DVD W PDT FMT Green.0 SF MT GLSS PSSVTD BDG TF Product Summary (@T = +25 ) V M (V) () V F (V) (µ),000.0.05 5 Features and Benefits Glass Passivated Die onstruction ompact, Thin Profile Package Design eliable obust onstruction deal for SMT Manufacturing Lead Free Finish; ohs ompliant (otes & 2) Halogen and ntimony Free. Green Device (ote 3) Description and pplications Mechanical Data Suitable for to D bridge full-wave rectification for SMPS, LD lighting, adapters, battery chargers, home appliances, office equipment and telecommunication applications. ase: ase Material: Molded Plastic; L Flammability lassification ating 94V-0 Moisture Sensitivity: Level per J-STD-020 Terminals: Finish Matte Tin nnealed over opper Leadframe; Solderable per ML-STD-202, Method 208 Polarity: s Marked on Body Weight: 0.09 grams (pproximate) Top View Pin Diagram nternal Schematic rdering nformation (ote 4) Part umber ase Packaging -3 3,000/Tape & eel otes:. Directive 2002/95/ (ohs) & 20/65/ (ohs 2) compliant. ll applicable ohs exemptions applied. 2. See http:///quality/lead_free.html for more information about Diodes ncorporated s definitions of Halogen- and ntimony-free, "Green" and Lead-free. 3. Halogen- and ntimony-free "Green products are defined as those which contain <900ppm bromine, <900ppm chlorine (<500ppm total Br + l) and <00ppm antimony compounds. 4. For packaging details, go to our website at http:///products/packages.html. Marking nformation Pin _ + M _ YWW ~ ~ M = Product Type Marking ode = Manufacturers ode Marking YWW = Date ode Marking Y = Last Digit of Year (ex: 6 = 206) WW = Week ode (0 to 53) Document number: DS37032 ev. 3-2 of 5 pril 206
DVD W PDT FMT Maximum atings (@T = +25, unless otherwise specified.) Single phase, half wave, 60Hz, resistive or inductive load. For capacitive load, derate current by 20%. Peak epetitive everse Voltage Working Peak everse Voltage D Blocking Voltage haracteristic Symbol Value nit V M V WM V MS everse Voltage V (MS) 700 V verage ectified utput urrent @ T = +20.0 on-epetitive Peak Forward Surge urrent, 8.3ms Single Half Sine-Wave Superimposed on ated Load,000 FSM 35 V Thermal haracteristics haracteristic Symbol Value nit Typical Thermal esistance, Junction to mbient (ote 5) θj 80 /W Typical Thermal esistance, Junction to ase θj 2 /W Typical Thermal esistance, Junction to Lead θjl 40 /W perating and Storage Temperature ange T J, T STG -55 to +50 lectrical haracteristics (@T = +25, unless otherwise specified.) haracteristic Symbol Min Typ Max nit Test ondition everse Breakdown Voltage (ote 6) V (B),000 V = 5μ Forward Voltage Leakage urrent (ote 6) V F 0.90 0.96.02.05 5 500 V μ F = 0.5 F = V =,000V, T = +25 V =,000V, T = +25 Total apacitance T pf V = 4V, f =.0MHz otes: 5. Device mounted on glass-epoxy substrate with oz 20mm x 20mm u pad per pin. 6. Short duration pulse test used to minimize self-heating effect. Document number: DS37032 ev. 3-2 2 of 5 pril 206
T, TTL PT (pf), STTS VS T ( µ ) FSM, PK FWD SG T () DVD W PDT FMT F, VG FWD T () F, STTS FWD T () ) ( T 0.8 D 0.6 W F 0.4 G V 0.2, F 0 00 ote 5 0 25 50 75 0 25 50 T, S TMPT ( ) Figure Forward urrent Derating urve ) T ( D W F S T 0. T S, F 35 T = 0 T = 25 T = 50 T = 25 T = 75 T = 50 0.0 0.0 0.2 0.4 0.6 0.8.0.2.4.6 V F, STTS FWD VLTG (V) Figure 2 Typical Forward haracteristics 0 T = 50 T = 25 T = 0 T = 75 30 25 20 5 0. T = 50 T = 25 0.0 200 400 600 800 00 V, STTS VS VLTG (V) Figure 3 Typical everse haracteristics 5 Pulse width 8.3ms Single Half Sine-Wave 0 0 MB F YLS T 60 H Z Figure 4 Forward Surge urrent Derating urve 0 f=mhz 0 V D VS VLTG (V), Figure 5 Total apacitance vs. everse Voltage Document number: DS37032 ev. 3-2 3 of 5 pril 206
DVD W PDT FMT Package utline Dimensions Please see http:///package-outlines.html for the latest version. D Seating Plane L b e x y Pin# 5 c 4 7 3 Dim Min Max Typ..30.20 0.00 0.05 0.02 4 0.05 0.08-5 0.03 0.08 0.05 b 0.55 0.70 0.60 c 0.2 0.8 0.5 D 4.40 4.60 4.50 4.90 5. 5.00 5.60 5.80 5.70 3 2.95 3.05 3.00 e 3.45 3.55 3.50 L 0.65 0.75 0.70 x 0.60 0.70 0.65 y 0.60 0.70 0.65 ll Dimensions in mm Suggested Pad Layout Please see http:///package-outlines.html for the latest version. Y Y Value Dimensions (in mm) 3.55 X 0.90 Y.05 Y 6. X Document number: DS37032 ev. 3-2 4 of 5 pril 206
DVD W PDT FMT MPTT T DDS PTD MKS WTY F Y KD, XPSS MPLD, WTH GDS T THS DMT, LDG, BT T LMTD T, TH MPLD WTS F MHTBLTY D FTSS F PTL PPS (D TH QVLTS D TH LWS F Y JSDT). Diodes ncorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes ncorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes ncorporated convey any license under its patent or trademark rights, nor the rights of others. ny ustomer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes ncorporated and all the companies whose products are represented on Diodes ncorporated website, harmless against all damages. Diodes ncorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should ustomers purchase or use Diodes ncorporated products for any unintended or unauthorized application, ustomers shall indemnify and hold Diodes ncorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. Products described herein may be covered by one or more nited States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more nited States, international or foreign trademarks. This document is written in nglish but may be translated into multiple languages for reference. nly the nglish version of this document is the final and determinative format released by Diodes ncorporated. LF SPPT Diodes ncorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the hief xecutive fficer of Diodes ncorporated. s used herein:. Life support devices or systems are devices or systems which:. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. ustomers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes ncorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes ncorporated. Further, ustomers must fully indemnify Diodes ncorporated and its representatives against any damages arising out of the use of Diodes ncorporated products in such safety-critical, life support devices or systems. opyright 206, Diodes ncorporated Document number: DS37032 ev. 3-2 5 of 5 pril 206