Notice for TAIYO YUDEN products

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Catherine Lee
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1 Notice for TAIYO YUDEN products Please read this notice before using the TAIYO YUDEN products. REMINDERS Product information in this catalog is as of October 214. All of the contents specified herein are subject to change without notice due to technical improvements, etc. Therefore, please check for the latest information carefully before practical application or usage of the Products. Please note that TAIYO YUDEN CO., LTD. shall not be responsible for any defects in products or equipment incorporating such products, which are caused under the conditions other than those specified in this catalog or individual specification. Please contact TAIYO YUDEN CO., LTD. for further details of product specifications as the individual specification is available. Please conduct validation and verification of products in actual condition of mounting and operating environment before commercial shipment of the equipment. All electronic components or functional modules listed in this catalog are developed, designed and intended for use in general electronics equipment.(for AV, office automation, household, office supply, information service, telecommunications, (such as mobile phone or PC) etc.). Before incorporating the components or devices into any equipment in the field such as transportation,( automotive control, train control, ship control), transportation signal, disaster prevention, medical, public information network (telephone exchange, base station) etc. which may have direct influence to harm or injure a human body, please contact TAIYO YUDEN CO., LTD. for more detail in advance. Do not incorporate the products into any equipment in fields such as aerospace, aviation, nuclear control, submarine system, military, etc. where higher safety and reliability are especially required. In addition, even electronic components or functional modules that are used for the general electronic equipment, if the equipment or the electric circuit require high safety or reliability function or performances, a sufficient reliability evaluation check for safety shall be performed before commercial shipment and moreover, due consideration to install a protective circuit is strongly recommended at customer's design stage. The contents of this catalog are applicable to the products which are purchased from our sales offices or distributors (so called TAIYO YUDEN s official sales channel ). It is only applicable to the products purchased from any of TAIYO YUDEN s official sales channel. Please note that TAIYO YUDEN CO., LTD. shall have no responsibility for any controversies or disputes that may occur in connection with a third party's intellectual property rights and other related rights arising from your usage of products in this catalog. TAIYO YUDEN CO., LTD. grants no license for such rights. Caution for export Certain items in this catalog may require specific procedures for export according to Foreign Exchange and Foreign Trade Control Law of Japan, U.S. Export Administration Regulations, and other applicable regulations. Should you have any question or inquiry on this matter, please contact our sales staff.

2 MULTILAYER CERAMIC DEVICES / DIPLEXERS / BALUNS ORDERING CODE REFLOW F I B T ❶ ❷ ❸ ❹ ❺ ❻ ❼ ❶Device code High Frequency FI Devices ❷Electrode code With Plating Blank space ❸Dimensions code mm EXTERNAL DIMENSIONS/STANDARD QUANTITY B L C P T D ❹Special Code Band Pass Type Low Pass Type Balance Type Diplexer Balun Dual Type ❺Frequency MHz example ❻Spec Code 1 Individual Spec ❼Packaging T Tape & Reel FI 325P Type.45max. 1.max FI 212B Type FI 212B19223 FI 212L Type FI 212C24533/FI 212C FI 168B/L Type FI 212C Type FI 212C249566/FI 212C35568 HIGH FREQUENCY PRODUCTS FI 212C24575 FI 212P Type FI 168T Type FI 168D Type max max FI 168P Type FI 15B/L Type Max Max FI 325P Type FI 212C245XX FI 212C FI212P8928/ FI 212P89213/ FI 168P2451/ FI 168T Type FI 212C35568 FI212P85912 FI 212P8599 FI 168P24523 FI 168D8718 FI 168P GND Balanced Balanced GND GND Unbalance GND High Band IN GND 2 Common GND GND Common Port Common Port GND Low Band GND High Band 3 GND Balanced Balanced GND GND Balanced Common Low Band IN Common 4 High Band GND GND High Band Low Band Balanced High Band Low Band OUT Low Band 5 GND Unbalance Unbalance GND GND GND GND 6 Low Band DC NC or DC Low Band High Band NC High Band OUT 7 NC NC 8 GND GND Type Standard Quantity pcs 325P 2 212B 212L 3 212C 6 212P 168B 168L 168T 168D 168P 15B 15L

3 PART NUMBERS Multi-layer Device band pass Type Applications External dimensions Ordering code Notes max. FI 212B24526/FI 212B GHz W-LAN Bluetooth max. FI 168B max. FI 15B24524 WiMAX max. FI 168B2565 PHS max. FI 212B19223 Multi-layer Device low pass Type Applications External dimensions Ordering code Notes Digital TV max. FI 168L625 Thickness.45 mm max. WiMAX max. FI 168L22G9 Thickness.45 mm max max. FI 168L Thickness.45 mm max. 2.4GHz W-LAN Bluetooth max. FI 15L8738 Thickness.4 mm max max. FI 15L2514 Thickness.4 mm max. Other max. FI 168D8718 Dual band LPF Multi-layer Device balance Type Applications External dimensions Ordering code Notes max. FI 212C24532 Conjugated match to CSR BC max. FI 212C24533 Conjugated match to CSR BC3 Bluetooth max. FI 212C24536 Conjugated match to CSR BC max. FI 212C24575 Conjugated match to CSR BC5FM, BC6ROM max. FI 212C Thickness.5 mm max. WiMAX max. FI 212C35568 Thickness.5 mm max. HIGH FREQUENCY PRODUCTS Multi-layer diplexer Applications External dimensions Ordering code Notes W-LAN max. FI 168P FI 168P2451 FI 168P24514 FI 168P24523 Cellular max. FI 212P82931 FI 212P829G2 FI 212P82934 FI 212P82935 FI 212P8928 FI 212P89213 FI 212P8599 FI 212P85912 GPS/ 2.4GHz W-LAN max. FI 168P ELECTRICAL CHARACTERISTICS TYPICAL CHARACTERISTICS FI 212B24526 Pass band frequency MHz at 2.6 db max. 25 deg-c 2.9 db max deg-c Ripple at 1. db max. at 4 db min MHz 3 db min MHz 25 db min MHz 3 db min MHz 3 db min MHz FI 212B24527 Pass band frequency 24-25MHz at Ripple 1. db max. FI 168B2451 Pass band frequency 24 25MHz at Ripple 1. db max. 2.1 max. 1.4 db max. 25 deg-c 1.7 db max deg-c 3 db min MHz 3 db min MHz 6 db min MHz 2 db min MHz 2.2 db 25deg-C 2.5 db 3 85deg-C 25 db min MHz 25 db min MHz 2 db min. 48 5MHz 2 db min MHz 5 ohm Multi-layer Balun Applications External dimensions Ordering code Notes BS max. FI 168T15521 Thickness.5 mm max. FI 15B24524 Pass band frequency 24-25MHz at Ripple 1. db max. 2.2 max. 3. db max. 25 deg-c 3.3 db max deg-c 25 db min MHz 22 db min MHz 2 db min MHz 2 db min MHz FI 168B2565 Pass band frequency MHz at 2.4 db max. 25 deg-c MHz 2.6 db max deg-c at 2.3 db max. 25 deg-c MHz 2.5 db max deg-c Ripple at 1.4 db max MHz Ripple at 1.3 db max MHz at 2.4 max MHz at 1.3 max MHz 15 db min MHz 1 db min MHz FI 212B19223 Pass band frequency MHz Insertion Loss at 1.7 db max. 25deg-C MHz 2. db max. 3-85deg-C Insertion Loss at 1.7 db max. 25deg-C MHz 2. db max. 3-85deg-C Ripple at Pass band 1. db max. at Pass band 3 db min. 142MHz 18 db min MHz 13

4 ELECTRICAL CHARACTERISTICS TYPICAL CHARACTERISTICS FI 168L625 Pass band frequency MHz at 1.2 db max. 25 deg-c 47-6MHz 1.3 db max deg-c at 2.2 db max. 25 deg-c 6-71MHz 2.4 db max deg-c at 4. db max. 25 deg-c 71-77MHz 4.4 db max deg-c Ripple at MHz 1.4 db max MHz 2.5 max MHz 25 db min MHz 25 deg-c 21 db min MHz 3 85 deg-c 25 db min MHz 27 db min MHz 26 db min MHz 26 db min MHz FI 168L22G MHz Pass band frequency MHz MHz at.5 db max. 25 deg-c MHz.55 db max deg-c at.65 db max. 25 deg-c MHz.75 db max deg-c at.9 db max. 25 deg-c 25-27MHz 1. db max deg-c Return loss.at 1 db min MHz 25 db min. 34 MHz 22 db min MHz 2 db min MHz FI 168L Pass band frequency MHz MHz at.5 db max. 25 deg-c 47-77MHz.6 db max deg-c at.5 db max. 25 deg-c 23-27MHz.6 db max deg-c Ripple at MHz.3 db max. Ripple at MHz.3 db max. at 47 77MHz at 23 27MHz 2 db min MHz 2 db min MHz FI 15L8738 Pass band frequency MHz at.75 db max deg-c MHz at 1.5 max MHz 23 db min MHz 23 db min MHz FI 168D8718 Pass band frequency MHz -1 at MHz.6 db max. 3 to +85 Deg.C -3 at MHz 1.5 max. S11-4 S21 25 db min MHz db min MHz Pass band frequency MHz -1 at MHz.6 db max. 3 to +85 Deg.C -3 at MHz 1.5 max. S11-4 S21 25 db min MHz 25 db min MHz Isolation In to In/Out to Out 27 db min MHz 3 db min MHz In to Out 3 db min MHz 3 db min MHz FI 212C24532 Pass band frequency 24-25MHz at Ripple 3.7 db 25deg-C 4. db 3 85deg-C 1. db max. Unbalanced port Balanced port Amplitude Imbalance 2. db max. Phase Imbalance 18 / 1 deg 35 db min MHz 2 db min MHz 2 db min MHz 2 db min. 48-5MHz Unbalanced Port 5 ohm Balanced Port Conjugated match to CSR BC4 FI 212C24533 Pass band frequency 24-25MHz at pass band 2.7 db 25deg-C 3. db 3 85deg-C Ripple 1. db max. Unbalanced port Balanced port Amplitude Imbalance 2. db max. Phase Imbalance 18 / 1 deg 25 db min MHz 15 db min MHz 15 db min MHz 15 db min. 48-5MHz Unbalanced Port Balanced Port Conjugated match to CSR BC3 HIGH FREQUENCY PRODUCTS FI 15L2514 Pass band frequency 24-25MHz at.45 db max. 25 deg-c MHz.55 db max deg-c at 1.7 max MHz 21 db min MHz 21 db min MHz 131

5 ELECTRICAL CHARACTERISTICS TYPICAL CHARACTERISTICS FI 212C24536 Pass band frequency 24-25MHz at Ripple 3.7 db 25deg-C 4. db 3 85deg-C 1. db max. Unbalanced port Balanced port Amplitude Imbalance 2. db max. Phase Imbalance 18 / 1 deg 35 db min MHz 2 db min MHz 15 db min MHz 2 db min. 48-5MHz Unbalanced Port Balanced Port Conjugated match to CSR BC FI 212C35568 Pass band frequency 33-38MHz at Ripple at pass band 2.5 db 25 deg-c 2.8 db deg-c 1. db max. Unbalanced port 2.3 max. Balanced port 2.3 max. Amplitude imbalance at pass 2. db max. band Phase imbalance 18 / 12 deg 4 db min MHz 4 db min MHz 35 db min MHz 15 db min MHz 5:1 HIGH FREQUENCY PRODUCTS FI 212C24575 Pass band frequency 24-25MHz at Ripple Unbalanced port Balanced port Amplitude Imbalance Phase Imbalance Unbalanced Port Balanced Port 3.7 db 25deg-C 4. db 3 85deg-C 1. db max. 2.2 max. 2.2 max. 2. db max. 18 / 1 deg 4 db min MHz 18 db min MHz 12 db min MHz 3 db min. 48-5MHz 5 ohm Conjugated match to CSR BC5FM.BC6ROM FI 212C Pass band frequency MHz 2.9 db max. 25 deg-c at MHz 3.2 db max deg-c Ripple at MHz 1.2 db max. Unbalanced port 2.3 max. at MHz Balanced port 2.3 max. at MHz Amplitude Imbalance 2. db max. at MHz Phase Imbalance 18 / 12 deg at MHz 2.3 db max. 25 deg-c at MHz 2.6 db max deg-c Ripple at MHz 1. db max. Unbalanced port 2.3 max. at MHz Balanced port 2.3 max. at MHz Amplitude Imbalance 2. db max. at MHz Phase Imbalance 18 / 12 deg at MHz 4 db Min MHz 15 db Min MHz 2 db Min MHz 5 : FI 168P Pass band frequency MHz Pass band frequency MHz Pass band frequency MHz at MHz at MHz at MHz.5 db max. 25 deg-c.6 db max deg-c.4 db max. 25 deg-c.5 db max deg-c.45 db max. 25 deg-c.55 db max deg-c at MHz at MHz at MHz 13 db min MHz Pass band frequency MHz.6 db max. 25 deg-c at MHz.7 db max deg-c at MHz 12 db min MHz 23 db min MHz 12 db min MHz FI 168P2451 Pass band frequency 24-25MHz at 24-25MHz.4 db max. 25 deg-c.5 db max deg-c at MHz 2 db min MHz 15 db min MHz Pass band frequency MHz.6 db max. 25 deg-c at MHz.7 db max deg-c at MHz 2 db min MHz 132

6 ELECTRICAL CHARACTERISTICS TYPICAL CHARACTERISTICS FI 168P24514 FI 212P829G Pass band frequency 24-25MHz at 24-25MHz.4 db max. 25 deg-c.5 db max deg-c at MHz 2 db min MHz 15 db min MHz Pass band frequency MHz at MHz.6 db max. 25 deg-c.7 db max deg-c at MHz 2 db min MHz FI 168P Pass band frequency 24-25MHz FI 212P db max. 25 deg-c at 24-25MHz.7 db max deg-c at MHz Pass band frequency Pass band frequency MHz Pass band frequency MHz at MHz at MHz 2 db min. 48-6MHz 2 db min MHz 5 ohm MHz.8 db max. 25 deg-c at MHz.95 db max deg-c at MHz 2 db min MHz 2 db min MHz *Referece 5 ohm.5 db max. 25 Deg.C.6 db max. 4 to 85 Deg.C.7 db max. 25 Deg.C.8 db max. 4 to 85 Deg.C at MHz at MHz 13dB min MHz Pass band frequency MHz Pass band frequency MHz Pass band frequency MHz Pass band frequency MHz.7 db max. 25 Deg.C at MHz.8 db max. 4 to 85 Deg.C.5 db max. 25 Deg.C at MHz.6 db max. 4 to 85 Deg.C.5 db max. 25 Deg.C at MHz.6 db max. 4 to 85 Deg.C.5 db max. 25 Deg.C at MHz.6 db max. 4 to 85 Deg.C at MHz 13dB min MHz Pass band frequency MHz at MHz at MHz Pass band frequency at MHz at MHz FI 212P FI 212P db max. 25 Deg.C.32 db max. 4 to 85 Deg.C 13dB min. ( MHz) 5 ohm MHz.45 db max. 25 Deg.C.55 db max. 4 to 85 Deg.C 19dB min MHz 5 ohm Pass band frequency MHz.5 db max. 4 to 85 Deg.C at MHz 1.4 max. at MHz 15dB min. ( MHz) 25dB min. ( MHz) 25dB min. ( MHz) 25dB min. ( MHz) 12dB min. ( MHz) Pass band frequency MHz Pass band frequency MHz.5 db max. 4 to 85 Deg.C at MHz.55 db max. 4 to 85 Deg.C at MHz 1.4 max. at MHz 1.8 max. at MHz 17dB min..3-96mhz Pass band frequency MHz.5 db max. 4 to 85 Deg.C at MHz 1.4 max. at MHz 15dB min. ( MHz) 25dB min. ( MHz) 25dB min. ( MHz) 25dB min. ( MHz) 12dB min. ( MHz) Pass band frequency MHz Pass band frequency MHz.5 db max. 4 to 85 Deg.C at MHz.55 db max. 4 to 85 Deg.C at MHz 1.4 max. at MHz 1.8 max. at MHz 17dB min..3-96mhz HIGH FREQUENCY PRODUCTS 133

7 ELECTRICAL CHARACTERISTICS TYPICAL CHARACTERISTICS HIGH FREQUENCY PRODUCTS FI 212P8928 Pass band frequency MHz at MHz at MHz Pass band frequency at MHz at MHz FI 212P89213 FI 212P8599 Pass band frequency MHz at MHz at MHz.7 db max. +25 deg-.c.75 db max deg-.c 19dB min MHz 2dB min MHz 19dB min MHz 5 ohm Pass band frequency MHz Pass band frequency MHz Pass band frequency MHz at MHz at MHz at MHz at MHz at MHz at MHz.27 db max. 25 Deg.C.32 db max. 4 to 85 Deg.C 13dB min. ( MHz) 5 ohm MHz.45 db max. +25 Deg.C.55 db max. 4 to 85 Deg.C 19dB min MHz 5 ohm Pass band frequency MHz at MHz at MHz Pass band frequency at MHz at MHz.27 db max. 25 Deg.C.32 db max. 4 to 85 Deg.C 13dB min. ( MHz) 5 ohm MHz.45 db max. 25 Deg.C.55 db max. 4 to 85 Deg.C 19dB min MHz 5 ohm.75 db max. +25 deg-.c.85 db max deg-.c.7 db max. +25 deg-.c.8 db max deg-.c.7 db max. +25 deg-.c.8 db max deg-.c 35dB min MHz 42dB min MHz 25dB min MHz 5 ohm FI 212P85912 Pass band frequency MHz.7 db max. +25 deg-.c at MHz.75 db max deg-.c at MHz 19dB min MHz 2dB min MHz 19dB min MHz Pass band frequency MHz Pass band frequency MHz Pass band frequency MHz.75 db max. +25 deg-.c at MHz.85 db max deg-.c.7 db max. +25 deg-.c at MHz.8 db max deg-.c.7 db max. +25 deg-.c at MHz.8 db max deg-.c at MHz at MHz at MHz 35dB min MHz 42dB min MHz 25dB min MHz FI 168P Pass band frequency MHz -1 Pass band frequency MHz -2 Pass band frequency MHz -3-4 at MHz.5 db max. +25 deg-.c.6 db max deg-.c at MHz.4 db max. +25 deg-.c.5 db max deg-.c at MHz.45 db max. +25 deg-.c.55 db max deg-.c at MHz at MHz at MHz 13dB min MHz High Band Pass band frequency MHz at MHz.6 db max. +25 deg-.c.7 db max deg-.c at MHz 12dB min MHz 23dB min MHz 2dB min MHz 134

8 ELECTRICAL CHARACTERISTICS TYPICAL CHARACTERISTICS FI 168T15521 Pass band frequency 9-22MHz at 2. db max. 25 deg-c 2.3 db max deg-c 2.3 max. Phase balance 18 / 2 deg Amplitude Imbalance / 2 db max. 5 : 75 HIGH FREQUENCY PRODUCTS 135

9 MULTILAYER CERAMIC DEVICES (FILTERS / DIPLEXERS / BALUNS) PACKAGING 1Minimum Quantity Type Embossed Tape [pcs] 325P 2 212B 212L 3 212C 212P 168B 168L 168T 4 168D 168P 15B 1 15L 2Tape Material Embossed Tape Top tape Card Board Cattier Tape Top tape Base tape Sprocket hole Sprocket hole Base tape Chip cavity Bottom tape Chip cavity Chip Filled Chip Taped package Type (EIA) Thickness mm (inch) Standard Quantity [pcs] 325P.9 typ.(.35) 2 212B.9 typ.(.35) 212L.45 typ.(.18) 212C.9 typ.(.35) 212P.9 typ.(.35) 3 212C typ.(.18) 212C-.7.6 typ.(.24) 168B.45 typ.(.18) 168L.45 typ.(.18) 168T.45 typ.(.18) 4 168D.45 typ.(.18) 168P.6 typ.(.24) 15B.3 typ.(.118) 15L.3 typ.(.118) 1 chipfilter_pack_e-e2r1

10 3Taping Dimensions Embossed tape.315 inches wide (325P Type, 212B Type, 212C Type, 212C-.7 Type, 212P Type) Unit:mm(inch) Chip cavity Insertion Pitch Tape Thickness max. Type(EIA) A B F K T 2.75± ±.2 4.± P (.18±.8) (.14±.8) (.157±.4) (.53) (.12) 1.55±.2 2.3±.2 4.± B (.61±.8) (.91±.8) (.157±.4) (.63) (.12) 1.55±.2 2.3±.2 4.± C (.61±.8) (.91±.8) (.157±.4) (.63) (.12) 1.55±.2 2.3±.2 4.± C-.7 (.61±.8) (.91±.8) (.157±.4) (.51) (.12) 1.55±.2 2.3±.2 4.± P (.61±.8) (.91±.8) (.157±.4) (.63) (.12) Unit:mm(inch) Paper tape.315 inches wide (212L Type, 212C-.5 Type, 168B Type, 168L Type, 168P Type, 168T Type, 168DType, 15B Type, 15L Type) Type(EIA) 212L 212C B 168L 168T 168D 168P 15B 15L Unit:mm(inch) Chip cavity Insertion Pitch Tape Thickness max. A B F T 1.55±.2 2.3±.2 4.±.1.65 (.61±.8) (.91±.8) (.157±.4) (.26) 1.55±.2 2.3±.2 4.±.1.3 (.61±.8) (.91±.8) (.157±.4) (.12) 1.±.5 1.8±.5 4.±.1.55 (.39±.2) (.71±.2) (.157±.4) (.22) 1.±.5 1.8±.5 4.±.1.55 (.39±.2) (.71±.2) (.157±.4) (.22) 1.±.5 1.8±.5 4.±.1.55 (.39±.2) (.71±.2) (.157±.4) (.22) 1.±.5 1.8±.5 4.±.1.55 (.39±.2) (.71±.2) (.157±.4) (.22).95±.5 1.8±.5 4.±.1.8 (.37±.2) (.71±.2) (.157±.4) (.31).62± ±.3 2.±.5.45 (.24±.1) (.44±.1) (.79±.2) (.18).62± ±.3 2.±.5.45 (.24±.1) (.44±.1) (.79±.2) (.18) Unit:mm(inch) chipfilter_pack_e-e2r1

11 4Leader and Blank Portion 5Reel size E t C R D B A W A B C D E R φ178±2. φ5min. φ13.±.2 φ21.±.8 2.±.5 1. (φ7.1±.79) (φ1.97 min.) (φ.512±.8) (φ.827±.31) (.79±.2) t W 8mm width tape (.315 inches width) 2.5max. (.98max.) 1±1.5 (.394±.59) 12mm width tape (.472 inches width) 2.5max. (.98max.) 14±1.5 (.551±.59) Unit:mm(inch) 6Top Tape Strength The top tape requires a peel-off force of.1~.7n in the direction of the arrow as illustrated below. chipfilter_pack_e-e2r1

12 MULTILAYER CERAMIC DEVICES (FILTERS / DIPLEXERS / BALUNS) RELIABILITY DATA 1. Operating Temperature Range -3~ Storage Temperature Range -3~+85 Note : -2 to +4 in taped packaging 3. Resistance to Flexure of Substrate No mechanical damage. Warp Testing board Thickness : 2mm : Glass epoxy-resin substrate :.8mm 4. Adhesion of Electrode Characteristics Appearance Applied force Duration : shall satisfy the electrical characteristics. : No significant abnormality. : 5N : 1 sec. 5. Solderability 75% or more of immersed surface of terminal electrode shall be covered with fresh solder. Solder temperature : 23±5 Duration : 4±1 sec Preconditioning : Immersion into flux. Immersion and Removal speed : 25mm/sec. 6. Resistance to Solder Heat Characteristics Appearance : shall satisfy the electrical characteristics. : No significant abnormality. Preheating : 15 for 2 min. Solder temperature : 26±5 Duration : 5±.5 sec. Preconditioning : Immersion into flux. Immersion and Removal speed : 25mm/sec. Recovery : 2 to 3hrs of recovery under the standard condition after the removal from test chamber. chipfilter_reli_e-e2r1

13 7. Thermal Shock Characteristics Appearance : shall satisfy the electrical characteristics. : No significant abnormality. According to JIS C 25. Conditions for 1 cycle Step Temperature ( ) Duration (min) 1-4±3 3±3 2 Room Temperature Within ±2 3±3 4 Room Temperature Within 3 Number of cycles : 1 Mounting method : Soldering onto PC board. Recovery : 2 to 3hrs of recovery under the standard condition after the removal from test chamber. 8. Humidity (steady state) Characteristics Appearance Temperature Humidity Duration Recovery : shall satisfy the electrical characteristics. : No significant abnormality. : +4±2 : 9~95%RH : 96hrs : 2 to 3hrs of recovery under the standard condition after the removal from test chamber. 9. High temperature life test Characteristics Appearance Temperature Duration Recovery : shall satisfy the electrical characteristics. : No significant abnormality. : +85±2 : 96hrs : 2 to 3hrs of recovery under the standard condition after the removal from test chamber. 1. Low temperature life test Characteristics Appearance Temperature Duration Recovery Note on standard condition: : shall satisfy the electrical characteristics. : No significant abnormality. : -4±2 : 96hrs : 2 to 3hrs of recovery under the standard condition after the removal from test chamber. "standard condition" referred to herein is defined as follows : 5 to 35 of temperature, 45 to 85% relative humidity and 86 to 16kPa of air pressure. When there are questions concerning measurement result : In order to provide correlation data, the test shall be conducted under condition of 2±2 of temperature, 6 to 7% relative humidity and 86 to 16kPa of air pressure. Unless otherwise specified, all the tests are conducted under the "standard condition". chipfilter_reli_e-e2r1

PCB Design Land pattern design Land pattern dimension

FI212B19223 FI212L Type Unit:mm Unit:mm Unit:mm

FI212C Type Technical considerations Unit:mm Unit:mm

Min. Temperature( ) 1 Slow cooling Temperature( ) 3 2

14 MULTILAYER CERAMIC DEVICES (FILTERS / DIPLEXERS / BALUNS) PRECAUTIONS 1. PCB Design Land pattern design Land pattern dimension examples FI325P Type FI212B Type FI212B24525 FI212B19223 FI212L Type Unit:mm Unit:mm Unit:mm Unit:mm FI168T/D Type FI168B/L Type FI168P Type FI212C Type Technical considerations Unit:mm Unit:mm Unit:mm Unit:mm FI212P Type FI212 P396A4 FI15B/L Type Unit:mm Unit:mm Unit:mm 2. Soldering Technical considerations Conditions for Reflow soldering (for reference) Reflow Profile 3 Preheating 23 Within 1sec. 6sec. 6sec 2 Min. Min. Temperature( ) 1 Slow cooling Temperature( ) Preheating15 6sec. Min. Peak 26 Max. Within 1sec. Heating above 23 4sec. Max. Slow cooling Components should be preheated to within 1 to 13 from soldering temperature. Assured to be reflow soldering for 2 times. Note : The above profiles are the maximum allowable soldering condition, therefore these profiles are not always recommended. chipfilter_prec_e-e2r1

15 3. Storage conditions Precautions Technical considerations Storage 1. To maintain the solderability of terminal electrodes and to keep the packaging material in good condition, care must be taken to control temperature and humidity in the storage area. Humidity should especially be kept as low as possible. Recommended conditions Ambient temperature : -2~+4 Humidity : Below 7%RH The ambient temperature must be kept below 3. Even under ideal storage conditions, the solderbility of electrodes decreases gradually, so filters should be mounted within 6 months from the time of delivery. The packaging material should be kept where no chlorine or sulfur exists in the air. Storage 1. If the parts are stocked in a high temperature and humidity environment, problems such as reduced solderability caused by oxidation of terminal electrodes and deterioration of taping/ packaging materials may take place. For this reason, components should be used within 6 months from the time of delivery. If exceeding the above period, please check the solderability before using the filter. Please contact of our offices for further details of specifications. All of the standard values listed here are subject to change without notice. Therefore, please check the specifications carefully before use. chipfilter_prec_e-e2r1

Notice for TAIYO YUDEN products

Notice for TAIYO YUDEN products Please read this notice before using the TAIYO YUDEN products. REMINDERS Product information in this catalog is as of October 2012. All of the contents specified herein