Project: IEEE P Working Group for Wireless Personal Area Networks N

Transcription

1 Slide 1 Project: IEEE P Working Group for Wireless Personal Area Networks N (WPANs( WPANs) Title: [RF Devices for Millimeter-Wave Applications ] Date Submitted: [10 November 2003] Source: [Kenichi Maruhashi] Company [NEC Corporation] Address [2-9-1 Seiran, Otsu, Shiga , Japan] Voice:[ ] [k-maruhashi@bl.jp.nec.com] Source:[Hiroyo Ogawa, Kiyoshi Hamaguchi, Yozo Shoji] Company [Communications Research Laboratory, Incorporated Administrative Agency] Address [3-4, Hikarino-Oka, Yokosuka, Kanagawa, , Japan] Voice:[ , , ] [hogawa@crl.go.jp, hamaguti@crl.go.jp, y-shoji@crl.go.jp] Re : [] Abstract:[RF Devices for mm-wave applications are introduced. ] Purpose:[Contribution for millimeter-wave interest group ] Notice :This document has been prepared to assist the IEEE P It is offered as a basis for discussion and is not binding on the contributing individual(s) or organization(s). The material in this document is subject to change in form and content after further study. The contributor(s) reserve(s) the right to add, amend or withdraw material contained herein. Release:The contributor acknowledges and accepts that this contribution becomes the property of IEEE and may be made publicly available by P

2 RF Devices for Millimeter-Wave Applications Slide 2

3 RF Devices for V-band (50-75GHz) Applications Gallium Arsenide (GaAs) Devices - phemt: high F T (>80GHz) and Fmax (>200GHz), low noise and high output power - HBT: low phase noise in oscillators - Mature process technology for 4 6 inch wafers - Foundry services available (provided by several companies in US, Europe, Japan and Taiwan) Indium Phosphide (InP) Devices - Higher F T and Fmax, lower noise compared to GaAs devices - Lower breakdown voltage i.e. inadequate for high power applications Silicon Germanium (SiGe) Devices - Higher F T and Fmax (>100GHz) for low voltage devices - Possible integration with other circuits (BiCMOS) Slide 3

4 Requirements Transceiver - Design with careful consideration of mmw device properties: some components are difficult to be obtained such as low-phase noise local oscillators, high linearity amplifiers, and narrow bandpass filters. Package - Simple module structure to be easily fabricated at mass production - Low loss interconnects - No parasitic radiation, oscillation and resonance due to packaging structure Slide 4

5 Self-heterodyne Technique Transmission - RF and LO transmitted simultaneously - Low phase noise and high stable oscillator NOT required Reception - Complete cancellation of phase-noise and frequency-offset by the self-heterodyne detection (square-law detection) Local leak DSB mixer IF input Transmitter P t SSB B P r T Receiver NF=F 2B square-law detector ( )2 IF output f i f c DSB B f c -f i f c f c f c +f i B f c +f i IM2 B B f i f Slide 5 Reference: IEEE /119r4

6 Block Diagram of Self-heterodyne Transceiver TX 36GHz OSC Sub-harmonically pumped mixer AMP (LNA) Filter MPA Ceramic Module MPA ANT IF in IF Amp RX ANT Ceramic Module IF Amp IF out LNA Filter Self-heterodyne mixer Reference: Millimeter-Wave Ad-hoc Wireless Access System II (6), TSMMW2003 Technical Digest, pp61-64, March 2003 Slide 6

7 Chipset Performance Chip Sub-harmonically pumped mixer(shm) Medium power amplifier (MPA) Low noise amplifier (LNA) Self-heterodyne mixer Filter Function Up-converting with intentional LO leakage Transmitting amplifier Receiving amplifier(rx) Driver amplifier(tx) Square-law detection Filtering (TX, RX) Performance P 1dB = LO =-5dBm / f LO =36GHz P 1dB =10.2dBm, f=72ghz / Vd=3.3V Gain 20dB (f:70 75GHz / Vd=3.3V) P IF = 1 =P 2 = -47dBm (f 1 =72.40GHz, f 2 =72.54GHz) Insertion loss=1db, BW=4.0GHz ICs have been fabricated using 0.15-µm phemt Process Reference: Millimeter-Wave Ad-hoc Wireless Access System II (6), TSMMW2003 Technical Digest, pp61-64, March 2003 Slide 7

8 Ceramic Module Coplanar Devices (ref1) Flip-chip mounting Embedded CPW (Ref2) Thick film printing Low dispersion 0.27dB/mm at 72GHz Lid To antenna (EM coupling) CPW/WG Transition Feeder loss < 2dB VIA GND GND RF GND DC LTCC PWB:Printed Wiring Board PWB Ball Grid Array IF signal DC Capacitor (Bias decoupling) IC (Ref1) M. Ito et al., IEEE MTT-S IMS, p.1789, 2002 (Ref2) K. Maruhashi et al, IEEE ISSCC, p.324, 2000 Slide 8

9 Transceiver Example Center frequency IF frequency RF power Duplex Transmission 72.4 GHz 140MHz or 470MHz +10dBm (P1dB) TDD DSB self-heterodyne 17cm 70GHz GHz-band Link 10cm Mobile Terminal (MT) Slide 9 Access Point Terminal (AP)

10 Conclusion RF devices operating at millimeter-wave frequencies are discussed. A trial example of the transceiver at V-band is introduced. Slide 10