needed. Once transmission is done, is auto back to standby mode. If all packets are finished and deeper power saving is necessary, user can issue Strobe command to ask staying in sleep mode. Figure 11.1 is the state diagram of Normal FIFO mode. CAL CMD CMD Value Calibration Section AK CALC.0=1, RSSI 15.3 CALC.1=1, IF Filter 15.2 CALC.2=1, VCO Deviation 15.6 CALC.3=1, VCO Bank 15.5 CALC.4=1, VCO Current 15.4 Strobe CMD Value Note Section ST1 1011b Enter to PLL ST2 1010b Enter to Standby ST3 1000b Enter to SLEEP ST4 1001b Enter to IDLE ST5-TX 1101b Enter to TX RST-CMD b Software Reset 10.5 Be notice, refer to chapter 16 for definition of RX FIFO Full and TX FIFO Empty. Figure 11.1 State diagram of Normal FIFO Mode 41

42 From Figure 11.1, when ST5 command is issued for TX operation, see Figure 11.2 for detailed timing. status can be represented to GIO1 to MCU for timing control. Strobe CMD (SCS,SCK,SDIO) ST5 Next Instruction 140 us (auto delay) RFO Pin Preamble + ID Code + Payload GIO1 Pin - WTR (GIO1S[3:0]=0000) Transmitting Time T0 T1 T2 Auto Back Standby Mode T0-T1: Auto Delay by Register setting (PDL + TDL) LO Freq. Standby to WPLL WPLL to TX TX Ready Time (PDL) (TDL) Changed 60 us 80 us 140 us No Changed 60 us 80 us 140 us Figure 11.2 Transmitting Timing Chart of Normal FIFO Mode 42

43 12 Crystal Oscillator Circuit needs external crystal or external clock that is either 8/12/16 MHz, to generate internal wanted clock. Relative Control Register Data Rate Clock Register (Address: 0Ch) R SDR1 SDR0 GRC3 GRC2 GRC1 GRC Name W SDR1 SDR0 GRC3 GRC2 GRC1 GRC0 CGS XS Reset Use External Crystal Figure 12.1 shows the connection of crystal network between XI and XO pins. C1 and C2 capacitance are used to adjust different crystal loading. support low cost crystal within ± 50 ppm accuracy. Be aware that crystal accuracy requirement includes initial tolerance, temperature drift, aging and crystal loading. Note: set XS= 1 (0Ch) to select external crystal oscillator. i.e., Crystal = 16MHz (Cload =18pF), C1=C2=27pF. Figure12.1 Crystal network connection for using external crystal 12.2 Use External Clock has built-in AC couple capacitor to support external clock input. Figure 11.2 shows how to connect. In such case, XI pin is left opened. To use external clock from MCU instead of external crystal, user just sets XS= 0 (0Ch) to active AC couple capacitor. Be notice, the frequency accuracy of external clock shall be controlled within ± 50ppm and the clock swing (peak-to-peak) shall be larger than 1.5V. (External clock is controlled within ± 50ppm.) Figure 12.2 Connect to external clock source 43

44 13. System Clock supports different external crystal frequency by programmable Data Rate Clock Register (0Ch). Based on this, two important internal clocks F CGR and F SYCK are generated. (1) F CGR: Clock Generation Reference = FCRYSTAL / (GRC+1) = 2MHz. where GRC is max 15. (2) F SYCK: System Clock = 64 MHz Relative Control Register Data Rate Clock Register (Address: 0Ch) R IFS GRC3 GRC2 GRC1 GRC Name W IFS GRC3 GRC2 GRC1 GRC0 CGS XS Reset Data Rate Divider Register (Address: 30h) Name W SDR7 SDR6 SDR5 SDR4 SDR3 SDR2 SDR1 SDR0 Reset PLL Register II (Address: 0Eh) R DBL RRC1 RRC0 CHR3 CHR2 CHR1 CHR0 IP8 Name W DBL RRC1 RRC0 CHR3 CHR2 CHR1 CHR0 BIP8 Reset Derive System Clock Because supports different external crystals, GRC [3:0] (0Ch) are used to get 2 MHz Clock Generation Reference (F CGR) for internal usage. F = GRC F XREF CGR. ( [ 3: 0] + 1) Below is block diagram of system clock. F XTAL is the crystal frequency. User can set registers to get F SYCK = 64MHz. F XREF is the reference clock of Clock Generator to generate F CGR = 2MHz and F SPLL = 64MHz. After delay circuitry, System clock is derived, F SYCK = 64MHz. ADC clock (F ADC = 4MHz or 8MHz) is from F SYCK = 64MHz after frequency divider. GRC CGS IFS XI XO F XTAL XS CE X DBL F XREF (GRC+1) F CGR = 2MHz PLL 64MHz Clock Generator 16MHz (500Kbps) div4 64MHz (2M / 1Mbps) CGS 0 div2 Delay div2 4MHz 8MHz 0 1 F SYCK ADC clock Figure 13.1 System Clock Block Diagram FSARS 44

45 Recommend to set DBL (0Eh) = [0], then, F XREF = F XTAL Crystal Frequency (F XTAL) Internal Crystal Reference (F XREF) Clock Generation Reference (F CGR) GRC [3:0] 16 MHz 16 MHz Must be 2 MHz [0111] 1 12 MHz 12 MHz Must be 2 MHz [0101] 1 8 MHz 8 MHz Must be 2 MHz [0011] 1 CGS 13.2 Data Rate supports programmable data rate by setting SDR [7:0] (39h). Data rate = (F IFCK / (SDR [1:0] +1)). The data rate clock is from IF clock (F IFCK). F IFCK is 2MHz for 2M/1M mode and 500KHz for data rate below 500Kbps. Figure 13.2 Data Rate Block Diagram Data Rate = (F IFCK / (SDR [1:0] +1)). F SYCK F IFCK (system clock) (IF clock) SDR [7:0] (30h) Data Rate 64 MHz 2 MHz [ ] 2 Mbps 64 MHz 2 MHz [ ] 1 Mbps 64 MHz 500 KHz [ ] 500Kbps 64 MHz 500 KHz [ ] 100Kbps 45

46 14. Transceiver Frequency is a sub 1GHz transmitter with embedded PA up to 10 dbm.. For TX frequency setting, user just needs to set up LO (Local Oscillator) frequency for one-way radio transmission. To target full range of 915MHz ISM band (902 MHz to 928 MHz), applies offset concept by LO frequency F LO = F LO_BASE + F OFFSET. Therefore, for different applications, is easy to implement frequency hopping and multi-channels by ONE register setting, PLL Register (CHN [7:0], 0Dh). The wanted RF formula F LO_BASE 1 BFP[15 : 0] = FPFD ( BIP[8: 0] + ) 16 n 2 1 F = ( DBL + 1) ( BIP[8: 0] n RRC[1: 0] + 1 f XTAL + BFP[15 : 0] ) 16 2 where PFD is the comparison frequency of PLL. Where n = 2 for MD = [10] or [11], 868M / 915MHz band Where n = 4 for MD = [01], 433M band Where n = 6 for MD = [00], 315MHz band MD[1:0] is located at address 2Ah [Bit5, Bit4]. DBL and RRC[1:0] are located at address 0Eh. Below is the LO frequency block diagram. F PFD X (DBL+1) / (RRC[1:0]+1) PFD VCO F LO F XTAL =16M BIP[8:0] + AC[14:0]/ AFC Divider VCO divider MD[1:0] VBS F MD F LO_BASE BFP[15:0]/ F LO CHN / [4*(CHR+1)] CHN[7:0] CHR[3:0] F offset + F TXRF Figure 14.1 Block Diagram of Local Oscillator 14.1 LO Frequency Setting From Figure 14.1, F LO is the VCO frequency to result the wanted F TXRF through VCO divider. To set up F LO, it is easy to implement by below 6 steps. 1. Set the base frequency (F LO_BASE) by PLL Register II, III, IV and V (0Eh, 0Dh, 10h and 11h). For example, set F LO_BASE ~ MHz. 2. Set the channel step (F CHSP) by PLL Register II (0Fh). supports channel steps by 250K. 3. Set CHN [7:0] to get offset frequency by PLL Register I (0Eh). F OFFSET = CHN [7:0] x F CHSP 4. LO frequency is equal to base frequency. F LO = F LO_BASE 46

47 5. MD frequency is equal to VCO frequency divides by VCO divider ( MD[1:0] ). F MD = F LO / (VCO Divider) 6. For TX radio frequency (F TXRF) is equal to MD frequency plus offset frequency. F TXRF = F MD + F OFFSET F LO_BASE 1 BFP[15 : 0] = FPFD ( BIP[8: 0] + ) 16 n 2 1 F = ( DBL + 1) ( BIP[8: 0] n RRC[1: 0] + 1 XTAL + BFP[15 : 0] ) 16 2 Base on the above formula, for example, if select 16MHz crystal (F XTAL= 16 MHz.) and select channel step F CHSP = 250 KHz, To get F LO_BASE and F LO,see Table 14.1, 14.2 and Figure 14.2 for details. How to set F LO_BASE ~ MHz STEP ITEMS VALUE NOTE 1 F XTAL 16 MHz Crystal Frequency 2 DBL 0 Disable double function 3 RRC 0 If so, F PFD= 16MHz 4 BIP 0x70 To get F LO =1792 MHz 5 BFP[15:8], PLL IV 0x80 To get F LO ~ MHz 5 BFP[7:0], PLL V 0x08 6 F LO_BASE ~ MHz LO Base frequency Table 14.1 How to set F LO_BASE How to set F TXRF ~ MHz STEP ITEMS VALUE NOTE 1 F LO_BASE ~ MHz After set up BIP and BFP 2 VBS ; MD VBS=[0] ; MD=[10b] To get F RF_BASE ~ MHz 3 F MD ~ MHz VCO divider frequency 4 CHR 7 To get F CHSP= 250 KHz 5 F CHSP 250 KHz Channel step = 250KHz 6 CHN 0x3C Set channel number = 60 7 F OFFSET 15 MHz F OFFSET= 250 KHz * (60) = 15MHz 8 F TXRF ~ MHz F TXRF = F TXRF = F MD + F OFFSET Table 14.2 How to set F TXRF X (DBL+1) DBL = 0 / (RRC[1:0]+1) RRC = 0 F PFD =16M PFD VCO F LO = M F XTAL =16M BIP[8:0] + BFP[15:0]/ 2 16 (BIP = 0x70) (BFP = 0x8008) AC[14:0]/ F LO_BASE = M AFC + F LO = M Divider CHN / [4*(CHR+1)] (CHN=0x3C) (CHR = 7) Figure 14.2 Block Diagram of F LO ~ MHz F offset = 15M VCO divider MD[1:0] =10 VBS =0 F MD = M + F TXRF = M 47

48 15. Calibration needs calibration process during initialization by below 5 items, they are, VCO Current, VCO Bank, VCO Deviation. 1. VCO Current Calibration is to find adequate VCO current. 2. VCO Bank Calibration is to select best VCO frequency bank for the calibrated frequency. 3. VCO Deviation Calibration is to calibrate 500 KHz deviation of VCO. VCO Current, Bank and Deviation shall be calibrated in PLL mode. User can set in PLL mode and enable 5 control registers together, then, all calibration procedures are automatically executed and its results are stored in calibration flags. Relative Control Register Calibration Control Register (Address: 02h) Name R/W VCC VBC VDC Reset Calibration Procedure 1. Initialize all control registers (refer to reference code). 2. Select auto value mode (set MVCS, MVBS, MVDS= 0). 3. Set in PLL mode. 4. Enable VCO Current, Bank and Deviation Calibration (VCC, VBC, VDC= 1). 5. After calibration done, VCC, VBC and VDC are auto clear. 6. Check pass or fail by calibration flag (VCCF, VBCF) VCO Current Calibration VCO Current Calibration Register (Address: 1Eh) R VCCF VCB3 VCB2 VCB1 VCB0 Name W VCCS MVCS VCOC3 VCOC2 VCOC1 VCOC0 Reset Initialize all control registers (refer reference code). 2. Set MVCS= 0 for auto calibration. 3. Set in PLL mode. 4. Set VCC= 1 (02h). 5. VCC is auto clear after calibration done. 6. User can read calibration flag (VCCF, 1Fh) to check pass or fail. 7. User can read VCB [3:0] (1Fh) to get the auto calibration value VCO Bank Calibration VCO Bank Calibration Register I (Address: 1Fh) R VBCF VB2 VB1 VB0 Name W DDC1 DDC0 DAGS -- MVBS MVB2 MVB1 MVB0 Reset Initialize all control registers (refer reference code). 2. Set MVBS= 0 for auto calibration. 3. Set in PLL mode. 4. Set VBC= 1 (02h). 48

49 5. The maximum calibration time for VCO Bank Calibration is about 240 us (4 * PLL settling time). 6. VBC is auto clear after calibration done. 7. User can read calibration flag (VBCF, 20h) to check pass or fail. 8. User can read VB [2:0] (1Fh) to get the auto calibration value VCO Deviation Calibration VCO Deviation Calibration Register II (Address: 21h) R ADEV7 ADEV6 ADEV5 ADEV4 ADEV3 ADEV2 ADEV1 ADEV0 Name W MVDS MDEV6 MDEV5 MDEV4 MDEV3 MDEV2 MDEV1 MDEV0 Reset Initialize all control registers (refer reference code). 2. Set MVDS= 0 for auto calibration. 3. Set in PLL mode. 4. Set VDC= 1 (02h). 5. VDC is auto clear after calibration done. 6. User can read ADEV [7:0] (22h) to get the auto calibration value. 7. No need to check calibration flag. 49

50 16. FIFO (First In First Out) supports separated 64-bytes TX FIFO by enabling FMS =1 (01h). For FIFO accessing, TX FIFO represents transmitted payload. In chapter 10 and 11, user can also find below FIFO information. (1) Figure and for FIFO accessing via 3-wire SPI. (2) Section and for FIFO pointer reset command. (3) Figure 11.2 and Figure 11.3 for Normal/Quick FIFO mode Packet Format of FIFO mode Data whitening(optional) FEC encoded/decoded(optional) CRC -16 calculation(optional) Preamble ID code Payload (1~64 bytes) (CRC) 4 bytes 4/6/8 bytes Max. 256 bytes Figure 16.1 Packet Format of FIFO mode 2 bytes ID code ID Byte 0 ID Byte 1... ID Byte n Figure 16.2 ID Code Format Preamble: The packet is led by preamble which is composed of alternate 0 and 1. If the first bit of ID code is 0, preamble shall be In the contrast, if the first bit of ID code is 1, preamble shall be Preamble length is recommended to set 4 bytes by PML [1:0] (1Ch). ID code: ID code is recommended to set 4 bytes by IDL=1 (1Ch) and ID Code is sequenced by ID Byte 0, 1, 2 and 3. Payload: Payload length is programmable by FEP [7:0] (03h). The physical FIFO depth is 64 bytes. also supports logical FIFO extension up to 256 bytes. See section 16.5 for details. CRC (option): In FIFO mode, if CRC is enabled (CRCS=1, 1Ch), 2-bytes of CRC value is transmitted automatically after payload. Relative Control Register Mode Register (Address: 00h) R -- FECF CRCF CER XER PLLER TRSR TRER Name W RESETN RESETN RESETN RESETN RESETN RESETN RESETN RESETN Reset FIFO Register I (Address: 03h) Name W FEP7 FEP6 FEP5 FEP4 FEP3 FEP2 FEP1 FEP0 Reset

51 Code Register I (Address: 1Ch) Name W MCS WHTS FECS CRCS IDL1 IDL0 PML1 PML0 Reset Bit Stream Process supports 3 optional bit stream process for payload, they are, (1) CCITT-16 CRC (2) (7, 4) Hamming FEC (3) Data Whitening by XOR PN7 (7-bits Pseudo Random Sequence). CRC (Cyclic Redundancy Check): 1. CRC is enabled by CRCS= 1 (1Ch). TX circuitry calculates the CRC value of payload (preamble, ID code excluded) and transmits 2-bytes CRC value after payload. FEC (Forward Error Correction): 1. FEC is enabled by FECS= 1 (1Ch). Payload and CRC value (if CRCS=1) are encoded by (7, 4) Hamming code. 2. Each 4-bits (nibble) of payload is encoded into 7-bits code word and delivered out automatically. (ex. 64 bytes payload will be encoded to 128 code words, each code word is 7 bits.) Data Whitening: 1. Data whitening is enabled by WHTS= 1 (1Ch). Payload and CRC value (if CRCS=1) or their encoded code words (if FECS=1) are encrypted by bit XOR operation with PN7. The initial seed of PN7 is set by WS [6:0] (1Dh) Transmission Time Based on CRC and FEC options, the transmission time are different. See table 16.1 for details. Data Rate = 2 Mbps Data Rate (Mbps) Preamble (bits) ID Code (bits) Payload (bits) CRC (bits) FEC Transmission Time / Packet Disable Disable 576 bit * 0.5 us = 288 us bits Disable 592 bit * 0.5 us = 296 us Disable 512 * 7 / bit * 0.5 us = 480 us * 7 / * 7 / bit * 0.5 us = 494 us Table 16.1 Transmission time of 2 Mbps data rate Data Rate = 1 Mbps Data Rate (Mbps) Preamble (bits) ID Code (bits) Payload (bits) CRC (bits) FEC Transmission Time / Packet Disable Disable 576 bit * 1.0 us = 576 us bits Disable 592 bit * 1.0 us = 592 us Disable 512 * 7 / bit * 1.0 us = 960 us * 7 / * 7 / bit * 1.0 us = 988 us Table 16.2 Transmission time of 1 Mbps data rate Data Rate = 500 Kbps Data Rate (Kbps) Preamble (bits) ID Code (bits) Payload (bits) CRC (bits) FEC Transmission Time / Packet Disable Disable 576 bit X 2 us = ms bits Disable 592 bit X 2 us = ms Disable 512 x 7 / bit X 2 us = ms x 7 / x 7 / bit X 2 us = ms Table 16.3 Transmission time of 500Kbps data rate 51

52 Data Rate = 100 Kbps Data Rate (Kbps) Preamble (bits) ID Code (bits) Payload (bits) CRC (bits) FEC Transmission Time / Packet Disable Disable 576 bit X 10 us = 5.76 ms bits Disable 592 bit X 10 us = 5.92 ms Disable 512 x 7 / bit X 10 us = 9.6 ms x 7 / x 7 / bit X 10 us = 9.88 ms 16.4 Usage of TX FIFO In application points of view, supports 3 options of FIFO arrangement. (1) Easy FIFO (2) Segment FIFO (3) FIFO Extension For FIFO operation, supports Strobe command to reset TX FIFO pointer as shown below. User can refer to section 10.5 for FIFO write pointer reset and FIFO read pointer reset. Strobe Command Strobe Command A7 A6 A5 A4 A3 A2 A1 A0 Description x x X x FIFO write pointer reset (for TX FIFO) FIFO Register I (Address: 03h) Name W FEP7 FEP6 FEP5 FEP4 FEP3 FEP2 FEP1 FEP0 Reset FIFO Register II (Address: 04h) Name W FPM1 FPM0 PSA5 PSA4 PSA3 PSA2 PSA1 PSA0 Reset FIFO DATA Register (Address: 05h) Name R/W FIFO7 FIFO6 FIFO5 FIFO4 FIFO3 FIFO2 FIFO1 FIFO0 Reset Easy FIFO In Easy FIFO, max FIFO length is 64 bytes. FIFO length is equal to (FEP [7:0] +1). User just needs to control FEP [7:0] (03h) and disable PSA and FPM as shown below. Register setting TX Control Registers FIFO Length (byte) FEP[7:0] (03h) PSA[5:0] (04h) FPM[1:0] (04h) 1 0x x x0F x1F x3F

53 Table 16.3 Control registers of Easy FIFO Procedures of TX FIFO Transmitting 1. Initialize all control registers (refer reference code). 2. Set FEP [7:0] = 0x3F for 64-bytes FIFO. 3. Refer to Figure 11.2 and Figure Send Strobe command TX FIFO write pointer reset. 5. MCU writes 64-bytes data to TX FIFO. 6. Send TX Strobe Command. 7. Done. Figure 16.3 Easy FIFO Segment FIFO In Segment FIFO, TX FIFO length is equal to (FEP [7:0] - PSA [5:0]+1). FPM [1:0] should be zero. This function is very useful for button applications. In such case, each button is used to transmit fixed code (data) every time. During initialization, each fixed code is written into corresponding segment FIFO once and for all. Then, if button is triggered, MCU just assigns corresponding segment FIFO (PSA [5:0] and FEP [7:0]) and issues TX strobe command. If TX FIFO is arranged into 8 segments, each TX segment is 8 bytes TX Control Registers Segment PSA FEP FIFO Length (byte) PSA[5:0] (04h) FEP[7:0] (03h) FPM[1:0] (04h) 1 PSA1 FEP1 8 0x00 0x PSA2 FEP2 8 0x08 0x0F 0 3 PSA3 FEP3 8 0x10 0x PSA4 FEP4 8 0x18 0x1F 0 5 PSA5 FEP5 8 0x20 0x PSA6 FEP6 8 0x28 0x2F 0 7 PSA7 FEP7 8 0x30 0x PSA8 FEP8 8 0x38 0x3F 0 Table 16.4 Segment FIFO is arranged into 8 segments 53

54 Procedures of TX FIFO Transmitting 1. Initialize all control registers (refer reference code). 2. Refer to Figure 11.2 and Figure 11.3 (in chapter 11). 3. Send Strobe command TX FIFO write pointer reset. 4. MCU writes fixed code into corresponding segment FIFO once and for all. 5. To consign Segment 1, set PSA = 0x00 and FEP= 0x07 To consign Segment 2, set PSA = 0x08 and FEP= 0x0F To consign Segment 3, set PSA = 0x10 and FEP= 0x17 To consign Segment 4, set PSA = 0x18 and FEP= 0x1F To consign Segment 5, set PSA = 0x20 and FEP= 0x27 To consign Segment 6, set PSA = 0x28 and FEP= 0x2F To consign Segment 7, set PSA = 0x30 and FEP= 0x37 To consign Segment 8, set PSA = 0x38 and FEP= 0x3F 6. Send TX Strobe Command. 7. Done. Figure 16.4 Segment FIFO Mode 54

55 FIFO Extension In FIFO Extension, FIFO length is equal to (FEP [7:0] +1). PSA [5:0] shall be zero, and FPM [1:0] is used to set FIFO Pointer Flag (FPF) to MCU. FIFO extension could be set up to 256 bytes by FEP [7:0] with different FPF trigger conditions. Be notice, setting of SPI data rate is important to prevent error operation of FIFO extension. The min. SPI data rate shall be equal or greater than ( data rate + 500Kbps) and refer Table 16.4 and 16.5 for max. SPI Data Rate. If data rate = 2Mbps and FIFO extension = 256 bytes. TX Control Registers FIFO Length (byte) 256 FPF Trigger Condition Max. SPI Data Rate FEP[7:0] FPM[1:0] PSA[5:0] Delta = Mbps 00 0 Delta = Mbps 01 0 Delta = Mbps 0xFF 10 0 Delta = 16 8 Mbps 11 0 Table 16.5 How to set FIFO extension when is at 2Mbps data rate If data rate = 1Mbps and FIFO extension = 256 bytes. TX Control Registers FIFO Length (byte) 256 FPF Trigger Condition Max SPI Data Rate FEP[7:0] FPM[1:0] PSA[5:0] Delta = Mbps 00 0 Delta = 08 8 Mbps 01 0 Delta = 12 5 Mbps 0xFF 10 0 Delta = 16 4 Mbps 11 0 Table 16.6 How to set FIFO extension when is at 1Mbps data rate Please refer to AMICCOM s reference code (FIFO extension) for details. Procedures of TX FIFO Extension 1. Initialize all control registers (refer reference code). 2. Set FEP [7:0] = 0xFF for 256-bytes FIFO extension. 3. Set FPM [1:0] = 11 for FPF trigger condition. 4. Set CKO Register = 0x12 5. Send Strobe command TX FIFO write pointer reset. 6. MCU writes 1 st 64-bytes TX FIFO. 7. Send TX Strobe command. 8. MCU monitors FPF from s CKO pin. 9. FPF triggers MCU to write 2 nd 48-bytes TX FIFO. 10. Monitor FPF. 11. FPF triggers MCU to write 3 rd 48-bytes TX FIFO. 12. Monitor FPF. 13. FPF triggers MCU to write 4 th 48-bytes TX FIFO. 14. Monitor FPF. 15. FPF triggers MCU to write 5 th 48-bytes TX FIFO. 16. Done. 55

56 Figure 16.5 TX FIFO Extension 56

57 17. ADC (Analog to Digital Converter) has built-in 8-bits ADC that supports multi-functions to do temperature measurement and convert external analog voltage (BP_RSSI pin) into 8-bits digital value. User can set FSARS (1Bh) to select 4MHz or 8MHz ADC clock (F ADC). The converting time is 20 x ADC clock periods. FSARS = 0 is recommended to result less power comsumption. Bit Description XADS (1Bh) RSS (1Fh) Standby mode RX mode 0 0 Temperature None 0 1 None RSSI / Carrier detect 1 x External voltage via BP_RSSI pin None XADS (1Bh) RFT[2:0] (2Dh) BP_BG (Pin 1) XADI 0 [00] Band-gap voltage For external AD input. 0 [01] Analog temperature voltage Analog temperature voltage 0 [10] External ADC input source For external AD input Temperature Measurement has built-in thermal sensor. Combined with 8-bits ADC, it can be used to monitor the relative environment temperature. Below is the measurement procedure: 1. Set RSS= 0 (1Fh), FSARS= 0 (1Bh). 2. Enter Standby mode. 3. Set ADCM= 1 (01h). will enable relative temperature measurement automatically. 4. After measurement done, ADCM is auto clear. 5. User can read digital temperature value from ADC [7:0] (1Bh) External Voltage Measurement BP_RSSI pin can be programmed to be input pin for external voltage measurement which range is 0.3V ~ 1.5V. Below is the measurement procedure: 1. Connect external voltage input to BP_RSSI pin. 2. Set XADS= 1 (1Bh). 3. Enter standby mode. 4. Set ADCM= 1 (01h) to enable external voltage measurement. 5. After measurement done, ADCM is auto clear. 6. User can read digital external voltage value from ADC [7:0] (1Bh). 57

58 18. Battery Detect has built-in battery detector to check supply voltage (REGI pin). The detect range is 2.1V ~ 2.8V into 8 levels. Relative Control Register Battery Detect Register (Address: 26h) R -- RGV1 RGV0 BDF BVT2 BVT1 BVT0 BD_E Name W ECKS RGV1 RGV0 QDS BVT2 BVT1 BVT0 BD_E Reset BVT [2:0]: Battery Voltage Threshold Select. [000]: 2.1V, [001]: 2.2V. [010]: 2.3V. [011]: 2.4V. [100]: 2.5V. [101]: 2.6V. [110]: 2.7V. [111]: 2.8V. ( Typical +-0.1V detection inaccuracy.) Below is the procedure of battery detector for low voltage detection (ex., below 2.3V): 1. Set in idle, standby or PLL mode. 2. Set BVT = [010] and enable BD_E = After 5 us, BD_E is auto clear. 4. Check BDF. If REGI pin > 2.3V, BDF = 1. Else, BDF = 0. 58

59 19. Application Circuit 19.1 MD7328-B90 (915MHz Band) J2 TXOUT 1 2 CON/2P 2.0 L1 8.2nH C13 3.9pF 1 2 CON/2P 2.0 C3 5pF L2 9.1nH C7 0.1uF C10 100pF C12 27pF C15 NC C16 NC R1 0 L3 33nH VDD_A C8 0.1uF C14 120pF C5 2.2uF VDD_A RFO BP_BG C11 100pF C17 0.1uF U1 BP_BG VDD_A RFO EXAD 16 EXAD VDD_VCO CP 5 REGI 15 REGI XI 6 C4 2.2uF CKO 14 CKO XO 7 GIO1 13 GIO1 VDD_PLL 8 SDIO SCK SCS VDD_D SDIO SCK SCS VDD_D REGI GND CKO GND GIO1 SDIO SCK SCS GND GND C6 2.2uF J CON/10P 2.0 CP XI XO C1 560pF R2 1K C2 10nF C18 27pF Y1 16MHz VDD_A C19 27pF C9 0.1uF 1. schematic for RF layouts with single ended 50Ω RF output. 2. C20 and C21 must be matched to the crystal s load capacitance (Cload). Y1 is a 16MHz crystal with 18 pf Cload. 59

60 MD7328-B90 is based on a design by a double-sided FR-4 board of 0.8mm thickness. All passive components are 0402 size. This PCB has a ground plane on the bottom layer. Additionally, there are ground areas on the component side of the board to ensure sufficient grounding of critical components. Keep sufficient via holes to connect the top layer ground areas to the bottom layer ground plane. Be notice, IC back side plate shall be well-solder to ground; otherwise, it will impact RF performance. To get a good RF performance, a well designed PCB is necessary. A poor layout can lead to loss of RF performance especially on matching networks as well as VDD bypass capacitors. PCB layout of critical traces shall follow AMICCOM s recommended values and layout placement. Long power supply lines on the PCB should be avoided. Keep GND via holes as close as possible to s GND pad and IC back side plate (GND). Be Notice, 1. IC Back side plate shall be well-solder to ground (U1 area) for good RF performance. 60

61 19.2 MD7328-B80 (868MHz Band) J2 TXOUT C17 L1 8.2nH C13 3.9pF C18 1.8pF 1.8pF L4 8.2nH J3 1 2 CON/2P 2.0 J4 C3 4.7pF 1 2 CON/2P 2.0 L2 9.1nH C7 0.1uF C10 100pF C12 27pF C15 NC C16 NC R1 0 L3 33nH VDD_A C8 0.1uF C14 120pF C5 2.2uF VDD_A RFO C1 560pF BP_BG C11 100pF R2 1K C19 0.1uF U1 BP_BG VDD_A RFO C2 10nF EXAD 16 EXAD VDD_VCO CP 5 CP REGI 15 REGI XI 6 XI C4 2.2uF CKO 14 CKO XO 7 XO C20 27pF GIO1 13 GIO1 VDD_PLL 8 Y1 SDIO SCK SCS VDD_D 16MHz 12 SDIO 11 SCK 10 SCS 9 VDD_A VDD_D C21 27pF REGI GND CKO GND GIO1 SDIO SCK SCS GND GND C6 2.2uF C9 0.1uF CON/10P schematic for RF layouts with single ended 50Ω RF output. 2. C20 and C21 must be matched to the crystal s load capacitance (Cload). Y1 is a 16MHz crystal with 18 pf Cload. 61

62 MD7328-B80 is based on a design by a double-sided FR-4 board of 0.8mm thickness. All passive components are 0402 size. This PCB has a ground plane on the bottom layer. Additionally, there are ground areas on the component side of the board to ensure sufficient grounding of critical components. Keep sufficient via holes to connect the top layer ground areas to the bottom layer ground plane. Be notice, IC back side plate shall be well-solder to ground; otherwise, it will impact RF performance. To get a good RF performance, a well designed PCB is necessary. A poor layout can lead to loss of RF performance especially on matching networks as well as VDD bypass capacitors. PCB layout of critical traces shall follow AMICCOM s recommended values and layout placement. Long power supply lines on the PCB should be avoided. Keep GND via holes as close as possible to s GND pad and IC back side plate (GND). Be Notice, 2. IC Back side plate shall be well-solder to ground (U1 area) for good RF performance. 62

63 19.3 MD7328-B40 (434MHz Band) J2 TXOUT C17 10pF C13 15pF J3 1 2 L1 18nH CON/2P 2.0 L4 27nH C18 10pF J4 C3 12pF 1 2 CON/2P 2.0 L2 27nH C7 0.1uF C10 100pF C12 27pF C15 NC C16 NC R1 0 L3 100nH VDD_A C8 0.1uF C14 100pF C5 2.2uF VDD_A RFO C1 560pF BP_BG C11 100pF R2 1K C19 0.1uF U1 BP_BG VDD_A RFO C2 10nF EXAD 16 EXAD VDD_VCO CP 5 CP REGI 15 REGI XI 6 XI C4 2.2uF CKO 14 CKO XO 7 XO C20 27pF GIO1 13 GIO1 VDD_PLL 8 Y1 SDIO SCK SCS VDD_D 16MHz 12 SDIO 11 SCK 10 SCS 9 VDD_A VDD_D C21 27pF REGI GND CKO GND GIO1 SDIO SCK SCS GND GND C6 2.2uF C9 0.1uF CON/10P schematic for RF layouts with single ended 50Ω RF output. 4. C20 and C21 must be matched to the crystal s load capacitance (Cload). Y1 is a 16MHz crystal with 18 pf Cload. 63

64 MD7328-B40 is based on a design by a double-sided FR-4 board of 0.8mm thickness. All passive components are 0402 size. This PCB has a ground plane on the bottom layer. Additionally, there are ground areas on the component side of the board to ensure sufficient grounding of critical components. Keep sufficient via holes to connect the top layer ground areas to the bottom layer ground plane. Be notice, IC back side plate shall be well-solder to ground; otherwise, it will impact RF performance. To get a good RF performance, a well designed PCB is necessary. A poor layout can lead to loss of RF performance especially on matching networks as well as VDD bypass capacitors. PCB layout of critical traces shall follow AMICCOM s recommended values and layout placement. Long power supply lines on the PCB should be avoided. Keep GND via holes as close as possible to s GND pad and IC back side plate (GND). Be Notice, 3. IC Back side plate shall be well-solder to ground (U1 area) for good RF performance. 64

65 20. Ordering Information Part No. Package Units Per Reel / Tray A73C28AQFI/Q QFN16L, Pb Free, Tape & Reel, K A73C28AQFI QFN16L, Pb Free, Tray, EA 65

66 21. Package Information QFN 16L (4 X 4 X 0.8mm) Outline Dimensions unit: inches/mm TOP VIEW BOTTOM VIEW 12 D C D L 8 13 E E C e b 0.10 M C A B // 0.10 C A1 A Seating Plane C A3 Symbol Dimensions in inches Dimensions in mm Min Nom Max Min Nom Max A A A REF b D D E E e 0.026BSC L

67 22. Top Marking Information A73C28AQFI Part No. :A73C28AQFI Pin Count :16 Package Type : QFN Dimension :4*4 mm Mark Method : Laser Mark Character Type :Arial 67

68 23. Reflow Profile 68

69 24. Tape Reel Information Cover / Carrier Tape Dimension Unit: mm TYPE P A0 B0 P0 P1 D0 D1 E F W 20 QFN 4* QFN 4* QFN 5* QFN3*3 / DFN SSOP SSOP TYPE K0 t COVER TAPE WIDTH 20 QFN (4X4) QFN (4X4) QFN (5X5) QFN3*3 / DFN SSOP SSOP

70 REEL DIMENSIONS Unit: mm TYPE G N T M D K L R 20 QFN(4X4) 24 QFN(4X4) 32 QFN(5X5) QFN(3X3) / DFN / REF 18.2(MAX) 1.75± / ± SSOP 24 SSOP / REF 22.4(MAX) 1.75± / ± / /

71 25 Product Status Data Sheet Identification Product Status Definition Objective Planned or Under Development This data sheet contains the design specifications for product development. Specifications may change in any manner without notice. Preliminary Engineering Samples and First Production This data sheet contains preliminary data, and supplementary data will be published at a later date.amiccom reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. No Identification Noted Full Production This data sheet contains the final specifications. AMICCOM reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. Obsolete Not In Production This data sheet contains specifications on a product that has been discontinued by AMICCOM. The data sheet is printed for reference information only. Headquarter A3, 1F, No.1, Li-Hsin Rd. 1, Hsinchu Science Park, Taiwan Tel: RF ICs AMICCOM Shenzhen Office Rm., 2003, DongFeng Building, No. 2010, Shennan Zhonglu Rd., Futian Dist., Shenzhen, China Post code: Web Site 71