Global Semiconductor and Electronics Forum 2017

Transcription

1 Global Semiconductor and Electronics Forum 2017 The Global Semiconductor and Electronics Forum (GSEF) is a unique event bringing together the end-to-end value chain of electronics development and production. Looking into the entire spectrum of challenge and opportunity for these fast-paced industries, GSEF is the only platform which supports progression of the entire semiconductor and electronics value chain. The event brings together C-level representatives from semiconductor manufacturers to consumer electronics and automotive companies to network, explore the latest trends, and find solutions to business-hindering challenges for a more connected future. Set over two days, GSEF is split into 2 distinct but interconnected tracks: one exploring the latest in semiconductors and the other on electronics. The programme is interweaved with one-to-one business meetings, providing exclusive airtime with the industry s suppliers. With our jam packed programme and variety of meetings on offer, GSEF offers you a tailor-made experience on site suited to your business needs. The annual event brings together C-Level, Executive and Senior VPs, Directors from the semiconductor and electronics industries. Both industries share similar challenges and opportunities and we seek to create a one stop shop to help guests meet their business needs. GSEF is an opportunity to share ideas, discover trends and network with peers, while accessing insight to exclusive research and case studies delivered by the industry s thought leaders. We invite you to become an active voice in this forum to shape the future of the industry. Sponsored by:

2 Pre-event welcome and registration 16:00 18:00 Event registration 18:00 21:00 Drinks reception and welcome dinner Thursday, 09 th March 2017 Day One: Identifying Intelligence and Innovation in the Global Semiconductor and Electronics Markets 08:00 08:50 Event registration and collection of meeting schedules 08:50 09:00 Chair s opening remarks 09:00 09:30 Keynote Presentation: Industry Overview Reviewing the industry in 2017 State of the industry: What are the key drivers? Focusing on the vision of a fully interconnected future with IoE Identifying how all industry players - from designers to component suppliers - can support this vision 09:35 10:05 Business meeting 1 Meeting room 10:05 10:35 Business meeting 2 Meeting room 10:35 11:05 Business meeting 3 Meeting room 11:10 11:15 Chair s Opening Remarks Global Semiconductor Forum (Conference room 1 ) Global Market Trends 11:15 11:45 Major drivers that will push industry growth Technological advances and global macroeconomic developments in the next 5 years Smaller, better, faster Ever more features on a single chip Strategy focus: Outsourcing or building a broad spectrum of knowledge in house? Refreshments and networking Exhibition area Global Electronics Forum (Conference room 2 ) Intelligent Homes and City Living Chair s Opening Remarks Axel Deicke, Director AutoSenEx Big data and advanced semiconductors for manufacturing Exploring the industrial Internet of Things Outlining the benefits of big data for manufacturing Technological advances that will drive the data industry Dr. Jinsoo Yoon, Vice President / Big Data R&D Group Leader Mobile & Communication Division - Samsung Electronics 11:45 12:15 12:15 12:45 Automotive Focus: Semiconductors as a key enabler for the industry Growth potential and opportunities in the automotive sector Increase of sophisticated electronic components per vehicle Taking advanced driver assistance systems (ADAS) to the next level IoE and the smart phone revolution breathing new life into the 200mm industry China s investment plans to increase capacity and cement its dominant position The return of 200mm fabs How to avoid challenges in secondary equipment supplies Topic TBC Hagen Fendler, Chief Design Officer TCL* Utilising IoE to create an interconnected environment Highlighting the benefits of utilising an interconnected ecosystem Exploring the key role of IoE for city planning, traffic control and intelligent living Creating a Internet of Secure Everything to prevent purpose-built attacks Representative, Schneider Electric*

3 12:45 13:45 Lunch and networking Exhibition area Day One (cont.) 13:45 14:15 Business meeting 4 Meeting room 14:15 14:45 Business meeting 5 Meeting room Refreshments and networking Exhibition area 14:45 15:15 Business meeting 6 Meeting room 15:20 15:50 Global Semiconductor Forum (Conference room 1 ) Big data and advanced semiconductors for manufacturing Outlining the benefits of big data for manufacturing Technological advances that will drive the data industry James Yang, Qualtera (Taiwan) Global Electronics Forum (Conference room 2 ) Innovative consumer technology trends Topic TBC Representative Lenovo* 15:50 16:20 Technological advances in Optical semiconductors and LED Recent research on semiconductor nanostructures Focusing on key trends in micro LED Evaluating growth over the next 5 years The evolutions of wearables Key technology trends that will shape wearables in the next 5 years Wearable case study Creating a relationship between wearables and existing devices David Lacey, Research and Innovation Director - Osram Opto Semiconductors* 16:20 17:00 Panel discussion: Driving effective integration of MEMS to support next generation devices Advantages of MEMS to enable the Internet of Moving Things Aligning the MEMS and semiconductor sector for a collaborative approach Innovating with unconventional materials and processes - Adrian Arcedera, VP MEMS & Sensors Amkor - Edvard Kalvesten, CEO Silex Microsystems - Benedetto Vigna, EVP MEMS & Analog STMicroelectronics Olivier Trolle, Vice President - Misfit APAC (Fossil Group) Panel Discussion: Outlining the future opportunities and challenges for wearables Synergy of trackers and watches Mobile phones as wearables Linking to PCs and wearables Olivier Trolle, Vice President - Misfit APAC (Fossil Group) Candy Gao, Country Manager Taiwan, Hong Kong and Philippines Fitbit 17:00 17:10 Chair s closing remarks Chair s closing remarks Axel Deicke, Director - AutoSenEx 17:10 Drinks reception and networking dinner

4 Friday, 10 th March 2017 Day Two: Designing and Manufacturing Electronics and Semiconductors of the Future 08:30 08:50 Event registration and refreshments 08:50 09:00 Chair s opening remarks Global Semiconductor Forum (Conference room 1 ) Designing and manufacturing the semiconductor of the future 09:00 09:30 Process technology challenges for advanced semiconductor manufacturing Evaluating manufacturing automation Manufacturer case study: Implementing technology Improving time to market and optimising global channel management Global Electronics Forum (Conference room 2 ) Chair s opening remarks Axel Deicke, Director AutoSenEx The future of transport: Automotives, mobility and connectivity The Connected car: current status and challenges for OEMs Highlighting the need for electrification, digitalisation and automation to go hand in hand Examining how the connected car fits into IoE Understanding the increasing value of infotainment in automated cars 09:30 10:00 Jinping Liu, Deputy Director - Global Foundries US* Debating the challenges of different designs: Which architecture to deploy? Should we move sideways instead of forcing the continuation of Moore s law? Gate-all-around nanowire FETs vs. triple-gate FinFETs Exploring new materials and designs to operate at faster frequencies with lower power dissipation Günther Nagy, Head of Technical PM, Digitalization, Energy Systems - Audi China Enterprise Management Outlining the cars role in IoT Connecting to consumer electronics Telematics: How do we use and communicate information? Future constrains and challenges in the automotive sector Steve Bentley, General Manager, Infotainment & Driver Interface Delphi (China) 10:05 10:35 Business meeting 7 Meeting room 10:35 11:05 Business meeting 8 Meeting room 11:10 12:00 Strategy focus: Disaggregation of the value chain to meet global demands Changing landscape of the industry Turning fixed costs into variable costs with a Fablight strategy Specialising in individual elements of the value chain Refreshments and networking Exhibition area Panel Discussion: Automated driving cloud systems reality or fiction? Recognising customer behaviour and future demands Opportunities in driving cloud Staying ahead of the curve to enable consumer driven innovation 12:00 12:30 Advanced materials and systems for optimised semiconductor packaging Is there an alternative to silicon for an industry reliant on this material? Reducing costs and improving efficiencies Evaluating new systems and processes Mandali Khalesi, Head of Asia Pacific Automotive HERE The future of transport: Exploring the role of drone technology to increase mobility Outlining the current use of drones Highlighting future developments and opportunities in the drone sector When will we be able to use drone technology for transport? Sponsored session

5 Day Two (cont.) 12:30 13:30 Lunch and networking Exhibition area 13:30 14:00 Business meeting 10 Meeting room 14:00 14:30 Manufacturer focus: Embracing technology Manufacturer case study: Implementing technology Demonstrating reliability, safety and robustness of technology to authorities New approaches for future success 14:30 15:30 Closing Expert Debate Establishing a Roadmap for the Industry in 2017 and Beyond 15:30 15:40 Join experts discussing strategic plans of action against the background of the forum s presentations. Panelists consist of representatives from different sectors to provide a cross industry view on the future direction of the market. Discussion points will include key points from across the our presentations: Highlighting the key industry trends identified from today s talks Will the automotive industry ever become truly autonomous? The mobility industry in 5 years What will the market look like? The role of semiconductors as a key enabler for the industry Discussing the way forward in innovative consumer technology - Dr. Jin Jwnag Wu, Vice President, United Microelectronics Corporation (Taiwan) Closing remarks Axel Deicke, Director AutoSenEx 15:40 Close of Global Semiconductor & Electronics Forum 2017 *Tentatively reserved for invited speakers

6 Last year s speakers include: GSF stream: Jesse Zhang, Programme Director, SEMI China Allen Lu, President, SEMI China Abel Mikati, Co-Founder and Executive Vice President, QUALTERA Tilo Pannenbaecker, Senior Director Purchasing, Infineon Technologies Asia Pacific Andrea Onetti, Group Vice President Volume MEMS Analog Div GM, STMicroelectronics Elvino da Silveira, Vice President of Marketing, Rudolph Technologies Michael Murray, General Manager IDS and High Performance Inertial, Analog Devices Chandra Mouli, Vice President, Manufacturing, Intel Thomas Klaushofer, Project Development, Siconnex Customized Solutions Ariel Meyuhas, Co-Founder and Chief Operations Officer,The MAX Group Thomas Skotnicki, Technical Vice President, Disruptive Technologies, Front-End Manufacturing and Technology R&D, Embedded Processing Solutions, STMicroelectronics Dr. John Y. Xie, Director, Packaging Technology Research and Development, Altera Corp Dr. JJ Wu, Vice President, United Microelectronics Corporation and Partner, Silicon Catalyst Dr. Tan Yong Tsong, Deputy Executive Director, Institute of Microelectronics, A*STAR Dr. Frank Stietz, President, Heraeus Electronics Ali Keshavarzi, Vice President R&D, Cypress Semiconductor Patrick Colin, Head of Market Segment Semiconductor, Pfeiffer Vacuum Bernd Wittstock, Director Operational Planning and Controlling, Infineon Technologies GEF stream: Alfred Boediman, Vice President, Samsung Electronics Charlie Liu, Head of Global External Innovation and Partnership, Sony Mobile Hagen Fendler, Chief Design Officer, ZTE Andy Rhodes, Executive Director Commercial IoT Solutions, Dell Devon Lee, Director of Communication, Misfit Ling Bai, Director of Connected Services, Qoros Auto Xiang Ruan, Expert, OMRON, Japan Celine Le Cotonnec, Head of Connected Services, Digital Marketing and Mobility, PSA Peugeot Citroen Terry Haggerty, Global Chief Engineer, Research and Advanced EESE, Ford Motor Jan Leuckfeld, Product Line Director Automotive, IDT Wei Sun, Senior Manager, IBM Francis Man, Head of IES China Interior Electronics Solutions, Continental Automotive Holding Co., Ltd. Axel Deicke, Director, AutoSenEx Hari Nair, Chief Design Officer, Whirlpool China Eric Janson, Executive Vice President, AMS Mandali Khalesi, Head of Asia Pacific, Automotive, HERE Paul Chen, Director of China, Intel Mobile Markus Seidel, Vice President, Head of BMW Group Technology Office China, BMW Pengju Kang, Engineering General Manager, GE Renewable Energy China