SD3933. RF power transistors HF/VHF/UHF N-channel MOSFETs. Features. Description

Transcription

1 RF power transistors HF/VHF/UHF N-channel MOSFETs Features Gold metallization Excellent thermal stability Common source configuration P OUT = 35 W min. with 29 db 3 MHz In compliance with the 22/95/EEC European directive Description The SD3933 is a gold metallized N-channel MOS field-effect RF power transistor. It is intended for use in 1 V DC large signal applications up to 2 MHz. Figure 1. M177 Epoxy sealed Pin connection Drain 2. Source 3. Gate 4. Source 5. Source Table 1. Device summary Order code Marking Package Packaging SD3933 SD3933 M177 Plastic tray October 28 Rev 6 1/

2 Contents SD3933 Contents 1 Electrical data Maximum ratings Thermal data Electrical characteristics Static Dynamic Impedance data Typical performance Test circuit Circuit layout VGS/GFS sorts Package mechanical data Revision history /17

3 Electrical data 1 Electrical data 1.1 Maximum ratings Table 2. Absolute maximum ratings (T CASE = 25 C) Symbol Parameter Value Unit V (1) (BR)DSS Drain source voltage 25 V V DGR Drain-gate voltage (R GS = 1 MΩ) 25 V V GS Gate-source voltage ±2 V I D Drain current 2 A P DISS Power dissipation 648 W T J Max. operating junction temperature 2 C T STG Storage temperature -65 to +15 C 1. T J = 15 C 1.2 Thermal data Table 3. Thermal data Symbol Parameter Value Unit R thjc Junction - case thermal resistance.27 C/W 3/17

4 Electrical characteristics SD Electrical characteristics T CASE = +25 o C 2.1 Static Table 4. Static Symbol Test conditions Min Typ Max Unit V (1) (BR)DSS V GS = V I DS = 1 ma 25 V I DSS V GS = V V DS = 1 V 2 ma I GSS V GS = 2 V V DS = V 5 na V GS(Q) V DS = 1 V I D = 25 ma V V DS(ON) V GS = 1 V I D = 1 A V G FS V DS = 1 V I D = 5 A 5 8 S C ISS V GS = V V DS = 1 V f = 1 MHz 1 pf C OSS V GS = V V DS = 1 V f = 1 MHz 265 pf C RSS V GS = V V DS = 1 V f = 1 MHz 13 pf 1. T J = +15 C 2.2 Dynamic Table 5. Dynamic Symbol Test conditions Min Typ Max Unit P OUT V DD = 1 V I DQ = 25 ma f = 3 MHz 35 W G PS V DD = 1 V I DQ = 25 ma P OUT = 35 W f = 3 MHz db h D V DD = 1 V I DQ = 25 ma P OUT = 35 W f = 3 MHz 6 66 % Load mismatch V DD = 1 V I DQ = 25 ma P OUT = 3 W f = 3 MHz All phase angles 3:1 VSWR 4/17

5 Impedance data 3 Impedance data Figure 2. Impedance data D Z DL Typical Input Impedance Typical Drain Load Impedance G Zin S Table 6. Impedance data Freq Z IN (Ω) Z DL (Ω) 3 MHz 2 - j j 7.5 5/17

6 Typical performance SD Typical performance Figure 3. Capacitance vs supply voltage Figure 4. Drain current vs gate source voltage Capacitance (pf) Crss Coss Ciss F = 1 MHz Vdd (V) Ids (A) Tc = +25 C 1 Vds = 1 V Vgs(V) Figure 5. Drain current vs drain source voltage Figure 6. Gate source voltage vs case temperature Ids (A) Vgs (V), Normalized Tc = +25 C Vgs = 1 V Vds (V).6 Idq = 25 ma Tc ( C) 6/17

7 Typical performance Figure 7. Output power vs input power Figure 8. Output power vs input power Vdd = 1 V Vdd = 9 V Vdd = 8 V Tc = +25 C Tc = +5 C Tc = +7 C Tc = +85 C f = 3 MHz Idq = 25 ma Pin (W) 1 f = 3 MHz 5 Vds = 1 V Idq = 25 ma Pin (W) Figure 9. Power gain vs output power Figure 1. Power gain vs output power Tc = +25 C Vdd = 8 V Vdd = 1 V Vdd = 9 V Tc = +85 C Tc = +5 C Tc = +7 C Gp (db) Gp (db) f = 3 MHz Idq = 25 ma f = 3 MHz 21 Vds = 1 V Idq = 25 ma /17

8 Typical performance SD3933 Figure 11. Efficiency vs output power Figure 12. Efficiency vs output power Vdd = 8 V Vdd = 9 V Vdd = 1 V 8 7 Tc = +85, +7, +5, +25 C 5 6 Nd (%) 4 Nd (%) f = 3 MHz Idq = 25 ma f = 3 MHz Vds = 1 V Idq = 25 ma Figure 13. Input return loss vs output power Figure 14. Output power vs supply voltage 5-2 f = 3 MHz Vds = 1 V Idq = 25 ma 45 4 RTL (db) Tc = +85, +7, +5, +25 C Pin =.62 W Pin =.36 W f = 3 MHz Tc = +25 C Vdd (V) Figure 15. Output power vs gate source voltage Pin = 27.8 dbm Vdd = 1 V Tc = +25 C f = 3 MHz Vgs (V) 8/17

9 Test circuit 5 Test circuit Figure 16. Test circuit + 5V BIAS Table 7. Components part list Item Qty Part N Vendor Description C2 1 ATC7B751MW5X ATC C1 1 Vishay 75 pf ATC 7B surface mount ceramic chip.1 µf / 5V surface mount ceramic chip R kω 1 W surface mount chip resistor VENKEL R kω 1/2 W axial lead resistor T BELDEN 1 TYPE 217 ALPHA T1 1 RT-6-9 COMM CONCEPTS, INC L2 1 TYPE 811 BELDEN L1 1 TYPE 874 BELDEN Transformer, RG-142B/U 5 Ω coaxial cable OD =.165[4.18] L = 15"[381.] Covered with 15"[381.] tinned copper tubular braid 13/65"[5.1] width Transformer, HF 2-3 MHz surface mount 9:1 (impedance ratio) (43 material) inductor,1 3/4 turn air-wound#12awg ID =.25 [6.34] bus bar wire Inductor,1 3/4 turn air-wound#16awg ID =.225 Poly-coated Magnet Wire RFC FAIR-RITE CORP 3 turns AWG #14 wire through fair rite toroid 9/17

10 Test circuit SD3933 Table 7. Item Qty Part N Vendor Description RFC FAIR-RITE CORP 3 turns AWG #14 wire through fair rite toroid FB FAIR-RITE CORP Toroid 18 AR TTS-S6 SPC TECHNOLOGY Clear teflon shrink tubing 17 AR TYPE 811 BELDEN Wire, bus bar AWG #12 solid tinned copper EF JOHNSON Nylon insulated banana jack, blue EF JOHNSON Nylon insulated banana jack, red EF JOHNSON Nylon insulated banana jack, black Device under test Wear block,.1 [.25] X.25 [6,35] X.3 [7,62] LG copper MARK EYELETS INC Eyelet, standard flat flange copper, electrotin A18 McMASTER-CARR Screw, hex socket set, 4-4 X 3/8 [9.53] LG A251 McMASTER-CARR A146 McMASTER-CARR 7 4 WLS-4-17-SZ SPC TECHNOLOGY Washer, #4 split lock A18 McMASTER-CARR APPLIED SPECIALTIES Connector, AC-N Screw, socket head, cap SS, 1-32 X 1 1/2 [38.1] LG Screw, socket head cap, SS 6-32 X 3/8 [9.53] LG Screw, socket head cap, SS 4-4 X 3/8 [9.53] LG 4 Power panel and heat sink (see sht 6) 3 Core (see sht 5) 2 Printed wiring board (see Sht 3) 1 Assembly, test fixture (see Sht 1) C16 1 Vishay C15 1 Components part list (continued) C14 1 Vishay C13 1 ATC7B122MW5X ATC C12 1 SKR47M1JF11V MALLORY.1 µf 5 V surface mount ceramic chip 1 µf / 2 V aluminum electrolytics radial lead.1 µf 5 V surface mount ceramic chip 12 pf ATC 7B Surface mount ceramic chip 47 μf / 63 V aluminum electrolytics radial lead 1/17

11 Test circuit Table 7. Components part list (continued) Item Qty Part N Vendor Description C11 1 ATC2B13MW5X ATC C1 1 ATC2B13MW5X ATC C9 1 C1812X7R51-13KNE Vishay C6 424 Arco Variable C5 1 ATC C4 1 ATC C3 1 ATC 1 pf ATC 2B surface mount ceramic chip 1 pf ATC 2B surface mount ceramic chip.1 μf / 5 V surface mount ceramic chip 75 pf ATC 7B surface mount ceramic chip 18 pf ATC 1B surface mount ceramic chip 75 pf ATC 7B surface mount ceramic chip 11/17

12 Circuit layout SD Circuit layout Figure 17. Test fixture component layout Figure 18. Test circuit photometers SD2923 SD3933 LOG111 12/17

13 VGS/GFS sorts 7 VGS/GFS sorts Table 8. VGS/GFS sorts Marking Vgs(min) Vgs(max) Gfs(min) Gfs(max) A A A A A B B B B B C C C C C D D D D D E E E E E F F F F F G G /17

14 VGS/GFS sorts SD3933 Table 8. VGS/GFS sorts (continued) Marking Vgs(min) Vgs(max) Gfs(min) Gfs(max) G G G H H H H H I I I I I J J J J J /17

15 Package mechanical data 8 Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: Table 9. Dim. M177 (.55 DIA 4/L N/HERM W/FLG) mechanical data mm. Inch Min Typ Max Min Typ Max A B C D E F G H I J K Figure 19. Package dimensions Controlling ension: Dim Inches 11112D 15/17

16 Revision history SD Revision history Table 1. Document revision history Date Revision Changes 1-Jul-24 1 First release 24-Jan-26 2 Idss value updated 3-Jul-27 3 Specification upgrade 7-Aug-27 4 Added Table 8: VGS/GFS sorts on page Oct-27 5 Updated Table 4: Static on page 4 9-Oct-28 6 Updated Table 8: VGS/GFS sorts on page 13 16/17

17 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ( ST ) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. 28 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America 17/17