High Speed/High Temperature Dual Digital Isolators. Features. Applications

Transcription

1 IL/IL/IL High Speed/High Temperature Dual Digital Isolators Functional Diagrams IN IN IL IN OUT OUT OUT OUT IN Features +5 V/+. V CMOS / TTL Compatible High Speed: 50 Typical (S-Series) High Temperature: 40 C to +5 C (T-Series) 500 V RMS Isolation ( min.) 00 ps Typical Pulse Width Distortion (S-Series) 00 ps Typical Pulse Jitter 4 Typical Propagation Delay Skew 0 Typical Propagation Delay 0 kv/µs Typical Common Mode Traient Immunity Low EMC Footprint Channel-to-Channel Skew 8-pin MSOP, SOIC, and PDIP Packages UL5 and IEC Approved OUT IN IL IN OUT Applicatio PROFIBUS DeviceNet CAN RS-485 and RS-4 Board-to-Board Communication Peripheral Interfaces Logic Level Shifting IL Description NVE s IL00 family of high-speed digital isolators are CMOS devices manufactured with NVE s patented* IsoLoop spintronic Giant Magnetoresistive (GMR) technology. The ILS and ILS are the world s fastest two-channel isolators, with a 50 typical data rate for both channels. The symmetric magnetic coupling barrier provides a typical propagation delay of only 0 and a pulse width distortion as low as 00 ps (0. ), achieving the best specificatio of any isolator. Typical traient immunity of 0 kv/µs is uurpassed. The IL has two tramit channels; the IL and IL have one tramit and one receive channel. The IL and IL operate full duplex, making them ideal for many fieldbus applicatio, including PROFIBUS, DeviceNet, and CAN. The IL has channels reversed to better suit certain board layouts. The IL and IL are available in 8-pin MSOP, SOIC, and PDIP packages. The IL is available in an 8-pin SOIC package. Standard and S-Grade parts are specified over a temperature range of 40 C to +00 C; T-Grade parts have a maximum operating temperature of +5 C. IsoLoop is a registered trademark of NVE Corporation. *U.S. Patent numbers 5,8,4;,00, and others. REV. X NVE Corporation 409 Valley View Road, Eden Prairie, MN Phone: (95) 89-9 Fax: (95) NVE Corporation

2 IL/IL/IL Absolute Maximum Ratings Parameters Symbol Min. Typ. Max. Units Test Conditio Storage Temperature T S C Ambient Operating Temperature () 5 T ILT/ ILT/ILT A 55 5 C Supply Voltage V DD, V DD 0.5 V Input Voltage V I 0.5 V DD V Output Voltage V O 0.5 V DD V Output Current Drive I O 0 ma Lead Solder Temperature 0 C 0 sec. ESD kv HBM Recommended Operating Conditio Parameters Symbol Min. Typ. Max. Units Test Conditio Ambient Operating Temperature IL/IL and ILS/ILS ILT/ILT/ILT T A C C Supply Voltage V DD, V DD V Logic High Input Voltage V IH.4 V DD V Logic Low Input Voltage V IL V Input Signal Rise and Fall Times t IR, t IF µs Iulation Specificatio Parameters Symbol Min. Typ. Max. Units Test Conditio Creepage Distance MSOP.0 mm SOIC 4.0 mm PDIP.04 mm Leakage Current (5) 0. µa 40 V RMS, 0 Hz Barrier Impedance (5) >0 4 Ω pf Package Characteristics Parameters Symbol Min. Typ. Max. Units Test Conditio Capacitance (Input Output) (5) C I O pf f = MHz Thermal Resistance MSOP θ JC 8 C/W SOIC θ JC 44 C/W PDIP θ JC 54 C/W Thermocouple at center underside of package Package Power Dissipation P PD 50 mw f = MHz, V DD = 5 V Safety and Approvals IEC00- TUV Certificate Numbers: N508, N508-0 Classification as Reinforced Iulation Pollution Degree Material Group Max. Working Voltage Model Package IL-; IL- MSOP II III 50 V RMS IL-; IL- PDIP II III 00 V RMS IL-; IL-; IL- SOIC II III 50 V RMS UL 5 Component Recognition Program File Number: E048 Rated 500V RMS for minute Soldering Profile Per JEDEC J-STD-00C, MSL=

3 IL/IL/IL IL Pin Connectio V DD Supply voltage IN Data in, channel IN Data in, channel 4 GND Ground return for V DD 5 GND Ground return for V DD OUT Data out, channel OUT Data out, channel 8 V DD Supply voltage V DD IN IN GND V DD OUT OUT GND IL IL Pin Connectio V DD Supply voltage IN Data in, channel OUT Data out, channel 4 GND Ground return for V DD 5 GND Ground return for V DD IN Data in, channel OUT Data out, channel 8 V DD Supply voltage V DD IN OUT GND V DD OUT IN GND IL IL Pin Connectio V DD Supply voltage OUT Data out, channel IN Data in, channel 4 GND Ground return for V DD 5 GND Ground return for V DD OUT Data out, channel IN Data in, channel 8 V DD Supply voltage V DD OUT IN GND V DD IN OUT GND IL Timing Diagram Legend t PLH Propagation Delay, Low to High t PHL Propagation Delay, High to Low t PW Minimum Pulse Width t R Rise Time Fall Time t F

4 IL/IL/IL. Volt Electrical Specificatio Electrical specificatio are T min to T max unless otherwise stated. Parameters Symbol Min. Typ. Max. Units Test Conditio DC Specificatio Input Quiescent Supply Current IL 8 0 µa I IL/IL DD.5 ma Output Quiescent Supply Current IL. 4 ma I IL/IL DD.5 ma Logic Input Current I I 0 0 µa Logic High Output Voltage V V DD 0. V DD I O = 0 µa, V I = V IH OH V 0.8 x V DD 0.9 x V DD I O = 4 ma, V I = V IH Logic Low Output Voltage V 0 0. I O = 0 µa, V I = V IL OL V I O = 4 ma, V I = V IL Switching Specificatio Maximum Data Rate IL/IL/IL ILS/ILS ILT/ILT/ILT Pulse Width () PW % Points, V O Propagation Delay Input to Output (High to Low) t PHL 8 Propagation Delay Input to Output t PLH 8 (Low to High) Pulse Width Distortion () IL/IL/IL ILS/ILS ILT/ILT/ILT PWD Propagation Delay Skew () t PSK 4 Output Rise Time (0% 90%) t R 4 Output Fall Time (0% 90%) t F 4 Common Mode Traient Immunity (Output Logic High or Logic Low) (4) CM H, CM L 0 0 kv/µs V CM = 00 V Channel-to-Channel Skew t CSK Dynamic Power Coumption () µa/mhz per channel Magnetic Field Immunity (8) (V DD = V, V<V DD <5.5V) Power Frequency Magnetic Immunity H PF A/m 50Hz/0Hz Pulse Magnetic Field Immunity H PM A/m t p = 8µs Damped Oscillatory Magnetic Field H OSC A/m 0.Hz MHz Cross-axis Immunity Multiplier (9) K X.5 4

5 IL/IL/IL 5 Volt Electrical Specificatio Electrical specificatio are T min to T max unless otherwise stated. Parameters Symbol Min. Typ. Max. Units Test Conditio DC Specificatio Input Quiescent Supply Current IL 0 5 µa I IL/IL DD.5 ma Output Quiescent Supply Current IL 5 ma I IL/IL DD.5 ma Logic Input Current I I 0 0 µa Logic High Output Voltage V V DD 0. V DD I O = 0 µa, V I = V IH OH V 0.8 x V DD 0.9 x V DD I O = 4 ma, V I = V IH Logic Low Output Voltage V 0 0. I O = 0 µa, V I = V IL OL V I O = 4 ma, V I = V IL Switching Specificatio Maximum Data Rate IL/IL/IL ILS/ILS ILT/ILT/ILT Pulse Width () PW % Points, V O Propagation Delay Input to Output (High to Low) t PHL 0 5 Propagation Delay Input to Output t PLH 0 5 (Low to High) Pulse Width Distortion () IL/IL/IL ILS/ILS ILT/ILT/ILT PWD 5 0. Pulse Jitter (0) t J 00 ps Propagation Delay Skew () t PSK 4 Output Rise Time (0% 90%) t R Output Fall Time (0% 90%) t F Common Mode Traient Immunity (Output Logic High or Logic Low) (4) CM H, CM L 0 0 kv/µs V cm = 00 V Channel to Channel Skew t CSK Dynamic Power Coumption () µa/mhz per channel Magnetic Field Immunity (8) (V DD = 5V, V<V DD <5.5V) Power Frequency Magnetic Immunity H PF A/m 50Hz/0Hz Pulse Magnetic Field Immunity H PM A/m t p = 8µs Damped Oscillatory Magnetic Field H OSC A/m 0.Hz MHz Cross-axis Immunity Multiplier (9) K X.5 Notes (apply to both. V and 5 V specificatio):. Absolute maximum ambient operating temperature mea the device will not be damaged if operated under these conditio. It does not guarantee performance.. PWD is defined as t PHL t PLH. %PWD is equal to PWD divided by pulse width.. t PSK is the magnitude of the worst-case difference in t PHL and/or t PLH between devices at 5 C. 4. CM H is the maximum common mode voltage slew rate that can be sustained while maintaining V O > 0.8 V DD. CM L is the maximum common mode input voltage that can be sustained while maintaining V O < 0.8 V. The common mode voltage slew rates apply to both rising and falling common mode voltage edges. 5. Device is coidered a two terminal device: pi 4 shorted and pi 5 8 shorted.. Dynamic power coumption is calculated per channel and is supplied by the channel s input side power supply.. Minimum pulse width is the minimum value at which specified PWD is guaranteed. 8. The relevant test and measurement methods are given in the Electromagnetic Compatibility section on p.. 9. External magnetic field immunity is improved by this factor if the field direction is end-to-end rather than to pin-to-pin (see diagram on p. ). 0. 4k-bit pseudo-random binary signal (PRBS) NRZ bit pattern with no more than five coecutive s or 0s; 800 ps traition time.

6 IL/IL/IL Application Information Electrostatic Discharge Seitivity This product has been tested for electrostatic seitivity to the limits stated in the specificatio. However, NVE recommends that all integrated circuits be handled with appropriate care to avoid damage. Damage caused by inappropriate handling or storage could range from performance degradation to complete failure. Electromagnetic Compatibility IsoLoop Isolators have the lowest EMC footprint of any isolation technology. IsoLoop Isolators Wheatstone bridge configuration and differential magnetic field signaling eure excellent EMC performance agait all relevant standards. These isolators are fully compliant with generic EMC standards EN5008, EN5008- and the umbrella line-voltage standard for Information Technology Equipment (ITE) EN000. NVE has completed compliance tests in the categories below: EN5008- Residential, Commercial & Light Industrial Methods EN550, EN5504 EN5008-: Industrial Environment Methods EN (ESD), EN (Electromagnetic Field Immunity), EN (Electrical Traient Immunity), EN (RFI Immunity), EN (Power Frequency Magnetic Field Immunity), EN (Pulsed Magnetic Field), EN (Damped Oscillatory Magnetic Field) ENV5004 Radiated Field from Digital Telephones (Immunity Test) Immunity to external magnetic fields is even higher if the field direction is end-to-end rather than to pin-to-pin as shown in the diagram below: Power Supply Decoupling Both power supplies to these devices should be decoupled with low-esr 4 nf ceramic capacitors. Ground planes for both GND and GND are highly recommended for data rates above 0. Capacitors must be located as close as possible to the V DD pi. Signal Status on Start-up and Shut Down To minimize power dissipation, input signals are differentiated and then latched on the output side of the isolation barrier to recotruct the signal. This could result in an ambiguous output state depending on power up, shutdown and power loss sequencing. Unless the circuit connected to the isolator performs its own poweron reset (POR), the designer should coider including an initialization signal in the start-up circuit. Initialization coists of toggling the input either high then low, or low then high. In CAN applicatio, the IL or IL should be used with CAN traceivers with Dominant Timeout functio for seamless POR. Most CAN traceiver manufacturers offer Dominant Timeout optio. Examples include NXP s TJA 050 and TJA 040 traceivers. Data Tramission Rates The reliability of a tramission system is directly related to the accuracy and quality of the tramitted digital information. For a digital system, those parameters which determine the limits of the data tramission are pulse width distortion and propagation delay skew. Propagation delay is the time taken for the signal to travel through the device. This is usually different when sending a low-to-high than when sending a high-to-low signal. This difference, or error, is called pulse width distortion (PWD) and is usually in nanoseconds. It may also be expressed as a percentage: PWD% = Maximum Pulse Width Distortion () x 00% Signal Pulse Width () For example, with data rates of.5 : Cross-axis Field Direction Dynamic Power Coumption IsoLoop Isolators achieve their low power coumption from the way they tramit data across the isolation barrier. By detecting the edge traitio of the input logic signal and converting these to narrow current pulses, a magnetic field is created around the GMR Wheatstone bridge. Depending on the direction of the magnetic field, the bridge causes the output comparator to switch following the input logic signal. Since the current pulses are narrow, about.5, the power coumption is independent of mark-to-space ratio and solely dependent on frequency. This has obvious advantages over optocouplers, which have power coumption heavily dependent on mark-to-space ratio. PWD% = x 00% =.5% 80 This figure is almost three times better than any available optocoupler with the same temperature range, and two times better than any optocoupler regardless of published temperature range. IsoLoop isolators exceed the 0% maximum PWD recommended by PROFIBUS, and will run to nearly 5 Mb within the 0% limit. Propagation delay skew is the signal propagation difference between two or more channels. This becomes significant in clocked systems because it is undesirable for the clock pulse to arrive before the data has settled. Short propagation delay skew is therefore especially critical in high data rate parallel systems for establishing and maintaining accuracy and repeatability. Worstcase channel-to-channel skew in an IL00 Isolator is only, which is ten times better than any optocoupler. IL00 Isolators have a maximum propagation delay skew of, which is five times better than any optocoupler.

7 IL/IL/IL Illustrative Applicatio Isolated CAN ADR 0..., CS Tx0 TxD CANH XTAL XTAL SJA000 Rx0 IL/IL RxD 4 TJA050 CANL In today s CAN networks, node-to-node isolation is increasingly recommended by designers to reduce EMI susceptibility, especially in highspeed applicatio and in hybrid and electrical vehicle networks, where the V battery has been replaced with one of several hundred volts. Operator and equipment safety becomes critical when a high voltage source, such as the battery, needs to be connected to diagnosis systems during routine maintenance procedures. In the application shown above, the microcontroller is isolated from the CAN traceiver by an IL or IL, allowing higher speed and more reliable bus operation by eliminating ground loops and reducing susceptibility to noise and EMI events. The best-in-class 0 typical IL/IL propagation delay minimizes CAN loop delay and maximizes data rate over any given bus length. The simple circuit works with any CAN traceiver with a TxD dominant timeout, which includes all of the current-generation traceivers. Isolated PROFIBUS / RS IL Isolation Boundary RS-485 Truth Table D DE A B R 0 Z Z X 0 0 Z Z X IL0 5 ISL8485 NVE offers a unique line of PROFIBUS / RS-485 traceivers, but IL00 high-speed digital signal isolators can also be used as part of multi-chip desig with non-isolated PROFIBUS traceivers.

8 IL/IL/IL Package Drawings, Dimeio and Specificatio 8-pin MSOP 0.4 (.90) 0. (.0) (0.40) 0.0 (0.0) 0.89 (4.80) 0.9 (5.00) 0.00 (0.5) 0.0 (0.40) 0.4 (.90) 0. (.0) (0.) (0.) 0.0 (0.80) 0.04 (.0) 0.00 (0.05) 0.08 (0.0) 0.00 (0.5) 0.04 (0.0) NOTE: Pin spacing is a BASIC dimeion; tolerances do not accumulate 8-pin SOIC Package Dimeio in inches (mm) 0.89 (4.8) 0.9 (5.0) 0º 8º 0.0 (0.40) (.) 0.8 (5.8) 0.44 (.) 0.50 (.8) 0.5 (4.0) 0.00 (0.5) 0.00 (0.50) x45º (.0) 0.00 (.5) (.) 0.09 (.5) (0.0) 0.00 (0.5) 0.0 (0.) 0.00 (0.50) (0.9) 0.00 (0.5) NOTE: Pin spacing is a BASIC dimeion; tolerances do not accumulate 8-pin PDIP 0.9 (.4) 0. (.9) 0.4 (.) 0. (.) 0. (.05) 0.5 (.8) (0.) 0. (9.0) 0.40 (0.) 0.0 (.) 0. (9.4) 0.05 (0.4) 0.05 (0.8) 0.05 (0.89) 0.00 (0.) 0.09 (.) (.4) 0.05 (0.8) 0. (.8) 0.0 (0.58) NOTE: Pin spacing is a BASIC (.4) dimeion; tolerances 0.05 (.5) do not accumulate 8

9 IL/IL/IL Ordering Information and Valid Part Numbers IL T - E TR Bulk Packaging Blank = Tube TR = '' Tape and Reel TR = '' Tape and Reel Package Blank= 80/0 Tin/Lead Plating E = RoHS Compliant Package Type - = MSOP - = PDIP - = 0.5'' 8-pin SOIC Grade Blank = Standard T = High Temperature S = High Speed Base Part Number = Drive Channels = Drive Channel Receive Channel = Drive Channel Receive Channel (reverse pinout) Product Family IL = Isolators Valid Part Numbers IL- IL-E ILS- ILS-E ILT- ILT-E IL- IL-E ILT- ILT-E IL- ILS- ILT- IL-E ILS-E ILT-E IL- IL-E ILS- ILS-E ILT- ILT-E IL- IL-E ILT- ILT-E IL- ILS- ILT- IL-E ILS-E ILT-E IL- ILT- IL-E ILT-E All MSOP and SOIC parts are available on tape and reel. RoHS COMPLIANT 9

10 IL/IL/IL ISB-DS-00-IL/-X September 00 ISB-DS-00-IL/-W ISB-DS-00-IL/-V ISB-DS-00-IL/-U ISB-DS-00-IL/-T ISB-DS-00-IL/-S ISB-DS-00-IL/-R ISB-DS-00-IL/-Q ISB-DS-00-IL/-P ISB-DS-00-IL/-O ISB-DS-00-IL/-N ISB-DS-00-IL/-M Changed MSOP pin spacing (p. 8). Changed MSOP pin spacing (p. 8). Clarified S-Series and T-Series speed specificatio. Added IL configuration. Added CAN application diagram (p. ). Added typical jitter specification at 5V. Added EMC details. IEC 00 approval for MSOP versio. Added magnetic field immunity and electromagnetic compatibility specificatio. Correct SOIC package drawing. Note on all package drawings that pin-spacing tolerances are non-accumulating; change MSOP pin-spacing dimeio and tolerance accordingly. Changed lower limit of length on PDIP package drawing. Tightened pin-spacing tolerance on MSOP package drawing. Changed ordering information to reflect that devices are now fully RoHS compliant with no exemptio. ISB-DS-00-IL/-L Eliminated soldering profile chart ISB-DS-00-IL/-K Added RS-485 application circuit ISB-DS-00-IL/-J MSOP packages, S- and T-Grades added Order information updated 0

11 IL/IL/IL About NVE An ISO 900 Certified Company NVE Corporation manufactures innovative products based on unique spintronic Giant Magnetoresistive (GMR) technology. Products include Magnetic Field Seors, Magnetic Field Gradient Seors (Gradiometers), Digital Magnetic Field Seors, Digital Signal Isolators, and Isolated Bus Traceivers. NVE pioneered spintronics and in 994 introduced the world s first products using GMR material, a line of ultra-precise magnetic seors for position, magnetic media, gear speed and current seing. NVE Corporation 409 Valley View Road Eden Prairie, MN USA Telephone: (95) 89-9 Fax: (95) Internet: isoinfo@nve.com The information provided by NVE Corporation is believed to be accurate. However, no respoibility is assumed by NVE Corporation for its use, nor for any infringement of patents, nor rights or licees granted to third parties, which may result from its use. No licee is granted by implication, or otherwise, under any patent or patent rights of NVE Corporation. NVE Corporation does not authorize, nor warrant, any NVE Corporation product for use in life support devices or systems or other critical applicatio, without the express written approval of the President of NVE Corporation. Specificatio shown are subject to change without notice. ISB-DS-00-IL/-X September 00