74LVC2G125. Description. Pin Assignments. Features. Applications DUAL BUFFER GATE WITH 3-STATE OUTPUTS 74LVC2G125. (Top View) 1OE VCC 2OE GND

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1 DUAL BUFFER GATE WITH 3-STATE OUTPUTS Description Pin Assignments The is a dual buffer gate with 3-state outputs. The (Top iew) device is designed for operation over a power supply range of 1.65 to 5.5. The device is fully specified for partial power down applications using I OFF. The I OFF circuitry disables the output, 1OE 1 8 CC preventing damaging current backflow when the device is powered down. 1A 2 7 2OE 2Y 3 6 1Y GND 4 5 2A X2-DFN X2-DFN Features Applications Wide Supply oltage Range from 1.65 to 5.5 ± 24mA Drive at 3.3 CMOS Low Power Consumption I OFF Supports Partial-Power-Down Mode Operation Inputs accept up to 5.5 Schmitt Trigger Action at all inputs makes the circuit tolerant for slower input rise and fall times. The hysteresis is typically 100m at CC = 3.0. ESD Protection Exceeds JESD Human Body Model (A114) Exceeds Charged Device Model (C101) Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) Halogen and Antimony Free. Green Device (Note 3) oltage Level Shifting General Purpose Logic Power Down Signal Isolation Wide Array of Products Such as: PCs, Networking, Notebooks, Netbooks, PDAs Tablet Computers, E-readers Computer Peripherals, Hard Drives, CD/DD ROMs Ts, DDs, DRs, Set Top Boxes Cell Phones, Personal Navigation / GPS MP3 Players, Cameras, ideo Recorders Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See for more information about Diodes Incorporated s definitions of Halogen- and Antimony-free, "Green" and Lead-free. 3. Halogen- and Antimony-free "Green products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. 1 of 11

2 Ordering Information (Note 4) 74LC2G 125 XXX -7 Logic Device Function Package Packing 74 : Logic Prefix 125: 3-State Buffer HD4 : -7 : 7 Tape & Reel LC : 1.65 to 5.5 OE - Low HK3 : X2-DFN Logic Family RA3 : X2-DFN G : Dual Gate Device Package Code Package (Note 5) HD4-7 HD4 HK3-7 HK3 X2-DFN RA3-7 RA3 X2-DFN Package Size 1.95mm x 1.0mm x 0.4mm 0.5 mm lead pitch 1.35mm x 1.0mm x 0.35mm 0.4 mm lead pitch 1.2mm x 1.0mm x 0.35mm 0.3 mm lead pitch 7 Tape and Reel (Note 6) Quantity Part Number Suffix 5,000/Tape & Reel -7 5,000/Tape & Reel -7 5,000/Tape & Reel -7 Notes: 4. For packaging details, go to our website at 5. Pad layout as shown in Diodes Incorporated s package outline PDFs, which can be found on our website at 6. The taping orientation is located on our website at Pin Descriptions Pin Name Pin No. Description 1 OE 1 Enable for buffer 1 1A 2 Data Input 2Y 3 Data GND 4 Ground 2A 5 Data Input 1Y 6 Data 2 OE 7 Enable for buffer 2 CC 8 Supply oltage Logic Diagram 1A 1OE 2A 2OE Y 2Y Function Table Inputs OE A Y L H H L L L H X Z 2 of 11

3 Absolute Maximum Ratings (Notes 7 & 8) Symbol Description Rating Unit ESD HBM Human Body Model ESD Protection 2 k ESD CDM Charged Device Model ESD Protection 1 k CC Supply oltage -0.5 to +6.5 I Input oltage -0.5 to +6.5 O oltage -Active Mode -0.5 to CC +0.5 oltage Power Down Mode -0.5 to +6.5 I IK Input Clamp Current I<0-50 ma I OK Clamp Current (O < 0 OR O > cc ) ±50 ma I O Continuous Current (O = 0 to CC) ±50 ma I CC Continuous Current Through CC 100 ma I GND Continuous Current Through GND -100 ma T J Operating Junction Temperature -40 to +150 C T STG Storage Temperature -65 to +150 C Notes: 7. Stresses beyond the absolute maximum may result in immediate failure or reduced reliability. These are stress values and device operation should be within recommend values. 8. Forcing the maximum allowed voltage could cause a condition exceeding the maximum current or conversely forcing the maximum current could cause a condition exceeding the maximum voltage. The ratings of both current and voltage must be maintained within the controlled range. Recommended Operating Conditions (Note 9) Symbol Parameter Min Max Unit CC Operating Operating oltage Data Retention Only 1.5 I Input oltage O I OH I OL Δt/Δ oltage Active Mode 0 CC oltage Power-Down Mode CC = CC = CC = High-Level Current ma -16 CC = CC = CC = CC = Low-Level Current CC = ma 16 CC = CC = Input Transition Rise or Fall Rate CC = 1.65 to CC = 2.7 to ns/ T A Operating Free-Air Temperature C Note: 9. Unused inputs should be held at CC or Ground. 3 of 11

4 Electrical Characteristics (All typical values are at T A = +25 C) -40 C to +85 C -40 C to +125 C Symbol Parameter Test Conditions CC Min Typ. Max Min Max CC = 1.65 to x CC 0.65 x CC IH High-Level CC = 2.3 to Input oltage CC = 2.7 to CC = 4.5 to x CC 0.7 x CC Unit CC = 1.65 to x CC 0.35 x CC IL Low-Level Input oltage CC = 2.3 to CC = 2.7 to CC = 4.5 to x CC 0.3 x CC I OH = -100μA 1.65 to 5.5 CC 0.1 cc CC 0.1 I OH = -4mA OH High-Level oltage I OH = -8mA I OH = -12mA I OH = -16mA I OH = -24mA I OH = -32mA I OL = 100μA 1.65 to I OL = 4mA OL Low-Level oltage I OL = 8mA I OL = 12mA I OL = 16mA I OL = 24mA I OL = 32mA I I Input Current I = 5.5 or GND 0 to 5.5 ± 0.1 ±5 ± 20 μa I OZ I OFF I CC ΔI CC C I Z-State Leakage Current Power Down Leakage Current Supply Current Additional Supply Current Input Capacitance I = IH or IL O = 5.5 or GND 3.6 ± 0.1 ± 10 ±20 μa I or O = ± 0.1 ±10 ±20 μa I = 5.5 or GND I O=0A 1.65 to μa One input at CC 0.6 Other inputs at CC 2.3 to ,000 μa or GND I = CC or GND pf 4 of 11

5 Operating Characteristics Parameter Test Conditions CC = 1.8 CC = 2.5 CC = 3.3 CC = 5 Typ. Typ. Typ. Typ. Unit C pd Power Dissipation Capacitance f = 10MHz output enabled f = 10MHz output disabled pf pf Package Characteristics Symbol Parameter Package Test Conditions Min Typ. Max Unit θ JA θ JC 313 Thermal Resistance Junctionto-Ambient X2-DFN (Note 10) 321 X2-DFN C/W 145 Thermal Resistance Junctionto-Case X2-DFN (Note 10) 166 X2-DFN C/W Note: 10. Test condition for each package type: Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout. Switching Characteristics Typical alues at T A = +25 C and nominal voltages 1.8, 2.5, 2.7, 3.3, and 5.0. See Figure 1. Parameter From To Input t pd A Y t en OE Y t dis OE Y CC T A = -40 C to +85 C T A = -40 C to +125 C Min Typ Max Min Max 1.8 ± ± ± ± ± ± ± ± ± ± ± ± Unit ns ns ns 5 of 11

6 Parameter Measurement Information From Under Test RL S1 LOAD Open GND TEST t PLH/t PHL t PLZ/t PZL S1 Open LOAD CL (see Note A) RL t PHZ/t PZH GND CC I Inputs t r/t f M LOAD C L R L 1.8±0.15 CC 2ns CC/2 2 x CC 30pF 1kΩ ±0.2 CC 2ns CC/2 2 x CC 30pF 500Ω ns pF 500Ω ± ns pF 500Ω 0.3 5±0.5 CC 2.5ns CC/2 2 x CC 50pF 500Ω 0.3 tw Input oltage Waveform Pulse Duration l 0 Control Waveform 1 S1 at LOAD (see Note B) tpzl tplz OL + l 0 LOAD/2 OL Input tplh tphl l 0 Waveform 2 S1 at GND (see Note B) tpzh tphz OH - OH 0 OH tphl tplh OL oltage Waveform Enable and Disable Times Low and High Level Enabling OH OL oltage Waveform Propagation Delay Times Inverting and Non Inverting s Figure 1. Load Circuit and oltage Waveforms Notes: A. Includes test lead and test apparatus capacitance. B. All pulses are supplied at pulse repetition rate 10MHz. C. Inputs are measured separately one transition per measurement. D. t PLZ and t PHZ are the same as t dis. E. t PZL and t PZH are the same as t en. F. t PLH and t PHL are the same as t pd. 6 of 11

7 Marking Information (Top iew) XX Y W X XX : Identification Code Y : Year : 0~9 W : Week : A~Z : 1~26 week; a~z : 27~52 week; z represents 52 and 53 week X : Internal Code Part Number Package Identification Code HD4-7 9U HK3-7 X2-DFN RA3-7 X2-DFN W 7 of 11

8 X2-DFN Package Outline Dimensions Please see for the latest version. X2-DFN A A1 (Pin #1 ID) C0.5X45 E k1 L1 e D z(4x) k Seating Plane z1(4x) X2-DFN Dim Min Max Typ A A b D E e k k L L z z All Dimensions in mm L(7x) b Suggested Pad Layout Please see for the latest version. X2-DFN X1 alue Dimensions (in mm) C G Y2 G X X Y Y Y C X 8 of 11

9 X2-DFN Package Outline Dimensions Please see for the latest version. X2-DFN A A3 E A1 La 1 D e L(7x) e1 X2-DFN Dim Min Max Typ A A A b D E e e L L All Dimensions in mm b A Suggested Pad Layout Please see for the latest version. X2-DFN X1 Y2 Y1 Y Y alue Dimensions (in mm) C X X Y Y Y X C 9 of 11

10 Package Outline Dimensions Please see for the latest version. A A1 A3 Seating Plane E R0.075 D e L Dim Min Max Typ A A A b D E e L z All Dimensions in mm z(4x) b Suggested Pad Layout Please see for the latest version. X1 Y1 Y alue Dimensions (in mm) C X X Y Y X C 10 of 11

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