D (double) Package type descriptive code HSOP44. HSOP (heatsink small outline package) Package body material type. P (plastic) Mounting method type
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1 HSOP44 plastic, heatsink small outline package; 44 leads; low standoff height, mm pitch, 15.9 mm x ugust 2018 Package information 1 Package summary Terminal position code D (double) Package type descriptive code HSOP44 Package type industry code HSOP44 Package style descriptive code HSOP (heatsink small outline package) Package body material type P (plastic) Mounting method type S (surface mount) Issue date Manufacturer package code SOT1131 Table 1. Package summary Parameter Min Nom Max Unit package length mm package width mm seated height mm package height mm nominal pitch - - mm actual quantity of termination
2 2 Package outline HSOP44: plastic, heatsink small outline package; 44 leads; low stand-off height E D x c y E 2 X H E v D 1 D pin 1 index Q E ( 3 ) θ L p detail X Z e b p w y Z θ Dimensions mm scale Unit b p c D (1) D 1 D 2 E (1) E 1 E 2 e H E L p Q v w x mm max nom min Note 1. Plastic or metal protrusions of mm maximum per side are not included sot1131-1_po Outline version References IEC JEDEC JEIT European projection Issue date Figure 1. Package outline HSOP44 () ll information provided in this document is subject to legal disclaimers. NXP B.V ll rights reserved. Package information 21 ugust / 5
3 3 Soldering Footprint information for reflow soldering of TSOP44 package Hx Gx P2 (0.125) Hy Gy By y C D2 (4x) P1 D1 X solder paste deposit solder land plus solder paste occupied area detail X DIMENSIONS in mm P1 P2 y By C D1 D2 Gx Gy Hx Hy sot1131-1_fr Figure 2. Reflow soldering footprint for HSOP44 () ll information provided in this document is subject to legal disclaimers. NXP B.V ll rights reserved. Package information 21 ugust / 5
4 4 Legal information Disclaimers Limited warranty and liability Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. ll information provided in this document is subject to legal disclaimers. NXP B.V ll rights reserved. Package information 21 ugust / 5
5 Contents 1 Package summary Package outline Soldering Legal information...4 NXP B.V ll rights reserved. For more information, please visit: For sales office addresses, please send an to: salesaddresses@nxp.com Date of release: 21 ugust 2018
D (double) Package type descriptive code. HSOP36 Package type industry code. HSOP36 Package style descriptive code
plastic, heatsink small outline package; 36 leads; low standoff height, mm pitch, 11 mm x 15.9 mm 21 ugust 2018 Package information 1 Package summary Terminal position code D (double) Package type descriptive
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More informationIn data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.
Important notice Dear Customer, On 7 February 27 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic and
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More informationIn data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.
Important notice Dear Customer, On 7 February 27 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic and
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More informationIn data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.
Important notice Dear Customer, On 7 February 207 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic
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