ITEM : CHIP POWER INDUCTORS APPROVAL SHEET CHIP POWER INDUCTORS CUSTOMER : DATE :

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1 ESTABLISHMENT APPROVED REVISION Series NO:IP APPROVAL SHEET CHIP POWER INDUCTORS CUSTOMER : DATE : You can reapprove only the changed quality request recorded in spec sheet. And, We can decide other changed parts

2 Features 1. The multi-layered Power Inductors provide high reliability for your products. 2. Magnetic shielded structure 3. Condensed SMT available. 4. Lead free. 5. Minimized design that is suitable for portable electronic equipments requiring low profile. Applications 1. DC-DC converter for mobile phone 2. MP3 Player 3. Digital still cameras / DVR 4. LCD Driver Module 5. Portable digital equipment Ordering Information IP L 2520 B M 472 T (1) (2) (3) (4) (5) (6) (7) (1) Products Series IP : Inductor for Power Line (2) Materials & Design H : For High current L,UL: For low resistance (3) Dimension First two digits : length ( mm ) Last two digits : width ( mm ) (4) Thickness Blank : other normal size(unmarking) B: T size Max 0.6 mm (5) Tolerance M : ± 20% N : ± 30% (6) Inductance First two digits are inductance values. Last digit is the number of zeros. (7) Packaging B : Bulk Packing T : Tape & Reel (Φ 178mm [ 7inches]) L : Tape & Reel (Φ 254mm [10inches]) Shape and Dimensions (Unit : mm[inch]) Type L W T C T C L W IPH 3225 IPH 2520 IPUL 2520 IPL 2520B IPL ± ± ± ± ± ± ± ± ±0.20 ± ± ± ± ± ± ± ±0.20 ± Max 0.5± ± ± Max.020± ±0.20 ± Max 0.5± ± ± Max.020±.008 ± ± Max 0.5± ± ± Max.020±.008

3 Specifications IPH series (For High Current) IPH3225 Part Number Inductance at 1MHz(µH) Q-factor at 1MHz DC Resistance (mω) Current (ma) * 1) Typ. Tolerance Typ ±20% ΔL/Lo=30% IPH3225M IPH3225M IPH3225M ± 20% IPH3225M IPH3225M IPH2520 Part Number Inductance at 1MHz(µH) Q-factor at 1MHz DC Resistance (mω) Current (ma) * 1) Typ. Tolerance Typ ±20% ΔL/Lo =30% IPH2520M IPH2520M IPH2520M ± 20% IPH2520M IPH2520M IPH2520M * 1) The maximum DC current having inductance decrease within ΔL=30% and temperature to rise becomes ΔT=40, whichever is lower. (Reference ambient temperature 20 ) Test Equipment & Fixture L, Q : HP4285A LCR Meter Rdc : TWA-161A, B L Test Frequency : 1MHz

4 Specifications IPL series (For Low DC Resistance) IPUL2520 Part Number Inductance at 1MHz(µH) DC Resistance (mω) Typ. Tolerance ±30% Current (ma) * 1) ΔT/To :40 IPUL2520N IPUL2520N IPUL2520N ± 30% IPUL2520N IPUL2520N IPL2520B low profile Part Number Inductance at 1MHz(µH) DC Resistance (mω) Typ. Tolerance ±30% Current (ma) * 1) ΔT/To :40 IPL2520BN IPL2520BN ± 30% IPL2520BN IPL2520BN Low Profile type ; T size Max 0.6 mm IPL2016 Inductance at 1MHz(µH) DC Resistance (mω) Current (ma) * Part Number 1) Typ. Tolerance ±30% ΔT/To :40 IPL2016N IPL2016N ± 30% IPL2016N IPL2016N ) In case temperature rise to 40 due to self-heating Test Equipment & Fixture L, Q : HP4285A LCR Meter Rdc : TWA-161A, B L Test Frequency : 1MHz

5 Electrical Characteristics IPH series (For High Current) IPH Inductance vs Frequency 1uH 50 1uH Q-factor vs Frequency 1 1uH Inductance vs Bias(ΔL) 40 1 Inductance(uH) 2 1 Q-value Inductance(uH) 10 Frequncy(Hz) 0 Frequncy(Hz) Bias(mA) IPH2520 Inductance vs Frequency Q-factor vs Frequency) Inductance vs Bias(ΔL) uH 50 1uH 1 1uH Inductance (uh) uH Frequency [Hz] Q-Value uH 0 Frequency(Hz) Inductance(uH) 1.0uH Bias(mA)

6 Inductance(uH)ITEM : CHIP POWER INDUCTORS Electrical Characteristics IPL series (For Low DC Resistance) IPUL2520 Inductance vs Frequency Inductance vs Bias(ΔL) 80 Temperature vs Bias(ΔT) (uh) Inductance 1.5uH Inductance(uH) 1.5uH Temperature( ) uH Frequency [Hz] Bias (ma) Bias (ma) IPL2520B low profile Inductance vs Frequency 6 Inductance vs Bias(ΔL) 80 Temperature vs Bias(ΔT) 5 Inductance (uh) Inductance (uh) Temperature( ) Frequency [Hz] Bias (ma) Bias (ma) Low Profile type ; T size Max 0.6 mm IPL2016 Inductance vs vs Frequency 1 Inductance vs Bias(ΔL) 80 Temperature vs vs Bias(ΔT) Inductance (uh) Temperature( ) Frequency [Hz] Bias(mA) Bias (ma)

7 Reliability and Test Conditions ITEM Operating temp. range Storage temp. & humidity range Resistance to solder heat Solderability Reflow soldering REQUIREMENTS B T TEST CONDITION -40 ~ max., 70% RH max. at packing condition 1.No damage such as cracks should be caused in chip element. 2.More than 75% of the terminal electrode shall be covered with new solder. 3. Inductance change 1 A type : ±within 20% 2 X type : ±within 30% 1.More than 90% of the terminal electrode shall be covered with new solder. 2. Inductance change 1 A type : ±within 20% 2 X type : ±within 30% 1. More than 50% of the terminal electrode shall be covered with new solder. S S T * 0.5 Preheat temperature : 100 to 150 Preheat time : 1min Solder temperature : 260 ±10 Dipping time : 10 ±0.5sec. Preheat temperature : 100 to 150 Preheat time : 1min Solder temperature : 230 ±10 Dipping time : 3 ±1sec. Preheat temperature : 150 Preheat time : 1min Solder temperature : 250 Soldering time : 10 sec. max. (Reflow soldering profile) Tensile strength (Terminal strength) W Unit : Kgf(W) W(kgf) min W Adhesion of Terminal electrode (Flexure strength) c Land Unit : mm (a,b,c), Kgf(W) a b c W Body strength 1.The body shall not be damaged by forces applied on the right. (Bending strength) a b a 1.0mm W R 0.5 W R 0.5 Unit : mm (d), Kgf(W) d 1.3 W T d

8 Reliability and Test Conditions ITEM REQUIREMENTS TEST CONDITION Drop Vibration Thermal shock (Temperature cycle) Low temp. resistance Humidity resistance 2. Inductance change 1 A type : ±within 20% 2 X type : ±within 30% 2. Inductance change 1 A type : ±within 20% 2 X type : ±within 30% 2. Inductance change 1 A type : ±within 20% 2 X type : ±within 30% Drop 10 times on a concrete floor from a height of 91cm Frequency : 10~55~10Hz Amplitude : 1.52mm Direction and time : X,Y,Z directions for 2 hours Step1. 40 ±3 30 ±3min. Step2. 85 ±3 30 ±3min. Number of cycle : 100 times Measured at room ambient temperature after placing for 24 hours Temperature : -40 ±5 Time : 1,000 hours Measured at room ambient temperature after placing for 24 hours Temperature : 40 ±2 Humidity : 90~95% RH Time : 500 hours Measured at room ambient temperature after placing for 24 hours

9 Land Pattern Design. (Unit : mm) Size a b c c a b a Packaging F 1. Label 1) Part name. 2) Lot No. 3) Quantity. 2. Standard quantity for packaging PCS Packing Type(EIA) Tape & reel Bulk Reel Inner box Carton box Vinyl or Cassette ,000 30, , ,000 30, , ,000 30, ,000 * Packaging method can be changed, based on user`s request. TAPE DIMENSION/ Embossing 8mm unit : mm SPROCKET HOLE Φ , - 0 CHIP CAVITY 1.75± ±5 (Unit : mm) Type A ± 0.1 B ± 0.1 P ± 0.1 K0 ± 0.1 T (max.) A ± B B P ±0.1 ±5 T Ko LEADER AND BLANK PORTION Blank Chips Blank Leader 10 to 20 pitches 20 to 40 pitches 210mm to 250 mm Drawing direction The pitch holes shift within ±0.3mm for cumulative 10 pitches

10 REEL DIMENSION ±0.8 Φ13.0±0.5 unit : mm Type W ( mm ) 2016 R1.0 Φ21.0±0.8 more than ± 0.3 Φ178± Φ254± W less than 1.5 Packaging F TOP COVER TAPE STRENGTH 165 to 180 Top cover tape Embossing tape The force for tearing off top cover tape is 20 to 70 grams in the arrow direction

11 Soldering Profile REFLOW SOLDERING PROFILE(Peak 260 ) Soldering 10 sec. max. 60 sec. max sec. min FLOW SOLDERING MANUAL SOLDERING 250 Preheating 100 sec. max. Dipping 10 sec. max. Cooling 60 sec. min. 300 Solder iron 30W Max sec. min. Tc ΔT ΔT 200 /.5sec soldering 2 sec max. Diameter of Solder iron 1.2mm Max Precaution for Product Storage The electrical characteristics of products will not change when stored under typical environmental conditions. However, it is possible that the solderability of the terminal electrodes and the characteristics of the tape packaging can change during storage. For this reasons, the following storage guidelines should be followed. 1. STORAGE ENVIRONMENT The tape packaging materials are designed to withstand long-term storage, but they will degrade more rapidly in the presence of high temperature or high humidity. Therefore, the products must be stored in an ambient temperature of less than 40 with a relative humidity of less than 70%. The products should be used within 6 months. To achieve best solderability, the products should be used as soon as possible after unpacking. Leftover products must be stored in dry conditions with desiccant. 2. CORROSIVE GASES Since sulfur and chlorine may degrade the solderability of the terminal electrodes, it is important to store the products in an environment free of these gases. 3. TEMPERATURE FLUCTUATIONS Since dew condensation may occur due to differences in temperature when the products are taken out of storage, it is important to maintain a temperature-controlled environment.