IMEC's Collaboration Models for Nanoelectronics Research and Role of the PRINS Research Infrastructure

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Osborne Hensley
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1 IMEC's Collaboration Models for Nanoelectronics Research and Role of the PRINS Research Infrastructure * IMEC, Kapeldreef 75, 3001 Leuven, Belgium *Also E.E. Dept, KU Leuven, Kasteelpark Arenberg 10, 3001 Leuven, Belgium

2 Outline Introduction about IMEC Business model PRINS RI

IMEC 1984 2008 a bit of history 1984 Established by state government of Flanders in Belgium Nonprofit organization Initial investment: 62M Initial staff: ~70 2008 One of the largest independent R&D

3 IMEC a bit of history 1984 Established by state government of Flanders in Belgium Nonprofit organization Initial investment: 62M Initial staff: ~ One of the largest independent R&D organizations in its field, worldwide Revenue (P&L) : 280M (includes 44 M grant from Flanders government) 17% government/state funding Staff: over 1750 Worldwide collaboration with many partners imec restricted

4 IMEC s total revenue versus research grant 250 M 2008 revenue: 280 M 280M M Flemish Government Revenue (P&L)

5 Evolution of staff in IMEC group (Jan. 2009) IMEC Leuven 534 non-payroll 185 PhD students 349 industrial residents Total Staff IMEC: about of which 534 visiting residents PR IMEC Leuven NPR IMEC Leuven PR IMEC NL NPR IMEC NL

6 Algeria Armenia Austria Belarus Brazil Bulgaria Canada Chili China Colombia Czechia Danmark Egypt Ethiopia Finland France Georgia Germany Great Britain Greece Hungaria India Iran Iraq Ireland Italy Ivory Coast Japan Korea Lebanon Lithuania Malaysia Mexico Moldova Mongolia Morocco Nicaragua Nigeria Pakistan Poland Portugal Romania Russia Rwanda Serbia/Montenegro Singapore Slovakia Slovenia South Africa Spain Sudan Sweden Swissland Taiwan The Netherlands Tunisia Turkey U.S.A. Ukrainia Vietnam More than 60 nationalities at IMEC Foreign coworkers (PR + NPR): number per nationality 60 foreign nationalities, 1024 Belgians (information dd. 31/10/2008) IMEC : brain magnet 1024 Belgians

Clean Room 2 3200 m 2 Clean Room 300 mm pilot line Ball Room, Clean sub-fab Continuous operation: 24hrs / 7 days IMECAMPUS

7 Clean Room m 2 Clean Room 300 mm pilot line Ball Room, Clean sub-fab Continuous operation: 24hrs / 7 days IMECAMPUS Clean Room m 2 Clean Room 1750 m 2 Class mm pilot line Continuous operation: 24hrs / 7 days Total: 8000 m 2 Clean Room

8 IMEC s Expansion Plans

9 Technology Roadmap: Strategic Agenda CNT, nanowire, TFET Graphene Quantum computing Spintronics Polymer electronics.

10 Scaling & Device Performance Scaling graphene??? nanowires??? Active Area Spacers Gate Field Ge/IIIV??? CNT s TunnelFET FinFET metal gate USJ L=35nm strain SiGe HfO 2 high -k The introduction of new materials and devices will allow to continue the performance scaling silicide time

11 Micro-Nano convergence Magneto-electronics Polymer electronics Molecular nanotechnology Micro (nano) electro- Mechanical systems Nanoelectronics Opto-electronics Nano-electronics Biosensors

12 Nano-bio vision :Bio & ICT meet at the nanoscale BIOTECH nm mm cm NANOTECH Nano building stone 31nm transistor x10 9 NANOELECTRONICS

13 More than Moore Heterogeneous Integration More Moore 3D Design 3D SIC Technology 3D WLP Technology Cu/Low k EMERALD PLANAR EUVL Double Patterning Hyper NA Immersion Application Driven Generic technology programs For increasing complexity Lithography Front End Back End 3D Integration LOGIC FLASH Core CMOS Programs DRAM Explore Exploratory Materials and Device Research for CMOS based Technologies Ge/III-V, expl. high-k Post-CMOS nano Cleaning & Contamination (UCP program) Materials Characterization & Metrology Supporting Expertise Centers Reliability & Modeling CMORE (i-soc) R&D platform for Multi Functional SoC (MEMS, Sensors, Actuators, ) based on 130 nm, 200 mm CMOS Nomadic Embedded Systems (APOLLO) Software Defined Radio Multi Media Cross-layer (QoE) MPSOC Compiler Technololgy Aware Design Above CMOS SiGe MEMS platform RF / Mixed Signal BiCMOS / RFCMOS APIC (SIP) Wireless Autonomous Transducer Systems ULP ULP Actuators MicroPower More than Moore Wireless DSP Sensors Generation Integration & Implement. Heterogeneous Bio-Medical Electronics Integration Advanced Packaging 3D SIP, WLP RF Integrated Passive Technology Flexible substrates Brain Computer Interface Molecular Imaging & Therapy Molecular Diagnostics Application 1: Industrial Monitoring Systems Application 2: Body Area Networks HUMAN++ Implantable Devices Nano Photonics Photovoltaics (SOLAR + ) Power Electr. Organic Electronics Si based Solar Cells Organic Solar Cells GaN

14 More than Moore Heterogeneous Integration 3D Design 3D SIC Technology 3D WLP Technology Cu/Low k EMERALD PLANAR EUVL Double Patterning Hyper NA Immersion Application Driven More Moore Generic technology programs For increasing complexity Lithography Front End Back End 3D Integration LOGIC FLASH DRAM Explore Exploratory Materials and Device Research for CMOS based Technologies Ge/III-V, expl. high-k Post-CMOS nano Cleaning & Contamination (UCP program) Materials Characterization & Metrology Supporting Expertise Centers Reliability & Modeling CMORE (i-soc) R&D platform for Multi Functional SoC (MEMS, Sensors, Actuators, ) based on 130 nm, 200 mm CMOS Nomadic Embedded Systems (APOLLO) Software Defined Radio Multi Media Cross-layer (QoE) MPSOC Compiler Technololgy Aware Design Above CMOS SiGe MEMS platform RF / Mixed Signal BiCMOS / RFCMOS APIC (SIP) Advanced Packaging 3D SIP, WLP RF Integrated Passive Technology Flexible substrates Wireless Autonomous Transducer Systems ULP Wireless ULP DSP Actuators Sensors Bio-Medical Electronics Brain Computer Interface Molecular Imaging & Therapy MicroPower Generation Molecular Diagnostics Integration & Implement. Application 1: Industrial Monitoring Systems Application 2: Body Area Networks HUMAN++ Implantable Devices Nano Photonics Photovoltaics (SOLAR + ) Power Electr. Organic Electronics Si based Solar Cells Organic Solar Cells GaN

15 Exciting challenges on the horizon Increased functionality through scaling: approaching physical, technological and financial limits: the pendulum of Moore s clock will slow down, innovative solutions needed! Technology in the human sphere: man-machine interactions, enhancement & replacement of senses engineering for the body Converging technologies: Nanotechnology, biotechnology, information and cognitive sciences engineering for the mind Entering a transdisciplinary world

16 Needed: Renaissance Engineers, Scientists Converging Technologies require: Wo(men) driven by socio-eco challenges Teamplayers, system architects tech nerds With cross-disciplinary communication skills Trained in creative thinking at system level Co-architects of society Putting a societal vision into a solution With economic value: entrepreneurial spirit Hence need for: Sociology for Future Engineers

17 University of the future Courtesy: H. De Man

18 Merger of techno-cultures Progress will be in the merger of previously unconnected Societal techno-cultures driven by Needs societal needs More Moore Computer Science Ambient Intelligent Systems Nano Technology Scaling Life Sciences More Than Moore

19 Outline Introduction about IMEC Business model PRINS RI

20 Partnering for Cost-effective R&D IC manufacturers & system houses Collaborative PROGRAMS & PROJECTS in an unique R&D infrastructure Equipment, material suppliers World-wide Centralized Research Platform Research Foundry Build critical mass Share R&D costs EU, Regional funding

21 Types of industrial collaboration IMEC with one or two partners Bilateral project on a specific research topic Microelectronics Training Center Annual Research Review Meeting Workshops IMEC with many partners R&D Collaboration Training Industrial Affiliation Program Mature Technologies Exclusive License Technologies Transfers, Licenses Spin-Off

22 IMEC Industrial Affiliation Programs What? R&D cooperation scheme Strategic programs within IMEC and defined by IMEC Industrial partner sends 1 or more residents to IMEC Benefits Sharing of costs, risks, results (IP) and resources Partner gets access to IMEC s background information, other shared results from other participants in the program On a bilateral basis Leverage effects Pricing (cost sharing) Information Cross-fertilization Time-to-market

23 IMEC s IIAP IP Model (for Core Partner) Co-owned (shared) IP (R1) Shared (licensed) IP partner A Exclusive IP (R2) partner B Partner obtains co-ownership (with IMEC) on results to which partner has contributed* (R1); Partner gets a free, non-exclusive, non-transferable license on results generated by IMEC or other partners in the program; IIAP Program background R&D program Results (IP) (Foreground) Partner gets a free, non-exclusive, non-transferable license on IMEC s background, necessary for exploitation of the results of the program; partner E partner D partner C For each partner there is possibility to generate limited proprietary results (R2); (type of results should be agreed upfront) * Contributed result means a result to which there is a clear contribution from the partner s assignee

24 IMEC Partner Update 2009Q nm 22 /16 nm - Core CMOS program focus moving towards 16nm and beyond - Expanded focus on Logic and Memory technology (NVM, DRAM)

25 IMEC Partner Update 2009Q1 Partnerships in core Program IIAP s The World s Largest Industry Commitment to Semiconductor Research in Partnership Lam RESEARCH

26 Shorter term, applications Time frame Longer term, many options Global R&D platforms Providing focus for universities and basic insight and solutions for industrial partners Universities Shared R&D Platforms Industry Lower R&D cost Higher

27 ACTIVE RESEARCH COOPERATIONS IMEC Academic Interactions RESEARCH COOPERATIONS In 2005: 113 active cooperations with universities in Europe and worldwide in IMEC s Advanced CMOS program only LITHOGRAPHY PLANAR EMERALD HKMG INTER CONNECT UCP GE/III-V DEVICES NANOTECHNOLOGY MCA

28 Outline Introduction about IMEC Business model PRINS RI

29 PRINS Project Pan-European Research Infrastructure for Nano-Structures

30 PRINS Pan European Research Infrastructure for Nano-Structures CP-CSA Infra proposal recommended by ESFRI RI on the ESFRI roadmap Preparatory Phase approved within FP7 Duration: 24 months Funded budget: 1 MEuro RI supported by ENIAC/AENEAS Starting date: April 1, 2008

31 PRINS Preparatory actions to enable in the following phase the establishment of a Research Infrastructure with the aim of enabling European innovative research for the micro- and nanoelectronics. The platform will be truly interdisciplinary by allowing the convergence of top-down technology, which is today the main enabler of Moore s law (i.e. transistor scaling), with bottom-up methods derived from fundamental disciplines such as material physics, chemistry, biotechnology and particle electronics. The open access of this RI provided to the Scientific Community and Industry will enable the cross-disciplinary fertilization of academic and industrial competences in the areas of nanoelectronics, nanosystems, nanobiology, nanophotonics, etc

32 PRINS - Partners IMEC (coordinator) CEA-LETI FhG-VmE NXP STMicroelectronics Infineon (IFX) ASM-L EWI (Flemish Government Dept Economy, Science and Innovation

33 Management Structure Project Steering Committee Scientific Advisory Committee Industrial Advisory Committee PA s Advisory Committee Executive Project Committee Project & WP leaders Chairs Adv. Committees Project Mgt. Committee WP management quarterly meetings WP IP ruling Legal aspects WP Governance/ Logistic WP Strategic issues WP Financial aspects

34 Research infrastructure bridge - PRINS Connecting Industry Needs and Research Skills academia industry SME Towards Scientific Knowledge Towards Applications targeting Society Needs

35 Fundamental research Society needs Focused Research Organization Specialized Lab scientific and technical integration Specialized Lab Specialized Lab scientific and technical integration Industrial Integration and development Specialized Lab Specialized Lab scientific and technical integration SMEs SMEs SMEs Modules and Architectures Integration Centers

36 Possible Nanoelectronics Technologies/Applications RIs Coordination Structure IP Ruling RI Steering Committee Hosting/Access Logistics Coordination Office RI Management Board Generic Issues PRINS Platform Flexible Platform Photonics Platform Bio-electronics Platform NN Platform

Outline. Introduction on IMEC & IMEC cooperation model. Program Challenges in CMOS scaling

Outline. Introduction on IMEC & IMEC cooperation model. Program Challenges in CMOS scaling imec 2009 1 The Role of European Research Institutes in the 450mm Wafer Transition Process IMEC nanoelectronics platform A Collaborative approach towards 450mm R&D IMEC March 2009 Outline Introduction