March 4-7, 2018 Hilton Phoenix / Mesa Hotel Mesa, Arizona Archive
|
|
- Abner Hopkins
- 5 years ago
- Views:
Transcription
1 March 4-7, 2018 Hilton Phoenix / Mesa Hotel Mesa, Arizona Archive 2018 BiTS Workshop Image: pilgrims49 / istock
2 COPYRIGHT NOTICE The presentation(s)/poster(s) in this publication comprise the Proceedings of the 2018 BiTS Workshop. The content reflects the opinion of the authors and their respective companies. They are reproduced here as they were presented at the 2018 BiTS Workshop. This version of the presentation or poster may differ from the version that was distributed in hardcopy & softcopy form at the 2018 BiTS Workshop. The inclusion of the presentations/posters in this publication does not constitute an endorsement by BiTS Workshop or the workshop s sponsors. There is NO copyright protection claimed on the presentation/poster content by BiTS Workshop. However, each presentation/poster is the work of the authors and their respective companies: as such, it is strongly encouraged that any use reflect proper acknowledgement to the appropriate source. Any questions regarding the use of any materials presented should be directed to the author(s) or their companies. The BiTS logo and are trademarks of BiTS Workshop. All rights reserved.
3 Life Cycles of Sockets; Specification vs Reality and Setting Standards Texas Instruments James Tong Conference Ready mm/dd/2014 BiTS Workshop March 4-7, 2018
4 TI Contactor Strategy Pass/Fail Criteria: > Life of 1M insertions,1 pins for all pitch by package type Electrical Mis-contact reliability DC (Open/Shorts) ofirst Pass conti% oyield recovery from Conti test Frist Pass yield Func-Para failures orf or speed related test Others Temperature performance Mechanical Force? Do we care if it performs the test Tip wear? Do we care if it does not affects the yield (electrical and mechanical) Package witness marks No physical damage to DUT pad or ball Alignment features - alignment of contact affecting potential VM rejects/electrical performance Contactor Live Cycles Panel Session Texas Instruments 2
5 Supplier Socket Self-Evaluation Methodology Equipment for METS Test Standard contactor vendor test equipment FReD tester, Contactor cycler, Power suppliers, offline measurement tools, Infrared camera, network analyzer and contactor checker or OQC tools Tester/Handler with actual devices Emulating test application as best as possible Pin specification Cost Pin and contactor METS test 1M Cres test at temp Mechanical test: scrub wear test, Cu expose test Vendor Self Qualification Prototype Checkout Build prototype contactor/s for engineering evaluation Prove RF/Speed characteristic of solution Small sample run to reduce risk at production qualification phase Multiple samples of contactor to prove lifetime (Cres) and other spec envelop Temperature, Current, Speed/RF test performance Maintenance learning Production Qualification Contactor Live Cycles Panel Session Texas Instruments 3
6 The Not-Me-Too Supplier Product distinction Cres stability Pin structure design, Plunger material and hardness, Spring material and characteristic Temperature, current, plating of plunger and barrel if applicable Support distinction Application support from supplier Hot switching, Residual electrical charge handling, Current load sharing and distribution Standardization Current carrying capability using METS Insertions life expectancy base on test application Compress pin height Common test guide line of specifying solution for high speed broadband and/or RF test needs Santa s List Contactor Live Cycles Panel Session Texas Instruments 4
March 4-7, 2018 Hilton Phoenix / Mesa Hotel Mesa, Arizona Archive
March 4-7, 2018 Hilton Phoenix / Mesa Hotel Mesa, Arizona Archive 2018 BiTS Workshop Image: pilgrims49 / istock COPYRIGHT NOTICE The presentation(s)/poster(s) in this publication comprise the Proceedings
More informationMarch 4-7, 2018 Hilton Phoenix / Mesa Hotel Mesa, Arizona Archive
March 4-7, 2018 Hilton Phoenix / Mesa Hotel Mesa, Arizona Archive 2018 BiTS Workshop Image: pilgrims49 / istock COPYRIGHT NOTICE The presentation(s)/poster(s) in this publication comprise the Proceedings
More informationMarch 5-8, 2017 Hilton Phoenix / Mesa Hotel Mesa, Arizona Archive Session 1
March 5-8, 2017 Hilton Phoenix / Mesa Hotel Mesa, Arizona Archive Session 1 2017 BiTS Workshop Image: tonda / istock Copyright Notice The presentation(s)/poster(s) in this publication comprise the Proceedings
More informationMarch 5-8, 2017 Hilton Phoenix / Mesa Hotel Mesa, Arizona Archive Session 8
March 5-8, 2017 Hilton Phoenix / Mesa Hotel Mesa, Arizona Archive Session 8 2017 BiTS Workshop Image: tonda / istock Copyright Notice The presentation(s)/poster(s) in this publication comprise the Proceedings
More informationMarch 4-7, 2018 Hilton Phoenix / Mesa Hotel Mesa, Arizona Archive
March 4-7, 2018 Hilton Phoenix / Mesa Hotel Mesa, Arizona Archive 2018 BiTS Workshop Image: pilgrims49 / istock COPYRIGHT NOTICE The presentation(s)/poster(s) in this publication comprise the Proceedings
More informationMarch 4-7, 2018 Hilton Phoenix / Mesa Hotel Mesa, Arizona Archive
March 4-7, 2018 Hilton Phoenix / Mesa Hotel Mesa, Arizona Archive 2018 BiTS Workshop Image: pilgrims49 / istock COPYRIGHT NOTICE The presentation(s)/poster(s) in this publication comprise the Proceedings
More informationMarch 5-8, 2017 Hilton Phoenix / Mesa Hotel Mesa, Arizona Archive Session 3
March 5-8, 2017 Hilton Phoenix / Mesa Hotel Mesa, Arizona Archive Session 3 2017 BiTS Workshop Image: tonda / istock Copyright Notice The presentation(s)/poster(s) in this publication comprise the Proceedings
More informationMarch 4-7, 2018 Hilton Phoenix / Mesa Hotel Mesa, Arizona Archive
March 4-7, 2018 Hilton Phoenix / Mesa Hotel Mesa, Arizona Archive 2018 BiTS Workshop Image: pilgrims49 / istock COPYRIGHT NOTICE The presentation(s)/poster(s) in this publication comprise the Proceedings
More informationOctober Suzhou - Shenzhen, China. Archive TestConX - Image: Breath10/iStock
October 23-25 2018 Suzhou - Shenzhen, China Archive 2018 TestConX - Image: Breath10/iStock COPYRIGHT NOTICE The presentation(s)/poster(s) in this publication comprise the Proceedings of the 2018 TestConX
More informationMarch 6-9, 2016 Hilton Phoenix / Mesa Hotel Mesa, Arizona Archive- Session 8
Proceedings Archive March 6-9, 2016 Hilton Phoenix / Mesa Hotel Mesa, Arizona Archive- Session 8 2016 BiTS Workshop Image: Stiop / Dollarphotoclub Proceedings Archive Presentation / Copyright Notice The
More informationMarch 4-7, 2018 Hilton Phoenix / Mesa Hotel Mesa, Arizona Archive
March 4-7, 2018 Hilton Phoenix / Mesa Hotel Mesa, Arizona Archive 2018 BiTS Workshop Image: pilgrims49 / istock COPYRIGHT NOTICE The presentation(s)/poster(s) in this publication comprise the Proceedings
More informationMarch 6-9, 2016 Hilton Phoenix / Mesa Hotel Mesa, Arizona Archive- Session 4
Proceedings Archive March 6-9, 2016 Hilton Phoenix / Mesa Hotel Mesa, Arizona Archive- Session 4 2016 BiTS Workshop Image: Stiop / Dollarphotoclub Proceedings Archive Presentation / Copyright Notice The
More informationTuesday 3/11/14 1:30pm
Tuesday 3/11/14 1:30pm SOCKETS WITH INTEGRITY High frequency signal and power integrity with sockets are essential to successful package testing. The opening presenter shares first-hand experience pairing
More informationProceedings. BiTS Shanghai October 21, Archive - Session BiTS Workshop Image: Zhu Difeng/Dollar Photo Club
Proceedings Archive - Session 2 2015 BiTS Workshop Image: Zhu Difeng/Dollar Photo Club Proceedings With Thanks to Our Sponsors! Premier Honored Distinguished Publication Sponsor 2 Proceedings Presentation
More informationARCHIVE Simple and Effective Contact Pin Geometry Bert Brost, Marty Cavegn Nuwix Technologies
T H I R T E E N T H A N N U A L ARCHIVE MAKING CONTACT For many socket and probe card manufacturers the pins are the secret sauce, especially when performing burn-in and test on today's devices that have
More informationARCHIVE Contactor Selection Criteria Overview for RF Component Testing James Migliaccio, Ph.D RF Microdevices
ARCHIVE 2008 SOCKETS: ON THE FLOOR, IN THE LAB Contactor Selection Criteria Overview for RF Component Testing James Migliaccio, Ph.D RF Microdevices Design Optimized, Manufacturing Limited - A 250W Thermal
More informationProceedings. BiTS Shanghai October 21, Archive - Session BiTS Workshop Image: Zhu Difeng/Dollar Photo Club
Proceedings Archive - Session 1 2015 BiTS Workshop Image: Zhu Difeng/Dollar Photo Club Proceedings With Thanks to Our Sponsors! Premier Honored Distinguished Publication Sponsor 2 Proceedings Presentation
More informationArchive 2017 BiTS Workshop- Image: Easyturn/iStock
Archive September 6-7, 2017 InterContinental Shanghai Pudong Hotel - Shanghai, China Archive 2017 BiTS Workshop- Image: Easyturn/iStock September 6-7, 2017 Archive COPYRIGHT NOTICE This multimedia file
More information50um In-line Pitch Vertical Probe Card
June 7-10, 2009 San Diego, CA 50um In-line Pitch Vertical Probe Card Author: John Wolfe Texas Instruments-EBT Co-Authors: Norman Armendariz, PhD and James Tong Texas Instruments-MTI Sato-San Minoru and
More informationMultiple Four Sided, Fine Pitch, Small Pad Devices
1 2000 SouthWest Test Workshop A Method for Probing... Multiple Four Sided, Fine Pitch, Small Pad Devices... using Cantilever Probes Presented by: Louis Molinari Director of Engineering (480) 333-1579
More informationAries. QFP microstrip socket. prepared by. Gert Hohenwarter. DC Measurement Results
Aries QFP microstrip socket DC Measurement Results prepared by Gert Hohenwarter 2/5/2005 1 Table of Contents TABLE OF CONTENTS... 2 OBJECTIVE... 3 METHODOLOGY... 3 Test procedures... 4 Setup... 4 MEASUREMENTS...
More informationARCHIVE 2012 ANALYZE THIS
T H I R T E E N T H A N N U A L ARCHIVE ANALYZE THIS What good is it to have optimized test devices if the characterization and analysis processes aren't up to speed as well? This session focuses on the
More informationARCHIVE Automated Topside and Bottomside Testing of POP Packages on a Robotic Handler Eric Pensa, Willie Jerrels Texas Instruments
ARCHIVE 2008 KEY CHALLENGES AND TECHNOLOGY TRENDS IN SOCKET DESIGN Automated Topside and Bottomside Testing of POP Packages on a Robotic Handler Eric Pensa, Willie Jerrels Texas Instruments High Speed
More informationWafer Scale Contactor Development and Deployment
San Diego, CA Wafer Scale Contactor Development and Deployment Jim Brandes Contactor Products Outline Probe Development Emergence of Wf Wafer Level ltest Engagement to Develop WL Contactors Field Deployment
More information3D-MEMS Probe for Fine Pitch Probing
3D-MEMS Probe for Fine Pitch Probing Ryuichiro Mori R&D Japan Electronic Materials Corp. 2007 IEEE SW Test Workshop 1 Presentation Overview 1. Introduction JEM product overview 2. Objectives Challenges
More informationA Solution of Test, Inspection and Evaluation for Blind Signal Waveform on a Board
A Solution of Test, Inspection and Evaluation for Blind Signal Waveform on a Board Tatsumi Watabe, Makoto Kawamura, & Hiroyuki Yamakoshi S.E.R. Corporation Conference Ready mm/dd/2014 2016 BiTS Workshop
More informationInternational SEMATECH Wafer Probe Benchmarking Project WAFER PROBE ROADMAP. Guidance For Wafer Probe R&D Resources Edition
International SEMATECH Wafer Probe Benchmarking Project WAFER PROBE ROADMAP Guidance For Wafer Probe R&D Resources 2002 Edition Fred Taber, IBM Microelectronics Probe Project Chair Gavin Gibson, Infineon
More informationMarch 6-9, 2016 Hilton Phoenix / Mesa Hotel Mesa, Arizona Archive- Session 8
Proceedings Archive March 6-9, 2016 Hilton Phoenix / Mesa Hotel Mesa, Arizona Archive- Session 8 2016 BiTS Workshop Image: Stiop / Dollarphotoclub Proceedings Archive Presentation / Copyright Notice The
More informationWLCSP xwave for high frequency wafer probe applications
WLCSP xwave for high frequency wafer probe applications Xcerra Corporation Overview Introduction / Background cmwave and mmwave Market/applications and xwave Objectives / Goals Move from package test to
More informationTOWARDS THE FINE PITCH
TOWARDS THE FINE PITCH CONSTRAINTS AND METHODOLOGY CROLLES PLANT G PERSICO / D PAPAZIAN / R MILESI STMicroelectronics ST CONTACTS WRITERS FONCTION TEL email PART Geraldine PERSICO Probe card Engineer 33476925431
More informationChallenges and More Challenges SW Test Workshop June 9, 2004
Innovating Test Technologies Challenges and More Challenges SW Test Workshop June 9, 2004 Cascade Microtech Pyramid Probe Division Ken Smith Dean Gahagan Challenges and More Challenges Probe card requirements
More informationAries. CSP center probe socket. prepared by. Gert Hohenwarter. DC Measurement Results
Aries CSP center probe socket DC Measurement Results prepared by Gert Hohenwarter 8/6/2004 1 Table of Contents TABLE OF CONTENTS... 2 OBJECTIVE... 3 METHODOLOGY... 3 Test procedures... 4 Setup... 4 MEASUREMENTS...
More informationMEMS process on RF Probe Cards. Yock Hsu, James Wang, Alex Wei, Fred Chou, Adolph Cheng
MEMS process on RF Probe Cards Yock Hsu, James Wang,, Fred Chou, Adolph Cheng Overview Objectives Introduction Application Summary 2 Overview Objectives Introduction Application Summary 3 Objectives High
More informationRevolutionary new C4 Wafer test probing technologies
Ethan Caughey & Roy Swart Intel Corporation Revolutionary new C4 Wafer test probing technologies 2007 San Diego, CA USA Outline Motivation for looking at new technologies Technical wall Commercial wall
More informationMS25 OPERATION MANUAL
SAFETY INSTRUCTIONS SPECIFICATIONS OPERATING INSTRUCTIONS MAINTENANCE ADJUSTMENTS REPLACEMENT OF PARTS MS25 DIAGRAM MS25 PARTS LIST MS25 OPERATION MANUAL SAFETY INSTRUCTIONS Please read these instructions
More informationModel C2327J5003AHF Rev D
Model C2327J53AHF Ultra Low Profile 85 3 db, 9 Hybrid Coupler Description The C2327J53AHF is a low cost, low profile sub-miniature high performance 3 db coupler in an easy to use surface mount package.
More informationImproved ON-resistance Measurement at Wafer Probe using a "DARUMA" stage
Improved ON-resistance Measurement at Wafer Probe using a "DARUMA" stage Masatomo TAKAHASHI ACCRETECH, Japan Nobuyuki TOYODA TESEC, Japan Background Trend of MOSFET Overview Solution DARUMA Transition
More informationProduct Specification PE42520
PE42520 Product Description The PE42520 SPDT absorptive RF switch is designed for use in Test/ATE and other high performance wireless applications. This broadband general purpose switch maintains excellent
More informationAries CSP microstrip socket Cycling test
Aries CSP microstrip socket Cycling test RF Measurement Results prepared by Gert Hohenwarter 2/18/05 1 Table of Contents TABLE OF CONTENTS... 2 OBJECTIVE... 3 METHODOLOGY... 3 Test procedures... 6 Setup...
More informationModel C1517J5003AHF. Ultra Low Profile db, 90 Hybrid Coupler
Model C57J53AHF Ultra Low Profile 85 3 db, 9 Hybrid Coupler Description The C57J53AHF is a low cost, low profile sub-miniature high performance 3 db coupler in an easy to use surface mount package. The
More informationOperation of Microwave Precision Fixed Attenuator Dice up to 40 GHz
Operation of Microwave Precision Fixed Attenuator Dice up to 40 GHz (AN-70-019) I. INTRODUCTION Mini-Circuits YAT-D-series MMIC attenuator dice (RoHS compliant) are fixed value, absorptive attenuators
More informationARCHIVE Brandon Prior Senior Consultant Prismark Partners ABSTRACT
ARCHIVE 2010 LOW COST, SMALL FORM FACTOR PACKAGING by Brandon Prior Senior Consultant Prismark Partners W ABSTRACT hile size reduction and performance improvement are often the drivers of new package and
More informationMonolithic Amplifier Die
Flat Gain, Ultra-Wideband Monolithic Amplifier Die 50Ω 0.01 to 12 GHz The Big Deal Ultra broadband performance Outstanding Gain flatness, ±0.7 db over 0.05 to 6 GHz Broadband high dynamic range without
More informationEnabling High Parallelism in Production RF Test
Enabling High Parallelism in Production RF Test Patrick Rhodes Ryan Garrison Ram Lakshmanan FormFactor Connectivity is Driving Change The connected world is driving the growth of RFICs in the market. These
More informationModel C0810J5003AHF. Ultra Low Profile db, 90 Hybrid Coupler
Model C81J53AHF Ultra Low Profile 85 3 db, 9 Hybrid Coupler Description The C81J53AHF is a low cost, low profile sub-miniature high performance 3 db coupler in an easy to use surface mount package. It
More informationTrademark. Guidelines/
Trademark Guidelines/ - LEGO IP rights The LEGO Group owns all rights and intellectual property rights in and to the LEGO SERIOUS PLAY methodology as well as LEGO SERIOUS PLAY materials, including, without
More informationAmbient Weather EZ Weather Station Tripod and Mast Assembly for AcuRite Weather Stations User Manual
Ambient Weather EZ-48-100 Weather Station Tripod and Mast Assembly for AcuRite Weather Stations User Manual Table of Contents 1. Introduction... 1 2. Accessories... 1 3. Parts... 2 4. Warnings... 2 5.
More informationHigh Current Pin and Socket Contacts 31 JUL 13 Rev C
Application Specification High Current Pin and Socket Contacts 31 JUL 13 NOTE NOTE i All numerical values are in metric units [with U.S. customary units in brackets]. Dimensions are in millimeters [and
More informationReliability Qualification Report
CGA-3318 - SnPb Plated CGA-3318Z - Matte Sn, RoHS Compliant The information provided herein is believed to be reliable at press time. Sirenza Microdevices assumes no responsibility for inaccuracies or
More informationFeatures. Specifications. Notes: Package marking provides orientation and identification 53 = Device Code X = Month of Manufacture = Pin 1
AVT-53663 DC 6000 MHz InGaP HBT Gain Block Data Sheet Description Avago Technologies AVT-53663 is an economical, easyto-use, general purpose InGaP HBT MMIC gain block amplifier utilizing Darlington pair
More informationAP MODULE FOR PNEUMATIC CRIMP TOOLS
SEE PAGE FOR IMPORTANT INFORMATION CONCERNING LIMITED WARRANTY, AND LIMITATION OF LIABILITY AP MODULE SYSTEM AIR SUPPLY FITTING SIDE KNOB QA MODULE (POSITIONER) (SOLD SEPARATELY) GAGING BUTTON (SSQA SERIES
More informationAries Kapton CSP socket Cycling test
Aries Kapton CSP socket Cycling test RF Measurement Results prepared by Gert Hohenwarter 10/21/04 1 Table of Contents TABLE OF CONTENTS... 2 OBJECTIVE... 3 METHODOLOGY... 3 Test procedures... 5 Setup...
More informationAries Kapton CSP socket
Aries Kapton CSP socket Measurement and Model Results prepared by Gert Hohenwarter 5/19/04 1 Table of Contents Table of Contents... 2 OBJECTIVE... 3 METHODOLOGY... 3 Test procedures... 4 Setup... 4 MEASUREMENTS...
More informationAre You Really Going to Package That? Ira Feldman Debbora Ahlgren
Are You Really Going to Package That? Ira Feldman Debbora Ahlgren Feldman Engineering Corp. Outline Situation Cost of Test New Paradigm Probe Card Cost Drivers Computational Evolution New Approaches Conclusion
More informationA Standardized Geometry For Space Access Ports
A Standardized Geometry For Space Access Ports A New Standard for 6 and 12U CubeSat Components 21 APRIL 2016 DOV JELEN, PUMPKIN, INC 1 History : Early Standards CubeSat Design Specification (CDS) from
More information1. Exceeding these limits may cause permanent damage.
Silicon PIN Diode s Features Switch & Attenuator Die Extensive Selection of I-Region Lengths Hermetic Glass Passivated CERMACHIP Oxide Passivated Planar s Voltage Ratings to 3000V Faster Switching Speed
More informationTactile Switch. Ordering Information. A Wide Range of Models: 6 x 6 mm, 12 x 12 mm, Vertical, and High-force.
Tactile Switch A Wide Range of Models: 6 x 6 mm, 12 x 12 mm, Vertical, and High-force. A positive click action plus a long life equal to that of a no-contact switch. Radial models (taping specifications)
More informationProbing Techniques for Signal Performance Measurements in High Data Rate Testing
Probing Techniques for Signal Performance Measurements in High Data Rate Testing K. Helmreich, A. Lechner Advantest Test Engineering Solutions GmbH Contents: 1 Introduction: High Data Rate Testing 2 Signal
More informationSilicon PIN Limiter Diodes V 5.0
5 Features Lower Insertion Loss and Noise Figure Higher Peak and Average Operating Power Various P1dB Compression Powers Lower Flat Leakage Power Reliable Silicon Nitride Passivation Description M/A-COM
More informationcontact probes for high currents radio frequency and kelvin measurement
high current probes kelvin probes radio frequency probes contact probes for high currents radio frequency and kelvin measurement Version 1 Contents Probe max. Current Page High Current Probes 1860C001
More informationData Sheet. AMMC GHz Amplifier. Description. Features. Applications
AMMC - 518-2 GHz Amplifier Data Sheet Chip Size: 92 x 92 µm (.2 x.2 mils) Chip Size Tolerance: ± 1µm (±.4 mils) Chip Thickness: 1 ± 1µm (4 ±.4 mils) Pad Dimensions: 8 x 8 µm (.1 x.1 mils or larger) Description
More informationQPC GHz 50 W GaN SPDT Switch. Product Overview. Key Features. Functional Block Diagram. Applications. Ordering Information
.15 2.8 GHz 5 W GaN SPDT Switch Product Overview Qorvo s is a Single-Pole, Double Throw (SPDT) switch fabricated on Qorvo s QGaN25.25um GaN on SiC production process. Operating from.15 to 2.8 GHz, the
More informationSAP Dynamic Edge Processing IoT Edge Console - Administration Guide Version 2.0 FP01
SAP Dynamic Edge Processing IoT Edge Console - Administration Guide Version 2.0 FP01 Table of Contents ABOUT THIS DOCUMENT... 3 Glossary... 3 CONSOLE SECTIONS AND WORKFLOWS... 5 Sensor & Rule Management...
More informationFeatures. Applications. Symbol Parameters/Conditions Units Min. Max.
AMMC - 622 6-2 GHz Low Noise Amplifier Data Sheet Chip Size: 17 x 8 µm (67 x 31. mils) Chip Size Tolerance: ± 1 µm (±.4 mils) Chip Thickness: 1 ± 1 µm (4 ±.4 mils) Pad Dimensions: 1 x 1 µm (4 ±.4 mils)
More informationMonolithic Amplifier Die
Ultra High Dynamic Range Monolithic Amplifier Die 50Ω 0.05 to 1.5 GHz The Big Deal Ultra High IP3 Broadband High Dynamic Range without external Matching Components Product Overview (RoHS compliant) is
More informationGA A26816 DESIGNS OF NEW COMPONENTS FOR ITER ECH&CD TRANSMISSION LINES
GA A26816 DESIGNS OF NEW COMPONENTS FOR ITER ECH&CD TRANSMISSION LINES by R.A. OLSTAD, J.L. DOANE, C.P. MOELLER and C.J. MURPHY JULY 2010 DISCLAIMER This report was prepared as an account of work sponsored
More informationTexas Instruments TXS0108EZXYR 8 Bit Bidirectional Voltage-Level Translator
Texas Instruments TXS0108EZXYR 8 Bit Bidirectional Voltage-Level Translator 1891 Robertson Road, Suite 500, Ottawa, ON K2H 5B7 Canada Tel: 613-829-0414 www.chipworks.com Some of the information in this
More informationApplication Note 5026
Surface Laminar Circuit (SLC) Ball Grid Array (BGA) Eutectic Surface Mount Assembly Application Note 5026 Introduction This document outlines the design and assembly guidelines for surface laminar circuitry
More informationVerification for test. Andy White, Nujira ltd
Verification for test Andy White, Nujira ltd Outline Introduction to Nujira Our design flow How DfT and VfT fits into our flow Device verification metrics Analogue verification coverage Nujira Company
More informationCSP-03G-003 High-Frequency Coaxial Test & Measurement Probe Model Number: CSP-03G-003, Replacement Probe: SPL-03G-043, SPL-03B-121 Target Connector: CPT-03-50-2 Applications: Designed for use in interconnect
More informationPE42823 Document Category: Product Specification
Document Category: Product Specification UltraCMOS, 7 MHz 6 GHz Features Excellent single-event peak power handling of 51 m LTE Exceptional linearity performance across all frequencies Input IP3: 7 m Input
More informationMA4L Series. Silicon PIN Limiters RoHS Compliant. M/A-COM Products Rev. V12. Features. Chip Outline. Description. Applications
Features Low Insertion Loss and Noise Figure High Peak and Average Operating Power Various P1dB Compression Powers Low Flat Leakage Power Proven Reliable, Silicon Nitride Passivation Chip Outline A Square
More informationApplication Tooling Specification Sheet
Mini-Mac Applicator FEATURES Application Tooling Specification Sheet Order No. 63891-4000 Directly adapts to most automatic wire processing machines Applicator designed to industry standard mounting and
More informationResponse Surface Channel Modeling Designer SI & DesignXplorer
Response Surface Channel Modeling Designer SI & DesignXplorer 1 ANSYS, Inc. September 14, Outline Product Introductions Designer SI DesignXplorer Intro to DOE & Response Surface Modeling Response Surfaces
More informationQuickSpecs. HP Ultrium Media. HP Ultrium Media. Overview
Overview HP Ultrium tape technology has been designed to deliver exceptional reliability and performance at the lowest cost per GB. The Ultrium format builds on the best of existing technologies; open
More informationData Sheet AMMC GHz Driver Amplifier. Features. Description. Applications
AMMC-6345 45 GHz Driver Amplifier Data Sheet Chip Size: 25 x 115 m ( x 45 mils) Chip Size Tolerance: ± m (±.4 mils) Chip Thickness: ± m (4 ±.4 mils) Pad Dimensions: x m (4 ±.4 mils) Description The AMMC-6345
More informationFLYYO Series. LGM C T5 CLEAR GLASS LED MODULE Rev1.1 Specification (0)
FLYYO Series LGM-1200-4000-C T5 CLEAR GLASS LED MODULE Rev1.1 Specification www.gryyn.eu info@gryyn.eu +49 (0)40 589 744-0 CONTENT 1. APPLICATION............................ Page 2. FUNDAMENTAL SPECIFICATIONS...........
More informationOptimization of Wafer Level Test Hardware using Signal Integrity Simulation
June 7-10, 2009 San Diego, CA Optimization of Wafer Level Test Hardware using Signal Integrity Simulation Jason Mroczkowski Ryan Satrom Agenda Industry Drivers Wafer Scale Test Interface Simulation Simulation
More informationDifferential Input / Output Impedance Match SM X 5 mm Nominal Footprint Lid Symbolization (YY=year, WW=week, S=shift) 15 pf
SF1189B-1 Designed for WLAN IF Applications Low Insertion Loss 5.0 x 5.0 x 1.7 mm Suface-Mount Case Single Ended or Differential Input and Output Differential Output Complies with Directive 2002/95/EC
More informationAries Center probe CSP socket Cycling test
Aries Center probe CSP socket Cycling test RF Measurement Results prepared by Gert Hohenwarter 10/27/04 1 Table of Contents TABLE OF CONTENTS... 2 OBJECTIVE... 3 METHODOLOGY... 3 Test procedures... 5 Setup...
More informationSDS TAP Retrofit Install Bartlett 3 Key Installation of TAP Control for Models Originally Built with the Bartlett 3 Key Control
SDS TAP Retrofit Install Bartlett 3 Key Installation of TAP Control for Models Originally Built with the Bartlett 3 Key Control This SDS Industries TAP Retrofit kit and installation instructions are intended
More informationMatrix BGA Socket Assembly Instructions
s 0,80mm, 1,00mm, 1,7mm Pitch MPI-1758-01 Rev. 1 4 5 6 7 1. mm Hex Wrench (Not Supplied.). Spring Plate Assembly. ( Item). Top Support Plate. ( Item) 4. BGA Package (Not Supplied.) 5. Matrix MPI BGA Socket
More informationRoad vehicles Component test methods for electrical disturbances from narrowband radiated electromagnetic energy. Part 3:
INTERNATIONAL STANDARD ISO 11452-3 Third edition 2016-09-01 Road vehicles Component test methods for electrical disturbances from narrowband radiated electromagnetic energy Part 3: Transverse electromagnetic
More informationPosition Accuracy Machines for Selective Soldering Fine Pitch Components Gerjan Diepstraten Vitronics Soltec B.V. Oosterhout, Netherlands
As originally published in the IPC APEX EXPO Conference Proceedings. Position Accuracy Machines for Selective Soldering Fine Pitch Components Gerjan Diepstraten Vitronics Soltec B.V. Oosterhout, Netherlands
More informationPE42512 Document Category: Product Specification
PE2 Document Category: Product Specification UltraCMOS, 9 khz8 GHz Features High isolation: @ 6 GHz Low insertion loss: 1.3 @ 6 GHz Fast switching time of 2 ns Power handling of m CW Logic select (LS)
More informationPE42562 Document Category: Product Specification
Document Category: Product Specification UltraCMOS, 9 khz8 GHz Features High isolation: @ 6 GHz Low insertion loss: 1.1 @ 6 GHz Fast switching time of 21 ns Power handling of 33 m CW Logic select (LS)
More informationMounting Approaches for RF Products Using the Package Type
Application Note: APPNOTE-012 Rev. A APPLICATION NOTE Mounting Approaches for RF Products Using the 780019 Package Type Introduction The objective of this application note is to provide users of Cree RF
More informationTGS2355 SM EVB GHz 100 Watt GaN Switch. Product Overview. Key Features. Applications. Functional Block Diagram. Ordering Information
Product Overview Qorvo s TGS2355 SM is a Single-Pole, Double Throw (SPDT) reflective switch fabricated on Qorvo s QGaN25 0.25um GaN on SiC production process. Operating from 0.5 to 6GHz, the TGS2355 SM
More informationKelvin Contactors for Wafer Level Test Jim Brandes
Kelvin Contactors for Wafer Level Test Multitest Xcerra Contents Kelvin History Existing Kelvin Product Need for Kelvin Spring Probes at Wafer Level New (Finer Pitch) Kelvin Product Beta Sites Products,
More informationOperating & Maintenance Instructions 25 Injection Moulding Machine
Operating & Maintenance Instructions 25 Injection Moulding Machine Table of Contents 1. Health and Safety Information... 2 2. Upon Receipt... 2 3a. Temperature Controller Settings (Brainchild Controller)...
More informationData Sheet. ALM MHz 4GHz PIN Diode Variable Attenuator Module. Description. Features. Specifications. Applications.
ALM-38140 50MHz 4GHz PIN Diode Variable Attenuator Module Data Sheet Description Avago Technologies ALM-38140 is a fully matched wideband variable attenuator module with high linearity performance and
More informationPE42582 Document Category: Product Specification
Document Category: Product Specification UltraCMOS, 9 khz8 GHz Features High isolation: @ 6 GHz Low insertion loss: 1.1 @ 6 GHz Fast switching time of 227 ns Power handling of m CW Logic select (LS) pin
More informationFixed Attenuator Die YAT-D-SERIES. The Big Deal Excellent power handling, up to 2W Wideband, DC to 26.5 GHz Usable to 40 GHz
Microwave Precision Fixed Attenuator Die 50Ω Up to 2W DC to 26.5 GHz YAT-D-SERIES The Big Deal Excellent power handling, up to 2W Wideband, DC to 26.5 GHz Usable to 40 GHz Unpackaged die form Product Overview
More informationProduct Specification PE42851
PE42851 Product Description The PE42851 is a HaRP technology-enhanced SP5T high power RF switch supporting wireless applications up to 1 GHz. It offers maximum power handling of 42.5 m continuous wave
More informationData Sheet. 2Tx. ADA-4643 Silicon Bipolar Darlington Amplifier. Description. Features. Specifications. Applications. Surface Mount Package
ADA- Silicon Bipolar Darlington Amplifier Data Sheet Description Avago Technologies ADA- is an economical, easy-touse, general purpose silicon bipolar RFIC gain block amplifiers housed in a -lead SC-7
More informationDetermine the stairway pitch based on tread and riser dimensions. For the main stairway in a house, the pitch can be no greater than 37º.
How-To-build guide Timber Stairs and steps What you can build using this guide This guide shows you how to order (and explains the construction of) a factory-made internal single flight of stairs for a
More informationMonolithic Amplifier PHA-202+ Ultra High Dynamic Range to 2.7 GHz. The Big Deal
Ultra High Dynamic Range Monolithic Amplifier 50Ω 0.03 to 2.7 GHz The Big Deal Ultra High IP3, +46.1 dbm Broadband High Dynamic Range without external Matching Components Medium power, 1W Excellent return
More informationASMB-KTF0-0A306-DS100
Data Sheet ASMB-KTF0-0A306 Overview The KTF0 is a series of tricolor LEDs in a PLCC-4 package. The package is (2.2 x 2.0) mm, and it is designed specifically for a small pitch display. The black outer
More informationDescription: SM-BGA socket for BGA223 19x15 array 0.5mm pitch 8mm x 10mm x 1.2mm DUT
Silver Ball Matrix BG Socket Recommended Torque 1.5 in-lb. Features Wide temperature range (-55C to +150C). Current capability is 4 per pin. Over 40GHz bandwidth @-1dB for edge pins. Low and stable contact
More informationVardhman Dies And Mould Tools
+91-8048762549 Vardhman Dies And Mould Tools https://www.mouldtoolsindia.com/ Renowned manufacturers of HSS Piercing Punches, Ejector Pins, Molding Tools that are fabricated from high grade metal & alloys.
More information