Probing Techniques for Signal Performance Measurements in High Data Rate Testing
|
|
- Janel Rich
- 5 years ago
- Views:
Transcription
1 Probing Techniques for Signal Performance Measurements in High Data Rate Testing K. Helmreich, A. Lechner Advantest Test Engineering Solutions GmbH Contents: 1 Introduction: High Data Rate Testing 2 Signal Performance Measurements: Why? How? 3 Probe Requirements and Solutions 4 Measurement Results 5 Summary
2 Introduction Automated Test Equipment (ATE) for high clock rate / high data rate logic / memory ICs... parallel test: up to 128 DUTs thousands of interconnects signal transition time: down to 0.4 ns (20% / 3 Vpp) clock speed / data rate: up to 1GHz / Gbit/s per pin ATE / DUT interconnect: multi-channel device interface (DI) ATE / DI interconnect: multi-channel, non-coaxial connectors DI / DUT interconnect: test sockets, probe card 'fly-by wiring': DUT I/O pin in: high Z out: low Z 50 Ω driver comparator
3 Memory IC Test Fixture
4 Introduction Motivations for ATE Signal Performance Measurements ATE: flexible, multi-channel measurement equipment of specified, high and traceable precision but... ATE manufacturer specification only for defined termination appliction specific DIs qualified separately ATE user may want to... verify overall ATE & DI performance in target application use ATE 'beyond spec' compare ATE from different vendors: 'benchmark'
5 Introduction ATE Signal Performance Evaluation requires... in-situ measurements on test sockets or wafer probe tips high bandwidth oscilloscope and probes high impedance probes to emulate application load Challenges test sockets contact pitch: down to 0.5 mm wafer probe card tip pitch: down to 50 µm oscilloscope probes limit measurement bandwidth
6 Probe Bandwidth Requirements Assumptions: 1. Test signals show 'Gaussian' edges (i.e. time integral of Gaussian pulses) 2. Probe shows Gaussian filter characteristic: a(db) ~ -f 2 B 3dB = 0.22 / t t 20/80 (signal / intrinsic) 80% 20% t t 20/80 signal passing probe: t 2 t, signal, out = t2 t, signal, in + t 2 t, probe, intrinsic 0dB -3dB 0 B 3dB f tolerated transition time prolongation 1%: B 3dB, probe > 1.55 / t t 20/80, signal, in t t 20/80, signal, in 0.4ns B 3dB, probe > 3.8 GHz
7 Model and Reality Real Test Signals... may not show exactly Gaussian edges Real Probes... may not show Gaussian filter characteristic Fortunately... above equations are fairly accurate for a variety of egde shapes and monotonous low pass filter responses Unfortunately... real probe inductance leads to undulating magnitude response, frequency dependent phase (delay) response, overshoot, parasitic transition time reduction
8 Probe Selection Among commercially available probes... active (FET) probes do not show sufficient bandwidth passive 50 Ω and 500 Ω (1:10) coaxial probes are more appropriate and even show lower input capacitance however: ground lead provided with commercial probes limits bandwidth due to its inductance probes characterised in frequency & time domain improved ground lead developed: - maintains coaxial geometry - fits application topology
9 Probe Characterisation, Measurement Assembly Vector Network Analyser Digital Sampling Oscilloscope Micromanipulator Assembly Coaxial Probes
10 Probe Characterisation, Measurement Assembly Detail micromanipulator assembly allows µm-positioning and safe, reproducible contacting
11 500 Ω (1:10) Coaxial Probe: Input Impedance vs. Frequency vendor specification sheet analytical model calculation with vendor specified value for C and reasonable value for L 10 3 input impedance of 500 Ohm / 0.15 pf / 2 nh probe mag(z) / Ohm phase(z) / o frequency / Hz model of 500 Ω probe: R 500Ω C 0.15pF 10*U out U in Z = R/(1+iωRC) + iωl L 2nH
12 500 Ω (1:10) Coaxial Probe: Input Impedance vs. Frequency vendor specification sheet measurement assembly: reference plane, 500 Ω probe, termination, Z from s 11 Z Z phase phase (Z) (Z)! Specified and measured probe characteristics differ! Resonance frequency 7GHz (instead of 9GHz). Maximum phase error larger than 60 degrees. Vendor spec apparently based on model!
13 500 Ω Probe Insertion Loss and Group Delay expected attenuation: 20log 20log 10 { 10 {[Z/(Z+R S +R S +R P )] P )]//[Z/(Z+R S )] S )]}} = -14.8dB standard assembly: reference plane 50 Ω probe 500 Ω probe reference plane modified ~ R S = 50Ω R P =450Ω Z=50Ω standard modified modified 500 Ω probe still shows amplitude error of about 2dB (>25%) and group delay distortion of more than 50ps in frequency range up to 4GHz
14 50 Ω Probe Insertion Loss and Group Delay standard modified assembly: reference plane 50 Ω probe #1 50 Ω probe #2 reference plane ~ R S = 50Ω Z=50Ω modified standard modified 50 Ω probe shows amplitude error of less than 0.4dB (5%) and group delay distortion of less than 20ps in frequency range up to 8GHz
15 500 Ω Probe In-System Insertion Loss and Group Delay through expected attenuation: 20log 20log 10 {[ZR 10 {[ZR T /((R T /((R T +Z+R T +Z+R P )R P )R S +(Z+R S +(Z+R P )R P )R T )]/[Z/(Z+R T S )]} S )]} = -20.4dB assembly: reference plane PC3.5 terminated 50 Ω transmission line contacted by 500 Ω probe reference plane PC3.5 through probe probe probe probe ~ R S = 50Ω R T = 50Ω R P =450Ω Z=50Ω amplitude error of about 4dB (60%) and group delay distortion of more than 70ps in frequency range up to 4GHz
16 Application: ATE Benchmark Digital Sampling Oscilloscope Delay Line Modified Probes Micromanipulator Assembly RDRAM 2 32 FPBGA DI DI GBit/s ATE
17 Detail: Probing on FPBGA Sockets (0.5mm pitch)
18 ATE Signal Performance Measurement Contact Travel Impact depressing socket contact by by 330 µm increases delay by by ps ps due to to reduced inductance
19 ATE Signal Performance Measurement Probe Impact measurement equipment transition times TDT step (black): 18ps + cable (green): 31ps Ω probe (red): 40ps
20 ATE Signal Performance Measurement ATE Signal 500 MHz clock signal picked up up via modified 500 Ω probe
21 ATE Signal Performance Measurement Transition Time 500 Ω probe: t t t 20/80 20/80 = 337ps Ω probe: t t t 20/80 20/80 = 387ps edge timing linearity measurement inhibited by by oscilloscope timebase inaccuracy of of about 10ps
22 ATE Signal Performance Measurement Eye Diagram eye diagram 1GBit/s random pattern eye opening >900ps
23 ATE Signal Performance Measurement clock signal: 12ps RMS Jitter random pattern: 9ps RMS
24 ATE Signal Performance Measurement Crosstalk crosstalk to to neighbour pin 70mV pp pp
25 Summary Probe amplitude and phase (or group delay) response need to be qualified in a frequency range of up to 4GHz, if high-end ATE signal transition times shall be measured with about 1% accuracy Precision measurements beyond a few 100MHz require 50Ω=technology If in-system measurements with high impedance probes have to be taken, results will suffer from significant amplitude error and group delay distortion Experience shows, that probe / oscilloscope vendor specifications are highly questionable or insufficient Therefore, a thorough characterisation of probes is absolutely mandatory Traceable equipment needs to be used for characterisation
Aries Kapton CSP socket
Aries Kapton CSP socket Measurement and Model Results prepared by Gert Hohenwarter 5/19/04 1 Table of Contents Table of Contents... 2 OBJECTIVE... 3 METHODOLOGY... 3 Test procedures... 4 Setup... 4 MEASUREMENTS...
More informationAries QFP microstrip socket
Aries QFP microstrip socket Measurement and Model Results prepared by Gert Hohenwarter 2/18/05 1 Table of Contents Table of Contents... 2 OBJECTIVE... 3 METHODOLOGY... 3 Test procedures... 4 Setup... 4
More informationHigh Speed Digital Systems Require Advanced Probing Techniques for Logic Analyzer Debug
JEDEX 2003 Memory Futures (Track 2) High Speed Digital Systems Require Advanced Probing Techniques for Logic Analyzer Debug Brock J. LaMeres Agilent Technologies Abstract Digital systems are turning out
More informationIEEE CX4 Quantitative Analysis of Return-Loss
IEEE CX4 Quantitative Analysis of Return-Loss Aaron Buchwald & Howard Baumer Mar 003 Return Loss Issues for IEEE 0G-Base-CX4 Realizable Is the spec realizable with standard packages and I/O structures
More informationCustom Interconnects Fuzz Button with Hardhat Test Socket/Interposer 1.00 mm pitch
Custom Interconnects Fuzz Button with Hardhat Test Socket/Interposer 1.00 mm pitch Measurement and Model Results prepared by Gert Hohenwarter 12/14/2015 1 Table of Contents TABLE OF CONTENTS...2 OBJECTIVE...
More informationAs all PMK probes the PML 751-RO features CeramCore TM technology. The entire probe
High impedance passive probe Features: 2.5 mm Diameter Tip Useable with any 50 Ω Instrument Interchangeable Spring Contact Tip IC Contacting System 0.5 to 1.27 mm pitch PMK introduces a new universal 10:1
More informationVLSI is scaling faster than number of interface pins
High Speed Digital Signals Why Study High Speed Digital Signals Speeds of processors and signaling Doubled with last few years Already at 1-3 GHz microprocessors Early stages of terahertz Higher speeds
More informationLimitations And Accuracies Of Time And Frequency Domain Analysis Of Physical Layer Devices
Limitations And Accuracies Of Time And Frequency Domain Analysis Of Physical Layer Devices Outline Short Overview Fundamental Differences between TDR & Instruments Calibration & Normalization Measurement
More informationPDN Probes. P2100A/P2101A Data Sheet. 1-Port and 2-Port 50 ohm Passive Probes
P2100A/P2101A Data Sheet PDN Probes 1-Port and 2-Port 50 ohm Passive Probes power integrity PDN impedance testing ripple PCB resonances transient step load stability and NISM noise TDT/TDR clock jitter
More informationAnalog Arts SL987 SL957 SL937 SL917 Product Specifications [1]
www.analogarts.com Analog Arts SL987 SL957 SL937 SL917 Product Specifications [1] 1. These models include: an oscilloscope, a spectrum analyzer, a data recorder, a frequency & phase meter, an arbitrary
More informationA Technical Discussion of TDR Techniques, S-parameters, RF Sockets, and Probing Techniques for High Speed Serial Data Designs
A Technical Discussion of TDR Techniques, S-parameters, RF Sockets, and Probing Techniques for High Speed Serial Data Designs Presenter: Brian Shumaker DVT Solutions, LLC, 650-793-7083 b.shumaker@comcast.net
More informationImproving CDM Measurements With Frequency Domain Specifications
Improving CDM Measurements With Frequency Domain Specifications Jon Barth (1), Leo G. Henry Ph.D (2), John Richner (1) (1) Barth Electronics, Inc, 1589 Foothill Drive, Boulder City, NV 89005 USA tel.:
More informationSHF Communication Technologies AG
SHF Communication Technologies AG Wilhelm-von-Siemens-Str. 23D 12277 Berlin Germany Phone ++49 30 / 772 05 10 Fax ++49 30 / 753 10 78 E-Mail: sales@shf.de Web: http://www.shf.de Datasheet SHF 806 E SHF
More informationAnalog Arts SF990 SF880 SF830 Product Specifications
1 www.analogarts.com Analog Arts SF990 SF880 SF830 Product Specifications Analog Arts reserves the right to change, modify, add or delete portions of any one of its specifications at any time, without
More informationApplication Note 5525
Using the Wafer Scale Packaged Detector in 2 to 6 GHz Applications Application Note 5525 Introduction The is a broadband directional coupler with integrated temperature compensated detector designed for
More informationT est POST OFFICE BOX 1927 CUPERTINO, CA TEL E P H ONE (408) FAX (408) ARIES ELECTRONICS
G iga T est L abs POST OFFICE BOX 1927 CUPERTINO, CA 95015 TEL E P H ONE (408) 524-2700 FAX (408) 524-2777 ARIES ELECTRONICS BGA SOCKET (0.80MM TEST CENTER PROBE CONTACT) Final Report Electrical Characterization
More informationAries Kapton CSP socket Cycling test
Aries Kapton CSP socket Cycling test RF Measurement Results prepared by Gert Hohenwarter 10/21/04 1 Table of Contents TABLE OF CONTENTS... 2 OBJECTIVE... 3 METHODOLOGY... 3 Test procedures... 5 Setup...
More informationAUTOMOTIVE ETHERNET CONSORTIUM
AUTOMOTIVE ETHERNET CONSORTIUM Clause 96 100BASE-T1 Physical Medium Attachment Test Suite Version 1.0 Technical Document Last Updated: March 9, 2016 Automotive Ethernet Consortium 21 Madbury Rd, Suite
More informationPML 791-RO. High impedance passive probe. Features: 2.5 mm Diameter Tip. Coaxial Design. Interchangeable Spring Contact Tip
High impedance passive probe Features: 2.5 mm Diameter Tip Coaxial Design Interchangeable Spring Contact Tip IC Contacting System 0.5 to 1.27 mm pitch PMK introduces a new universal 100:1 miniature probe
More informationAnalog Arts SF900 SF650 SF610 Product Specifications
www.analogarts.com Analog Arts SF900 SF650 SF610 Product Specifications Analog Arts reserves the right to change, modify, add or delete portions of any one of its specifications at any time, without prior
More informationAnalog Arts SG985 SG884 SG834 SG814 Product Specifications [1]
www.analogarts.com Analog Arts SG985 SG884 SG834 SG814 Product Specifications [1] 1. These models include: an oscilloscope, a spectrum analyzer, a data recorder, a frequency & phase meter, and an arbitrary
More informationAries Center probe CSP socket Cycling test
Aries Center probe CSP socket Cycling test RF Measurement Results prepared by Gert Hohenwarter 10/27/04 1 Table of Contents TABLE OF CONTENTS... 2 OBJECTIVE... 3 METHODOLOGY... 3 Test procedures... 5 Setup...
More informationAries CSP microstrip socket Cycling test
Aries CSP microstrip socket Cycling test RF Measurement Results prepared by Gert Hohenwarter 2/18/05 1 Table of Contents TABLE OF CONTENTS... 2 OBJECTIVE... 3 METHODOLOGY... 3 Test procedures... 6 Setup...
More information40 AND 100 GIGABIT ETHERNET CONSORTIUM
40 AND 100 GIGABIT ETHERNET CONSORTIUM Clause 93 100GBASE-KR4 PMD Test Suite Version 1.0 Technical Document Last Updated: October 2, 2014 40 and 100 Gigabit Ethernet Consortium 121 Technology Drive, Suite
More informationIntroduction to On-Wafer Characterization at Microwave Frequencies
Introduction to On-Wafer Characterization at Microwave Frequencies Chinh Doan Graduate Student University of California, Berkeley Introduction to On-Wafer Characterization at Microwave Frequencies Dr.
More informationTaking the Mystery out of Signal Integrity
Slide - 1 Jan 2002 Taking the Mystery out of Signal Integrity Dr. Eric Bogatin, CTO, GigaTest Labs Signal Integrity Engineering and Training 134 S. Wolfe Rd Sunnyvale, CA 94086 408-524-2700 www.gigatest.com
More informationThe Practical Limitations of S Parameter Measurements and the Impact on Time- Domain Simulations of High Speed Interconnects
The Practical Limitations of S Parameter Measurements and the Impact on Time- Domain Simulations of High Speed Interconnects Dennis Poulin Anritsu Company Slide 1 Outline PSU Signal Integrity Symposium
More informationProbe Card Characterization in Time and Frequency Domain
Gert Hohenwarter GateWave Northern, Inc. Probe Card Characterization in Time and Frequency Domain Company Logo 2007 San Diego, CA USA Objectives Illuminate differences between Time Domain (TD) and Frequency
More informationTraceability for Oscilloscopes and Oscilloscope Calibrators
Traceability for Oscilloscopes and Oscilloscope Calibrators in relation to RF Voltage measurements Paul C. A. Roberts Fluke Precision Measurement PCAR Traceability for Scope Cal Mar 2006 1 Introduction
More informationP331-2 set ESD generator (IEC )
User manual Probe set set ESD generator (IEC 61000-4-2) Copyright January 2017 LANGER GmbH 2017.01.09 User manual Table of contents: Page 1 ESD generator (IEC 61000-4-2) 3 1.1 Design and function of the
More informationLogic Analyzer Probing Techniques for High-Speed Digital Systems
DesignCon 2003 High-Performance System Design Conference Logic Analyzer Probing Techniques for High-Speed Digital Systems Brock J. LaMeres Agilent Technologies Abstract Digital systems are turning out
More informationHigh Data Rate Characterization Report
High Data Rate Characterization Report ERDP-013-39.37-TTR-STL-1-D Mated with: ERF8-013-05.0-S-DV-DL-L and ERM8-013-05.0-S-DV-DS-L Description: Edge Rate Twin-Ax Cable Assembly, 0.8mm Pitch Samtec, Inc.
More informationMeasuring PCB, Cable and Interconnect Impedance, Dielectric Constants, Velocity Factor, and Lengths
Measuring PCB, Cable and Interconnect Impedance, Dielectric Constants, Velocity Factor, and Lengths Controlled impedance printed circuit boards (PCBs) often include a measurement coupon, which typically
More informationEBERT 2904 Pulse Pattern Generator and Error Detector Datasheet
EBERT 2904 Pulse Pattern Generator and Error Detector Datasheet REV 1.0 2904 KEY FEATURES Four channel NRZ Pulse Pattern Generator and Error Detector Operating range between 24.6 to 29.5 Gb/s along with
More informationAWG-GS bit 2.5GS/s Arbitrary Waveform Generator
KEY FEATURES 2.5 GS/s Real Time Sample Rate 14-bit resolution 2 Channels Long Memory: 64 MS/Channel Direct DAC Out - DC Coupled: 1.6 Vpp Differential / 0.8 Vpp > 1GHz Bandwidth RF Amp Out AC coupled -10
More informationGigaTest Labs CINCH 1 MM PITCH CIN::APSE LGA SOCKET. Final Report. August 31, Electrical Characterization
GigaTest Labs POST OFFICE OX 1927 CUPERTINO, C TELEPHONE (408) 524-2700 FX (408) 524-2777 CINCH 1 MM PITCH CIN::PSE LG SOCKET Final Report ugust 31, 2001 Electrical Characterization Table of Contents Subject
More informationOptimization of Wafer Level Test Hardware using Signal Integrity Simulation
June 7-10, 2009 San Diego, CA Optimization of Wafer Level Test Hardware using Signal Integrity Simulation Jason Mroczkowski Ryan Satrom Agenda Industry Drivers Wafer Scale Test Interface Simulation Simulation
More informationUniversity of New Hampshire InterOperability Laboratory Gigabit Ethernet Consortium
University of New Hampshire InterOperability Laboratory Gigabit Ethernet Consortium As of June 18 th, 2003 the Gigabit Ethernet Consortium Clause 40 Physical Medium Attachment Conformance Test Suite Version
More informationMIL-STD-883E METHOD 3024 SIMULTANEOUS SWITCHING NOISE MEASUREMENTS FOR DIGITAL MICROELECTRONIC DEVICES
SIMULTANEOUS SWITCHING NOISE MEASUREMENTS FOR DIGITAL MICROELECTRONIC DEVICES 1. Purpose. This method establishes the procedure for measuring the ground bounce (and V CC bounce) noise in digital microelectronic
More informationImproving TDR/TDT Measurements Using Normalization Application Note
Improving TDR/TDT Measurements Using Normalization Application Note 1304-5 2 TDR/TDT and Normalization Normalization, an error-correction process, helps ensure that time domain reflectometer (TDR) and
More informationLVDS Flow Through Evaluation Boards. LVDS47/48EVK Revision 1.0
LVDS Flow Through Evaluation Boards LVDS47/48EVK Revision 1.0 January 2000 6.0.0 LVDS Flow Through Evaluation Boards 6.1.0 The Flow Through LVDS Evaluation Board The Flow Through LVDS Evaluation Board
More informationHA MHz, High Slew Rate, High Output Current Buffer. Description. Features. Applications. Ordering Information. Pinouts.
SEMICONDUCTOR HA-2 November 99 Features Voltage Gain...............................99 High Input Impedance.................... kω Low Output Impedance....................... Ω Very High Slew Rate....................
More informationHigh Speed Digital Design & Verification Seminar. Measurement fundamentals
High Speed Digital Design & Verification Seminar Measurement fundamentals Agenda Sources of Jitter, how to measure and why Importance of Noise Select the right probes! Capture the eye diagram Why measure
More informationHV739 ±100V 3.0A Ultrasound Pulser Demo Board
HV79 ±00V.0A Ultrasound Pulser Demo Board HV79DB Introduction The HV79 is a monolithic single channel, high-speed, high voltage, ultrasound transmitter pulser. This integrated, high performance circuit
More informationEBERT 1504 Pulse Pattern Generator and Error Detector Datasheet
EBERT 1504 Pulse Pattern Generator and Error Detector Datasheet REV 1.0 1504 KEY FEATURES Four channel NRZ Pulse Pattern Generator and Error Detector Wide operating range between 1 to 15 Gb/s and beyond
More informationFIBRE CHANNEL CONSORTIUM
FIBRE CHANNEL CONSORTIUM FC-PI-2 Clause 9 Electrical Physical Layer Test Suite Version 0.21 Technical Document Last Updated: August 15, 2006 Fibre Channel Consortium Durham, NH 03824 Phone: +1-603-862-0701
More informationCONNECTING THE PROBE TO THE TEST INSTRUMENT
2SHUDWLRQ 2SHUDWLRQ Caution The input circuits in the AP034 Active Differential Probe incorporate components that protect the probe from damage resulting from electrostatic discharge (ESD). Keep in mind
More informationPML 711A-RO High impedance passive probe Features:
High impedance passive probe Features: 2.5 mm Diameter Tip CeramCore TM Hybrid Probe Coaxial Design Interchangeable Spring Contact Tip IC Contacting System 0.5 to 1.27 mm pitch PMK introduces a new universal
More informationHigh Data Rate Characterization Report
High Data Rate Characterization Report EQRF-020-1000-T-L-SMA-P-1 Mated with: QSE-xxx-01-x-D-A and SMA-J-P-x-ST-TH1 Description: Cable Assembly, High Speed Coax, 0.8 mm Pitch Samtec, Inc. 2005 All Rights
More informationSignal Integrity Tips and Techniques Using TDR, VNA and Modeling. Russ Kramer O.J. Danzy
Signal Integrity Tips and Techniques Using TDR, VNA and Modeling Russ Kramer O.J. Danzy Simulation What is the Signal Integrity Challenge? Tx Rx Channel Asfiakhan Dreamstime.com - 3d People Communication
More information10 Mb/s Single Twisted Pair Ethernet 10BASE-T1L PSD Mask Steffen Graber Pepperl+Fuchs
10 Mb/s Single Twisted Pair Ethernet 10BASE-T1L PSD Mask Steffen Graber Pepperl+Fuchs IEEE P802.3cg 10 Mb/s Single Twisted Pair Ethernet Task Force 1/15/2018 1 Content Time Domain Specification Time Domain
More informationUnderstanding Star Switching the star of the switching is often overlooked
A Giga-tronics White Paper AN-GT110A Understanding Star Switching the star of the switching is often overlooked Written by: Walt Strickler V.P. of Business Development, Switching Giga tronics Incorporated
More informationPicoSource PG900 Series USB differential pulse generators
USB differential pulse generators Three PicoSource models Integrated 60 ps pulse outputs: PG911 Tunnel diode 40 ps pulse heads: PG912 Both output types: PG914 Integrated pulse outputs Differential with
More informationSignal Integrity Design of TSV-Based 3D IC
Signal Integrity Design of TSV-Based 3D IC October 24, 21 Joungho Kim at KAIST joungho@ee.kaist.ac.kr http://tera.kaist.ac.kr 1 Contents 1) Driving Forces of TSV based 3D IC 2) Signal Integrity Issues
More informationLVDS Owner s Manual. A General Design Guide for National s Low Voltage Differential Signaling (LVDS) Products. Moving Info with LVDS
LVDS Owner s Manual A General Design Guide for National s Low Voltage Differential Signaling (LVDS) Products Moving Info with LVDS Revision 2.0 January 2000 LVDS Evaluation Boards Chapter 6 6.0.0 LVDS
More informationAVTECH TECHNICAL BRIEF 15 (TB15) A COMPARISON OF REVERSE RECOVERY MEASUREMENT SYSTEMS
A V T E C H E L E C T R O S Y S T E M S L T D. N A N O S E C O N D W A V E F O R M E L E C T R O N I C S S I N C E 1 9 7 5 P.O. BOX 265 OGDENSBURG, NY U.S.A. 13669-0265 TEL: 888-670-8729 (USA & Canada)
More informationApplication Note. Signal Integrity Modeling. SCSI Connector and Cable Modeling from TDR Measurements
Application Note SCSI Connector and Cable Modeling from TDR Measurements Signal Integrity Modeling SCSI Connector and Cable Modeling from TDR Measurements Dima Smolyansky TDA Systems, Inc. http://www.tdasystems.com
More informationHigh Speed Characterization Report
HDLSP-035-2.00 Mated with: HDI6-035-01-RA-TR/HDC-035-01 Description: High Density/High Speed IO Cable Assembly Samtec, Inc. 2005 All Rights Reserved Table of Contents Introduction...1 Product Description...1
More informationEngineering the Power Delivery Network
C HAPTER 1 Engineering the Power Delivery Network 1.1 What Is the Power Delivery Network (PDN) and Why Should I Care? The power delivery network consists of all the interconnects in the power supply path
More informationExperiment 8 Frequency Response
Experiment 8 Frequency Response W.T. Yeung, R.A. Cortina, and R.T. Howe UC Berkeley EE 105 Spring 2005 1.0 Objective This lab will introduce the student to frequency response of circuits. The student will
More informationImpedance and Electrical Models
C HAPTER 3 Impedance and Electrical Models In high-speed digital systems, where signal integrity plays a significant role, we often refer to signals as either changing voltages or a changing currents.
More informationBACKPLANE ETHERNET CONSORTIUM
BACKPLANE ETHERNET CONSORTIUM Clause 72 10GBASE-KR PMD Test Suite Version 1.1 Technical Document Last Updated: June 10, 2011 9:28 AM Backplane Ethernet Consortium 121 Technology Drive, Suite 2 Durham,
More informationKeysight Technologies Signal Integrity Tips and Techniques Using TDR, VNA and Modeling
Keysight Technologies Signal Integrity Tips and Techniques Using, VNA and Modeling Article Reprint This article first appeared in the March 216 edition of Microwave Journal. Reprinted with kind permission
More informationSHF Communication Technologies AG. Wilhelm-von-Siemens-Str. 23D Berlin Germany. Phone Fax
SHF Communication Technologies AG Wilhelm-von-Siemens-Str. 23D 12277 Berlin Germany Phone +49 30 772 051-0 Fax +49 30 753 10 78 E-Mail: sales@shf-communication.com Web: www.shf-communication.com Datasheet
More informationMeasuring the Invasiveness of High-Impedance Probes
Measuring the Invasiveness of High-Impedance Probes Uwe Arz 1 Pavel Kabos 2 Dylan F. Williams 2 1 Physikalisch-Technische Bundesanstalt, Braunschweig, Germany 2 National Institute of Standards and Technology,
More information1000BASE-T1 EMC Test Specification for Common Mode Chokes
IEEE 1000BASE-T1 EMC Test Specification for Common Mode Chokes Version 1.0 Author & Company Dr. Bernd Körber, FTZ Zwickau Title 1000BASE-T1 EMC Test Specification for Common Mode Chokes Version 1.0 Date
More informationTLP/VF-TLP/HMM Test System TLP-3010C/3011C Advanced TLP/HMM/HBM Solutions
1 Features Wafer and package level TLP/VF-TLP/HMM testing Ultra fast high voltage pulse output with typical 1 ps rise time Built-in HMM (IEC 61-4-2) pulse up to ±8 kv High pulse output current up to ±3
More information1 of 6 03/12/2012 14:56 2012-12-03 HAMEG > Products > Accessories > Probes http://www.hameg.com/186.0.html P R O B E S H Z 5 6-2 * AC/ DC Current Clamps This AC/DC Current Probe is used to measure currents
More informationThe data rates of today s highspeed
HIGH PERFORMANCE Measure specific parameters of an IEEE 1394 interface with Time Domain Reflectometry. Michael J. Resso, Hewlett-Packard and Michael Lee, Zayante Evaluating Signal Integrity of IEEE 1394
More informationPicoSource PG900 Series
USB differential pulse generators Three PicoSource models Integrated 60 ps pulse outputs: PG911 Tunnel diode 40 ps pulse heads: PG912 Both output types: PG914 Integrated pulse outputs Differential with
More informationDifferential Signal and Common Mode Signal in Time Domain
Differential Signal and Common Mode Signal in Time Domain Most of multi-gbps IO technologies use differential signaling, and their typical signal path impedance is ohm differential. Two 5ohm cables, however,
More informationHigh Data Rate Characterization Report
High Data Rate Characterization Report EQCD-020-39.37-STR-TTL-1 EQCD-020-39.37-STR-TEU-2 Mated with: QTE-020-01-X-D-A and QSE-020-01-X-D-A Description: 0.8mm High-Speed Coax Cable Assembly Samtec, Inc.
More informationHigh Data Rate Characterization Report
High Data Rate Characterization Report VPSTP-016-1000-01 Mated with: VRDPC-50-01-M-RA and VRDPC-50-01-M-RA Description: Plug Shielded Twisted Pair Cable Assembly, 0.8mm Pitch Samtec, Inc. 2005 All Rights
More informationHigh Speed Characterization Report
TCDL2-10-T-05.00-DP and TCDL2-10-T-10.00-DP Mated with: TMMH-110-04-X-DV and CLT-110-02-X-D Description: 2-mm Pitch Micro Flex Data Link Samtec, Inc. 2005 All Rights Reserved Table of Contents Introduction...1
More informationLM2462 Monolithic Triple 3 ns CRT Driver
LM2462 Monolithic Triple 3 ns CRT Driver General Description The LM2462 is an integrated high voltage CRT driver circuit designed for use in color monitor applications. The IC contains three high input
More informationOctober Suzhou - Shenzhen, China. Archive TestConX - Image: Breath10/iStock
October 23-25 2018 Suzhou - Shenzhen, China Archive 2018 TestConX - Image: Breath10/iStock COPYRIGHT NOTICE The presentation(s)/poster(s) in this publication comprise the Proceedings of the 2018 TestConX
More informationHigh Speed Characterization Report
SSW-1XX-22-X-D-VS Mates with TSM-1XX-1-X-DV-X Description: Surface Mount Terminal Strip,.1 [2.54mm] Pitch, 13.59mm (.535 ) Stack Height Samtec, Inc. 25 All Rights Reserved Table of Contents Connector Overview...
More informationSHF Communication Technologies AG
SHF Communication Technologies AG Wilhelm-von-Siemens-Str. 23 Aufgang D 12277 Berlin Marienfelde Germany Phone ++49 30 / 772 05 10 Fax ++49 30 / 753 10 78 E-Mail: sales@shf.biz Web: http://www.shf.biz
More informationHigh Speed Characterization Report
QTE-020-02-L-D-A Mated With QSE-020-01-L-D-A Description: Parallel Board-to-Board, 0.8mm Pitch, 8mm (0.315 ) Stack Height Samtec, Inc. 2005 All Rights Reserved Table of Contents Connector Overview... 1
More informationBLS-to-ADF Transition System
BLS-to-ADF Transition System Existing and proposed calorimeter trigger rack layouts. The color code shows how the calorimeter trigger inputs will be reassigned from the existing trigger crates to the new
More informationAgilent E2695A SMA Probe Head for InfiniiMax 1130 Series Active Oscilloscope Probes. User s Guide
User s Guide Publication Number E2695-92000 June 2003 Copyright Agilent Technologies 2003 All Rights Reserved. Agilent E2695A SMA Probe Head for InfiniiMax 1130 Series Active Oscilloscope Probes Agilent
More informationSURFACE MOUNT HIGH REPEATABILITY, BROADBAND TO-5 RELAYS DPDT
SURFACE MOUNT HIGH REPEATABILITY, BROADBAND TO-5 RELAYS DPDT SERIES GRF300 GRF300D GRF300DD GRF303 GRF303D GRF303DD RELAY TYPE Repeatable, RF relay Repeatable, RF relay with internal diode for coil transient
More informationWhere Did My Signal Go?
Where Did My Signal Go? A Discussion of Signal Loss Between the ATE and UUT Tushar Gohel Mil/Aero STG Teradyne, Inc. North Reading, MA, USA Tushar.gohel@teradyne.com Abstract Automatic Test Equipment (ATE)
More informationTransient calibration of electric field sensors
Transient calibration of electric field sensors M D Judd University of Strathclyde Glasgow, UK Abstract An electric field sensor calibration system that operates in the time-domain is described and its
More informationA Simplified QFN Package Characterization Technique
Slide -1 A Simplified QFN Package Characterization Technique Dr. Eric Bogatin and Trevor Mitchell Bogatin Enterprises Dick Otte, President, Promex 8/1/10 Slide -2 Goal of this Project Develop a simple
More informationA 4 GSample/s 8-bit ADC in. Ken Poulton, Robert Neff, Art Muto, Wei Liu, Andrew Burstein*, Mehrdad Heshami* Agilent Laboratories Palo Alto, California
A 4 GSample/s 8-bit ADC in 0.35 µm CMOS Ken Poulton, Robert Neff, Art Muto, Wei Liu, Andrew Burstein*, Mehrdad Heshami* Agilent Laboratories Palo Alto, California 1 Outline Background Chip Architecture
More informationMODEL AND MODEL PULSE/PATTERN GENERATORS
AS TEE MODEL 12010 AND MODEL 12020 PULSE/PATTERN GENERATORS Features: 1.6GHz or 800MHz Models Full Pulse and Pattern Generator Capabilities Programmable Patterns o User Defined o 16Mbit per channel o PRBS
More informationAgilent 81133A/81134A
Agilent 81133A/81134A Performance Verification Rev. 2.3, Dec. 2009 Agilent Technologies Introduction Use these tests if you want to check that the Agilent 81133A / 81134A Pulse / Pattern Generator is
More informationDevice Generated Noise Measurement Techniques
Fairchild Semiconductor Application Note November 1990 Revised June 2001 Device Generated Noise Measurement Techniques Abstract In recent years the speed and drive capability of advanced digital integrated
More informationGetting the most out of your Measurements Workshop. Mike Schnecker
Getting the most out of your Measurements Workshop Mike Schnecker Agenda Oscilloscope Basics Using a RTE1000 Series Oscilloscope. Probing Basics Passive probe compensation Ground lead effects Vertical
More informationHideo Okawara s Mixed Signal Lecture Series. DSP-Based Testing Fundamentals 37 F-matrix Simulation TDR
Hideo Okawara s Mixed Signal Lecture Series DSP-Based Testing Fundamentals 37 F-matrix Simulation TDR Verigy Japan June 2011 Preface to the Series ADC and DAC are the most typical mixed signal devices.
More informationMeasurement and Analysis for Switchmode Power Design
Measurement and Analysis for Switchmode Power Design Switched Mode Power Supply Measurements AC Input Power measurements Safe operating area Harmonics and compliance Efficiency Switching Transistor Losses
More informationMeasurement Techniques
Measurement Techniques Primary measurement tool: Oscilloscope Other lab tools: Logic Analyser, Gain-Phase Analyser, Spectrum Analyser Visualisation of electrical signals in the time domain Visualisation
More informationMODEL 5002 PHASE VERIFICATION BRIDGE SET
CLARKE-HESS COMMUNICATION RESEARCH CORPORATION clarke-hess.com MODEL 5002 PHASE VERIFICATION BRIDGE SET TABLE OF CONTENTS WARRANTY i I BASIC ASSEMBLIES I-1 1-1 INTRODUCTION I-1 1-2 BASIC ASSEMBLY AND SPECIFICATIONS
More informationSHF Communication Technologies AG
SHF Communication Technologies AG Wilhelm-von-Siemens-Str. 23 Aufgang D 12277 Berlin Marienfelde Germany Phone ++49 30 / 772 05 10 Fax ++49 30 / 753 10 78 E-Mail: sales@shf.biz Web: http://www.shf.biz
More informationyellow highlighted text indicates refinement is needed turquoise highlighted text indicates where the text was original pulled from
yellow highlighted text indicates refinement is needed turquoise highlighted text indicates where the text was original pulled from The text of this section was pulled from clause 72.7 128.7 2.5GBASE-KX
More informationSHF Communication Technologies AG. Wilhelm-von-Siemens-Str. 23D Berlin Germany. Phone Fax
SHF Communication Technologies AG Wilhelm-von-Siemens-Str. 23D 12277 Berlin Germany Phone ++49 30 772 051-0 Fax ++49 30 753 10 78 E-Mail: sales@shf.de Web: http://www.shf.de Datasheet SHF S807 B Linear
More informationMeasurements with Scattering Parameter By Joseph L. Cahak Copyright 2013 Sunshine Design Engineering Services
Measurements with Scattering Parameter By Joseph L. Cahak Copyright 2013 Sunshine Design Engineering Services Network Analyzer Measurements In many RF and Microwave measurements the S-Parameters are typically
More informationIEEE 100BASE-T1 Physical Media Attachment Test Suite
IEEE 100BASE-T1 Physical Media Attachment Test Suite Version 1.0 Author & Company Curtis Donahue, UNH-IOL Title IEEE 100BASE-T1 Physical Media Attachment Test Suite Version 1.0 Date June 6, 2017 Status
More information