Preliminary Datasheet

Transcription

1 Preliminary Datasheet MBI5124 Features 16 Channel Constant Current LED Driver with Ghosting Elimination 16 constantcurrent output channels Constant output current invariant to load voltage change: Constant output current range: DD =5V; DD =3.3V Excellent output current accuracy: between channels: ±1.5% (typ.) and ±2.5% (max.) between ICs: ±1.5% (typ.) and ±3% (max.) Output current adjusted through an external resistor Fast response of output current, OE (min.): 50ns with good uniformity between output channels Integrating ghosting elimination Staggered delay of output 25MHz clock frequency Schmitt trigger input 3.3V/ 5V supply voltage Pbfree & Green Package Small Outline Package GF: SOP24L Shrink SOP GP: SSOP24L Mini SOP GM: mssop24l Product Description With PrecisionDrive technology, MBI5124 is designed for LED displays which require to operate at low current and to match the luminous intensity of each channel. It provides supply voltage and accepts CMOS logic input at 3.3V and 5.0V to meet the trend of low power consumption. MBI5124 contains a serial buffer and data latches which convert serial input data into parallel output format. At MBI5124 output stage, sixteen regulated current ports are designed to provide uniform and constant current sinks for driving LEDs within a large range of V F variations. Besides, MBI5124 integrates the precharge circuit which can relieve the ghosting. MBI5124 provides users with great flexibility and device performance while using MBI5124 in their system design for LED display applications, e.g. LED panels. It accepts an input voltage range from 3.3V to 5V and maintains a constant current up from 1mA to 25mA determined by an external resistor, R ext, which gives users flexibility in controlling the light intensity of LEDs. MBI5124 guarantees to endure maximum 17V at the output port. The high clock frequency, 25 MHz, also satisfies the system requirements of high volume data transmission. Macroblock, Inc Floor 64, No.18, PuTing Rd., Hsinchu, Taiwan 30077, ROC. TEL: , FAX: info@mblock.com.tw 1 June 2014, V1.00

2 Block Diagram OUT0 OUT1 OUT14 OUT15 REXT I O Regulator VDD Precharge 16bit Output Drive OE LE 16 16bit Output Latch GND Configuration Register SDI CLK 16bit Shift Register SDO 2 June 2014, V1.00

3 Pin Configuration GND 1 24 VDD SDI 2 23 REXT CLK 3 22 SDO LE 4 21 OE OUT OUT15 OUT OUT14 OUT OUT13 OUT OUT12 OUT OUT11 OUT OUT10 OUT OUT9 OUT OUT8 MBI5124GF/GP/GM Terminal Description Pin No. Pin Name Function 1 GND Ground terminal for control logic and current sink 2 SDI Serialdata input to the shift register 3 CLK Clock input terminal for data shift on rising edge 4 LE Data strobe input terminal Serial data is transferred to the output latch when LE is high. The data is latched when LE goes low. 5~20 OUT0 ~ OUT15 Constant current output terminals 21 OE 22 SDO 23 REXT Output enable terminal When (active) low, the output drivers are enabled; when high, all output drivers are turned OFF (blanked). Serialdata output to the following SDI of next driver IC. SDO signal change on rising edge of CLK. Input terminal used to connect an external resistor for setting up output current for all output channels 24 VDD 3.3V/5V supply voltage terminal 3 June 2014, V1.00

4 Equivalent Circuits of Inputs and Outputs OE terminal LE terminal VDD VDD IN IN CLK, SDI terminal VDD SDO terminal VDD IN OUT 4 June 2014, V1.00

5 Timing Diagram CLK N = SDI D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 LE OE OUT0 OUT1 OUT2 OUT3 D0 D1 D2 OFF ON OFF ON OFF ON OFF ON OUT15 D15 OFF ON SDO D15 : don t care Truth Table CLK LE OE SDI OUT0 OUT 7 OUT15 SDO H L D n D n.. D n 7. D n 15 D n15 L L D n+1 No Change D n14 H L D n+2 D n + 2. D n 5. D n 13 D n13 X L D n+3 D n + 2. D n 5. D n 13 D n13 X H D n+4 Off D n13 5 June 2014, V1.00

6 Maximum Ratings Characteristic Symbol Rating Unit Supply Voltage V DD 0~7.0 V Input Voltage(SDI, CLK, LE, GCLK) V IN 0.4~V DD +0.4 V Output Current I OUT +30 ma Sustaining Voltage at OUT Port V DS 0.5~+17.0 V GND Terminal Current I GND 480 ma GFtype 2.34 Power Dissipation GPtype P (On PCB, Ta=25 C)* D 1.76 GMtype 1.33 W GFtype Thermal Resistance R (On PCB, Ta=25 C)* GPtype th(ja) GMtype 93.5 C/W Junction Temperature T j, max 150** C Operating Ambient Temperature T opr 40~+85 C Storage Temperature T stg 55~+150 C ESD Rating HBM(MILSTD883G Method ) MM(JEDEC EIA/JESD22A115) HBM MM Class 3A (5000V) Class M4 ( 400V) *The PCB size is 76.2mm*114.3mm in simulation. Please refer to JEDEC JESD51. ** Operation at the maximum rating for extended periods may reduce the device reliability; therefore, the suggested junction temperature of the device is under 125 C. Note: The performance of thermal dissipation is strongly related to the size of thermal pad, thickness and layer numbers of the PCB. The empirical thermal resistance may be different from simulative value. Users should plan for expected thermal dissipation performance by selecting package and arranging layout of the PCB to maximize the capability. 6 June 2014, V1.00

7 Electrical Characteristics (V DD = 5.0V, Ta=25 ) Characteristics Symbol Condition Min. Typ. Max. Unit Supply Voltage V DD V Sustaining Voltage at OUT Ports Output Current Input Voltage V DS OUT0~ OUT15 17 V I OUT Refer to Test Circuit for Electrical Characteristics ma I OH SDO 1.0 ma I OL SDO 1.0 ma H level V IH T a =40~85ºC 0.7 x V DD V DD V L level V IL T a =40~85ºC GND 0.3 x V DD V Output Leakage Current I OH V DS =17.0V 0.5 μa Output Voltag SDO V OL I OL =+1.0mA 0.4 V V OH I OH =1.0mA 4.6 V Output Current 1 I OUT1 V DS =1.0V R ext =1820Ω ma Current Skew di OUT1 I OUT =10.05mA V DS =1.0V R ext =1820Ω ±1.5 ±2.5 % Output Current 2 I OUT2 V DS =1.0V R ext =1820Ω ma Current Skew Output Current vs. Output Voltage Regulation Output Current vs. Supply Voltage Regulation di OUT2 I OUT =10.05mA V DS =1.0V R ext =1820Ω ±1.5 ±3.0 % %/dv DS V DS within 1.0V and 3.0V ±0.1 ±0.3 %/V %/dv DD V DD within 4.5V and 5.5V ±1.0 %/V Pullup Resistor R IN (up) OE KΩ Pulldown Resistor R IN (down) LE KΩ Supply Current OFF I DD (off) 1 R ext =Open, OUT0~ OUT15 =Off I DD (off) 2 ON I DD (on) 1 R ext =1820Ω, (10.05mA) OUT0~ OUT15 =Off R ext =1820Ω, (10.05mA) OUT0~ OUT15 =On ma 7 June 2014, V1.00

8 Electrical Characteristics (V DD = 3.3V, Ta=25 ) Characteristics Symbol Condition Min. Typ. Max. Unit Supply Voltage V DD V Sustaining Voltage at OUT Ports Output Current Input Voltage V DS OUT0~ OUT V I OUT Refer to Test Circuit for Electrical Characteristics 1 10 ma I OH SDO, V OH =2.9V 1.0 ma I OL SDO, V OL =0.4V 1.0 ma H level V IH T a =40~85ºC 0.7 x V DD V DD V L level V IL T a =40~85ºC GND 0.3 x V DD V Output Leakage Current I OH V DS =17.0V 0.5 μa Output Voltag SDO V OL I OL =+1.0mA 0.4 V V OH I OH =1.0mA 2.9 V Output Current 1 I OUT1 V DS =1.0V Rext=1820Ω ma Current Skew di OUT1 I OUT =10.05mA V DS =1.0V Rext=1820Ω ±1.5 ±2.5 % Output Current 2 I OUT2 V DS =1.0V Rext=1820Ω ma Current Skew Output Current vs. Output Voltage Regulation Output Current vs. Supply Voltage Regulation di OUT2 I OUT =10.05mA V DS =1.0V Rext=1820Ω ±1.5 ±3.0 % %/dv DS V DS within 1.0V and 3.0V ±0.1 ±0.3 %/V %/dv DD V DD within 3.0V and 4.5V ±0.5 ±1.0 %/V Pullup Resistor R IN (up) OE KΩ Pulldown Resistor R IN (down) LE KΩ Supply Current OFF I DD (off) 1 R ext = Open, OUT0~ OUT15 =Off I DD (off) 2 ON I DD (on) 1 R ext =1820Ω, (10.05mA) OUT0~ OUT15 =Off R ext =1820Ω, (10.05mA) OUT0~ OUT15 =On Test Circuit for Electrical Characteristics ma I DD VDD IOUT V DD OE OUT0 I IH,IIL. VDS CLK. V IH,VIL LE SDI OUT15 SDO R EXT GND Iref 8 June 2014, V1.00

9 Switching Characteristics (V DD = 5.0V, Ta=25 ºC) Propagation Delay Time ( L to H ) Characteristics Symbol Condition Min. Typ. Max. Unit LE OUT 2n t plh ns LE OUT2n ns OE OUT 2n t plh ns OE OUT2n ns CLKSDO t plh ns LE OUT 2n t phl ns LE OUT2n ns Propagation Delay Time OE OUT 2n ns ( H to L ) t phl3 OE OUT2n 1 V DD =5.0V ns Pulse Width Hold Time for LE CLKSDO CLK LE OE ** t phl t w(clk) t w(l) t w(oe) t h(l) V DS =1.0V V IH =V DD V IL =GND R ext =1820Ω V L =4.0V R L =300Ω C L =10pF ns ns ns ns ns Setup Time for LE t su(l) 5 ns Hold Time for SDI t h(d) 5 ns Setup Time for SDI t su(d) 3 ns Maximum CLK Rise Time t r 500 ns Maximum CLK Fall Time t f 500 ns SDO Rise Time t r,sdo ns SDO Fall Time T f,sdo ns Output Rise Time of Output Ports t or ns Output Fall Time of Output Ports t of ns *The staggered delay between odd channels, OUT2n 1 (e.g. OUT1, OUT3, OUT5, etc.) and even channels OUT 2n (e.g. OUT2, OUT4, OUT6, etc.) is 2ns. MBI5124 has a builtin staggered circuit to perform delay mechanism, by which the even and odd output ports will be turned on at a different time so that the instant current from the power line will be lowered. ** ** With uniform output current. 9 June 2014, V1.00

10 Switching Characteristics (V DD = 3.3V, Ta=25 ºC) Propagation Delay Time ( L to H ) Characteristics Symbol Condition Min. Typ. Max. Unit LE OUT 2n t plh ns LE OUT2n ns OE OUT 2n t plh ns OE OUT2n ns CLKSDO t plh ns LE OUT 2n t phl ns LE OUT2n ns Propagation Delay Time OE OUT 2n ns ( H to L ) t phl3 OE OUT2n ns Pulse Width Hold Time for LE CLKSDO CLK LE OE ** t phl t w(clk) t w(l) t w(oe) t h(l) V DD =3.3V V DS =1.0V V IH =V DD V IL =GND R ext =1820Ω V L =4.0V R L =300Ω C L =10pF ns ns ns ns ns Setup Time for LE t su(l) 5 ns Hold Time for SDI t h(d) 5 ns Setup Time for SDI t su(d) 3 ns Maximum CLK Rise Time t r 500 ns Maximum CLK Fall Time t f 500 ns SDO Rise Time t r,sdo ns SDO Fall Time T f,sdo ns Output Rise Time of Output Ports t or ns Output Fall Time of Output Ports t of ns *The staggered delay between odd channels, OUT2n 1 (e.g. OUT1, OUT3, OUT5, etc.) and even channels, OUT 2n (e.g. OUT2, OUT4, OUT6, etc.) is 2ns. MBI5124 has a builtin staggered circuit to perform delay mechanism, by which the even and odd output ports will be turned on at a different time so that the instant current from the power line will be lowered. ** ** With uniform output current. 10 June 2014, V1.00

11 Test Circuit for Switching Characteristics IDD VDD Function Generator Logic Input VIH,VIL OE CLK LE SDI VDD R EXT GND. OUT0 OUT15 SDO IOUT RL CL 5V Waveform Iref CL VL 0V t r =t f =10ns Timing Waveform t W(CLK) CLK 50% 50% 50% t su(d) t h(d) SDI 50% 50% SDO 50% t plh, t phl t W(L) LE 50% 50% t h(l) t su(l) OE LOW = OUTPUTS ENABLED HIGH = OUTPUT OFF OUTn 50% t plh1, t phl1 t plh2, t phl2 LOW = OUTPUT ON t W(OE) OE 50% 50% t phl3 t plh3 OUTn 90% 90% 50% 50% 10% 10% t of t or 11 June 2014, V1.00

12 Control Command Signals Combination Description Command Name Number of CLK Rising LE Edge when LE is The Action After a Falling Edge of LE asserted Latch data High 0 Latch the serial data to the output latch. Write configuration High 4 Serial data are transferred to the configuration register Read configuration High 5 Configuration register is shifted out to SDO. No Action High 1,2,3, >5 No action. Please do not use it. Definition of Configuration Register MSB LSB F E D C B A According the driven LED, please set the configuration register by the following settings: Red LED ( R ) Green LED ( G ) Blue LED ( B ) Precharge waveform OE OUTn Precharge control signal (High=Enable) 12 June 2014, V1.00

13 Application Information Constant Current To design LED displays, MBI5124 provides nearly no variations in current from channel to channel and from IC to IC. This can be achieved by: 1) The maximum current variation between channels is less than ±2.5%, and that between ICs is less than ±3%. 2) In addition, the current characteristic of output stage is flat and users can refer to the figure as shown below. The output current can be kept constant regardless of the variations of LED forward voltages (V F ). This performs as a perfection of load regulation. I OUT (ma) 30 MBI5124 V DS vs I V DD =5V mA 20mA 15mA 10mA 5mA 1mA V DS (V) I OUT (ma) 12 MBI5124 V DS vs I V DD =3.3V mA 4 2 5mA 1mA V DS (V) 13 June 2014, V1.00

14 Adjusting Output Current The output current of each channel (I OUT ) is set by an external resistor, R ext. The relationship between I OUT and R ext is shown in the following figure. I OUT (ma) MBI5124 R ext vs. I OUT R ext (Ω) Also, the output current can be calculated from the equation: V REXT =1.23V;I OUT =V REXT *(1/Rext)x15; R ext =(V REXT /I OUT )x15 Where R ext is the resistance of the external resistor connected to REXT terminal and V REXT is the voltage of REXT terminal. The magnitude of current (as a function of R ext ) is around 20mA at 930Ω and 10mA at 1860Ω. Output Staggered Delay MBI5124 has a builtin staggered circuit to perform delay mechanism. The 16 output channels are categorized into 2 groups OUT2n and OUT2n 1, and each group outputs current by the staggered sequence, 2ns. 14 June 2014, V1.00

15 Soldering Process of Pbfree & Green Package Plating* Macroblock has defined "PbFree & Green" to mean semiconductor products that are compatible with the current RoHS requirements and selected 100% pure tin (Sn) to provide forward and backward compatibility with the highertemperature Pbfree processes. Pure tin is widely accepted by customers and suppliers of electronic devices in Europe, Asia and the US as the leadfree surface finish of choice to replace tinlead. Also, it adopts tin/lead (SnPb) solder paste, and please refer to the JEDEC JSTD020C for the temperature of solder bath. However, in the whole Pbfree soldering processes and materials, 100% pure tin (Sn) will all require from 245 o C to 260 o C for proper soldering on boards, referring to JEDEC JSTD020C as shown below. Temperature ( ) ± Average rampup rate= 0.7 /s 30s max Rampdown 6 /s (max) s max 100 Peak Temperature 245 ~260 < 10s 50 Average rampup rate = 0.4 /s Average rampup rate= 3.3 /s Maximum peak temperature Recommended reflow profile JEDEC Acc.JSTD020C Time (sec) Package Thickness Volume mm 3 <350 Volume mm Volume mm <1.6mm o C o C o C 1.6mm 2.5mm o C o C o C 2.5mm o C o C o C *For details, please refer to Macroblock s Policy on Pbfree & Green Package. 15 June 2014, V1.00

16 Package Power Dissipation (P D ) The maximum allowable package power dissipation is determined as P D (max)=(tj Ta)/R th(ja). When 16 output channels are turned on simultaneously, the actual package power dissipation is P D (act)=(i DD xv DD )+(I OUT xdutyxv DS x16). Therefore, to keep P D (act) P D (max), the allowable maximum output current as a function of duty cycle is: I OUT ={[(Tj Ta)/R th(ja) ] (I DD xv DD )}/V DS /Duty/16, where Tj=150 C. Package R th(ja) ( C/W) P D (W) GF GP GM Power Dissipation (W) 4.0 MBI5124Maximum Power Dissipation at Various Ambient Temperature GF Type: Rth=53.28 C/W GP Type: Rth=70.90 C/W GM Type: Rth=93.50 C/W Safe Operation Area Ambient Temperature( C) 16 June 2014, V1.00

17 Load Supply Voltage (V LED ) MBI5124 are designed to operate with V DS ranging from 0.4V to 0.8V (depending on I OUT =1~25mA) considering the package power dissipating limits. V DS may be higher enough to make P D(act) >P D(max) when V LED =5V and V DS =V LED V F, in which V LED is the load supply voltage. In this case, it is recommended to use the lowest possible supply voltage or to set an external voltage reducer, V DROP. A voltage reducer lets V DS =(V LED V F ) V DROP. Resistors or Zener diode can be used in the applications as shown in the following figures. Voltage Supply (V LED ) Voltage Supply (V LED ) V Drop V Drop V F V DS V F V DS MBI5124 MBI June 2014, V1.00

18 Package Outline MBI5124GF Outline Drawing Note: The unit for the outline drawing is mm 18 June 2014, V1.00

19 SYMBOLS Dimensions shown in inches Dimensions shown in millimeters MIN. NOM. MAX. MIN. NOM. MAX. A A A D E E b c L e BASIC BASIC L BASIC BASIC Θ MBI5124GP Outline Drawing 19 June 2014, V1.00

20 NOTES: 1. JEDEC OUTLINE: N/A. 2. DIMENSION D DOES NOT INCLUDE MOLD PROTRUSIONS OR GATE BURRS. MOLD PROTRUSIONS AND GATE BURRS SHALL NOT EXCEED PER SIDE. DIMENSION E1 DOES NOT INCLUDE INTERLEAD MOLD PROTRUSIONS. INTERLEAD MOLD PROTRUSIONS SHALL NOT EXCEED PER SIDE. 3. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION/ INTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE TOTAL IN EXCESS OF b DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR INTRUSION SHALL NOT REDUCE DIMENSION b BY MORE THAN AT LEAST. MBI5124GM Outline Drawing 20 June 2014, V1.00

21 Product Topmark Information The first row of printing MBIXXXX Or MBIXXXX Part number ID number The second row of printing Digits Product No. Process Code Package Code Manufacture Code Device Version Code Product Revision History Datasheet Version Device Version Code V1.00 A Product Ordering Information Product Ordering Number* RoHS Compliant Package Type Weight (g) MBI5124GFA SOP24L MBI5124GPA SSOP24L MBI5124GMA mssop24l *Please place your order with the product ordering number information on your purchase order (PO). 21 June 2014, V1.00

22 Disclaimer Macroblock reserves the right to make changes, corrections, modifications, and improvements to their products and documents or discontinue any product or service. Customers are advised to consult their sales representative for the latest product information before ordering. All products are sold subject to the terms and conditions supplied at the time of order acknowledgement, including those pertaining to warranty, patent infringement, and limitation of liability. Macroblock s products are not designed to be used as components in device intended to support or sustain life or in military applications. Use of Macroblock s products in components intended for surgical implant into the body, or other applications in which failure of Macroblock s products could create a situation where personal death or injury may occur, is not authorized without the express written approval of the Managing Director of Macroblock. Macroblock will not be held liable for any damages or claims resulting from the use of its products in medical and military applications. All text, images, logos and information contained on this document is the intellectual property of Macroblock. Unauthorized reproduction, duplication, extraction, use or disclosure of the above mentioned intellectual property will be deemed as infringement. 22 June 2014, V1.00