RClamp2451ZA. Ultra Small RailClamp 1-Line, 24V ESD Protection

Transcription

1 - RailClamp Dscription RailClamp TVS diods ar ultra low capacitanc dvics dsignd to protct snsitiv lctronics from damag or latch-up du to ESD, EFT, and EOS. Thy ar dsignd for us on high spd ports in applications such as cll phons, notbook computrs, and othr portabl lctronics. Ths dvics offr dsirabl charactristics for board lvl protction including fast rspons tim, low oprating and clamping voltag, and no dvic dgradation. RClamp 2451ZA is spcifically dsignd for protction of Nar Fild Communications (NFC) intrfacs. It faturs xtrmly good ESD protction charactristics including a low typical dynamic rsistanc of 0.16 Ohms (typical), low pak ESD clamping voltag, and high ESD withstand voltag (+/-14kV contact pr IEC ). Low typical capacitanc (0.35pF at VR=0V) mans that will not crat harmonic distortion in th RF signal. This dvic is bidirctional and has a working voltag of 24V for us on NFC rsonator circuits without signal clipping. is in a 2-pin SLP0603P2X3F packag masuring 0.6 x 0.3 mm with a nominal hight of 0.25mm. Lads ar finishd with lad-fr NiAu. Th combination of working voltag, low dynamic rsistanc, and low capacitanc maks this dvic idal for us on NFC antnna ciruits, RF signal lins, and FM antnnas in portabl dvics. Ultra Small RailClamp 1-Lin, 24V ESD Protction Faturs High ESD withstand Voltag: +/-14kV (Contact) and +/- 18kV (Air) pr IEC Abl to withstand ovr 1000 ESD striks pr IEC Lvl 4 Ultra-small packag ag Protcts on high spd data lin Working voltag: +/- 24V Low capacitanc: 0.35pF typical Low dynamic rsistanc: 0.16 Ohms (Typ) Low ESD clamping voltag Solid-stat silicon-avalanch tchnology Mchanical Charactristics SLP0603P2X3F Packag Pb-Fr, Halogn Fr, RoHS/WEEE Compliant Nominal Dimnsions: 0.6 x 0.3 x 0.25 mm Lad Finish: NiAu Marking: Marking Cod Packaging: Tap and Rl Applications Nar Fild Communication (NFC) lins RF signal lins FM Antnna Nominal Dimnsions Schmatic BSC Nominal Dimnsions (in mm) SLP0603P2X3F (Bottom Viw) Rvision 10/23/ This datasht has bn downloadd from at this pag

2 Absolut Maximum Rating Rating Symbol Valu Units Pak Puls Powr (tp = 8/20μs) M aximum Pak Puls Currnt ( tp = 8/20μs) P pk 60 Watts I pp 3 Amps ESD pr IEC (Air) SD pr IEC (Contact) E 1 V ESD +/- 18 +/- 14 kv Oprating Tmpratur T J -40 to +85 C Storag Tmpratur T STG 55 to C Elctrical Charactristics (T=25 o C) Paramtr Symbol Conditions Minimum Typical Maximum Units Rvrs Stand-Off Voltag V WM R in 1 to 2 or 2 to 1 P 24 V Brakdown Voltag V BR I BR = 10μ A V Rvrs Lakag Currnt I R V RWM = 24V, T=25 C Pin 1 to 2 or 2 to 1 2 ESD Clamping Voltag V C I P P = 4A, tlp = 0.2/100ns 2 ESD Clamping Voltag V C I P P = 16A, tlp = 0.2/100ns < 1 50 na 5 V 7 V, 3 Dynamic Rsistanc 2 R tp = 0.2/100n s 0.16 Ohms D Junction Capacitanc C j V R = 0V, f = 1MHz pf Nots 1)ESD gun rturn path connctd to ESD ground rfrnc plan. 2)Transmission Lin Puls Tst (TLP) Sttings: t p = 100ns, t r = 0.2ns, I TLP and V TLP avraging window: t 1 = 70ns to t 2 = 90ns. 3) Dynamic rsistanc calculatd from I TLP = 4A to I TLP = 16A 2014 Smtch Corporation 2

3 Typical Charactristics ESD Clamping (+8kV Contact pr IEC ) ESD Clamping (-8kV Contact pr IEC ) Masurd with 50 Ohm scop input impdanc, 2GHz bandwidth. Corrctd for 50 Ohm, 20dB attnuator. ESD gun rturn path connctd to ESD ground plan Clamping Voltag - V C (V) Tim (ns) Clamping Voltag - V C (V) Masurd with 50 Ohm scop input impdanc, 2GHz bandwidth. Corrctd for 50 Ohm, 20dB attnuator. ESD gun rturn path connctd to ESD ground plan Tim (ns) TLP Charactristic (Positiv) TLP Charactristic (Ngativ) Transmission Lin Puls Tst (TLP) Sttings: t p = 100ns, t r = 0.2ns, I TLP and V TLP avraging window: t 1 = 70ns to t 2 = 90ns TLP Currnt (A) TLP Currnt (A) Transmission Lin Puls Tst (TLP) Sttings: t p = 100ns, t r = 0.2ns, I TLP and V TLP avraging window: t 1 = 70ns to t 2 = 90ns Clamping Voltag (V) Clamping Voltag (V) Junction Capacitanc vs. Rvrs Voltag Typical Insrtion Loss (S21) Junction Capacitanc - C J (pf) f = 1MHz Voltag (V) Frquncy (GHz) 2014 Smtch Corporation 3 Loss (db)

4 Applications Information ESD Protction of NFC Intrfacs Th Nar Fild Communication (NFC) antnna is usually connctd to th NFC controllr IC via contact points on th phon. Ths contact points ar usr accssabl and thrfor may b subjctd to ESD striks. Extrnal protction (TVS) dvics should b placd btwn th antnna and th NFC chip intrfac. Th working voltag of th TVS should b high nough as not to clip th NFC signal. Additionally, th capacitanc of th dvic should b minimizd in ordr to avoid harmonic distortion of th RF signal. mts ths rquirmnts and also faturs xtrmly low dynamic rsistanc (<0.1 Ohms) rsulting in low ESD clamping voltag. Th low dynamic rsistanc also hlps insur protction for Schottky diods that may b usd in th NFC circuit. is dsignd to work on NFC circuits with AC signals as high as 24V. An xampl protction ciruit using is shown blow in Figur 1. RX+ RX- TX+ EMI Filtr Ckt Antnna Matching Ckt Antnna+ NFC Controllr GND TX- EMI Filtr Ckt Antnna Matching Ckt Antnna - REC R C Figur 1 - NFC Protction Exampl 2014 Smtch Corporation 4

5 Applications Information Assmbly Guidlins Th small siz of this dvic mans that som car must b takn during th mounting procss to insur rliabl soldr joints. Th figur at th right dtails Smtch s rcommndd aprtur basd on th assmbly guidlins dtaild in th tabl blow. Not that ths ar only rcommndations and should srv only as a starting point for dsign sinc thr ar many factors that affct th assmbly procss. Exact manufacturing paramtrs will rquir som xprimntation to gt th dsird soldr application Assmbly Soldr Paramtr Stncil Dsign Rcommndation Lasr cut, Elctro-polish d Aprtur shap Rctangular with roundd cornrs S oldr Stncil Thicknss mm (0.004") Soldr Past Typ Typ 4 siz sphr or smallr Soldr Rflow Profil Pr JEDEC J-STD-020 Land Pad Stncil opning Componnt Rcommndd Mounting Pattrn PCB PCB Soldr Pad Dsign Pad Finish Non-Soldr mask dfind OSP OR NiAu 2014 Smtch Corporation 5

6 Outlin Drawing - SLP0603P2X3F A aaa C A1 D TOP VIEW /2 B E A C R0.025 TYP SEATING PLANE DIMENSIONS DIM MILLIMETERS MIN NOM MAX A A b D E BSC L N 2 aaa 0.08 bbb 0.10 bxn bbb C A B 2X L BOTTOM VIEW NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). Land Pattrn - SLP0603P2X3F DIMENSIONS (C) G Z DIM MILLIMETERS C (0.385) G X Y Z Y X NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES ). 2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY 'S MANUFACTURING GUIDELINES ARE MET Smtch Corporation 6

7 Marking Cod Ordring Information Part Numbr Qty pr Rl Pockt Pitch Rl Siz TFT 15,000 2mm 7 Inch Nots: RailClamp and RClamp ar tradmarks of Smtch Corporation Not: Dvic is lctrically symmtrical Carrir Tap Spcification Dvic Orintation in Tap 2014 Smtch Corporation 7

8 Contact Information for Smtch Intrnational AG Taiwan Branch Tl: Fax: Kora Branch Tl: Fax: Shanghai Offic Tl: Fax: Japan Offic (Osaka) Tl: Fax: Smtch Intrnational AG is a wholly-ownd subsidiary of Smtch Corporation, which has its hadquartrs in th U.S.A. Japan (Tokyo) Offic Tl: Fax: Smtch Limitd (U.K.) Tl: Fax: Smtch Franc SARL Tl: 33-(0) Fax: 33-(0) Smtch Grmany GmbH Tl: 49-(0) Fax: 49-(0) Smtch Corporation 8