HVQFN16 HVQFN (thermal enhanced very thin quad flatpack; no leads) NA (not applicable) P (plastic) MO-220 S (surface mount) Issue date
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1 HVQFN16 packag; no lads; 16 trminals; body 3 x 3 x 8 Fbruary 2016 Packag information 1. Packag summary Tabl 1. Packag summary Trminal position cod Packag typ dscriptiv cod Packag typ industry cod Packag styl dscriptiv cod Packag styl suffix cod Packag body matrial typ JEDE packag outlin cod Mounting mthod typ Q (quad) HVQFN16 HVQFN16 HVQFN (thrmal nhancd vry thin quad flatpack; no lads) N (not applicabl) P (plastic) MO-220 S (surfac mount) Issu dat Symbol Paramtr Min Typ Nom Max Unit D packag lngth mm E packag width mm satd hight [tbd] mm 2 packag hight [tbd] [tbd] mm n 2 actual quantity of trmination
2 2. Packag outlin HVQFN16: packag; no lads; 16 trminals; body 3 x 3 x D B trminal 1 indx ara E 1 c dtail X 1 1/2 b 5 8 v M w M B y 1 y L 4 9 E h 2 1/ trminal 1 indx ara D h mm X scal DIMENSIONS (mm ar th original dimnsions) UNIT (1) max. 1 b c D (1) D h E (1) E h 1 2 L v w y y 1 mm Not 1. Plastic or mtal protrusions of mm maximum pr sid ar not includd. OUTLINE VERSION REFERENES IE JEDE JEIT MO EUROPEN PROJETION ISSUE DTE Fig. 1. Packag outlin HVQFN16 () ll information providd in this documnt is subjct to lgal disclaimrs. NXP Smiconductors N.V ll rights rsrvd Packag information 8 Fbruary / 5
3 3. Soldring Footprint information for rflow soldring of HVQFN16 packag Hx Gx D P (0.105) SPx nspx SPy Hy Gy SPy tot nspy SLy By y SPx tot SLx Bx x soldr land soldr past dposit soldr land plus soldr past occupid ara nspx nspy 2 2 Dimnsions in mm P x y Bx By D SLx SLy SPx tot SPy tot SPx SPy Gx Gy Hx Hy Issu dat Fig. 2. Rflow soldring footprint for HVQFN16 () sot758-1_fr ll information providd in this documnt is subjct to lgal disclaimrs. NXP Smiconductors N.V ll rights rsrvd Packag information 8 Fbruary / 5
4 4. Lgal information Disclaimrs Limitd warranty and liability Information in this documnt is blivd to b accurat and rliabl. Howvr, NXP Smiconductors dos not giv any rprsntations or warrantis, xprssd or implid, as to th accuracy or compltnss of such information and shall hav no liability for th consquncs of us of such information. NXP Smiconductors taks no rsponsibility for th contnt in this documnt if providd by an information sourc outsid of NXP Smiconductors. In no vnt shall NXP Smiconductors b liabl for any indirct, incidntal, punitiv, spcial or consquntial damags (including - without limitation - lost profits, lost savings, businss intrruption, costs rlatd to th rmoval or rplacmnt of any products or rwork chargs) whthr or not such damags ar basd on tort (including nglignc), warranty, brach of contract or any othr lgal thory. Notwithstanding any damags that customr might incur for any rason whatsovr, NXP Smiconductors aggrgat and cumulativ liability towards customr for th products dscribd hrin shall b limitd in accordanc with th Trms and conditions of commrcial sal of NXP Smiconductors. Right to mak changs NXP Smiconductors rsrvs th right to mak changs to information publishd in this documnt, including without limitation spcifications and product dscriptions, at any tim and without notic. This documnt suprsds and rplacs all information supplid prior to th publication hrof. ll information providd in this documnt is subjct to lgal disclaimrs. NXP Smiconductors N.V ll rights rsrvd Packag information 8 Fbruary / 5
5 5. ontnts 1. Packag summary Packag outlin Soldring Lgal information... 4 NXP Smiconductors N.V ll rights rsrvd For mor information, plas visit: For sals offic addrsss, plas snd an mail to: salsaddrsss@nxp.com Dat of rlas: 8 Fbruary 2016 ll information providd in this documnt is subjct to lgal disclaimrs. NXP Smiconductors N.V ll rights rsrvd Packag information 8 Fbruary / 5
S (surface mount) Issue date
HVQFN40 package; no leads; 40 terminals 21 pril 2016 Package information 1. Package summary Table 1. Package summary Terminal position code Package type descriptive code Package type industry code Package
HVQFN32 HVQFN (thermal enhanced very thin quad flatpack; no leads) P (plastic) MO-220 S (surface mount) Issue date
HVQFN32 DFN5050-32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 8 June 2016 Package information 1. Package summary Table 1. Package summary Terminal position
S (surface mount) Issue date
Plastic thermal enhanced very thin small outline package; no leads; 16 terminals 10 June 2016 Package information 1. Package summary Table 1. Package summary Terminal position code Package type descriptive
Q (quad) Package type descriptive code HUQFN32. QFP (quad flat package) Package style suffix code. NA (not applicable) Package body material type
HUQFN32 package; no leads; 32 terminals; body 5 x 5 x 8 February 2016 Package information 1. Package summary Terminal position code Q (quad) Package type descriptive code HUQFN32 Package type industry
Q (quad) Package type descriptive code. SQFP240 Package type industry code. SQFP240 Package style descriptive code
length 1.3 mm); body 32 x 32 x 3.4 mm; high 8 February 2016 Package information 1. Package summary Terminal position code Q (quad) Package type descriptive code SQFP240 Package type industry code SQFP240
Q (quad) Package type descriptive code LQFP64. LQFP (low profile quad flat package) Package style suffix code
LQFP64 body 10 x 10 x 1.4 mm 8 February 2016 Package information 1. Package summary Terminal position code Q (quad) Package type descriptive code LQFP64 Package type industry code LQFP64 Package style
D (double) Package type descriptive code TSSOP14. TSSOP (thin shrink small outline package) Package style suffix code
TSSOP14 leads; body width 4.4 mm 8 February 2016 Package information 1. Package summary Terminal position code D (double) Package type descriptive code TSSOP14 Package type industry code TSSOP14 Package
plastic leaded chip carrier; 44 leads Q (quad) Package type descriptive code PLCC44 PLCC (plastic leaded chip carrier) Package style suffix code
PLCC44 8 February 2016 Package information 1. Package summary Terminal position code Q (quad) Package type descriptive code PLCC44 Package type industry code PLCC44 Package style descriptive code PLCC
B (bottom) Package type descriptive code. VFBGA144 Package type industry code. VFBGA144 Package style descriptive code
8 February 2016 Package information 1. Package summary Terminal position code (bottom) Package type descriptive code VFG144 Package type industry code VFG144 Package style descriptive code VFG (very thin
HTQFP64 HTQFP (thermal enhanced thin quad flat package) NA (not applicable) P (plastic) MS-026 S (surface mount) Issue date
HTQFP64 64 leads; exposed die pad 8 February 2016 Package information 1. Package summary Table 1. Package summary Terminal position code Package type descriptie code Package type industry code Package
plastic ball grid array package; 426 balls B (bottom) Package type descriptive code BGA426 Package type industry code
8 February 2016 Package information 1. Package summary Terminal position code B (bottom) Package type descriptive code BG426 Package type industry code BG426 Package style descriptive code BG (ball grid
D (double) Package type descriptive code TSSOP8. TSSOP (thin shrink small outline package) Package body material type
TSSOP8 plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0.5 mm 8 June 2016 Package information 1. Package summary Terminal position code D (double) Package type descriptive
D (double) Package type descriptive code VSSOP8. P (plastic) JEDEC package outline code. MO-187 Mounting method type
VSSOP8 plastic very thin shrink small outline package; 8 leads; body width 2.3 mm 5 July 2016 Package information 1. Package summary Terminal position code D (double) Package type descriptive code VSSOP8
D (double) Package type descriptive code TSSOP8. TSSOP (thin shrink small outline package) Package style suffix code
TSSOP8 leads; body width 3 mm 8 February 2016 Package information 1. Package summary Terminal position code D (double) Package type descriptive code TSSOP8 Package type industry code TSSOP8 Package style
D (double) Package type descriptive code XSON16. P (plastic) JEDEC package outline code. MO-252 Mounting method type
XSON16 plastic extremely thin small outline package; no leads; 16 terminals; body 2.5 x 3.2 x 0.5 mm 8 June 2016 Package information 1. Package summary Terminal position code D (double) Package type descriptive
D (double) Package type descriptive code. HSOP36 Package type industry code. HSOP36 Package style descriptive code
plastic, heatsink small outline package; 36 leads; low standoff height, mm pitch, 11 mm x 15.9 mm 21 ugust 2018 Package information 1 Package summary Terminal position code D (double) Package type descriptive
HVQFN (thermal enhanced very thin quad flatpack; no leads) P (plastic) MO-220 S (surface mount) Issue date Manufacturer package code
HVQFN48 plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; 7 mm x 7 mm x 0.85 mm 5 February 2018 Package information 1. Package summary Table 1. Package summary Terminal position
Q (quad) Package type descriptive code LQFP32. LQFP (low profile quad flat package) Package body material type. P (plastic) IEC package outline code
LQFP32 plastic low profile quad flat package; 32 leads; body 7 mm x 7 mm x 1.4 mm 19 July 2017 Package information 1. Package summary Terminal position code Q (quad) Package type descriptive code LQFP32
D (double) Package type descriptive code HSOP44. HSOP (heatsink small outline package) Package body material type. P (plastic) Mounting method type
HSOP44 plastic, heatsink small outline package; 44 leads; low standoff height, mm pitch, 15.9 mm x 11.0 21 ugust 2018 Package information 1 Package summary Terminal position code D (double) Package type
D (double) Package type descriptive code. SC-73 Package type industry code. SC-73 Package style descriptive code
heatsink; leads 8 February 2016 Package information 1. Package summary Terminal position code D (double) Package type descriptive code Package type industry code Package style descriptive code SO (small
D (double) Package type descriptive code SO8. SO (small outline) Package body material type. P (plastic) IEC package outline code
SO8 plastic, small outline package; 8 leads; 1.27 mm pitch; 4.9 mm x 3.9 mm x 1.75 mm body 7 December 2018 Package information 1 Package summary Terminal position code D (double) Package type descriptive
D (double) Package type descriptive code. TSOP6 Package type industry code. TSOP6 Package style descriptive code
plastic, surface-mounted package (TSOP6); 6 leads; mm pitch; 2.9 mm x 1.5 mm x 1 mm body 5 May 2018 Package information 1. Package summary Terminal position code D (double) Package type descriptive code
B (bottom) Package type descriptive code Package type industry code. VFBGA Package style descriptive code
VFG64 20 ecember 2016 Package information 1. Package summary Terminal position code (bottom) Package type descriptive code VFG64 Package type industry code VFG Package style descriptive code VFG (very
DFN2020MD-6 HUSON (thermal enhanced ultra thin small outline; no leads) P (plastic) S (surface mount) Issue date Manufacturer package code
DFN2020MD-6 plastic, thermal enhanced ultra thin small outline package; no leads; 6 terminals; 0.65 mm pitch; 2 mm x 2 mm x 0.65 mm body 23 January 2017 Package information 1. Package summary Table 1.
SOT023_fr SOT023_fw REL Major version date Minor version date Security status
plastic, surface-mounted package; 3 terminals; 1.9 mm pitch; 2.9 mm x 1.3 mm x 1 mm body 9 January 2017 Package information 1. Package summary Table 1. Package summary Dimensions (mm) 2.9 x 1.3 x 1 Terminal
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EMA5 / UMA5N / FMA5A. V CC -50V -100mA 2.2kW 47kW I C(MAX.) R 1 R 2. Datasheet
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EMD4 / UMD4N V CC I C(MAX.) R 1 R 2. 50V 100mA. 47kW. V CC -50V -100mA 10kW. Datasheet
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SOT1688-1(SC) 1 Package summary
1 Package summary HLQFN16; plastic, thermal enhanced low profile quad flat non-leaded package; 16 terminals; 0.8 mm pitch; 4 mm x 4 mm x 1.5 mm body 16 July 2018 Package information Terminal position code
DTD114GK V CEO I C R. 50V 500mA 10kW. Datasheet. NPN 500mA 50V Digital Transistors (Bias Resistor Built-in Transistors) Outline Parameter Value SMT3
NPN 500mA 50V Digital Transistors (Bias Rsistor Built-in Transistors) Datasht Outlin Paramtr Valu SMT3 V CEO I C R 50V 500mA 10kW Bas Emittr Collctor DTD114GK SOT-346 (SC-59) Faturs 1) Built-In Biasing
D (double) Package type descriptive code. SMA; PMOS Package type industry code. SMA; PMOS Package style descriptive code
SMA PMOS rectangular surface mounted package; 2 8 February 2016 Package information 1. Package summary Terminal position code D (double) Package type descriptive code SMA; PMOS Package type industry code
DTA123E series V CC I C(MAX.) R 1 R 2. 50V 100mA 2.2k 2.2k. Datasheet. PNP -100mA -50V Digital Transistors (Bias Resistor Built-in Transistors)
DT123 sris PNP -100m -50V Digital Transistors (Bias Rsistor Built-in Transistors) Datasht Paramtr V CC I C(MX.) R 1 R 2 Valu 50V 100m 2.2k 2.2k Faturs 1) Built-In Biasing Rsistors, R 1 = R 2 = 2.2k. Outlin
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B (bottom) Package type descriptive code. VFBGA176 Package style descriptive code
VFBGA176, plastic, very thin fine-pitch ball grid array; 176 balls; 0.5 mm pitch; 9 mm x 9 mm x 0.86 mm 30 July 2018 Package information 1 Package summary Terminal position code B (bottom) Package type
D (double) Package type descriptive code. SOD2 Package type industry code. DSN Package style descriptive code
terminals; body 0.6 x 0.3 x 0.3 mm 8 February 2016 Package information 1. Package summary Terminal position code D (double) Package type descriptive code SOD2 Package type industry code DSN0603-2 Package
SOD323_fr SOD323_fw REL Major version date Minor version date Security status
plastic, surface-mounted package; 2 terminals; 1.7 mm x 1.25 mm x 0.95 mm body 9 January 2017 Package information 1. Package summary Table 1. Package summary Dimensions (mm) 1.7 x 1.25 x 0.95 Terminal
US6H23 / IMH23 V CEO 20V V EBO 12V. 600mA R k. Datasheet. Outline Parameter Tr1 and Tr2 TUMT6 SMT6
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Your satisfaction is important to us, plas lt us hlp! If you hav any qustions or concrns during th installation, our support rprsntativs ar availabl to assist you. Plas call: 1-877-769-3765 or Liv Chat
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In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.
Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic
Package: H: TO-252 P: TO-220 S: TO-263. Output Voltage : Blank = Adj 12 = 1.2V 15 = 1.5V 18 = 1.8V 25 = 2.5V 33 = 3.3V 50 = 5.0V 3.3V/3A.
Faturs Advancd Powr 3-Trminal ustabl or Fixd.V,.5V,.8V,.5V, 3.3V or 5.V Output Maximum Dropout.4V at Full Load Currnt Fast Transint Rspons Built-in Thrmal Shutdown Output Currnt Limiting Good Nois Rjction
Bus buffer/line driver; 3-state
Rev. 2 7 December 2015 Product data sheet 1. General description is a high-speed Si-gate CMOS device. It provides one non-inverting buffer/line driver with 3-state output. The 3-state output is controlled
HEF4001B. 1. General description. 2. Features and benefits. 3. Ordering information. 4. Functional diagram. Quad 2-input NOR gate
Rev. 9 21 November 2011 Product data sheet 1. General description 2. Features and benefits The is a quad 2-input NOR gate. The outputs are fully buffered for the highest noise immunity and pattern insensitivity
Quad 2-input EXCLUSIVE-NOR gate
Rev. 4 18 July 2014 Product data sheet 1. General description 2. Features and benefits 3. Ordering information The is a quad 2-input EXCLUSIVE-NOR gate. The outputs are fully buffered for the highest noise
BCP68; BC868; BC68PA
Rev. 8 8 October 2 Product data sheet. Product profile. General description NPN medium power transistor series in Surface-Mounted Device (SMD) plastic packages. Table. Product overview Type number [] Package
In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.
Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic
BCP56H series. 80 V, 1 A NPN medium power transistors
SOT223 8 V, A NPN medium power transistors Rev. 23 November 26 Product data sheet. Product profile. General description NPN medium power transistors in a medium power SOT223 (SC-73) Surface-Mounted Device
Octal bus switch with quad output enables
Rev. 3 8 September 2017 Product data sheet 1 General description 2 Features and benefits 3 Ordering information Table 1. Ordering information Type number The provides eight bits of high-speed TTL-compatible
BAP Product profile. 2. Pinning information. 3. Ordering information. Silicon PIN diode. 1.1 General description. 1.2 Features and benefits
Rev. 5 28 April 2015 Product data sheet 1. Product profile 1.1 General description Two planar PIN diodes in common cathode configuration in a SOT23 small plastic SMD package. 1.2 Features and benefits
74AHCU04-Q General description. 2. Features and benefits. 3. Ordering information. Hex unbuffered inverter
Rev. 2 7 December 25 Product data sheet. General description The is high-speed Si-gate CMOS device and is pin compatible with low-power Schottky TTL (LSTTL). It is specified in compliance with JEDEC standard
Four planar PIN diode array in SOT363 small SMD plastic package.
Rev. 4 7 March 2014 Product data sheet 1. Product profile 1.1 General description Four planar PIN diode array in SOT363 small SMD plastic package. 1.2 Features and benefits High voltage current controlled
RClamp2451ZA. Ultra Small RailClamp 1-Line, 24V ESD Protection
- RailClamp Dscription RailClamp TVS diods ar ultra low capacitanc dvics dsignd to protct snsitiv lctronics from damag or latch-up du to ESD, EFT, and EOS. Thy ar dsignd for us on high spd ports in applications
In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.
Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic
In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.
Important notice Dear Customer, On 7 February 27 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic and
In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.
Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic
Advanced Power N-CHANNEL ENHANCEMENT MODE Electronics Corp.
dvancd Powr N-CHNNEL ENHNCEMENT MODE Elctronics Corp. POWER MOSFET Low Gat Charg D BV DSS 3V Simpl Driv Rquirmnt R DS(ON) 8mΩ Fast Switching I D 5 G S Dscription P5N3GH/J RoHS-compliant Product TO-252
Maintain Your F5 Solution with Fast, Reliable Support
F5 SERVICES TECHNICAL SUPPORT SERVICES DATASHEET Maintain Your F5 Solution with Fast, Rliabl Support In a world whr chang is th only constant, you rly on your F5 tchnology to dlivr no mattr what turns
Single Schmitt trigger buffer
Rev. 11 2 December 2016 Product data sheet 1. General description The provides a buffer function with Schmitt trigger input. It is capable of transforming slowly changing input signals into sharply defined
BAT54W series. 1. Product profile. 2. Pinning information. Schottky barrier diodes. 1.1 General description. 1.2 Features and benefits
SOT2 Rev. 20 November 2012 Product data sheet 1. Product profile 1.1 General description Planar with an integrated guard ring for stress protection, encapsulated in a very small SOT2 (SC-70) Surface-Mounted
3A High Current, Low Dropout Voltage Regulator Adjustable, Fast Response Time
SPX29302 3 High Currnt, ow Dropout Voltag Rgulator djustabl, Fast Rspons Tim FTURS djustabl Output Down To 1.25V 1% Output ccuracy Output Currnt of 3 ow Dropout Voltag of 370mV @ 3 xtrmly Fast Transint