Table of Contents Site Information Schedule Plenary Session Technical Sessions Poster Session Conference Room Maps

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1 Table of Contents Site Information 2 Schedule 4 Plenary Session 5 Dr. M. Jamal Deen, "Smart Sensors for Environmental and Health Applications" 6 Dr. Seung Kang, "Emerging Memory Architectures for IOT (Internet-of-Things) and Wearables" 7 Dr. Rao Tummala, "System Scaling: The Other Electronics Frontier For A New Era of Consumer, Computer and Automotive 8 Technical Sessions 9 Circuits and Devices 9 Failure Analysis 10 Metrology, CFM, and Test 11 Quality and Reliability 12 Process Technology I: 3D and Analog RF Devices 13 Process Technology II: FEOL 14 Process Technology III: MOL and BEOL 15 Semiconductor Manufacturing I 16 Semiconductor Manufacturing II 17 Poster Session 18 Circuits and Devices 18 Failure Analysis 18 Metrology, CFM, and Test 20 Quality and Reliability 21 Process Technology 22 Semiconductor Manufacturing 25 Conference Room Maps 27

2 Site Information EVENT LOCATION & PARKING Fab 8 GLOBALCAFÉ (Admin 1 Building) 400 Stone Break Road Extension, Malta, NY When you arrive, please proceed to the Cafe Lobby entrance, where you will pass through security. Please bring a valid photo ID. If you are driving to the site, it is suggested that you carpool and arrive a few minutes early to find a parking spot (Lot C is recommended). See map for the location of Lot C (shaded in red) as well as the walking path to the GLOBALCAFÉ entrance (indicated with a blue line). 2 2

3 Site Information IMPORTANT SAFETY INSTRUCTIONS Although unlikely, in the event of a fire alarm: Please proceed to the nearest emergency exit and evacuate the building. GLOBALFOUNDRIES employees will be on site to escort guests to a designated muster point in the East or West parking lot. Wait for further instructions from the GLOBALFOUNDRIES Emergency Response Team or their designee. In the event of an emergency situation or injury: Dial from a desk or wall phone. Dial (518) from a cell phone. SMOKING POLICY Fab 8 is a non-smoking campus with the exception of designated smoking areas. 3

4 Schedule Theme: New Frontiers in Electron Devices Date: August 11, 2016 Location: GLOBALFOUNDRIES' Malta site Plenary Session: 8:30 a.m. to 12:00 p.m. - GLOBALFOUNDRIES' Global Café, Malta, NY 08:30-09:00 Coffee, pastries 09:00-09:10 Technical Session Information, Janet Tinkler, Sr Mgr/Dep. Dir of Global Technical Vitality 09:10-09:20 Welcome and Kick-off Remarks, Dr. Gary Patton, SVP and CTO of GLOBALFOUNDRIES 09:20-09:30 Dr. Fernando Guarin, IEEE EDS DL, IEEE Fellow and GF DMTS Si Devices 09:30-09:40 Dr. Mukta Farooq, IEEE EDS DL, IEEE Fellow and GF Fellow Packaging 09:40-10:20 Dr. Jamal Deen President Academy of Science, Royal Society of Canada; Distinguished University Professor Electrical & Computer Engineering Department & School of Biomedical Engineering, McMaster University, Hamilton, Ontario CANADA Talk Title: "Smart Sensors for Environmental and Health Applications" 10:20-10:40 Break 10:40-11:20 Dr. Seung Kang Director of Engineering at Qualcomm and IEEE EDS Distinguished Lecturer. Talk Title: "Emerging Memory Architectures for IOT (Internet-of-Things) and Wearables" 11:20-12:00 Dr. Rao Tummala Georgia Tech, Electronics Packaging Chair in the School of Electrical and Computer Engineering and joint faculty appointment in the School of Materials Science and Engineering. Founding Director of an NSF Engineering Research Center (ERC) called the Microsystems Packaging Research Center (PRC). Talk Title: "System Scaling: The Other Electronics Frontier For A New Era of Consumer, Computer and Automotive Applications." Break for Lunch: 12:00 p.m. to 1:30 p.m. GLOBALFOUNDRIES Internal Sessions: 1:30 p.m. to 5:30 p.m. (Breakout Rooms) 13:30-16:00 Technical Session Talks by Discipline 16:00-17:30 Technical Poster Session 4

5 Plenary Session 8:30 a.m. 12:00 p.m. GLOBAL Cafe Dr. M. Jamal Deen Title: Smart Sensors for Environmental and Health Applications Abstract: Two of the grand challenges in engineering are in the environmental and healthcare fields. In the environmental area, clean water for everyone is critical because water is a vital and necessary resource for all humans. However, chemicals and bacteria in drinking water pose significant health risks for us. To improve the safety of drinking water, sensitive, low-cost, rapid detection methods are required for water quality monitoring. Here, using Raman spectroscopy, a non-contacting, non-destructive, optical technique for chemical and biological analysis is developed. Since water is a weak Raman scatterer, then Raman spectroscopy is an especially promising technique for water quality monitoring. However, the low concentration of contaminants in water and the small Raman cross-section demand an integrated system consisting of ultrasensitive, low light level detectors and associated electronics. So in the first part, we describe an entire Micro-Raman spectrometer system. We also we describe our work on developing sensitive, small-size, flexible, easy-to-use, reliable and low-cost ph and chlorine sensing devices that are integrated with preprocessing modules and electronics towards smart sensors for drinking water quality monitoring. In the second part related to the healthcare challenge, we investigate biomedical imaging modalities such as time-of-flight (ToF) positron emission tomography (PET) and fluorescence-lifetime imaging microscopy (FLIM) for molecular and cellular imaging in medical diagnostics. To obtain high precision, high temporal resolution and high contrast medical images for more accurate diagnoses, state-of-the-art integrated electronics with high sensitivity, high counting rates and fine time resolution are needed. To meet these requirements, single photon detectors designed in standard, low-cost, deep sub-micron silicon technologies are employed. This approach also allows us to take advantage of the inherent speed and increased integration density afforded by the state-of-the-art silicon processes. We will describe the main components of high-performance biomedical imaging systems that combine integrated circuits with high-speed single photon detectors. The key design goals of high-resolution, high throughput, good linearity, wide measurement range, small size and low power, as well as results from extensive testing will be provided and discussed. ================================ Bio: Dr. M. Jamal Deen is currently Distinguished University Professor and Senior Canada Research Chair in Information Technology, McMaster University. His current research interests are nanoelectronics, optoelectronics, nanotechnology and their emerging applications to health and environmental sciences. Dr. Deen s research record includes more than 500 peer-reviewed articles (about 20% are invited), two textbooks on Silicon Photonics- Fundamentals and Devices and Fiber Optic Communications: Fundamentals and Applications, 6 awarded patents that have been used in industry, and 13 best paper/poster/presentation awards. Over his career, he has won more than fifty awards and honors. 5

6 Plenary Session 8:30 a.m. 12:00 p.m. GLOBAL Cafe Dr. Seung Kang Title: Embedded STT-MRAM: Emerging Products and Beyond Abstract: STT-MRAM has reached a level of maturity capable of serving early products. Compared with conventional and other emerging memories, STT-MRAM is a new class of memory to enable both nonvolatile information processing and storage. Potentially disruptive memory subsystems can be realized by utilizing a unique combination of high speed, nonvolatility, and practically unlimited read and write endurance. Compelling use cases are envisioned for emerging mobile products such as wearables, Internet-of- Things (IOT), and secure elements, which are in need of innovative memory subsystems in energy efficiency, cost, and security. In addition, high-performance embedded STT-MRAM is under development to serve advanced application processors. Embedded STT-MRAM products are to be built on CoFeB-based perpendicular magnetic tunnel junction (pmtj). Persistent innovations are essential to serve deeply scaled semiconductor nodes for broad applications. The success of STT-MRAM largely hinges on the pmtj scaling path. Required attributes include high STT efficiency and tunnel barrier tunability. Sustainable innovations in materials or process must account for these requirements simultaneously. Further, a robust circuit design methodology is critical to assure reliable chip operations over a sufficient process-voltage- temperature window. The STT-MRAM community shall continually be driven by holistic pathfinding and systematic optimization efforts concerning materials, device, circuit, and system architecture. ================================== Bio: Seung H. Kang is Director of Engineering, Corporate R&D, Qualcomm Technologies, Inc., and leads an emerging memory technology group for mobile systems, and healthcare/bio electronics. He received B.S. and M.S. degrees from Seoul National University, Korea, and his Ph.D. degree in Materials Science and Engineering from the University of California at Berkeley. Dr. Kang had worked at Lawrence Berkeley National Laboratory in the fields of SQUID sensors and VLSI interconnects. From 1998 till 2005, he worked at Lucent Technologies Bell Laboratories and led advanced device reliability projects as Distinguished Member of Technical Staff. In 2006, he joined Qualcomm and has pioneered embedded STT-MRAM and spintronic devices for mobile systems. He has served at numerous technical committees. He has published over 80 papers and delivered more than 40 keynote and invited speeches at international conferences. He also holds over 400 patents granted globally. Dr. Kang currently serves as an IEEE Electron Device Society Distinguished Lecturer. 6

7 Plenary Session 8:30 a.m. 12:00 p.m. GLOBAL Cafe Dr. Rao Tummala Title: System Scaling: The Other Electronics Frontier For A New Era of Consumer, Computer and Automotive Applications Abstract: What made electronics the largest industry is a result of singular focus on transistor scaling that started six decades ago. But the semiconductor and systems landscape is changing dramatically. ICs, on one hand, for the most part, are becoming commodities, providing much lower profit margins than ever before, leading to fabless companies and industry consolidation to less than ten manufacturing companies within the next decade, worldwide. In addition, the cost and complexity of transistor scaling is growing exponentially. There is no longer a cost reduction as the next node is introduced with higher transistor density. In addition, limits are being seen in frontend due to high leakage and in the backend due to high resistance. The driving engines for electronic systems, on the other hand, are also changing dramatically to smart, wearable, wireless healthcare, wireless networks, and new era of automotive electronics; requiring advances in computing and communications, sensor-based autonomous driving, as well as high-power and high-temperature electronics for electric cars. All these require an entirely different vision and strategy than transistor scaling alone that has been practiced during the last 60 years. These systems are small to ultra-small as well as highly heterogeneous. They must perform dozens of functions that include digital, wireless, photonics, MEMS and sensors, camera, 5G, mm-wave, radar, power, wireless power as well as ultra-high power and ultra-high heat transfer and many, many others, all at lowest cost, highest performance and reliability than ever before. The only way to accomplish is by means of system scaling leading to the concept of SOP (system-on-package) in 3D system architecture, in contrast to SOC. Georgia Tech sees unprecedented challenges and opportunities in addressing these needs by integration of disparate set of technologies that hitherto fore thought to be impossible to integrate. It sees a need for new strategic directions in system scaling to ultra-miniaturized components and their integration in 3D package architectures at system level. In addressing the above needs, packaging must move from serving the devices by simply packaging, as it did in the past, to enabling better devices and better systems. This is the basis of system scaling in this talk. ================================== Bio: Prof. Rao Tummala is a Distinguished and Endowed Chair Professor at Georgia Tech USA. He is well known as an industrial technologist, technology pioneer, and educator. Prior to joining Georgia Tech, he was an IBM Fellow, pioneering such major technologies as the industry s first plasma display and the first and next three generations of 100 chip multi-chip packaging. He is the father of LTCC and System-on-Package technologies. As an educator, Professor Tummala was instrumental in setting up the largest Academic Center in Electronic Systems at Georgia Tech involving more than 100 Ph.D and MS students, 25 faculty from ECE, ME, MSE and CHE, and 70 companies from the U.S., Europe and Asia, all working together with an integrated approach to research, education and industry. 7