SPECIFICATION FOR APPROVAL
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1 Ⅰ. Configuration and dimensions: REV P PAGE 1/8 Marking Inductance code A' C H F A A' C E F G H 3.20 ± ± ± ±0.2 ± Ⅱ. Description: a. Ferrite drum core construction. b. Enamelled copper wire:h class A c. Product weight:0.05 g(ref.) d. Moisture sensitivity Level 3 e. Products comply with RoHS' requirements F K1 E K2 +0 K= K1-K2 =0.25 m/m I G I ( PC Pattern ) Unit:m/m I Ⅲ. General Specification: a. Temp. rise :20 max. b. Ambient temp.: max. c. Storage temp.: d. Operating temp.: (Temp. rise included) e. Terminal pull strength:1.5 kg min. f. Rated current:current cause inductance drop within 10% g. Resistance to solder heat: secs. h. Resistance to solvent:per MIL-STD-202F Temperature ( ) Reflow profile Peak Temp:250 max. Max time above 245 :20~40sec max. Max time above 217 :60~150sec max. 200 ~250 Average Ramp-up Rate:3 /second max. Temperature Rising Area Preheat Area Reflow Area Forced Cooling Area 150 ~ 200 / 60 ~ 180sec 20~40sec 60~150sec 6 / second max. Peak Temperature: Time ( seconds )
2 REF : PAGE: 2/8 Ⅴ. ELECTRICAL CHARACTERISTICS: DWG No. Inductance ( μh ) Q Test Freq SRF RDC IDC min. ( MHz ) ( MHz ) ( Ω ) ( ma ) min. max. max WL R12M 0.120±20% WL R15M 0.150±20% WL R18M 0.180±20% WL R22M 0.220±20% WL R27M 0.270±20% WL R33M 0.330±20% WL R39M 0.390±20% WL R47M 0.470±20% WL R56M 0.560±20% WL R68M 0.680±20% WL R82M 0.820±20% WL R0K 0±10% WL R2K 1.200±10% WL R5K 1.500±10% WL R8K 1.800±10% WL R2K 2.200±10% WL R7K 2.700±10% WL R3K 3.300±10% WL R9K 3.900±10% WL R7K 4.700±10% WL R6K 5.600±10% WL R8K 6.800±10% WL R2K 8.200±10% WL K ±10% WL K ±10% WL K ±10% WL K ±10% WL K ±10% WL K ±10% WL K ±10% WL K ±10% WL K ±10% WL K ±10% WL K ±10% WL K ±10% WL K.000±10% WL K ±10% WL K ±10% WOUND CHIP INDUCTOR 1). : Packaging information... A : ulk 2)."- ":Reference code CUSTOMER : CUST P/N NO.: : Taping Reel
3 Ⅴ. Curve: WL R12M REV P PAGE 3/ WL R12M WL R12M Q T( ) IDC(A) Freq(kHz) WL R0K 70.0 WL R0K T@25.00 WL R0K Q T( ) IDC(A) Freq(kHz) WL K WL K T@ WL K T( ) Q IDC(A) Freq(kHz) 0 00 WL K WL K T@ WL K Q T( ) IDC(A) Freq(kHz)
4 REV P PAGE 4/8 Ⅵ-1. Packaging information: ( 1 ) Configuration T Cover Tape 2.0±0.5 A N D G Embossed Carrier Carrier Tape Width : D End P:4 m/m 4 m/m Start Leader Trailer 200 m/m min. Components 450 m/m min. User direction of feed ( 2 ) Dimensions Unit:m/m Style A C D G N T ± (S) ± ( 3 ) Q'TY & G.W. Per package Code Inner : Reel G.W. (gw) Style Outer : Carton G.W. (Kg) Size (cm) C 1,000 2, (S) ,000, x 39 x x 39 x 22 E 1, , x 39 x 22
5 REV P PAGE 5/8 Ⅵ-2. Packaging information: ( 1 ) Configuration T Cover Tape 2.0±0.5 A N D G Embossed Carrier Carrier Tape Width : D End P:4 m/m 4 m/m Start Leader Trailer 200 m/m min. Components 400 m/m min. User direction of feed ( 2 ) Dimensions Unit:m/m Style A C D G N T ±0.8 13± ( 3 ) Q'TY & G.W. Per package Code Inner : Reel G.W. (gw) Style Outer : Carton G.W. (Kg) Size (cm) D 7, , x 39 x 22
6 REV P PAGE 6/8 Ⅵ-3. Packaging information: ( 1 ) Configuration T Cover Tape 2.0±0.5 A N D G Embossed Carrier Carrier Tape Width : D End P:4 m/m 4 m/m Start Leader Trailer 200 m/m min. Components 160 m/m max. User direction of feed ( 2 ) Dimensions Unit:m/m Style A C D G N T ± ( 3 ) Q'TY & G.W. Per package Code Inner : Reel G.W. (gw) Style Outer : Carton G.W. (Kg) Size (cm) F 2, , x 39 x 22 G 2, , x 39 x 22
7 REV P PAGE 7/8 Ⅶ. Reliability test: Item Reference documents Test Condition Test Specification 1.High Temperature Exposure MIL-STD-202 Method Temperature Cycling JESD22-A iased Humidity Test MIL-STD-202 Method Operational Life JESD22-A External Visual 6.Physical Dimensions 7.Resistance to solvents JESD & MIL-STD-883 Method 2009 JESD22- MIL-STD-202 Method Vibration Test MIL-STD-202 Method Resistance To MIL-STD-202 Method 210 Soldering Heat Test & J-STD020D.1 10.Saturation Current 11.Over load 12.Temperature Rise Current 13.Solderability Test 14.Electrical Characteriazation JIS C 6436 & User SPEC. JIS C 6436 & User SPEC. JIS C 6436 & User SPEC. J-STD-002 & JESD MIL-STD-202 Method 304 & User SPEC. 1.Temperature: 125±2 2.Time:96±2 hours. 1.Temperature: -40 ~ Number of cycle: cycle 3.Dwell time:30 minutes Inspect product constructions, marking and workmanship. Verify physical dimensions to the applicable product detail specification. Immerse into solvent for 3±0.5 minutes & brush 10 times for 3 cycles. 1.Frequency and Amplitued : Hz, 1.5 mm. 2.Direction:X, Y, Z 3.Test duration:2 hours for each direction, 6 hours in total. 1.Highest temperature: 250±5. 2.Time(temp. 217 ):60~150 Second. 3.IR reflow times:3 times. 1.Applied rated current for 5 second. 2.Rated current 1.Applied one and half rated current for a period of 5 minutes. 2.Rated current 1.Applied rated current for 10 minutes. 2.Temperature measure by digital surface thermometer. 3.Irms current 1.aking in pre-testing: 150±5 / 16Hours±30 min. 2.Peak temperature:240±5 3.Time(temp. 217 ):60~150 second. 4.IR reflow times:1 times. 1.Operating temperature:-40 ~125 2.Room temperature:25. 1.No pollution on the surface of products. 2.Clear marking. 3.No crack. Per product specification standard 1.No body change in apperarance. 2.No marking blurred. 3.Inductance shall not change Inductance shall not drop more than 10% max. No electrical or mechanical damage Surface temperature rise is less than 20 max. More than 95% soldering coverage min on terminations. 15.Withstanding MIL-STD-202 Method DC: 500 V (Terminal to Coating) 1.During the test no breakdown. Voltage Test & User SPEC. 2.Time:1minutes 2.No mechanical or electrical damage. 16.Insulation DC voltage V applied between inductor 1.IR = 0MΩ Min. Resistance MIL-STD-202 Method 302 terminal and coating for 1 minute. 2.No mechanical or electrical damage. 17.Drop 18.Terminal Strength Test 1.Products shall be mounted on SPEC. pcb and dropped down from a heigh of 1m CNS-C6354 & G/T Drop total time:6 time (Every side ofsample drop 2 time) IEC Temperature:85±2 2.Humidity: 85% RH. 3.Time:96±2 Hours 1.Temperature: 125 (Temp. rise included) 2.Time:96±2 hours. 3.Rated current 1.Apply push force to samples mounted on PC. 2.Force of 1.8 kg for 60±1 seconds. 1. Adhesion on PC shall be enough. 2. Product appearance shall not break. 3. No electrical damage. After test, inductors shall be no mechanical damage.
8 REV P PAGE 8/8 Ⅸ. Change history: DATE/REV. DISCRIPTION DRAWN CHECKED APPROVED A~G NA H Remove inductance R I Change the cover tape:heat seal/adhesive UCT J Change the cover tape:uct Adhesive K 1. Change the resistance to solder heat: secs. 2. Add Electrical specifications at L Modify the specification form and add the current curve and 3D picture M Correct the package code F: Trailer direction from 160 m/m min. 160 m/m max N O P Add package code G Modify the Reliability test Add Change history and Drawing number expression: Miz Hsieh Miz Hsieh Nick Chen Nick Chen Nick Chen Nick Chen
SPECIFICATION FOR APPROVAL PAGE: 1
PAGE: 1 CONFIGURATION & DIMENSIONS A A : 2.5±0.2 B : 2.0±0.1 C : 1.8±0.1 B E : 1.4±0.1 Not Marking F : 0.40 C 0. 1.5 0.9 1.5 0.9 F F E PCB Pattern SCHEMATIC DIAGRAM d MATERIALS a Core Ferrite DR core b
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