Element InSb Detector with Digital Processor

Size: px
Start display at page:

Download "Element InSb Detector with Digital Processor"

Transcription

1 Element InSb Detector with Digital Processor O. Nesher, S. Elkind, I. Nevo, T. Markovitz, A. Ganany, A. B. Marhashev, and M. Ben-Ezra a Semi Conductor Devices (SCD), P.O. Box 2250, Haifa 31021, Israel a Israeli MOD, MAFAT, Optronics, Tel-Aviv 63734, Israel ABSTRACT After completing the development of a digital detector with a format of elements ("Sebastian"), SCD is now developing a mid format digital detector with elements. This detector is based on the same concept as Sebastian, which was introduced last year at the SPIE conference in Orlando. The element detector has all the features and performance of Sebastian as then introduced, and in addition exhibits some additional functionality. The format of the element detector was chosen in order to maintain the same active area as in a standard format element detector of today. Thus with specific system optics, a higher resolution is achieved with our new detector. As a direct consequence, the detection range is increased by 22-35% depending on the target type, when using this detector instead of the conventional element detector in a typical system. The element detector is designed to be integrated both into imaging systems and into head seekers missile-applications. In this paper we present the concept and the basic structure of the detector, the special operation modes unique to the digital detector, and the results of detection range calculations. Keywords: Digital Detector, element detector, Focal Plane Array, Digital Focal Plane Processor, FPGA, IR detector, InSb detector, 15 bit digital video. INTRODUCTION During 2003 SCD completed the development of the first detector which is based on a digital signal processor on the Focal Plane Array (FPA) itself 1, 2. The main challenge in designing a high performance signal processor for a cooled IR detector with digital output was to maintain power consumption similar to that in an analogue processor. Predictions showed that the conventional design for analogue to digital conversion (ADC) results in power consumption over 1Watt under the operation conditions of a standard IR detector 3, 4. However, the special design at SCD of the ADC and the whole signal processor has resulted in a power consumption of the digital signal processor which is even lower compared to existing analogue processors 1, 2. Detectors based on a digital FPA are considered to be very attractive due to their many advantages over detectors with an analogue FPA, which are expressed especially on the system level. These include: Lower level of readout noise due to immunity of the analogue signal to external noise Higher linearity Less sensitivity to external ambient conditions Higher long term stability of the Residual Non Uniformity (RNU) Removal of the requirement to develop low noise electronics in the system The distance between the detector and the system electronics can be increased up to several meters without affecting the performance The integration of the detector into the system is much simpler and faster Last year at the SPIE conference at Orlando SCD introduced for the first time the fully integrated element digital detector (Sebastian) with its measured performance 2. All the above advantages of the digital detector were demonstrated by the performance measured on the Sebastian detector. The measurements of the detector showed a high linearity of 0.01% with Residual Non Uniformity of 0.015% over a range of 2-90%, and with both spatial and temporal NETD of 10mK together with high RNU stability. In this paper we present the second digital detector after the Sebastian, with elements for the mid format, currently under development at SCD and based on Sebastian. First the general structure of the signal processor and its

2 main features are described. Then, the performance of the detector is calculated on the system level and is compared to a standard analog element detector. It shows a significant improvement in recognition range for the digital detector. Next, special integration modes implemented in the detector for large dynamic range with high sensitivity will be discussed. Finally, results of frame to frame mode transition measurements are presented. GENERAL DESCRIPTION OF THE DIGITAL DETECTOR The Digital Focal Plane Processor (DFPP) is fabricated with a 0.5 micron double-poly, triple metal CMOS process and it consists of 4.5 million transistors. It is designed to work with Indium-Antimonide (InSb) and related diodes and for snapshot mode operation. The DFPP is connected to proximity electronics that contain a FPGA component, which controls its operation and samples the output data from the DFPP and processes it. Signal processor structure The DFPP consists of the following parts as described schematically in figure 1: Pixel cells Integrate the photo-currents generated in the detector pixels. A/D Converters Two rows of 15-bits A/D converters exist, providing two A/Ds per column. One row above the active matrix, and one row below it. Thus, at each given time during the Frame-Read process, two rows are converted (while the two rows that were previously converted are read-out). Row Shift Register Responsible for the connection of the proper rows of the matrix to the A/D converters. Column Shift Register and Readout Circuitry Multiplexing the digital data from the A/D converters and sending them out. Frame-Timing This circuitry advances the A/D converters and the shift registers mentioned above, through their operation states. The Frame-Timing is fully controlled by the FPGA. Communication The DFPP is rich with features and possibilities. All the operation modes are controlled by the FPGA via a serial communication channel, transferring a long communication word. Figure 1: Block diagram of the DFPP

3 Digital Detector structure Unlike other focal plane processors, there is no internal correlation between the integration and the frame-read procedures in the DFPP. These functions are fully controlled separately by the FPGA, residing in the proximity card. The DFPP is designed as an open system, meaning that the controller of the frame states and the integration activities is not a part of the DFPP. On the other hand, the control of the DFPP and the interface to it is quite complicated. Therefore the proximity card contains a FPGA which functions as the controller of the DFPP and as the arbitrator between the system and the DFPP. The combination of the DFPP-FPGA makes a universal system, where the FPGA can be programmed specifically for each application. The relationship between the System, FPGA, and DFPP is described schematically in figure 2. As mentioned above, the DFPP is operated directly by the FPGA, with a local oscillator on the proximity card. Therefore there is no need for the system to handle the timing requirements of the frame-read sequence and the diversity of the parameters. The readout data from the DFPP are collected, preprocessed and arranged sequentially by the FPGA before it is transferred to the system. Because of the diversity of modes and features and since each application requires different settings and ways of operation, the definition and characterization of the system requirements are done at SCD, in advance. Thus the FPGA is programmed accordingly, with the proper parameters and the user receives a Detector-Module that is specifically tailored to his needs. In most cases these parameters are constant in the FPGA and do not need to be changed. In more complicated applications, some parameters may change dynamically by external intervention. The communication between the system and the FPGA is simple and deals just with the topics that are of system interest, like cycle rate, integration time, window, etc. The interface between the FPGA and the system can either be standard (e.g. Camera link), or specific as per system requirements. Figure 2: Block diagram of System-Proxy-Detector Main features The conversion resolution of the detector can be controlled externally, up to 15 bits. There is a tradeoff between the A/D resolution and the maximum frame rate achievable. For example: with a 15 bit resolution the detector can operate at a maximum frame rate of 165Hz with full window, whereas at 13 bit resolution the detector can operate at 200Hz with a full window. The pixel unit can store up to 14Me-. Five different variable gains are available with a full range of: 1Me-, 3Me-, 7Me-, 10Me- or 14Me-. An anti-blooming feature was designed to avoid a very strong light source from disrupting the operation of the detector. The saturation level of the input stage at the DFPP can be controlled gradually by the FPGA. Using this feature, the performance of the detector can be optimized to the level of photocurrent. A dilution in rows readout (reading every 2 nd or 6 th row) enables the user to increase the frame rate. In addition there is an option of joining every two adjacent pixels in rows or columns (achieving large size pixels), or joining every four adjacent pixels (quadruple pixel). Operating the readout dilution together with the pixel merging enables the operation of the detector at high frame rate with a higher signal to noise ratio per pixel. The number of the data output lines from the

4 Dewar can be changed according to the maximum frame rate, 16 outputs for 200Hz, 8 outputs for 100Hz and 4 outputs for 50Hz at 13 bit resolution. The following modes can be changed on-line: Window dimensions and location. Readout direction (Up or down, left or right) IWR or ITR or any other combined integration modes. Pixels readout dilution. Pixels unification: every two horizontally, every two vertically, or four adjacent pixels. Optimization of digital resolution with frame rate. One of five gain values. Optimization of the power dissipation vs. frame rate. Anti blooming operation. One of ten different bias operating points for the InSb diode: from 50pA to 1nA Basic performance The measured radiometric performance of the Sebastian detector was reported elswere 2. Briefly, the deviation from linearity over a regime of 2-90% well fill capacity is below 0.01% of the full range. A direct outcome of this high linearity is a Residual Non Uniformity (RNU) of less than 0.05% STD/DR for a range of 2-90% well fill capacity. In the digital detector a linear relationship between the noise and the signal was measured, meaning that the signal sampling inside the signal processor is very clean. An NETD of 10.5mK was measured at 50% well fill capacity with a black body temperature of 25 C, meaning that a similar value of 10mK is achieved for the spatial and the temporal noise in the digital detector. This demonstrates the great advantage of systems using SCD's digital detector, where the detector performance is not limited by the spatial noise. SPECIAL ASPECTS OF THE FORMAT Lately there is a growing need to improve the resolution of systems in order to improve their performance but to maintain the same detection area as current detectors. For the next generation of SCD mid format digital detectors, a format of elements was chosen. The format was chosen in order to maintain the same detector dimensions and active area (Field Of View) as today's standard mid format of Any other formats such as or can be derived immediately from the detector. This new format together with the performance of the digital detector can improve significantly the performance of the system compared to an analogue detector with elements. In order to illustrate the differences between digital detector with elements and the analog detector with the elements, we performed calculations at the system level. All these calculation were carried out with TRM3 simulation model. For these calculations we assume a system with objective lens of 65mm diameter, F/3.8 and a focal length of 250mm, resulting in a field of view of Other parameters used for the calculations: optical transmittance of 0.8, Optics MTF quality factor of 1.15, a good display with 1000 TVL and an atmospheric transmittance of 0.85Km -1. Two targets were used for recognition calculations: a NATO tank target of 2.3m 2.3m with a temperature difference of 1.25 C between the target and the background, and a human target with a size of 1.5m 0.5m and a temperature difference of 5 C between the target and the background. For the analog element detector an excess current of 30pA (the sum of the stray and the dark current), a system readout noise of 2000e- and a system RNU of 30mK were used. For a 60Hz frame rate with a temperature background of 23 C and 10msec integration time (integration capacity limited), a system NETD of 20mK was used. For a system based on this detector, recognition ranges of 4.4Km for the tank target and 2.3Km for the human target were calculated. For the digital detector with elements with exactly the same FOV, an excess current of 15pA, a system readout noise of 1000e- and RNU of 10mK were used 2. For a 60Hz frame rate with a temperature background of 23 C and 10msec integration time (integration capacity limited), a system NETD of 15mK was used. It is important to note that this value of 15mK NETD was measured in systems into which Sebastian has been integrated. For a system based on this detector, recognition ranges of 5.3Km for the tank target and 3.1Km for the human target were calculated. These calculation results show improvements of 22% for the tank recognition range and 35% for the human recognition range, respectively, due to the digital detector. The improvement in the recognition range of the tank is mainly

5 influenced, but not only by the improvement of the system NETD, whereas the improvement in the human recognition range is mainly due to the improvement of the resolution and the spatial noise. SPECIAL INTEGRATION MODES At the past few years there is a growing need for applications which related to Missile Warning Systems (MWS) and Muzzle Flash Detection System (MFDS) for air and ground platforms. In these systems, where the principle need is to identify the sources of threat, the main challenge today is to reduce the number of false alarms. In order to get performance with high reliability there is a need for detector that are operation with a high dynamic range and a high rate of image sampling. In our digital detector family, special integration modes were implemented inside the signal processor, enabling an operation mode, combining high dynamic range with high sensitivity, and an operation mode which combines high dynamic range with a high frame rate. In these modes the detector can also be operated with a high rate of image sampling, in order to be able to detect events of very short duration,. 1) Combined Integrate Mode High dynamic range with high sensitivity. This Mode was first implemented in the Blue Fairy detector 5 and later in the Sebastian detector. The sequence of one cycle of the Combined Mode is shown in Figure 3. Two integration pulses are used, a short and a long one for frames A and B respectively. For example Integrate-B is 8 times longer than Integrate-A. Time simultaneity between the frames can be improved by splitting the integration pulse B into two equal pulses and inserting integration pulse A in-between. Each frame is read at the end of its integration. By using the appropriate algorithm, the user can choose the best frame out of the two, or fuse two frames with the corresponding weight for each one, in order to get an image with hot and cold details together. This mode is thoroughly discussed and demonstrated in a previous article of SCD 5. Figure 3: Timing diagram for one cycle of the Combined Integrate Mode 2) Multi-step integration mode high dynamic range with high frame rate. Another operation mode enables dynamic optimization of the detector operation in one frame. This mode enables an increase of dynamic range in one frame, and thus allows higher frame rate operation compared to the combined mode. In this mode the pixel saturation level is changed according to the level of the photocurrent, together with the use of multiple integration pulses in the same frame. Such a mode with two integrations per frame, each with a long pulse and a short pulse is demonstrated in figure 4. Before each integration starts, the saturation level parameter is changed (by the communication channel) as shown in the drawing. A low Saturation level is set before the long integration pulse, and a high saturation level is set before the short integration pulse. For a low irradiated pixel, the signal will be proportional to the total integration time. For a highly irradiated pixel the signal level will be the sum of the low saturation level and the signal accumulated during the short integration with the high saturation level. Thus two ranges are used in the same frame: one with the low saturation level for the low radiant pixels and the second between the low and the high saturation levels for the high radiant pixels. For example: for the first range with the low saturation level, a background temperature up to 150 C can be detected with NETD up to 20mK, whereas for the second range a background temperature from 150 C to 800 C can be detected with NETD of 1-2 K. Using this mode the dynamic range is increased, as demonstrated in figure 4, with high frame rate. This method can be extended to more than two integration pulses per one frame together with the use of the multiple saturation levels available.

6 Figure 4: Timing diagram of Multiple-step integration mode 3. Multiple integration mode high rate image sampling As was mentioned above, the frame read and the integration events are not correlated, thus a large flexibility can be achieved in various modes of operation. As a consequence an operation mode with several integration pulses within one readout cycle can be performed. The timing diagram of such a mode is described schematically in figure 5. In this mode we overcome the limitation of the maximum readout rate of the FPA. The integration pulse is divided into many integration pulses at the required frequency (For example: 1KHz), where the total number of electrons which are collected in the integration capacitor can be controlled by the ratio between the single integration pulse and the non integrating period (duty cycle). Using this integration mode the system can have high rate sampling of the background with the ability to detect events with short time duration, and to track targets with high speed. Figure 5: Timing diagram of the multiple integration mode FRAME TO FARAME MODE CHANGES For systems that are designed to cope with high dynamics, especially in missile applications, there is a need to change operation modes during flight but the system cannot afford to lose any frame due to these mode changes. A special effort was made in the design of the detector in order to avoid unwanted effects in the following frame after changing a mode of operation. Measurements of the following four mode changes are presenting in figure 6: frame rate, DFPP gain, integration time and recovery from saturation. For these measurements a series of 90 consecutive frames was measured and the median of each frame was calculated. The measurements were made with 15 bit resolution. In the graphs the

7 median of the signal is shown as a digital level and is plotted as a function of the frame number. For all the graphs, the change of the mode was performed at frame number 45. In figure 6a a change in the gain of the signal processor is shown, from 3Me- to 6.5Me-. In figure 6b a change in the frame rate is shown, from 32Hz to 80Hz. In figure 6c a change in the integration time is shown, from 5msec to 10msec. In figure 6d a recovery from saturation is shown. One can see from all the four graphs that there is no loss of frame after the mode change is performed and that the first frame following the change is not disrupted. The only slight exception is the recovery from saturation where the first frame after the transition deviates by only 0.06% from the mean signal. Median signal (DL) Median signel (DL) Transition point Frame number Figure 6a: Gain change Frame number Figure 6b: Frame rate change Median signal (DL) Frame number Figure 6c: Integration time change Median signal (DL) Frame number Figure 6d: Recovery from saturation SUMMARY Today SCD is producing the element digital detector (Sebastian). Sebastian finished its development phase during 2003 and its performance was presented at the SPIE conference in April of that year. A few Sebastian detectors have already been integrated into some systems, and they have demonstrated excellent performance at the system level such as: Low noise level, high linearity and long term stability, as were demonstrated by the detector itself. Sebastian consists of a proximity electronics card which includes an FPGA component to provide direct operation of the signal processor and to enable the setting up of any standard interface to the system. An interface such as a camera link enables easy and fast integration of the digital detector into the system, by using standard components and software modules. Following on from Sebastian SCD is developing for the mid format, a digital IR detector with elements which has the same active area as the standard mid format of today that has elements. This detector, according to our calculations, is expected to improve the recognition range for a tank target by 22% and for a human target by 35%, in a typical system, compared to a standard analog detector with elements. The element detector is

8 integrated into our standard analog mid format dewars, including the compact "Piccolo" detector for hand-held applications 6, 7. Prototypes of the elements digital detector are expected to be ready during Special integration modes have been implemented in the signal processor which can be used for missile warning applications that require high dynamic range and a high rate of image sampling. These modes include the combined mode for high dynamic range combined with high sensitivity, the multi-step integration mode for large dynamic range combined with high frame rate, and the multiple integration mode for high rate image sampling. We show that for highly dynamic applications that require mode transitions on a frame to frame basis, there is a smooth transition after the mode change. These transitions were demonstrated with changes of gain, frame rate and integration time and also recovery from saturation. The new family of the SCD's digital detectors will all have a similar interface to the system. The generic design of the signal processor enables us to develop any other formats of digital detector such as , or , at short notice and according to any customer requirement. ACKNOWLEDGMENTS The development of digital detector was partly supported by MAFAT, Israeli Ministry of Defense. We would like to thank to all the technicians and engineers which their dedicated contribution to the development, production and characterization of the digital detector where able to achieve the breakthrough of the Sebastian. REFERENCES 1. Shimon Elkind, Amnon Adin, Itzhak Nevo and Arkady B. Marhasev, "Focal plane processor with a digital video output for InSb detectors", Proceedings of SPIE vol. 4820, Infrared Technology and Applications XXVIII Conference, July. 2002, pp O. Nesher, S. Elkind, A. Adin, I. Nevo, A. B. Yaakov, S. Raichshtain, A. B. Marhasev, A. Magner, M. Katz, T. Markovitz, D. Chen, M. Kenan A. Ganany, J. Oiknine Schlesinger and Z. Calahorra, " A Digital Cooled InSb Detector for IR Detection", proceedings of SPIE vol. 5074, Infrared Technology and Applications XXIX Conference, April. 2003, pp L. J. Kozlowski et al., "Progress towards high-performance infrared imaging system-on-a-chip", Proceedings of SPIE vol. 4130, Infrared Technology and Applications XXVI Conference, July-Aug. 2000, pp L. J. Kozlowski, M. Loose, A. Joshi, K. Vural and M. Buchin, "Low power system-on-chip FPAs", Proceedings of SPIE vol. 4820, Infrared Technology and Applications XXVIII Conference, July. 2002, pp O. Nesher, S. Elkind, A. Adin, U. Palty, O. Pelleg, E. Jacobsohn, T. Markovitz, I. Szafranek, Z. Calahorra, and J. Oiknine Schlesinger, " Performance of BF Focal Plane Array InSb Detectors ", Proceedings of SPIE vol. 4820, Infrared Technology and Applications XXVIII Conference, July. 2002, pp T. Markovitz, F. Schapiro, D. Alfiya, S. Hasson, A. Magner and O. Nesher, "Piccolo A High Performance IR Detector Optimized for Handheld Applications", proceedings of SPIE Infrared Technology and Applications XXX Conference, April Ofer Nesher, Philip C. Klipstein and Eliezer Weiss, " Advanced IR Detector Design at SCD: From D 3 C TM to ABCS", proceeding of Photonic West conference, January 2004

High resolution , 15 µm pitch compact InSb IR detector with on-chip ADC

High resolution , 15 µm pitch compact InSb IR detector with on-chip ADC High resolution 1280 1024, 15 µm pitch compact InSb IR detector with on-chip ADC O. Nesher, I. Pivnik, E. Ilan, Z. Calahorra, A. Koifman, I Vaserman, J. Oiknine Schlesinger, R. Gazit and I. Hirsh SemiConductor

More information

A 3 Mpixel ROIC with 10 m Pixel Pitch and 120 Hz Frame Rate Digital Output

A 3 Mpixel ROIC with 10 m Pixel Pitch and 120 Hz Frame Rate Digital Output A 3 Mpixel ROIC with 10 m Pixel Pitch and 120 Hz Frame Rate Digital Output Elad Ilan, Niv Shiloah, Shimon Elkind, Roman Dobromislin, Willie Freiman, Alex Zviagintsev, Itzik Nevo, Oren Cohen, Fanny Khinich,

More information

Large format 17µm high-end VOx µ-bolometer infrared detector

Large format 17µm high-end VOx µ-bolometer infrared detector Large format 17µm high-end VOx µ-bolometer infrared detector U. Mizrahi, N. Argaman, S. Elkind, A. Giladi, Y. Hirsh, M. Labilov, I. Pivnik, N. Shiloah, M. Singer, A. Tuito*, M. Ben-Ezra*, I. Shtrichman

More information

Multi-function InGaAs detector with on-chip signal processing

Multi-function InGaAs detector with on-chip signal processing Multi-function InGaAs detector with on-chip signal processing Lior Shkedy, Rami Fraenkel, Tal Fishman, Avihoo Giladi, Leonid Bykov, Ilana Grimberg, Elad Ilan, Shay Vasserman and Alina Koifman SemiConductor

More information

Multi-function IR detector with on-chip signal processing

Multi-function IR detector with on-chip signal processing Multi-function IR detector with on-chip signal processing Lidia Langof (1), Dan Nussinson (1), Elad Ilan (1), Shimon Elkind (1), Roman Dobromislin (1), Itzik Nevo (1), Fanny Khinich (1), Michael Labilov

More information

10 m pitch family of InSb and XBn detectors for MWIR imaging

10 m pitch family of InSb and XBn detectors for MWIR imaging m pitch family of InSb and XBn detectors for MWIR imaging G. Gershon, E. Avnon, M. Brumer, W. Freiman, Y. Karni, T. Niderman, O. Ofer, T. Rosenstock, D. Seref, N. Shiloah, L. Shkedy, R. Tessler, and I.

More information

Advanced µ-bolometer detectors for high-end applications

Advanced µ-bolometer detectors for high-end applications Advanced µ-bolometer detectors for high-end applications U. Mizrahi, F. Schapiro, L. Bykov, A. Giladi, N. Shiloah, I. Pivnik, S. Elkind, S. Maayani, E. Mordechai, O. Farbman, Y. Hirsh, A. Twitto ( *),

More information

High Definition 10µm pitch InGaAs detector with Asynchronous Laser Pulse Detection mode

High Definition 10µm pitch InGaAs detector with Asynchronous Laser Pulse Detection mode High Definition 10µm pitch InGaAs detector with Asynchronous Laser Pulse Detection mode R. Fraenkel, E. Berkowicz, L. Bykov, R. Dobromislin, R. Elishkov, A. Giladi, I. Grimberg, I. Hirsh, E. Ilan, C. Jacobson,

More information

Development of low SWaP and low noise InGaAs detectors

Development of low SWaP and low noise InGaAs detectors Development of low SWaP and low noise InGaAs detectors R. Fraenkel, E. Berkowicz, L. Bikov, R. Elishkov, A. Giladi, I. Hirsh, E. Ilan C. Jakobson, P. Kondrashov, E. Louzon, I. Nevo, I. Pivnik, A. Tuito*

More information

High Resolution 640 x um Pitch InSb Detector

High Resolution 640 x um Pitch InSb Detector High Resolution 640 x 512 15um Pitch InSb Detector Chen-Sheng Huang, Bei-Rong Chang, Chien-Te Ku, Yau-Tang Gau, Ping-Kuo Weng* Materials & Electro-Optics Division National Chung Shang Institute of Science

More information

THREE DIMENSIONAL FLASH LADAR FOCAL PLANES AND TIME DEPENDENT IMAGING

THREE DIMENSIONAL FLASH LADAR FOCAL PLANES AND TIME DEPENDENT IMAGING THREE DIMENSIONAL FLASH LADAR FOCAL PLANES AND TIME DEPENDENT IMAGING ROGER STETTNER, HOWARD BAILEY AND STEVEN SILVERMAN Advanced Scientific Concepts, Inc. 305 E. Haley St. Santa Barbara, CA 93103 ASC@advancedscientificconcepts.com

More information

High Dynamic Range Imaging using FAST-IR imagery

High Dynamic Range Imaging using FAST-IR imagery High Dynamic Range Imaging using FAST-IR imagery Frédérick Marcotte a, Vincent Farley* a, Myron Pauli b, Pierre Tremblay a, Martin Chamberland a a Telops Inc., 100-2600 St-Jean-Baptiste, Québec, Qc, Canada,

More information

Digital-pixel focal plane array development

Digital-pixel focal plane array development Digital-pixel focal plane array development The MIT Faculty has made this article openly available. Please share how this access benefits you. Your story matters. Citation As Published Publisher Brown,

More information

Thermography. White Paper: Understanding Infrared Camera Thermal Image Quality

Thermography. White Paper: Understanding Infrared Camera Thermal Image Quality Electrophysics Resource Center: White Paper: Understanding Infrared Camera 373E Route 46, Fairfield, NJ 07004 Phone: 973-882-0211 Fax: 973-882-0997 www.electrophysics.com Understanding Infared Camera Electrophysics

More information

READOUT TECHNIQUES FOR DRIFT AND LOW FREQUENCY NOISE REJECTION IN INFRARED ARRAYS

READOUT TECHNIQUES FOR DRIFT AND LOW FREQUENCY NOISE REJECTION IN INFRARED ARRAYS READOUT TECHNIQUES FOR DRIFT AND LOW FREQUENCY NOISE REJECTION IN INFRARED ARRAYS Finger 1, G, Dorn 1, R.J 1, Hoffman, A.W. 2, Mehrgan, H. 1, Meyer, M. 1, Moorwood A.F.M. 1 and Stegmeier, J. 1 1) European

More information

Low SWaP /17µm Uncooled Detector and Video Core

Low SWaP /17µm Uncooled Detector and Video Core OPTRO-2016-23 Low SWaP 640 480/17µm Uncooled Detector and Video Core Y. Shamay, E. Braunstain, R. Gazit, Y. Gridish, R. Iosevich, S. Linzer Horesh, Y. Lury, R. Meshorer, U. Mizrahi, E. Raz, M. Savchenko,

More information

Long Mid-Wave Infrared Detector with Time Delayed Integration

Long Mid-Wave Infrared Detector with Time Delayed Integration Long Mid-Wave Infrared Detector with Time Delayed Integration M. Zucker, I. Pivnik, E. Malkinson, J. Haski, T. Reiner, D. Admon, M. Keinan, M.Yassen. I. Sapiro N. Sapir and A. Fraenkel Semi Conductor Devices

More information

A new Photon Counting Detector: Intensified CMOS- APS

A new Photon Counting Detector: Intensified CMOS- APS A new Photon Counting Detector: Intensified CMOS- APS M. Belluso 1, G. Bonanno 1, A. Calì 1, A. Carbone 3, R. Cosentino 1, A. Modica 4, S. Scuderi 1, C. Timpanaro 1, M. Uslenghi 2 1- I.N.A.F.-Osservatorio

More information

Characterisation of a CMOS Charge Transfer Device for TDI Imaging

Characterisation of a CMOS Charge Transfer Device for TDI Imaging Preprint typeset in JINST style - HYPER VERSION Characterisation of a CMOS Charge Transfer Device for TDI Imaging J. Rushton a, A. Holland a, K. Stefanov a and F. Mayer b a Centre for Electronic Imaging,

More information

High-performance MCT Sensors for Demanding Applications

High-performance MCT Sensors for Demanding Applications Access to the world s leading infrared imaging technology High-performance MCT Sensors for www.sofradir-ec.com High-performance MCT Sensors for Infrared Imaging White Paper Recent MCT Technology Enhancements

More information

PAPER NUMBER: PAPER TITLE: Multi-band CMOS Sensor simplify FPA design. SPIE, Remote sensing 2015, Toulouse, France.

PAPER NUMBER: PAPER TITLE: Multi-band CMOS Sensor simplify FPA design. SPIE, Remote sensing 2015, Toulouse, France. PAPER NUMBER: 9639-28 PAPER TITLE: Multi-band CMOS Sensor simplify FPA design to SPIE, Remote sensing 2015, Toulouse, France On Section: Sensors, Systems, and Next-Generation Satellites Page1 Multi-band

More information

A new Photon Counting Detector: Intensified CMOS- APS

A new Photon Counting Detector: Intensified CMOS- APS A new Photon Counting Detector: Intensified CMOS- APS M. Belluso 1, G. Bonanno 1, A. Calì 1, A. Carbone 3, R. Cosentino 1, A. Modica 4, S. Scuderi 1, C. Timpanaro 1, M. Uslenghi 2 1-I.N.A.F.-Osservatorio

More information

Advanced ROIC designs for cooled IR detectors. Xavier Lefoul, Patrick Maillart, Michel Zécri, Eric Sanson, Gilbert Decaens, Laurent Baud

Advanced ROIC designs for cooled IR detectors. Xavier Lefoul, Patrick Maillart, Michel Zécri, Eric Sanson, Gilbert Decaens, Laurent Baud Advanced ROIC designs for cooled IR detectors Xavier Lefoul, Patrick Maillart, Michel Zécri, Eric Sanson, Gilbert Decaens, Laurent Baud Outline Introduction Presentation of latest FPA currently available

More information

Understanding Infrared Camera Thermal Image Quality

Understanding Infrared Camera Thermal Image Quality Access to the world s leading infrared imaging technology Noise { Clean Signal www.sofradir-ec.com Understanding Infared Camera Infrared Inspection White Paper Abstract You ve no doubt purchased a digital

More information

Interpixel crosstalk in a 3D-integrated active pixel sensor for x-ray detection

Interpixel crosstalk in a 3D-integrated active pixel sensor for x-ray detection Interpixel crosstalk in a 3D-integrated active pixel sensor for x-ray detection The MIT Faculty has made this article openly available. Please share how this access benefits you. Your story matters. Citation

More information

Charged Coupled Device (CCD) S.Vidhya

Charged Coupled Device (CCD) S.Vidhya Charged Coupled Device (CCD) S.Vidhya 02.04.2016 Sensor Physical phenomenon Sensor Measurement Output A sensor is a device that measures a physical quantity and converts it into a signal which can be read

More information

ABSTRACT 1. INTRODUCTION

ABSTRACT 1. INTRODUCTION Preprint Proc. SPIE Vol. 5076-10, Infrared Imaging Systems: Design, Analysis, Modeling, and Testing XIV, Apr. 2003 1! " " #$ %& ' & ( # ") Klamer Schutte, Dirk-Jan de Lange, and Sebastian P. van den Broek

More information

MASSACHUSETTS INSTITUTE OF TECHNOLOGY LINCOLN LABORATORY 244 WOOD STREET LEXINGTON, MASSACHUSETTS

MASSACHUSETTS INSTITUTE OF TECHNOLOGY LINCOLN LABORATORY 244 WOOD STREET LEXINGTON, MASSACHUSETTS MASSACHUSETTS INSTITUTE OF TECHNOLOGY LINCOLN LABORATORY 244 WOOD STREET LEXINGTON, MASSACHUSETTS 02420-9108 3 February 2017 (781) 981-1343 TO: FROM: SUBJECT: Dr. Joseph Lin (joseph.lin@ll.mit.edu), Advanced

More information

The new CMOS Tracking Camera used at the Zimmerwald Observatory

The new CMOS Tracking Camera used at the Zimmerwald Observatory 13-0421 The new CMOS Tracking Camera used at the Zimmerwald Observatory M. Ploner, P. Lauber, M. Prohaska, P. Schlatter, J. Utzinger, T. Schildknecht, A. Jaeggi Astronomical Institute, University of Bern,

More information

Fundamentals of CMOS Image Sensors

Fundamentals of CMOS Image Sensors CHAPTER 2 Fundamentals of CMOS Image Sensors Mixed-Signal IC Design for Image Sensor 2-1 Outline Photoelectric Effect Photodetectors CMOS Image Sensor(CIS) Array Architecture CIS Peripherals Design Considerations

More information

A PFM Based Digital Pixel with Off-Pixel Residue Measurement for Small Pitch FPAs

A PFM Based Digital Pixel with Off-Pixel Residue Measurement for Small Pitch FPAs A PFM Based Digital Pixel with Off-Pixel Residue Measurement for Small Pitch FPAs S. Abbasi, Student Member, IEEE, A. Galioglu, Student Member, IEEE, A. Shafique, O. Ceylan, Student Member, IEEE, M. Yazici,

More information

Photons and solid state detection

Photons and solid state detection Photons and solid state detection Photons represent discrete packets ( quanta ) of optical energy Energy is hc/! (h: Planck s constant, c: speed of light,! : wavelength) For solid state detection, photons

More information

Where detectors are used in science & technology

Where detectors are used in science & technology Lecture 9 Outline Role of detectors Photomultiplier tubes (photoemission) Modulation transfer function Photoconductive detector physics Detector architecture Where detectors are used in science & technology

More information

Low Cost Earth Sensor based on Oxygen Airglow

Low Cost Earth Sensor based on Oxygen Airglow Assessment Executive Summary Date : 16.06.2008 Page: 1 of 7 Low Cost Earth Sensor based on Oxygen Airglow Executive Summary Prepared by: H. Shea EPFL LMTS herbert.shea@epfl.ch EPFL Lausanne Switzerland

More information

Fully Integrated Communication Terminal and Equipment. IRIS-3 Executive Summary

Fully Integrated Communication Terminal and Equipment. IRIS-3 Executive Summary Fully Integrated Communication Terminal and Equipment Specification : Executive Summary, D36A Authors : Document no. : Status : Issue Date : July 005 ESTEC Contract : 13716/99/NL/FM(SC) ESTEC Technical

More information

Tunable wideband infrared detector array for global space awareness

Tunable wideband infrared detector array for global space awareness Tunable wideband infrared detector array for global space awareness Jonathan R. Andrews 1, Sergio R. Restaino 1, Scott W. Teare 2, Sanjay Krishna 3, Mike Lenz 3, J.S. Brown 3, S.J. Lee 3, Christopher C.

More information

The first uncooled (no thermal) MWIR FPA monolithically integrated with a Si-CMOS ROIC: a 80x80 VPD PbSe FPA

The first uncooled (no thermal) MWIR FPA monolithically integrated with a Si-CMOS ROIC: a 80x80 VPD PbSe FPA DOI 10.516/irs013/i4.1 The first uncooled (no thermal) MWIR FPA monolithically integrated with a Si-CMOS ROIC: a 80x80 VPD PbSe FPA G. Vergara, R. Linares-Herrero, R. Gutiérrez-Álvarez, C. Fernández-Montojo,

More information

ARMY RDT&E BUDGET ITEM JUSTIFICATION (R-2 Exhibit)

ARMY RDT&E BUDGET ITEM JUSTIFICATION (R-2 Exhibit) COST (In Thousands) FY 2002 FY 2003 FY 2004 FY 2005 FY 2006 FY 2007 FY 2008 FY 2009 Actual Estimate Estimate Estimate Estimate Estimate Estimate Estimate H95 NIGHT VISION & EO TECH 22172 19696 22233 22420

More information

LWIR NUC Using an Uncooled Microbolometer Camera

LWIR NUC Using an Uncooled Microbolometer Camera LWIR NUC Using an Uncooled Microbolometer Camera Joe LaVeigne a, Greg Franks a, Kevin Sparkman a, Marcus Prewarski a, Brian Nehring a, Steve McHugh a a Santa Barbara Infrared, Inc., 30 S. Calle Cesar Chavez,

More information

THE OFFICINE GALILEO DIGITAL SUN SENSOR

THE OFFICINE GALILEO DIGITAL SUN SENSOR THE OFFICINE GALILEO DIGITAL SUN SENSOR Franco BOLDRINI, Elisabetta MONNINI Officine Galileo B.U. Spazio- Firenze Plant - An Alenia Difesa/Finmeccanica S.p.A. Company Via A. Einstein 35, 50013 Campi Bisenzio

More information

MIRAGE read-in-integrated-circuit testing results

MIRAGE read-in-integrated-circuit testing results header for SPIE use MIRAGE read-in-integrated-circuit testing results Theodore R. Hoelter, Blake A. Henry, John H. Graff, Naseem Y. Aziz Indigo Systems Corporation, 5385 Hollister Avenue #103, Santa Barbara,

More information

A SPAD-Based, Direct Time-of-Flight, 64 Zone, 15fps, Parallel Ranging Device Based on 40nm CMOS SPAD Technology

A SPAD-Based, Direct Time-of-Flight, 64 Zone, 15fps, Parallel Ranging Device Based on 40nm CMOS SPAD Technology A SPAD-Based, Direct Time-of-Flight, 64 Zone, 15fps, Parallel Ranging Device Based on 40nm CMOS SPAD Technology Pascal Mellot / Bruce Rae 27 th February 2018 Summary 2 Introduction to ranging device Summary

More information

Blooming effects in indium antimonide focal plane arrays

Blooming effects in indium antimonide focal plane arrays Blooming effects in indium antimonide focal plane arrays. Szafranek, 0. Amir, Z. Calahorra, A. Adin, and D. Cohen Semiconductor Devices (SCD), P.O. Box 2250, Haifa 3 1021, srael ABSTRACT Studies of blooming

More information

Development of a shutterless calibration process for microbolometer-based infrared measurement systems

Development of a shutterless calibration process for microbolometer-based infrared measurement systems More Info at Open Access Database www.ndt.net/?id=17685 Development of a shutterless calibration process for microbolometer-based infrared measurement systems Abstract by A. Tempelhahn*, H. Budzier*, V.

More information

Highly Miniaturised Radiation Monitor (HMRM) Status Report. Yulia Bogdanova, Nicola Guerrini, Ben Marsh, Simon Woodward, Rain Irshad

Highly Miniaturised Radiation Monitor (HMRM) Status Report. Yulia Bogdanova, Nicola Guerrini, Ben Marsh, Simon Woodward, Rain Irshad Highly Miniaturised Radiation Monitor (HMRM) Status Report Yulia Bogdanova, Nicola Guerrini, Ben Marsh, Simon Woodward, Rain Irshad HMRM programme aim Aim of phase A/B: Develop a chip sized prototype radiation

More information

Meteosat Third Generation (MTG) Lightning Imager (LI) instrument on-ground and in-flight calibration

Meteosat Third Generation (MTG) Lightning Imager (LI) instrument on-ground and in-flight calibration Meteosat Third Generation (MTG) Lightning Imager (LI) instrument on-ground and in-flight calibration Marcel Dobber, Stephan Kox EUMETSAT (Darmstadt, Germany) 1 Contents of this presentation Meteosat Third

More information

BACKSIDE ILLUMINATED CMOS-TDI LINE SCANNER FOR SPACE APPLICATIONS

BACKSIDE ILLUMINATED CMOS-TDI LINE SCANNER FOR SPACE APPLICATIONS BACKSIDE ILLUMINATED CMOS-TDI LINE SCANNER FOR SPACE APPLICATIONS O. Cohen, N. Ben-Ari, I. Nevo, N. Shiloah, G. Zohar, E. Kahanov, M. Brumer, G. Gershon, O. Ofer SemiConductor Devices (SCD) P.O.B. 2250,

More information

Ultra-high resolution 14,400 pixel trilinear color image sensor

Ultra-high resolution 14,400 pixel trilinear color image sensor Ultra-high resolution 14,400 pixel trilinear color image sensor Thomas Carducci, Antonio Ciccarelli, Brent Kecskemety Microelectronics Technology Division Eastman Kodak Company, Rochester, New York 14650-2008

More information

Towards lower Uncooled IR-FPA system integration cost

Towards lower Uncooled IR-FPA system integration cost Towards lower Uncooled IR-FPA system integration cost Benoit DUPONT 1,2,3, Michel VILAIN 1 1 ULIS, Veurey-Voroise, FRANCE 2 Laboratoire d'electronique de Technologie de l'information, Commissariat à l

More information

Designing and construction of an infrared scene generator for using in the hardware-in-the-loop simulator

Designing and construction of an infrared scene generator for using in the hardware-in-the-loop simulator 124 Designing and construction of an infrared scene generator for using in the hardware-in-the-loop simulator Mehdi Asghari Asl and Ali Reza Erfanian MSc of Electrical Engineering Electronics, Department

More information

Designing an MR compatible Time of Flight PET Detector Floris Jansen, PhD, Chief Engineer GE Healthcare

Designing an MR compatible Time of Flight PET Detector Floris Jansen, PhD, Chief Engineer GE Healthcare GE Healthcare Designing an MR compatible Time of Flight PET Detector Floris Jansen, PhD, Chief Engineer GE Healthcare There is excitement across the industry regarding the clinical potential of a hybrid

More information

A Current Mirroring Integration Based Readout Circuit for High Performance Infrared FPA Applications

A Current Mirroring Integration Based Readout Circuit for High Performance Infrared FPA Applications IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS II: ANALOG AND DIGITAL SIGNAL PROCESSING, VOL. 50, NO. 4, APRIL 2003 181 A Current Mirroring Integration Based Readout Circuit for High Performance Infrared FPA

More information

Integrated Multi-Aperture Imaging

Integrated Multi-Aperture Imaging Integrated Multi-Aperture Imaging Keith Fife, Abbas El Gamal, Philip Wong Department of Electrical Engineering, Stanford University, Stanford, CA 94305 1 Camera History 2 Camera History Despite progress,

More information

A 3MPixel Multi-Aperture Image Sensor with 0.7µm Pixels in 0.11µm CMOS

A 3MPixel Multi-Aperture Image Sensor with 0.7µm Pixels in 0.11µm CMOS A 3MPixel Multi-Aperture Image Sensor with 0.7µm Pixels in 0.11µm CMOS Keith Fife, Abbas El Gamal, H.-S. Philip Wong Stanford University, Stanford, CA Outline Introduction Chip Architecture Detailed Operation

More information

pco.edge 4.2 LT 0.8 electrons 2048 x 2048 pixel 40 fps up to :1 up to 82 % pco. low noise high resolution high speed high dynamic range

pco.edge 4.2 LT 0.8 electrons 2048 x 2048 pixel 40 fps up to :1 up to 82 % pco. low noise high resolution high speed high dynamic range edge 4.2 LT scientific CMOS camera high resolution 2048 x 2048 pixel low noise 0.8 electrons USB 3.0 small form factor high dynamic range up to 37 500:1 high speed 40 fps high quantum efficiency up to

More information

Detectors that cover a dynamic range of more than 1 million in several dimensions

Detectors that cover a dynamic range of more than 1 million in several dimensions Detectors that cover a dynamic range of more than 1 million in several dimensions Detectors for Astronomy Workshop Garching, Germany 10 October 2009 James W. Beletic Teledyne Providing the best images

More information

High-end CMOS Active Pixel Sensor for Hyperspectral Imaging

High-end CMOS Active Pixel Sensor for Hyperspectral Imaging R11 High-end CMOS Active Pixel Sensor for Hyperspectral Imaging J. Bogaerts (1), B. Dierickx (1), P. De Moor (2), D. Sabuncuoglu Tezcan (2), K. De Munck (2), C. Van Hoof (2) (1) Cypress FillFactory, Schaliënhoevedreef

More information

Based on lectures by Bernhard Brandl

Based on lectures by Bernhard Brandl Astronomische Waarneemtechnieken (Astronomical Observing Techniques) Based on lectures by Bernhard Brandl Lecture 10: Detectors 2 1. CCD Operation 2. CCD Data Reduction 3. CMOS devices 4. IR Arrays 5.

More information

Hyperspectral goes to UAV and thermal

Hyperspectral goes to UAV and thermal Hyperspectral goes to UAV and thermal Timo Hyvärinen, Hannu Holma and Esko Herrala SPECIM, Spectral Imaging Ltd, Finland www.specim.fi Outline Roadmap to more compact, higher performance hyperspectral

More information

Application Notes: Discrete Amplification Photon Detector 5x5 Array Including Pre- Amplifiers Board

Application Notes: Discrete Amplification Photon Detector 5x5 Array Including Pre- Amplifiers Board Application Notes: Discrete Amplification Photon Detector 5x5 Array Including Pre- Amplifiers Board March 2015 General Description The 5x5 Discrete Amplification Photon Detector (DAPD) array is delivered

More information

Alexandrine Huot Québec City June 7 th, 2016

Alexandrine Huot Québec City June 7 th, 2016 Innovative Infrared Imaging. Alexandrine Huot Québec City June 7 th, 2016 Telops product offering Outlines. Time-Resolved Multispectral Imaging of Gases and Minerals Background notions of infrared multispectral

More information

STA1600LN x Element Image Area CCD Image Sensor

STA1600LN x Element Image Area CCD Image Sensor ST600LN 10560 x 10560 Element Image Area CCD Image Sensor FEATURES 10560 x 10560 Photosite Full Frame CCD Array 9 m x 9 m Pixel 95.04mm x 95.04mm Image Area 100% Fill Factor Readout Noise 2e- at 50kHz

More information

Minimizes reflection losses from UV-IR; Optional AR coatings & wedge windows are available.

Minimizes reflection losses from UV-IR; Optional AR coatings & wedge windows are available. Now Powered by LightField PyLoN:2K 2048 x 512 The PyLoN :2K is a controllerless, cryogenically-cooled CCD camera designed for quantitative scientific spectroscopy applications demanding the highest possible

More information

UNCLASSIFlED CCD FOCAL PLANE IMAGE PROCESSING. 14 November 1988

UNCLASSIFlED CCD FOCAL PLANE IMAGE PROCESSING. 14 November 1988 UNCLASSIFlED To appear in Proc. 1988 Conf. Pattern Recognition for Adv. Missile Systems Huntsville, AL Nov 1988 CCD FOCAL PLANE IMAGE PROCESSING 14 November 1988 Eric R. Fossum Department of Electrical

More information

Backside illuminated CMOS-TDI line scan sensor for space applications

Backside illuminated CMOS-TDI line scan sensor for space applications Backside illuminated CMOS-TDI line scan sensor for space applications Omer COHEN, Oren OFER, Gil ABRAMOVICH, Nimrod BEN-ARI, Gal GERSHON, Maya BRUMER, Adi SHAY, Yaron SHAMAY SemiConductor Devices (SCD)

More information

DEFENSE APPLICATIONS IN HYPERSPECTRAL REMOTE SENSING

DEFENSE APPLICATIONS IN HYPERSPECTRAL REMOTE SENSING DEFENSE APPLICATIONS IN HYPERSPECTRAL REMOTE SENSING James M. Bishop School of Ocean and Earth Science and Technology University of Hawai i at Mānoa Honolulu, HI 96822 INTRODUCTION This summer I worked

More information

Part Number SuperPix TM image sensor is one of SuperPix TM 2 Mega Digital image sensor series products. These series sensors have the same maximum ima

Part Number SuperPix TM image sensor is one of SuperPix TM 2 Mega Digital image sensor series products. These series sensors have the same maximum ima Specification Version Commercial 1.7 2012.03.26 SuperPix Micro Technology Co., Ltd Part Number SuperPix TM image sensor is one of SuperPix TM 2 Mega Digital image sensor series products. These series sensors

More information

Enhanced LWIR NUC Using an Uncooled Microbolometer Camera

Enhanced LWIR NUC Using an Uncooled Microbolometer Camera Enhanced LWIR NUC Using an Uncooled Microbolometer Camera Joe LaVeigne a, Greg Franks a, Kevin Sparkman a, Marcus Prewarski a, Brian Nehring a a Santa Barbara Infrared, Inc., 30 S. Calle Cesar Chavez,

More information

SMALL UNMANNED AERIAL VEHICLES AND OPTICAL GAS IMAGING

SMALL UNMANNED AERIAL VEHICLES AND OPTICAL GAS IMAGING SMALL UNMANNED AERIAL VEHICLES AND OPTICAL GAS IMAGING A look into the Application of Optical Gas imaging from a suas 4C Conference- 2017 Infrared Training Center, All rights reserved 1 NEEDS ANALYSIS

More information

ABSTRACT. Keywords: 0,18 micron, CMOS, APS, Sunsensor, Microned, TNO, TU-Delft, Radiation tolerant, Low noise. 1. IMAGERS FOR SPACE APPLICATIONS.

ABSTRACT. Keywords: 0,18 micron, CMOS, APS, Sunsensor, Microned, TNO, TU-Delft, Radiation tolerant, Low noise. 1. IMAGERS FOR SPACE APPLICATIONS. Active pixel sensors: the sensor of choice for future space applications Johan Leijtens(), Albert Theuwissen(), Padmakumar R. Rao(), Xinyang Wang(), Ning Xie() () TNO Science and Industry, Postbus, AD

More information

Low-Cost Far-Infrared FPA based on High-Volume Pressure Sensor Process

Low-Cost Far-Infrared FPA based on High-Volume Pressure Sensor Process Low-Cost Far-Infrared FPA based on High-Volume Pressure Sensor Process Michael Krueger 1, Ingo Herrmann 1 Robert Bosch GmbH - Automotive Electronics, Tuebinger Str. 13, D-776 Reutlingen, Germany, michael.krueger@de.bosch.com

More information

Image acquisition. In both cases, the digital sensing element is one of the following: Line array Area array. Single sensor

Image acquisition. In both cases, the digital sensing element is one of the following: Line array Area array. Single sensor Image acquisition Digital images are acquired by direct digital acquisition (digital still/video cameras), or scanning material acquired as analog signals (slides, photographs, etc.). In both cases, the

More information

Digital camera. Sensor. Memory card. Circuit board

Digital camera. Sensor. Memory card. Circuit board Digital camera Circuit board Memory card Sensor Detector element (pixel). Typical size: 2-5 m square Typical number: 5-20M Pixel = Photogate Photon + Thin film electrode (semi-transparent) Depletion volume

More information

TEST RESULTS WITH 2KX2K MCT ARRAYS

TEST RESULTS WITH 2KX2K MCT ARRAYS TEST RESULTS WITH 2KX2K MCT ARRAYS Finger, G, Dorn, R.J., Mehrgan, H., Meyer, M., Moorwood A.F.M. and Stegmeier, J. European Southern Observatory Abstract: Key words: The performance of both an LPE 2Kx2K

More information

Optical Correlator for Image Motion Compensation in the Focal Plane of a Satellite Camera

Optical Correlator for Image Motion Compensation in the Focal Plane of a Satellite Camera 15 th IFAC Symposium on Automatic Control in Aerospace Bologna, September 6, 2001 Optical Correlator for Image Motion Compensation in the Focal Plane of a Satellite Camera K. Janschek, V. Tchernykh, -

More information

Detectors for microscopy - CCDs, APDs and PMTs. Antonia Göhler. Nov 2014

Detectors for microscopy - CCDs, APDs and PMTs. Antonia Göhler. Nov 2014 Detectors for microscopy - CCDs, APDs and PMTs Antonia Göhler Nov 2014 Detectors/Sensors in general are devices that detect events or changes in quantities (intensities) and provide a corresponding output,

More information

Hartmann-Shack sensor ASIC s for real-time adaptive optics in biomedical physics

Hartmann-Shack sensor ASIC s for real-time adaptive optics in biomedical physics Hartmann-Shack sensor ASIC s for real-time adaptive optics in biomedical physics Thomas NIRMAIER Kirchhoff Institute, University of Heidelberg Heidelberg, Germany Dirk DROSTE Robert Bosch Group Stuttgart,

More information

Techniques for Pixel Level Analog to Digital Conversion

Techniques for Pixel Level Analog to Digital Conversion Techniques for Level Analog to Digital Conversion Boyd Fowler, David Yang, and Abbas El Gamal Stanford University Aerosense 98 3360-1 1 Approaches to Integrating ADC with Image Sensor Chip Level Image

More information

A 1.3 Megapixel CMOS Imager Designed for Digital Still Cameras

A 1.3 Megapixel CMOS Imager Designed for Digital Still Cameras A 1.3 Megapixel CMOS Imager Designed for Digital Still Cameras Paul Gallagher, Andy Brewster VLSI Vision Ltd. San Jose, CA/USA Abstract VLSI Vision Ltd. has developed the VV6801 color sensor to address

More information

a simple optical imager

a simple optical imager Imagers and Imaging a simple optical imager Here s one on our 61-Inch Telescope Here s one on our 61-Inch Telescope filter wheel in here dewar preamplifier However, to get a large field we cannot afford

More information

A New Single-Photon Avalanche Diode in 90nm Standard CMOS Technology

A New Single-Photon Avalanche Diode in 90nm Standard CMOS Technology A New Single-Photon Avalanche Diode in 90nm Standard CMOS Technology Mohammad Azim Karami* a, Marek Gersbach, Edoardo Charbon a a Dept. of Electrical engineering, Technical University of Delft, Delft,

More information

Sensor Fusion Enables Comprehensive Analysis of Laser Processing in Additive Manufacturing

Sensor Fusion Enables Comprehensive Analysis of Laser Processing in Additive Manufacturing MKS Instruments 1 of 6 Sensor Fusion Enables Comprehensive Analysis of Laser Processing in Additive Manufacturing By Kevin Kirkham, Senior Manager, Product Development, Ophir Sensor: "A device that detects

More information

Challenges in Imaging, Sensors, and Signal Processing

Challenges in Imaging, Sensors, and Signal Processing Challenges in Imaging, Sensors, and Signal Processing Raymond Balcerak MTO Technology Symposium March 5-7, 2007 1 Report Documentation Page Form Approved OMB No. 0704-0188 Public reporting burden for the

More information

Realization of a ROIC for 72x4 PV-IR detectors

Realization of a ROIC for 72x4 PV-IR detectors Realization of a ROIC for 72x4 PV-IR detectors Huseyin Kayahan, Arzu Ergintav, Omer Ceylan, Ayhan Bozkurt, Yasar Gurbuz Sabancı University Faculty of Engineering and Natural Sciences, Tuzla, Istanbul 34956

More information

ULS24 Frequently Asked Questions

ULS24 Frequently Asked Questions List of Questions 1 1. What type of lens and filters are recommended for ULS24, where can we source these components?... 3 2. Are filters needed for fluorescence and chemiluminescence imaging, what types

More information

NIRCam optical calibration sources

NIRCam optical calibration sources NIRCam optical calibration sources Stephen F. Somerstein, Glen D. Truong Lockheed Martin Advanced Technology Center, D/ABDS, B/201 3251 Hanover St., Palo Alto, CA 94304-1187 ABSTRACT The Near Infrared

More information

Wide-field Infrared Survey Explorer (WISE)

Wide-field Infrared Survey Explorer (WISE) Wide-field Infrared Survey Explorer (WISE) Latent Image Characterization Version 1.0 12-July-2009 Prepared by: Deborah Padgett Infrared Processing and Analysis Center California Institute of Technology

More information

CHAPTER 1 INTRODUCTION. fluid flow imaging [3], and aerooptic imaging [4] require a high frame rate image

CHAPTER 1 INTRODUCTION. fluid flow imaging [3], and aerooptic imaging [4] require a high frame rate image CHAPTER 1 INTRODUCTION High speed imaging applications such as combustion imaging [1],[2], transmach fluid flow imaging [3], and aerooptic imaging [4] require a high frame rate image acquisition system

More information

PRELIMINARY. Specifications are at array temperature of -30 C and package ambient temperature of 23 C All values are typical

PRELIMINARY. Specifications are at array temperature of -30 C and package ambient temperature of 23 C All values are typical DAPD NIR 5x5 Array+PCB 1550 Series: Discrete Amplification Photon Detector Array Including Pre-Amplifier Board The DAPDNIR 5x5 Array 1550 series takes advantage of the breakthrough Discrete Amplification

More information

Properties of a Detector

Properties of a Detector Properties of a Detector Quantum Efficiency fraction of photons detected wavelength and spatially dependent Dynamic Range difference between lowest and highest measurable flux Linearity detection rate

More information

CHAPTER 9 POSITION SENSITIVE PHOTOMULTIPLIER TUBES

CHAPTER 9 POSITION SENSITIVE PHOTOMULTIPLIER TUBES CHAPTER 9 POSITION SENSITIVE PHOTOMULTIPLIER TUBES The current multiplication mechanism offered by dynodes makes photomultiplier tubes ideal for low-light-level measurement. As explained earlier, there

More information

The design and testing of a small scale solar flux measurement system for central receiver plant

The design and testing of a small scale solar flux measurement system for central receiver plant The design and testing of a small scale solar flux measurement system for central receiver plant Abstract Sebastian-James Bode, Paul Gauche and Willem Landman Stellenbosch University Centre for Renewable

More information

CCD Characteristics Lab

CCD Characteristics Lab CCD Characteristics Lab Observational Astronomy 6/6/07 1 Introduction In this laboratory exercise, you will be using the Hirsch Observatory s CCD camera, a Santa Barbara Instruments Group (SBIG) ST-8E.

More information

CCD67 Back Illuminated AIMO High Performance Compact Pack CCD Sensor

CCD67 Back Illuminated AIMO High Performance Compact Pack CCD Sensor CCD67 Back Illuminated AIMO High Performance Compact Pack CCD Sensor FEATURES * 256 x 256 Pixel Image Area. * 26 mm Square Pixels. * Low Noise, High Responsivity Output Amplifier. * 1% Active Area. * Gated

More information

System and method for subtracting dark noise from an image using an estimated dark noise scale factor

System and method for subtracting dark noise from an image using an estimated dark noise scale factor Page 1 of 10 ( 5 of 32 ) United States Patent Application 20060256215 Kind Code A1 Zhang; Xuemei ; et al. November 16, 2006 System and method for subtracting dark noise from an image using an estimated

More information

Computational Sensors

Computational Sensors Computational Sensors Suren Jayasuriya Postdoctoral Fellow, The Robotics Institute, Carnegie Mellon University Class Announcements 1) Vote on this poll about project checkpoint date on Piazza: https://piazza.com/class/j6dobp76al46ao?cid=126

More information

A Foveated Visual Tracking Chip

A Foveated Visual Tracking Chip TP 2.1: A Foveated Visual Tracking Chip Ralph Etienne-Cummings¹, ², Jan Van der Spiegel¹, ³, Paul Mueller¹, Mao-zhu Zhang¹ ¹Corticon Inc., Philadelphia, PA ²Department of Electrical Engineering, Southern

More information

Electron-Bombarded CMOS

Electron-Bombarded CMOS New Megapixel Single Photon Position Sensitive HPD: Electron-Bombarded CMOS University of Lyon / CNRS-IN2P3 in collaboration with J. Baudot, E. Chabanat, P. Depasse, W. Dulinski, N. Estre, M. Winter N56:

More information

IT FR R TDI CCD Image Sensor

IT FR R TDI CCD Image Sensor 4k x 4k CCD sensor 4150 User manual v1.0 dtd. August 31, 2015 IT FR 08192 00 R TDI CCD Image Sensor Description: With the IT FR 08192 00 R sensor ANDANTA GmbH builds on and expands its line of proprietary

More information

A Low-Cost Thermal Imaging Sensor for Military Dismounted Operations

A Low-Cost Thermal Imaging Sensor for Military Dismounted Operations A Low-Cost Thermal Imaging Sensor for Military Dismounted Operations David Huckridge, Paul Manning, Nicholas Parkinson, John Gillham Optronics Centre, QinetiQ Malvern Technology Centre Malvern, Worcs WR14

More information