SOD323_fr SOD323_fw REL Major version date Minor version date Security status
|
|
- Rafe Robertson
- 5 years ago
- Views:
Transcription
1 plastic, surface-mounted package; 2 terminals; 1.7 mm x 1.25 mm x 0.95 mm body 9 January 2017 Package information 1. Package summary Table 1. Package summary Dimensions (mm) 1.7 x 1.25 x 0.95 Terminal position code Package type descriptive code Package outline version code Manufacturer package code Package type industry code Package outline version description Package style descriptive code Package body material type JEITA package outline code Handling precautions Thermal design considerations Mounting method type D (double) plastic, surface-mounted package; 2 terminals; 1.7 mm x 1.25 mm x 0.95 mm body SOD (small outline diode) P SC-76 IC26_CHAPTER_3_2000 SC18_1999_CHAPTER_5_2 S (surface mount) Generic mounting and soldering information AN10365_3 Reflow soldering footprint Wave soldering footprint Package life cycle status _fr _fw REL Major version date Minor version date Security status COMPANY PUBLIC Modified date Issue date Web publication date Initial web publication date Customer specific indicator Maturity Package author Package approver N Product Nair Deepa Nair Deepa Symbol Parameter Min Typ Nom Max Unit A seated height mm D package length mm
2 Symbol Parameter Min Typ Nom Max Unit E package width mm n 2 actual quantity of termination All information provided in this document is subject to legal disclaimers. NXP Semiconductors N.V All rights reserved Package information 9 January / 6
3 2. Package outline Plastic surface-mounted package; 2 leads D A E X H D v M A 1 2 Q b p A (1) A 1 c detail X L p mm DIMENSIONS (mm are the original dimensions) scale UNIT A A 1 max 1.1 mm b p c D E H D L p Q v 0.2 Note 1. The marking bar indicates the cathode OUTLINE VERSION REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE SC Fig. 1. Package outline All information provided in this document is subject to legal disclaimers. NXP Semiconductors N.V All rights reserved Package information 9 January / 6
4 3. Soldering solder lands solder resist (2 ) 0.6 (2 ) solder paste occupied area 0.5 (2 ) 0.6 (2 ) 2.2 Dimensions in mm sod323_fr Fig. 2. Reflow soldering footprint for (2 ) solder lands solder resist occupied area (2 ) Dimensions in mm preferred transport direction during soldering sod323_fw Fig. 3. Wave soldering footprint for All information provided in this document is subject to legal disclaimers. NXP Semiconductors N.V All rights reserved Package information 9 January / 6
5 4. Legal information Disclaimers Limited warranty and liability Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. All information provided in this document is subject to legal disclaimers. NXP Semiconductors N.V All rights reserved Package information 9 January / 6
6 5. Contents 1. Package summary Package outline Soldering Legal information... 5 NXP Semiconductors N.V All rights reserved For more information, please visit: For sales office addresses, please send an to: salesaddresses@nxp.com Date of release: 9 January 2017 All information provided in this document is subject to legal disclaimers. NXP Semiconductors N.V All rights reserved Package information 9 January / 6
SOT023_fr SOT023_fw REL Major version date Minor version date Security status
plastic, surface-mounted package; 3 terminals; 1.9 mm pitch; 2.9 mm x 1.3 mm x 1 mm body 9 January 2017 Package information 1. Package summary Table 1. Package summary Dimensions (mm) 2.9 x 1.3 x 1 Terminal
More informationD (double) Package type descriptive code. SOD2 Package type industry code. DSN Package style descriptive code
terminals; body 0.6 x 0.3 x 0.3 mm 8 February 2016 Package information 1. Package summary Terminal position code D (double) Package type descriptive code SOD2 Package type industry code DSN0603-2 Package
More informationD (double) Package type descriptive code. SMA; PMOS Package type industry code. SMA; PMOS Package style descriptive code
SMA PMOS rectangular surface mounted package; 2 8 February 2016 Package information 1. Package summary Terminal position code D (double) Package type descriptive code SMA; PMOS Package type industry code
More informationD (double) Package type descriptive code. SC-73 Package type industry code. SC-73 Package style descriptive code
heatsink; leads 8 February 2016 Package information 1. Package summary Terminal position code D (double) Package type descriptive code Package type industry code Package style descriptive code SO (small
More informationHVQFN (thermal enhanced very thin quad flatpack; no leads) P (plastic) MO-220 S (surface mount) Issue date Manufacturer package code
HVQFN48 plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; 7 mm x 7 mm x 0.85 mm 5 February 2018 Package information 1. Package summary Table 1. Package summary Terminal position
More informationD (double) Package type descriptive code TSSOP8. TSSOP (thin shrink small outline package) Package style suffix code
TSSOP8 leads; body width 3 mm 8 February 2016 Package information 1. Package summary Terminal position code D (double) Package type descriptive code TSSOP8 Package type industry code TSSOP8 Package style
More informationD (double) Package type descriptive code XSON16. P (plastic) JEDEC package outline code. MO-252 Mounting method type
XSON16 plastic extremely thin small outline package; no leads; 16 terminals; body 2.5 x 3.2 x 0.5 mm 8 June 2016 Package information 1. Package summary Terminal position code D (double) Package type descriptive
More informationD (double) Package type descriptive code SO8. SO (small outline) Package body material type. P (plastic) IEC package outline code
SO8 plastic, small outline package; 8 leads; 1.27 mm pitch; 4.9 mm x 3.9 mm x 1.75 mm body 7 December 2018 Package information 1 Package summary Terminal position code D (double) Package type descriptive
More informationDFN2020MD-6 HUSON (thermal enhanced ultra thin small outline; no leads) P (plastic) S (surface mount) Issue date Manufacturer package code
DFN2020MD-6 plastic, thermal enhanced ultra thin small outline package; no leads; 6 terminals; 0.65 mm pitch; 2 mm x 2 mm x 0.65 mm body 23 January 2017 Package information 1. Package summary Table 1.
More informationD (double) Package type descriptive code TSSOP8. TSSOP (thin shrink small outline package) Package body material type
TSSOP8 plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0.5 mm 8 June 2016 Package information 1. Package summary Terminal position code D (double) Package type descriptive
More informationD (double) Package type descriptive code. TSOP6 Package type industry code. TSOP6 Package style descriptive code
plastic, surface-mounted package (TSOP6); 6 leads; mm pitch; 2.9 mm x 1.5 mm x 1 mm body 5 May 2018 Package information 1. Package summary Terminal position code D (double) Package type descriptive code
More informationD (double) Package type descriptive code VSSOP8. P (plastic) JEDEC package outline code. MO-187 Mounting method type
VSSOP8 plastic very thin shrink small outline package; 8 leads; body width 2.3 mm 5 July 2016 Package information 1. Package summary Terminal position code D (double) Package type descriptive code VSSOP8
More informationB (bottom) Package type descriptive code. VFBGA176 Package style descriptive code
VFBGA176, plastic, very thin fine-pitch ball grid array; 176 balls; 0.5 mm pitch; 9 mm x 9 mm x 0.86 mm 30 July 2018 Package information 1 Package summary Terminal position code B (bottom) Package type
More informationSOT Package summary
1 Package summary HLQFP64, plastic, thermal enhanced low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body; 4.9 mm x 4.9 mm exposed pad 7 August 2018 Package information
More informationQ (quad) Package type descriptive code. SQFP240 Package type industry code. SQFP240 Package style descriptive code
length 1.3 mm); body 32 x 32 x 3.4 mm; high 8 February 2016 Package information 1. Package summary Terminal position code Q (quad) Package type descriptive code SQFP240 Package type industry code SQFP240
More informationQ (quad) Package type descriptive code LQFP64. LQFP (low profile quad flat package) Package style suffix code
LQFP64 body 10 x 10 x 1.4 mm 8 February 2016 Package information 1. Package summary Terminal position code Q (quad) Package type descriptive code LQFP64 Package type industry code LQFP64 Package style
More informationSOT1688-1(SC) 1 Package summary
1 Package summary HLQFN16; plastic, thermal enhanced low profile quad flat non-leaded package; 16 terminals; 0.8 mm pitch; 4 mm x 4 mm x 1.5 mm body 16 July 2018 Package information Terminal position code
More informationD (double) Package type descriptive code TSSOP14. TSSOP (thin shrink small outline package) Package style suffix code
TSSOP14 leads; body width 4.4 mm 8 February 2016 Package information 1. Package summary Terminal position code D (double) Package type descriptive code TSSOP14 Package type industry code TSSOP14 Package
More informationQ (quad) Package type descriptive code LQFP32. LQFP (low profile quad flat package) Package body material type. P (plastic) IEC package outline code
LQFP32 plastic low profile quad flat package; 32 leads; body 7 mm x 7 mm x 1.4 mm 19 July 2017 Package information 1. Package summary Terminal position code Q (quad) Package type descriptive code LQFP32
More informationplastic ball grid array package; 426 balls B (bottom) Package type descriptive code BGA426 Package type industry code
8 February 2016 Package information 1. Package summary Terminal position code B (bottom) Package type descriptive code BG426 Package type industry code BG426 Package style descriptive code BG (ball grid
More informationD (double) Package type descriptive code HSOP44. HSOP (heatsink small outline package) Package body material type. P (plastic) Mounting method type
HSOP44 plastic, heatsink small outline package; 44 leads; low standoff height, mm pitch, 15.9 mm x 11.0 21 ugust 2018 Package information 1 Package summary Terminal position code D (double) Package type
More informationB (bottom) Package type descriptive code Package type industry code. VFBGA Package style descriptive code
VFG64 20 ecember 2016 Package information 1. Package summary Terminal position code (bottom) Package type descriptive code VFG64 Package type industry code VFG Package style descriptive code VFG (very
More informationplastic leaded chip carrier; 44 leads Q (quad) Package type descriptive code PLCC44 PLCC (plastic leaded chip carrier) Package style suffix code
PLCC44 8 February 2016 Package information 1. Package summary Terminal position code Q (quad) Package type descriptive code PLCC44 Package type industry code PLCC44 Package style descriptive code PLCC
More informationB (bottom) Package type descriptive code. VFBGA144 Package type industry code. VFBGA144 Package style descriptive code
8 February 2016 Package information 1. Package summary Terminal position code (bottom) Package type descriptive code VFG144 Package type industry code VFG144 Package style descriptive code VFG (very thin
More informationD (double) Package type descriptive code. HSOP36 Package type industry code. HSOP36 Package style descriptive code
plastic, heatsink small outline package; 36 leads; low standoff height, mm pitch, 11 mm x 15.9 mm 21 ugust 2018 Package information 1 Package summary Terminal position code D (double) Package type descriptive
More informationS (surface mount) Issue date
Plastic thermal enhanced very thin small outline package; no leads; 16 terminals 10 June 2016 Package information 1. Package summary Table 1. Package summary Terminal position code Package type descriptive
More informationHVQFN32 HVQFN (thermal enhanced very thin quad flatpack; no leads) P (plastic) MO-220 S (surface mount) Issue date
HVQFN32 DFN5050-32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 8 June 2016 Package information 1. Package summary Table 1. Package summary Terminal position
More informationS (surface mount) Issue date
HVQFN40 package; no leads; 40 terminals 21 pril 2016 Package information 1. Package summary Table 1. Package summary Terminal position code Package type descriptive code Package type industry code Package
More informationQ (quad) Package type descriptive code HUQFN32. QFP (quad flat package) Package style suffix code. NA (not applicable) Package body material type
HUQFN32 package; no leads; 32 terminals; body 5 x 5 x 8 February 2016 Package information 1. Package summary Terminal position code Q (quad) Package type descriptive code HUQFN32 Package type industry
More informationSymbol Parameter Conditions Min Typ Max Unit V F forward voltage I F =10mA
Rev. 3 11 October 2016 Product data sheet 1. Product profile 1.1 General description Low-power voltage regulator diodes in a small SOD323 (SC-76) Surface-Mounted Device (SMD) plastic package. The diodes
More informationHTQFP64 HTQFP (thermal enhanced thin quad flat package) NA (not applicable) P (plastic) MS-026 S (surface mount) Issue date
HTQFP64 64 leads; exposed die pad 8 February 2016 Package information 1. Package summary Table 1. Package summary Terminal position code Package type descriptie code Package type industry code Package
More informationVHF variable capacitance diode
Rev. 1 25 March 2013 Product data sheet 1. Product profile 1.1 General description The is a variable capacitance diode, fabricated in planar technology, and encapsulated in the SOD323 (SC-76) very small
More informationPlanar PIN diode in a SOD523 ultra small SMD plastic package.
Rev. 5 28 September 2010 Product data sheet 1. Product profile 1.1 General description Planar PIN diode in a SOD523 ultra small SMD plastic package. 1.2 Features and benefits High voltage, current controlled
More informationPlanar PIN diode in a SOD523 ultra small plastic SMD package.
Rev. 10 12 May 2015 Product data sheet 1. Product profile 1.1 General description Planar PIN diode in a SOD523 ultra small plastic SMD package. 1.2 Features and benefits High voltage, current controlled
More informationTable 1. Quick reference data Symbol Parameter Conditions Min Typ Max Unit I F forward current T j = 25 C V RRM
29 June 2018 Product data sheet 1. General description, in an ultra small SOD523 (SC-72) flat lead Surface-Mounted Device (SMD) plastic package. 2. Features and benefits High switching speed: t rr 50 ns
More informationIn data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.
Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic
More informationDISCRETE SEMICONDUCTORS DATA SHEET. BAP65-03 Silicon PIN diode. Product specification Supersedes data of 2001 May Feb 11
DISCRETE SEMICONDUCTORS DATA SHEET Supersedes data of 2001 May 11 2004 Feb 11 FEATURES PINNING High voltage, current controlled RF resistor for RF switches Low diode capacitance Low diode forward resistance
More information50 ma LED driver in SOT457
SOT457 in SOT457 Rev. 1 December 2013 Product data sheet 1. Product profile 1.1 General description LED driver consisting of resistor-equipped PNP transistor with two diodes on one chip in an SOT457 (SC-74)
More informationBB Product profile. 2. Pinning information. 3. Ordering information. FM variable capacitance double diode. 1.1 General description
SOT23 Rev. 3 7 September 2011 Product data sheet 1. Product profile 1.1 General description The is a variable capacitance double diode with a common cathode, fabricated in silicon planar technology, and
More informationRB520CS30L. 1. Product profile. 100 ma low V F MEGA Schottky barrier rectifier. 1.1 General description. 1.2 Features and benefits. 1.
SOD882 Rev. 0 March 20 Product data sheet. Product profile. General description Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress
More information40 V, 0.75 A medium power Schottky barrier rectifier
2 May 216 Product data sheet 1. General description Medium power Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in a very small SOD323 (SC-76) Surface-Mounted
More informationTwo elements in series configuration in a small SMD plastic package Low diode capacitance Low diode forward resistance AEC-Q101 qualified
Rev. 2 25 October 2016 Product data sheet 1. Product profile 1.1 General description Two planar PIN diodes in series configuration in a SOT323 small SMD plastic package. 1.2 Features and benefits Two elements
More informationDISCRETE SEMICONDUCTORS DATA SHEET. k, halfpage M3D102. BAP64-04W Silicon PIN diode Jan 29. Product specification Supersedes data of 2000 Jun 06
DISCRETE SEMICONDUCTORS DATA SHEET k, halfpage M3D12 Supersedes data of 2 Jun 6 21 Jan 29 FEATURES High voltage, current controlled RF resistor for RF attenuators and switches Low diode capacitance Low
More informationBCP56H series. 80 V, 1 A NPN medium power transistors
SOT223 8 V, A NPN medium power transistors Rev. 23 November 26 Product data sheet. Product profile. General description NPN medium power transistors in a medium power SOT223 (SC-73) Surface-Mounted Device
More informationBAT54W series. 1. Product profile. 2. Pinning information. Schottky barrier diodes. 1.1 General description. 1.2 Features and benefits
SOT2 Rev. 20 November 2012 Product data sheet 1. Product profile 1.1 General description Planar with an integrated guard ring for stress protection, encapsulated in a very small SOT2 (SC-70) Surface-Mounted
More informationBAS116GW. 1. General description. 2. Features and benefits. 3. Applications. 4. Quick reference data
5 April 208 Product data sheet. General description, encapsulated in an SOD23 small Surface-Mounted Device (SMD) plastic package. 2. Features and benefits High switching speed: t rr = 0.8 µs Low leakage
More informationDATA SHEET. BAP50-05 General purpose PIN diode DISCRETE SEMICONDUCTORS. Product specification Supersedes data of 1999 Feb May 10.
DISCRETE SEMICONDUCTORS DATA SHEET alfpage M3D088 Supersedes data of 1999 Feb 01 1999 May 10 FEATURES Two elements in common cathode configuration in a small-sized plastic SMD package Low diode capacitance
More informationIn data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.
Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic
More informationBAS21GW. 1. General description. 2. Features and benefits. 3. Applications. 4. Quick reference data
15 June 2017 Product data sheet 1. General description, encapsulated in an SOD123 small Surface-Mounted Device (SMD) plastic package. 2. Features and benefits High switching speed: t rr 50 ns Low leakage
More informationFour planar PIN diode array in SOT363 small SMD plastic package.
Rev. 4 7 March 2014 Product data sheet 1. Product profile 1.1 General description Four planar PIN diode array in SOT363 small SMD plastic package. 1.2 Features and benefits High voltage current controlled
More informationPMEG2005EGW. 1. General description. 2. Features and benefits. 3. Applications. 4. Quick reference data
5 December 206 Product data sheet. General description Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection encapsulated in
More informationBAP Product profile. 2. Pinning information. 3. Ordering information. Silicon PIN diode. 1.1 General description. 1.2 Features and benefits
Rev. 5 28 April 2015 Product data sheet 1. Product profile 1.1 General description Two planar PIN diodes in common cathode configuration in a SOT23 small plastic SMD package. 1.2 Features and benefits
More informationHigh-speed switching diodes. Type number Package Configuration Package NXP JEITA JEDEC
Rev. 07 14 April 2010 Product data sheet 1. Product profile 1.1 General description, encapsulated in small Surface-Mounted Device (SMD) plastic packages. Table 1. Product overview Type number Package Configuration
More informationPMEG3050BEP. 1. General description. 2. Features and benefits. 3. Applications. 4. Quick reference data
28 May 28 Product data sheet. General description Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in a
More informationSymbol Parameter Conditions Min Typ Max Unit V F forward voltage I F =10mA
SOT23 Rev. 6 6 March 2014 Product data sheet 1. Product profile 1.1 General description Low-power voltage regulator diodes in a small SOT23 (TO-236AB) Surface-Mounted Device (SMD) plastic package. The
More informationPlanar PIN diode in a SOD882D leadless ultra small plastic SMD package.
DFN1006D-2 Rev. 2 6 August 2013 Product data sheet 1. Product profile 1.1 General description Planar PIN diode in a SOD882D leadless ultra small plastic SMD package. 1.2 Features and benefits High voltage,
More informationTable 1. Quick reference data Symbol Parameter Conditions Min Typ Max Unit
2 December 207 Product data sheet. General description Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated
More informationPMEG4050ETP. 1. General description. 2. Features and benefits. 3. Applications. 4. Quick reference data
25 April 28 Product data sheet. General description Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in
More informationHigh-speed switching in e.g. surface-mounted circuits
Rev. 3 22 July 2010 Product data sheet 1. Product profile 1.1 General description Two high-speed switching diodes fabricated in planar technology, and encapsulated in a small SOT143B Surface-Mounted Device
More informationSingle Schottky barrier diode
SOD23F Rev. 2 28 November 20 Product data sheet. Product profile. General description Single planar Schottky barrier diode with an integrated guard ring for stress protection, encapsulated in a small and
More informationIn data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.
Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic
More informationIn data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.
Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic
More informationBAS16GW. 1. General description. 2. Features and benefits. 3. Applications. 4. Quick reference data
23 November 206 Product data sheet. General description, encapsulated in an SOD23 small Surface-Mounted Device (SMD) plastic package. 2. Features and benefits High switching speed: t rr 4 ns Low leakage
More informationPMEG4010ETP. 40 V, 1 A low VF MEGA Schottky barrier rectifier. Low voltage rectification High efficiency DC-to-DC conversion Switch mode power supply
Rev. 5 October 20 Product data sheet. Product profile. General description Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection,
More informationRB521CS30L. 1. Product profile. 100 ma low V F MEGA Schottky barrier rectifier. 1.1 General description. 1.2 Features and benefits. 1.
Rev. 24 January 20 Product data sheet. Product profile. General description Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection,
More informationBAV102; BAV103. Single general-purpose switching diodes
Rev. 4 6 August 2010 Product data sheet 1. Product profile 1.1 General description, fabricated in planar technology, and encapsulated in small hermetically sealed glass SOD80C Surface-Mounted Device (SMD)
More informationTable 1. Quick reference data Symbol Parameter Conditions Min Typ Max Unit
7 November 207 Product data sheet. General description Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated
More informationHigh-speed switching diode in dual series configuration, encapsulated in a small SOT23 (TO-236AB) Surface-Mounted Device (SMD) plastic package.
Rev. 01 30 March 2010 Product data sheet 1. Product profile 1.1 General description in dual series configuration, encapsulated in a small SOT23 (TO-236AB) Surface-Mounted Device (SMD) plastic package.
More informationPMEG4010ER. 1. Product profile. 1 A low V F MEGA Schottky barrier rectifier. 1.1 General description. 1.2 Features and benefits. 1.
Rev. 2 5 April 2 Product data sheet. Product profile. General description Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection,
More informationBC857xMB series. 45 V, 100 ma PNP general-purpose transistors
SOT883B Rev. 1 21 February 2012 1. Product profile 1.1 General description PNP general-purpose transistors in a leadless ultra small SOT883B Surface-Mounted Device (SMD) plastic package. Table 1. Product
More informationPTVS5V0Z1USKP. 1. General description. 2. Features and benefits. 3. Applications. 4. Quick reference data. 5. Pinning information
Transient voltage suppressor in DSN168-2 for mobile applications 9 June 217 Product data sheet 1. General description Unidirectional Transient Voltage Suppressor (TVS) in an ultra small leadless DSN168-2
More informationBAV70SRA. 1. General description. 2. Features and benefits. 3. Applications. 4. Quick reference data
14 September 2018 Product data sheet 1. General description 2. Features and benefits 3. Applications 4. Quick reference data with common cathode configurations encapsulated in a leadless ultra small DFN1412-6
More informationSymbol Parameter Conditions Min Typ Max Unit V F forward voltage I F =10mA V P ZSM. non-repetitive peak reverse power dissipation
Rev. 5 26 January 2011 Product data sheet 1. Product profile 1.1 General description Low-power voltage regulator diodes in small hermetically sealed glass SOD80C Surface-Mounted Device (SMD) packages.
More informationPMEG6045ETP. 1. General description. 2. Features and benefits. 3. Applications. 4. Quick reference data
28 May 28 Product data sheet. General description Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in a
More informationIn data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.
Important notice Dear Customer, On 7 February 207 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic
More information20 ma LED driver in SOT457
in SOT457 Rev. 1 December 2013 Product data sheet 1. Product profile 1.1 General description LED driver consisting of resistor-equipped PNP transistor with two diodes on one chip in an SOT457 (SC-74) plastic
More information65 V, 100 ma NPN general-purpose transistors
Rev. 8 24 April 2012 Product data sheet 1. Product profile 1.1 General description NPN general-purpose transistors in Surface-Mounted Device (SMD) plastic packages. Table 1. Product overview Type number
More informationDISCRETE SEMICONDUCTORS DATA SHEET. BFS17W NPN 1 GHz wideband transistor. Product specification Supersedes data of November 1992.
DISCRETE SEMICONDUCTORS DATA SHEET Supersedes data of November 1992 1995 Sep 4 APPLICATIONS Primarily intended as a mixer, oscillator and IF amplifier in UHF and VHF tuners. DESCRIPTION Silicon NPN transistor
More informationPTVS12VZ1USK. 1. General description. 2. Features and benefits. 3. Applications. 4. Quick reference data
Transient voltage suppressor in DSN168-2 for mobile applications 22 August 216 Product data sheet 1. General description Unidirectional Transient Voltage Suppressor (TVS) in a very small leadless DSN168-2
More informationIn data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.
Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic
More informationWide working voltage range: nominal 2.4 V to 75 V (E24 range) Two tolerance series: ± 2 % and ± 5 % AEC-Q101 qualified
Rev. 1 29 May 2018 Product data sheet 1 Product profile 1.1 General description General-purpose Zener diodes in an SOT323 (SC-70) leadless very small Surface- Mounted Device (SMD) plastic package. 1.2
More informationHigh-speed switching diodes. Type number Package Configuration Package Nexperia JEITA JEDEC
Rev. 8 18 November 2010 Product data sheet 1. Product profile 1.1 General description, encapsulated in small Surface-Mounted Device (SMD) plastic packages. Table 1. Product overview Type number Package
More informationES_LPC1114. Errata sheet LPC1114. Document information
Rev. 2 15 November 2010 Errata sheet Document information Info Keywords Abstract Content LPC1114 errata This errata sheet describes both the known functional problems and any deviations from the electrical
More informationPMEG40T50EP. 1. General description. 2. Features and benefits. 3. Applications. 4. Quick reference data
9 August 207 Product data sheet. General description Trench Maximum Efficiency General Application (MEGA) Schottky barrier rectifier encapsulated in a CFP5 (SOD28) small and flat lead Surface-Mounted Device
More informationPMEG3002AESF. 30 V, 0.2 A low VF MEGA Schottky barrier rectifier. Table 1. Quick reference data Symbol Parameter Conditions Min Typ Max Unit
March 27 Product data sheet. General description Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection in a DSN63-2 (SOD962-2)
More informationIn data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.
Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic
More informationBCP55; BCX55; BC55PA
Rev. 8 24 October 2 Product data sheet. Product profile. General description NPN medium power transistor series in Surface-Mounted Device (SMD) plastic packages. Table. Product overview Type number []
More informationPESD5V0F1BSF. 1. Product profile. 2. Pinning information. Extremely low capacitance bidirectional ESD protection diode. 1.1 General description
Rev. 1 10 December 2012 Product data sheet 1. Product profile 1.1 General description Extremely low capacitance bidirectional ElectroStatic Discharge (ESD) protection diode in a DSN0603-2 (SOD962) leadless
More informationLow voltage rectification High efficiency DC-to-DC conversion Switch mode power supply Reverse polarity protection Low power consumption application
4 March 23 Product data sheet. General description Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in a
More informationPDTC143Z series. NPN resistor-equipped transistors; R1 = 4.7 k, R2 = 47 k
PDTC4Z series NPN resistor-equipped transistors; R = 4.7 k, R2 = 47 k Rev. 8 5 December 20 Product data sheet. Product profile. General description NPN Resistor-Equipped Transistor (RET) family in Surface-Mounted
More informationIn data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.
Important notice Dear Customer, On 7 February 207 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic
More informationGeneral regulation functions ElectroStatic Discharge (ESD) ultra high-speed switching High-frequency applications
Rev. 4 23 March 2018 Product data sheet 1 Product profile 1.1 General description General-purpose Zener diodes in an SOD882 (DFN1006-2) leadless ultra small Surface- Mounted Device (SMD) plastic package.
More informationSingle Zener diodes in a SOD123 package
Rev. 1 16 March 2017 Product data sheet 1 Product profile 1.1 General description General-purpose Zener diodes in a SOD123 small Surface-Mounted Device (SMD) plastic package. 1.2 Features and benefits
More informationBAV756S; BAW56 series
Rev. 6 8 March 205 Product data sheet. Product profile. General description, encapsulated in small Surface-Mounted Device (SMD) plastic packages. Table. Product overview Type number Package Package Configuration
More informationUltra compact transient voltage supressor
23 March 218 Product data sheet 1. General description Transient voltage supressor in a DFN16-2 (SOD882) ultra small and leadless Surface-Mounted Device (SMD) package designed to protect one line against
More informationESD protection for In-vehicle network lines in automotive enviroments CAN LIN FlexRay SENT
8 November 217 Product data sheet 1. General description ESD protection device in a small SOD323 (SC-76) Surface-Mounted Device (SMD) plastic package designed to protect automotive In-vehicle network bus
More informationIn data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.
Important notice Dear Customer, On 7 February 207 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic
More informationIn data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.
Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic
More informationAN NHS3xxx Temperature sensor calibration. Document information
Rev. 2 12 September 2016 Application note Document information Info Keywords Abstract Content Temperature sensor, calibration This application note describes the user calibration of the temperature sensor.
More informationDISCRETE SEMICONDUCTORS DATA SHEET. book, halfpage MBD128. BGA2022 MMIC mixer Dec 04. Product specification Supersedes data of 2000 Jun 06
DISCRETE SEMICONDUCTORS DATA SHEET book, halfpage MBD128 Supersedes data of 2000 Jun 0 2000 Dec 0 FEATURES PINNING Large frequency range: Cellular band (900 MHz) PCS band (1900 MHz) WLAN band (2. GHz)
More information