IMAPS Advanced Technology Workshop on High Reliability Microelectronics for Military Applications

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ADVANCE PROGRAM AND REGISTRATION ON-LINE AT WWW.IMAPS.

1 ADVANCE PROGRAM AND REGISTRATION ON-LINE AT IMAPS Advanced Technology Workshop on High Reliability Microelectronics for Military Applications Bethesda North Marriott Hotel & Conference Center Bethesda, Maryland - USA August 31 - September 2, 2010 General Chair: Greg Caswell DfR Solutions gcaswell@dfrsolutions.com Technical Team: Ed Kurek - Northrop Grumman - edward.kurek@ngc.com Rick Gunn - NexTek Inc. - rick.gunn@nextekinc.com Maureen Curran - Orbital Sciences - curran.maureen@orbital.com Keith Sturcken - BAE Systems - keith.sturcken@baesystems.com Bruce Romenesko - Johns Hopkins University/APL - Bruce.Romenesko@jhuapl.edu Carolynn Drudik - DMEA - carolynn.drudik@dmea.osd.mil Corporate Sponsors: Chesapeake Chapter Organized by: The International Microelectronics And Packaging Society (IMAPS) Bringing Together the Entire Microelectronics Supply Chain! Early Registration Deadline & Hotel Cut-off: August 6, 2010

Workshop Overview In our current global situation where the focus is on military electronics reliability and performance in hostile environments, extensive work is being done to advance the

The technical program will focus on the latest military electronic devices, systems, and applications, with particular emphasis on system level issues that have an impact on mission assurance as well

2 Workshop Overview In our current global situation where the focus is on military electronics reliability and performance in hostile environments, extensive work is being done to advance the state-of-the-art in high reliability electronics packaging. The technical program will focus on the latest military electronic devices, systems, and applications, with particular emphasis on system level issues that have an impact on mission assurance as well as the connected issues at the design and applications level. Tuesday, August 31 st Registration: 7:00 am - 4:15 pm Continental Breakfast: 7:15 am - 8:00 am OPENING REMARKS: 8:00 AM - 8:15 AM General Chair: Greg Caswell, DfR Solutions KEYNOTE PRESENTATION: 8:15 AM - 9:00 AM Title: Challenges in DoD Acquisition: Reliability Design and Assessment in a Post-MIL-STD World Speaker: Grant Schmieder, OSD Grant Richard Schmieder is a senior reliability engineer supporting the Office of the Director, Defense Research and Engineering/Systems Engineering, in Arlington, VA. Mr. Schmieder has 26 years of experience in logistics and reliability engineering, including 19 years in defense; a BS in engineering from the University of Santa Clara in Santa Clara, CA; and an MS in systems and industrial engineering from the University of Arizona in Tucson. He spent 16 years with Hughes (now Raytheon) Missile Systems in Tucson, working as a logistics engineer on the Maverick, AMRAAM, ESSM, AIM-9X, and Phoenix missile programs. Transitioning to reliability engineering while obtaining his master s degree in systems and industrial engineering, he served as the reliability engineer on the Stinger missile system. After a brief stint as a reliability engineer for Cubic Defense Systems in San Diego, he spent 7 years working as the reliability lead for Telabs Salix Division and BioVeris Corporation in Maryland. He is an American Society for Quality Certified Reliability Engineer and holds the Professional Certificate in Reliability and Quality Engineering from the University of Arizona. KEYNOTE PRESENTATION: 9:00 AM - 9:45 AM Title: Pb-Free Electronics Overview Speaker: Edward A. Morris, Lockheed Martin Corporation Edward A. Morris is Director of Mechanical Engineering & Manufacturing on the Lockheed Martin Corporate Engineering & Technology team. His focus is on improving the effectiveness of mechanical engineering design and manufacturing processes and technologies, and establishing practices that link the Mechanical Engineering, Production, Supply Chain Management and Sustainment communities so that life-cycle cost can be effectively managed. He is Vice Chairman of the Lockheed Martin Corporate Production Council. Additionally, Ed is responsible for developing and executing a proactive Lockheed Martin approach for Pb (lead)-free electronics risk management. Ed has a BS in Aeronautical Engineering from Purdue University and an MBA from the University of Texas at Arlington. He has 39 years of defense, commercial and international aerospace industry experience. Break: 9:45 am - 10:15 am SESSION 1: SYSTEM LEVEL/MISSION ASSURANCE Session Chair: Keith Sturcken, BAE Systems 10:15 am - 11:45 am Microcircuit Reliability Prediction Based on Physics-of-Failure Models Lloyd Condra, Boeing; Craig Hillman, Ed Wyrwas, DfR Solutions; Dave Redman, Aerospace Vehicle Systems Institute Derating Guidelines - Need to be Used Properly in Design Dave Kayser, NAVAIR ANSI/GEIA-STD-0009 and The HB0009 Reliability Handbook Efforts Paul E. Shedlock, Raytheon Company Lunch: 11:45 am - 12:45 pm

3 SESSION 2: SYSTEM LEVEL RELIABILITY Session Chairs: Maureen Curran, Orbital Sciences; Keith Rogers, Department of Defense 12:45 pm - 4:15 pm High Reliability Microelectronics for Military Applications Jim McLeish, DfR Solutions NanoChromics Printed Security Solutions Applications to Anti-Counterfeit, Identification, and Authentication Applications Alain C. Briancon, NTERA, Inc. Minimizing the Risk of Counterfeit Electronic Devices Mark Marshall, Integra Technologies LLC High Reliability Avionics at Northrop Grumman Electronic Systems Bill Marsh, Northrop Grumman Break: 2:15 pm - 2:45 pm Considering Counterfeits - Evaluating Anti-Counterfeit Partners and Strategies with Business Fundamentals Philip Comer, DMEA Using DNA to Safeguard Electrical Components and Protect Against Counterfeiting and Diversion Janice Meraglia, James Hayward, Applied DNA Sciences Wednesday, September 1 st Registration: 7:00 am - 4:15 pm Continental Breakfast: 7:15 am - 8:00 am SESSION 3: TEST SESSION/RELIABILITY, QUALIFICATION Session Chair: Rick Gunn, NexTek Inc. 8:00 am - 11:30 am Optical Leak Test Data per Latest Release of MIL-STD 750, Test Method 1071 Chris Aubertin, Dick Vanderneut, NorCom Systems Inc.; Thomas J Green, TJ Green Associates LLC Low Cost Hermetic Sealing of Large Electronic Packages Thomas E. Salzer, Hermetric, Inc. Quantifying the Impact of Lead Free Assembly Using High Temperature Testing Bill Birch, PWB Interconnect Solutions Inc. Reliability Testing for Microvias in Printed Wire Boards Bill Birch, PWB Interconnect Solutions Inc. Understanding Semiconductor Package Hermeticity John Pernicka, Pernicka Corporation Break: 9:30 am - 10:00 am Automated Design Analysis: Accurately Capturing Warranty and End-of-Life Risks Early in Product Development Nathan Blattau, DfR Solutions Lunch: 11:30 am - 12:30 pm Military ATW Speaker Information Extended Abstract or Presentation Material due: August 6, Send your extended abstract or presentation material via to jmorris@imaps.org, in PDF format only (PDF can be in color). Powerpoint/Presentation file used during session: Speaker s responsibility to bring to session on USB and/or CD (recommended to have back-up on personal laptop, CD-ROM, or memory stick). Laptop will be provided by IMAPS in the session room. Speakers must register for the workshop at the reduced speaker rate. Advance registration deadline is August 6, Visit for more information.

4 KEYNOTE PRESENTATION: 12:45 PM - 1:15 PM Title: Leading on the Tough Days Speaker: Colonel Danny McKnight Colonel Danny R. McKnight, U.S. Army, Retired, was born in Columbus, Georgia; moved to Rockledge, Florida in 1959; graduated from Cocoa High School in 1969 and Brevard Community College in He was a Distinguished Military Graduate from Florida State University in 1973, where he earned a BS in Management. In 1985, Danny earned his Master s in Higher Education from the University of Florida while assigned as an Assistant Professor of Military Science in the ROTC Department. His military career included combat duty on two occasions, Panama 1989 and Somalia 1993 (basis for the Book and Movie Black Hawk Down ). Colonel McKnight now focuses all his efforts on being a nationwide motivational speaker. He and his wife, Linda, reside in Rockledge, Florida. SESSION 4: PACKAGING/BOARD LEVEL Session Chair: Ed Kurek, Northrop Grumman 1:15 pm - 4:15 pm Leveraging Device Level 3D Integration Technologies for High Performance/Reliability Modules Dan Baldwin, Engent Ceramic Column Grid Array Durability in Rugged Environments Jerry Keller, Scott Dukes, Roy Belaen, Honeywell Aerospace Failure Analysis - Detailed Investigation David Boyarski, Orbital Sciences Electronic Packaging Trends and Drivers in USA Voya Markovich, Endicott Interconnect, Inc. Break: 2:15 pm - 2:45 pm Low-Temperature Soldering Options for High-Reliability Hermetic Sealing Christopher Nash, Thomas Acchione, Carol Gowans, Indium Corporation Thursday, September 2 nd Registration: 7:00 am - 10:00 am Continental Breakfast: 7:15 am - 8:00 am A Review of Flip Chip Ceramic CGA Packaging Joseph Fabula, Xilinx, Inc. Broadband Printing - Enhanced Solder Joint Reliability Rick Love, Cookson Electronics Mixed Metals Impact on Reliability Rick Gunn, Nextek Incorporated SESSION 5: MATERIALS/COMPONENTS Session Chair: Carolynn Drudik, DMEA 8:00 am - 10:00 am Understanding the Reliability Impacts of Reballed BGAs for Military Applications Stephen Meschter, BAE Systems; Joelle Arnold, DfR Solutions Closing Remarks: 10:00 am THANK YOU A SPECIAL THANK YOU TO ALL OF THE MEMBERS OF THE TECHNICAL TEAM, THE CORPORATE SPONSORS, CHAIRS AND SPEAKERS. YOUR PARTICIPATION IS GREATLY APPRECIATED!

Upcoming Events... Mark Your Calendar. You Don t Want to Miss These Upcoming IMAPS Events!!! ATW on RF & Microwave The Crowne Plaza San Diego San Diego, California - USA September 21-23, 2010 www.

5 Upcoming Events... Mark Your Calendar. You Don t Want to Miss These Upcoming IMAPS Events!!! ATW on RF & Microwave The Crowne Plaza San Diego San Diego, California - USA September 21-23, ATW and Tabletop Exhibition on Thermal Management Dinah s Garden Hotel Palo Alto, California - USA September 28-30, rd International Symposium on Microelectronics (IMAPS 2010) Raleigh Convention Center Raleigh, North Carolina - USA October 31 - November 4, Topical Workshop on Nano-Integrated Microsystems Packaging: Design, Materials, Processes and Applications Marriott Raleigh City Center Raleigh, North Carolina - USA November 4-5, Co-located with and immediately following IMAPS ATW on Electronic Packaging of Solar Cells and Fuel Cells Hilton Garden Inn Cleveland Airport 4900 Emerald Ct. SW Cleveland, OH March 29-30, IMAPS/ACerS 7 th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies The Westgate Hotel San Diego, California - USA April 5-7, Announcements and Call for Abstracts are listed on-line. Abstract deadline fast approaching for most events! Visit or the official website for each event for more information.

6 Dr. Mr. Ms. REGISTRATION FORM REGISTER ON-LINE AT MILITARY WORKSHOP: AUGUST 31 - SEPTEMBER 2, 2010 Member ID# First Name M.I. Last Name Company/Affiliation Job Position Address City State Zip Country Phone Fax PAYMENT MIL10PROG Workshop Fee: $ Additional Purchases: $ Total Payment Due: $ For Wire Transfer information call Enclosed is a check payable in US funds to IMAPS Charge my fees to: Visa MasterCard Discover Amex Card # Exp. Signature Card billing address, if different from above: (required) Mail this form with payment to: IMAPS * 611 2nd Street, NE * Washington, DC For credit card transactions, register on-line: or register by phone with your credit card by calling ; Fax: Additional information? IMAPS@imaps.org, or visit our web site: Workshop Cancellations will be refunded (less a $50 processing fee) only if written notice is postmarked on or before Friday, August 20, No refunds will be issued after that date. REGISTRATION FEES: EARLY REGISTRATION ENDS 8/6/10 WORKSHOP FEES (On or before 8/6) (After 8/6) Member (IMAPS) $625 $725 Non-Member* $725 $825 Speaker Chair Chapter Officer $400 $500 Student $275 $375 *Includes one-year IMAPS individual membership. Does not apply to corporate or affiliate memberships. Workshop Fee includes: abstract book; meals listed and a CD of Presentations. CD of Presentations will be mailed 15 business days after the event. HOW DID YOU HEAR ABOUT THIS EVENT? Direct Mail Website Advancing Microelectronics Colleague IMAPS Weekly Bulletin Personal Call Industry/Trade Magazine Other ADDITIONAL PURCHASES Guest/Family Member (meals only) $160 $160 CD of Presentations (Member Rate) $200 $200 CD of Presentations (Non-Member Rate) $300 $300 Add to Ship in the US $7 $7 Add to Ship Overseas $25 $25 HOTEL RESERVATION (Hotel Cut-off is August 6, 2010) Reservation must be made directly with: Bethesda North Marriott Hotel & Conference Center 5701 Marinelli Road; Bethesda, MD Accessible by Metro - Red Line, White Flint Station. Group Rate: $149/night plus tax For reservations, call: or and ask for International Microelectronics And Packaging Society Pre registered attendees can save $12/day on parking. (Attendees must be pre registered by Friday, August 27 th.) Presorted First-Class Mail U.S. Postage PAID Merrifield, VA Permit No IMAPS Registration 611 2nd Street, NE Washington, DC "Return Service Requested" Guests booking rooms through the official block will receive complimentary Internet access in their sleeping room, a savings of $12.95/day.

IMAPS Advanced Technology Conference and Tabletop Exhibition on Non-Hermetic Packaging Technology for Reliable Microelectronics

IMAPS Advanced Technology Conference and Tabletop Exhibition on Non-Hermetic Packaging Technology for Reliable Microelectronics Rosen Centre Hotel Orlando, Florida - USA JANUARY 18, 2012 Final Program