Global Semiconductor. & Electronics Forum March 2019, Shanghai, China CONNECTING TECHNOLOGY LEADERS. STREAMS: GSf Gef. Global Electronics Forum

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1 Global Semiconductor, Forum Global Electronics Forum

2 Event Background The concept of and Electronic Forum (GSEF) is based around bringing together the end to end value chain in semiconductors and consumer electronics. It s the industry s most important gathering that explores current and future trends, stands out as best for business promotions and finding solutions to business-hindering challenges. Each year we create a comprehensive agenda, attracting key speakers and an attentive audience gathers to share ideas and inspire the innovations of the future. The dual-streamed programme has been engineered to ensure that as an attendee you can gain benefit from a full two days of relevant content, regardless of whether your personal focus is strategy, decision, manufacturing, operations or technology. GSEF is made up of: The Forum (GSF) GSF, in its own right has been running for over a decade, hosting well-respected and high-ranking semiconductor developers to present, discuss and collaborate on key concerns, ideas and trends within the current market. The Global Electronics Forum (GEF) GEF has provided opportunities for delegates to develop lasting relationships, create new business partnerships and meet with key decision makers within the electronics manufacturing industry.

3 ef STREAMS: GSf G Advisors & Speakers Keynote Speaker Hans Stork Chief Technology Officer ON Semiconductors Dae-woo Kim Vice President of Packaged Solutions Package Development Team Samsung Semiconductors R&D Centre Dr. Hai Wang Senior Vice President Global Technolgy Innovation NXP Semiconductors Wei-Chung Wang Executive Vice President Manufacturing and Operations Cypress Semiconductors Dr. Guanshan Tong Senior Vice President and former Chief Technology Officer BOE Technology Group Co Michael Campbell Senior Vice President Engineering Qualcomm Incorporated Ralph Lauxmann Senior Vice President Systems and Technology Continental Automotive Hans Adlkofer Vice President Systems Group The Automotive Division Infineon Technologies Qi Bi Senior Vice President China Telecom Corporation Limited Eiji Fujii Executive Officer Panasonic Corporation Vice President CTO Automotive & Industrial Systems Company Ross Jatou Vice President and General Manager, Automotive Solutions Division ON Semiconductor Chidi Chidambaram Vice President QCT Process Technology & Foundry Engineering Qualcomm Inc

4 GSEF Chairs 2019 Sandeep Kumar Senior Vice President Worldwide Opertions Silicon Labs Chris Foster FAB25 Product Engineering and Integration Cypress Corporation Raghu Nambiar Corporate Vice President and Chief Technology Officer AMD John T. Kelly Senior Director International Programs Consumer Technology Association

5 What to expect Interactive presentations: Learn about the latest industry trends and challenges through our strategic presentations and case studies. Business meetings: Enhance your business partnerships and explore new solutions with our one-to-one business meetings. Networking opportunities: Meet new and like-minded people in a relaxed and friendly environment. Panel discussions: Be part of the conversation with industry experts as they open the floor to questions.

6 INDUSTRY REGION JOB TITLE Consumer Electronics 34% Semiconductor 40% Europe 9% Group Head 9% Director 5% Asia 53% EVP/VP 32% C-Level 54% North America 38% Automotive 26% The entire semiconductor and electronics industry in one place Semiconductors Automotive Embedded systems Displays Sensor technology Test and measurement Electronic Design (ED/EDA) Passive components Electro mechanics/system peripherals (connectors, relays, switches, keyboards and casing technology) Power supplies PCBs, other circuit carriers and EMS Wireless Robotics

7 GSEF 2019 Advisory Board Ralph Lauxmann, Senior Vice President Systems & Technology, Continental Automotive Hans Adlkofer, Vice President Systems Group, The Automotive Division, Infineon Technologies Hai Wang, Senior Vice President, Global Technology Innovation, NXP Semiconductors Wei-Chung Wang, Executive Vice President, Manufacturing and Operations, Cypress Semiconductor Michael Campbell, Senior Vice President Engineering, Qualcomm Incorporated Qi Bi, Senior Vice President, China Telecom Technology Innovation Centre Dr Guanshan Tong, Senior Vice President and Former Chief Technology Officer, BOE Technology Group Co Eiji Fujii, Executive Officer, Panasonic Corporation and Vice President Chief Technology Officer, Automotive & Industrial Systems Company Ross Jatou, Vice President & General Manager, Automotive Solutions Division, ON Semiconductor Forum Programme Day One 13 March :00 18:00 Event registration 18:00 21:00 Drinks Reception and Welcome Dinner Forum Programme Day Two 14 March :00-08:50 Event Registration and Collection of Meeting schedules 08:50-09:00 Chair s opening remarks: Sandeep Kumar, Senior Vice President, Worldwide Operations, Silicon Labs 09:00-09:30 Opening Address: Sensor and power semiconductors as enablers of a transportation revolution Power electronics is essential to the electrification of driving Power devices and modules are scaling rapidly in size and performance, with new materials and processes Image sensors for high speed mobility require both high dynamic range and speed; hard to do both New package level integration processes enable better architectures for the imaging system Automotive robustness and quality expectations are now a safety condition Smartness (ie AI support) must be accessible locally and remotely Hans Storks, Chief Technology Officer, On Semiconductor

8 09:30-10:00 Managing Big Data: Convergence in the cloud for IoT Examining the exponential growth of artificial intelligence adoption in the cloud and at the edge The value of pre-processing at the edge to optimising the cloud environment Raghu Nambiar, Corporate Vice President and Chief Technology Officer, AMD 10:00-10:30 Application of Big Data and Machine Learning in Global Manufacturing Chains to Control IC Quality, Yield, and Manufacturing Excellence Fmplementation of end-to-end IC-level traceability for automotive quality control Automated cross-supply-chain data analytics for smart manufacturing Smart data sharing in collaborative manufacturing ecosystems Going from big data to instant manufacturing insights and action Dr. Paul Simon, Executive VP and co-founder, Qualtera 10:35-11:05 MEETING 1 11:10-11:40 MEETING 2 GSF: Chair Sandeep Kumar, Senior Vice President, Worldwide Operations, Silicon Labs GEF: Chair John T. Kelley, Senior Director, International Programs, Consumer Technology Association 11:45-12:15 MEETING 3 12:15-12:45 Keynote presentation: Semiconductors for Safe and Secure Mobility Automotive is driving the next wave of semiconductor growth as global megatrends result in tripling the IC content per car With this growth, comes a new set of disruptive challenges in automotive IC manufacturing To ensure quality, safety and security, a new more holistic approach is needed This session will address the manufacturing considerations and requirements for future car electronics Hai Wang, Senior Vice President, Global Technology Innovations, NXP Semiconductors Keynote Presentation: Autonomous driving systems Exploring the advancement of new features, connectivity, and intelligence in modern vehicle Optimising IVI systems to enhance user experience How to successful integrate of smart technology to meet customer needs The role of artificial intelligence and machine learning in personalising the driving experience Ralph Lauxmann, Senior Vice President Systems & Technology, Continental Automotive MEETING 4

9 12:45-13:15 MEETING 5 13:15-14:15 Lunch and Networking Chair: Chris Foster, Vice President Fellow, FAB25 Product Engineering and Integration, Cypress corporation E-mobility and Electric Vehicles: GM s Zero emission strategy Overcoming challenges to battery technology and charging infrastructure How existing supply chain support EV battery production Maximising car lifetime value through IOT and data analytics Chair: John T. Kelley, Senior Director, International Programs, Consumer Technology Association 14:15-14:45 Live interview: The Future of displays LCD, OLED, or MicroLED Which will dominate the industry LCD, OLED or MicroLED Acknowledging how OLED will influence the smartphone, smart TVs and flexible electronics industry What will emerge after MicroLED 14:45-15:15 MEETING 6 15:15-15:45 PANEL DISCUSSION: The future of semiconductor test systems Options for testing complex semiconductor devices Traditional design and test cycles High Volume MEMS Production Test Speakers: Astronics Test Systems Flexible displays for future technology: Unlocking innovative product designs How will flexible displays and sensors promote innovative products How will they facilitate greater user experience and compatibility with the user s lifestyle 15:50-16:20 Advanced Materials: Role of materials in addressing new challenges in developing devices with advanced performance MEETING 7 16:20-16:50 Best Practice: Samsung Advanced Package Solution What is Advanced Package? Mobile package trend and solution path for future premium mobile products AI/Network package solution using interposer and Dae-Woo Kim, Vice President Of Advanced Package Solution, Package Development Team, Samsung Semiconductor R&D Center New Technology innovation and brand protection Understanding the next level of consumer technology Brand protection and the development of unique products 16:50-17:20 The end of Moore s law: Assessing the Path forward for IC manufacturing PR (Chidi) Chidambaram, Vice President, QCT Process Technology & Foundry Engineering, Qualcomm Incorporated MEETING 8

10 17:20 18:00 PANEL DISCUSSION: 5G world- Growth in high bandwidth communication: the move from 4G to 5G Research shows that 5G connections will provide a number of enhanced capabilities over 4G which include increased data rates, reduced latency and enhanced reliability. This panel aims to assess the progress of 5G connection. Establishing infrastructure to withstand 5G capabilities Overcoming challenges surrounding power and the security risk brought on by connections Exploring how 5G will push forward innovation in autonomous vehicles, smartphones and VR/AR industries Examining the future of 5G: Will there be 6G in the near future Qi Bi, Senior Vice Present, China Telecom Technology Innovation Centre 18:00 Chair s Closing Remarks: John T. Kelley, Senior Director, International Programs, Consumer Technology Association 18:00-20:00 Drinks Reception and Networking Sponsored by Nordson Forum Programme Day Three 15 March :00-09:00 Event Registration and Collection of Meeting schedules 09:00-09:10 Chair s opening remarks: John T. Kelley, Senior Director, International Programs, Consumer Technology Association 09:10-09:40 Keynote speech: 09:40-10:10 On-site Gas Production: Enabling Semiconductor Manufacturing Large volumes of ultra-high purity gases are needed for semiconductor and display manufacturing Nitrogen and often oxygen, argon, and hydrogen can be more economically and efficiently manufactured on-site rather than delivered by truck from remote sources On-site gas production plants are built at the same time as the fab because gases need to be available as soon as the fab shell is finished We will illustrate the specification, design, execution, and qualification necessary for a successful on-site gas production project 10:10-10:40 MEETING 9 10:40-11:10 MEETING 10 11:10-11:40 Maximising Industry 4.0 to achieve efficiency and save cost How to successfully deploy machine learning and robotics for labour intensive tasks Combining lean manufacturing and industry 4.0 principles to achieve operational excellence Prevention maintenance: Implementing advanced analytics to assess machine function in real-time and predict failure Leveraging incoming data to improve day-to-day operations

11 GSF: Chair Raghu Nambiar, Corporate Vice President and Chief Technology Officer, AMD GEF: Chair John T. Kelley, Senior Director, International Programs, Consumer Technology Association 11:45-12:15 MEETING 11 12:15-12:45 Lithography: Movement from 7nm to 5nm Lithography at 5nm - Will EUVL have a prominent role at 5nm? Identifying new innovative methods for heat management Analysing the power density and physical limits of 5nm chips Overcoming the manufacturing cost barriers: Alternative to EUV How quantum effects will impact designs below 5nm Open standards for VR/AR and AI How to best utilise VR tech and mainstream VR adoption to further your business goals and increase revenue Integrating augmented reality to personalise user experience Leveraging VR and AR in other industries IoT Security be part of the solution How to successfully mitigate the increased security risks of connecting several devices to the internet Latest policies and planning of IoT security such as internet security law of the People s Republic of China Designing chips that protect themselves: Protecting data, embedded systems and software Recognising the long-term cost benefits of this approach Understanding the rapidly evolving cyber-threat landscape 12:45-13:45 Lunch and Networking 13:45-14:15 Business Meeting 12 14:15-14:45 Memory/NAND application in the Internet of Things world Addressing new applications Exploring the 3D NAND Flash memory demand for smartphones, laptops and tablets John Scaramuzzo, SVP, Advanced Storage Technology Office, Western Digital MEETING 13 14:45-15:15 Automotive and telecom industry partnerships in driving forward innovation in mobility and 5G The benefits of collaborations in the development of future mobility and 5G services Security considerations and future forecasts BUSINESS MEETING 14

12 15:15-15:55 PANEL DISCUSSION: The growth of autonomous driving: Achieving level four - highly autonomous vehicles by Autonomous vehicles can be viewed as a blend of semiconductor driven technology, the list includes: 3-D mapping applications, augmented reality, enhanced LIDAR sensors and improved camera based sensors. These developments have changed the way vehicle manufacturers interact with their suppliers and increased the demands from the semiconductor industry. What will it take to achieve success and encourage the journey towards full-autonomous vehicles? How will the industry address the fundamental concerns around safety How to bridge the impeding gap between expectations and demands between the automotive industry and their suppliers Understanding the regulation and policies that underpin the movement to build driverless cars 15:55-16:00 Chair s Closing Remarks: Raghu Nambiar, Corporate Vice President and Chief Technology Officer, AMD 16:00-17:00 Farewell Drinks and Close of GSEF 2019

13 GSEF Q&A Dr. Hai Wang Senior Vice President Global Technolgy Innovation NXP Semiconductors ef STREAMS: GSf G We ve interviewed a few of our speakers and advisors for this year s forum here they share their insights with us: Michael Campbell Senior Vice President Engineering Qualcomm Incorporated Ralph Lauxmann Senior Vice President Systems and Technology Continental Automotive Dae-woo Kim Vice President of Packaged Solutions Package Development Team Samsung Semiconductors R&D Centre Wei-Chung Wang Executive Vice President Manufacturing and Operations Cypress Semiconductors Eiji Fujii Executive Officer Panasonic Corporation Vice President CTO Automotive & Industrial Systems Company Q1: What first attracted you to the semiconductor/consumer electronics industry? Dr. Hai Wang, NXP Semiconductors One of the professors in college advised us that semiconductor is a really difficult major to pursue. Michael Campbell, Qualcomm Incorporated The constant innovation and continuous challenges from both an engineering excellence view and a manufacturing excellence, is truly unique. Ralph Lauxmann, Continental Automotive The semiconductor/consumer electronics industry always has a strong influence on the automotive industry, as its innovations drive the technology progress in automotive as well. Examples are the GPUs that originally were developed for video gaming and today are used in automotive computer vision applications like traffic sign recognition or lane keeping assistant. Looking to Automated Driving and Artificial Intelligence which are needing even more computation power, we are relying again on innovative concepts of the semiconductor industry. Wei-Chung Wang, Cypress Semiconductors I was interested in solid state physics in college and chose semiconductor for my graduate study. That s why I joined Intel after graduate school and continue to be in this industry until now. Dae-woo Kim, Samsung Semiconductors R&D Centre My detail background was LED (Light Emitting Diode) & LD (Laser diode) and my favourite color is blue. So, I want to work on blue light emitting device. Eiji Fujii, Panasonic Corporation, Automotive & Industrial Sytems Company IoT system and related devices including printed electronics.

14 Q2: What has been your company s biggest challenge in 2018? Dr. Hai Wang, NXP Semiconductors The now defunct Qualcomm acquisition of NXP was a challenge for us in However, once again as a standalone company, the core basics of the business have actually strengthened and our position in Automotive and Industrial & IoT is stronger than ever. Michael Campbell, Qualcomm Incorporated Start of the commercialization of 5G. Ralph Lauxmann, Continental Automotive In the next decade and after, the global automotive industry will undergo the largest and most profound transformation in its over 130-year history. We are looking ahead and taking on this transformation at an early stage. The innovation speed in the Automotive gets similar to consumer electronics. Therefore, our development phases need to get faster. Learning from best practices in the software industry, we have started to introduce agile methods to cope with that challenge. Besides that, we are intensifying our partnerships as well as collaborations with startups. Complexity is continuously increasing, and customers demand more and more integration capabilities from us as suppliers. To cope with that we are further growing our system engineering competence up to vehicle level and mobility eco-systems. To extend our know-how, we constantly develop our organisation and employees. Especially for Automated Driving, a lot of questions need to be answered. But we cannot work on all of them in parallel. The prioritisation of topics is a real challenge. We manage that by clustering them in so-called building blocks like environmental perception, motion control, or artificial intelligence and defining a clear strategy for each of them. Summing up. The mentioned challenges that we are facing in the Automotive industry especially from an advanced engineering perspective and building a bridge to the semiconductor industry: across all vehicle domains we are intensively working on solutions to bring more computing power into the vehicles in order to offer solutions for Automated Driving and handling the increasing complexity as well as the integration requirements. Wei-Chung Wang, Cypress Semiconductors Being able to have enough manufacturing capacity to meet demands in most part of 2018 and managing demand swing in Q4 due to tariff and economy condition concerns. Dae-woo Kim, Samsung Semiconductors R&D Centre Catch up the advanced package platform. Eiji Fujii, Panasonic Corporation, Automotive & Industrial Sytems Company Show the new company concept in our 100 year anniversary.

15 Q3: What do you think is needed in the semiconductor industry/consumer electronics industry to encourage growth and innovation? Dr. Hai Wang, NXP Semiconductors In both the Industrial & IoT and Automotive semiconductor markets, we should see continued growth in both the number of units shipped and content per unit. To encourage this growth, the automotive market needs to help accelerate the three megatrends of autonomy, electrification and connectivity. In the Industrial & IoT market, growth will come from edge computing and machine learning, with an increased demand for scalable processing solutions. Michael Campbell, Qualcomm Incorporated General simulation tools to deliver better integrated design for the IOT space to speed time to market. Ralph Lauxmann, Continental Automotive From my perspective as I am an expert in the Automotive industry, I can tell you about our growth forces. The key innovation fields in Automotive are Automated Driving, Connectivity, Electrification and Shared Mobility. Some of these trends lead to disruption but as well to a lot of new opportunities. To be able to distinguish between short-term hypes and long-term profit pools is the key to identify the relevant innovation fields that will create sustainable growth. Dae-woo Kim, Samsung Semiconductors R&D Centre There has been lots of talks about Fan Out package platform after TSMC released Info package, but I believe INFO package was too early for general mobile product application. Now, FO Package seems to be Must-Have. We felt our FO PKG development little bit late, so we tried to catch up. 2.5D Si interposer also was very similar situation and finally we are now on track. Key challenge was mass production readiness in both technology. As for Good Application, we have lots of different devices and package solution. In order to boost up entire industry, we need new application, such as software development. I meant mainly someone need to combine what the end user want to use. IOT was one of good examples, also autonomous driving would be next one. Wei-Chung Wang, Cypress Semiconductors Taking advantage of opportunities in AI, automotive, IoT, cloud computing, and 5G. Applying advanced data analytics to how we manage engineering and manufacturing for fast time to market. Continuing to expand in emerging markets. These are 3 different areas business opportunities, how we apply data analytics, and grow business into new markets. I look the first one from market opportunity perspectives. For semiconductor industry, it always needs a market driver for innovation, technology, manufacturing, and business. PC, smart phone, IoT are all examples. One of the key issue today is that smartphone market is matured and revenue flatted out. AI, automotive, IoT, cloud, 5G are offering real opportunities. No one is 100% sure the growth rate or timing, but these are areas of opportunities for folks to invest, to put innovative ideas into products, demands, and business growth. Every company has different expertise and strengths, and every company has to figure out how they align their strategic directions and investments to align with future opportunities. I can highlight the trends, and every member in this industry has to figure out how they want to do it. As for applying data analytics, I believe it s important for us to use big data and analytics for engineering as well as manufacturing. Eiji Fujii, Panasonic Corporation, Automotive & Industrial Sytems Company Show the post smart phone or new HMI.

16 Q4: What will be the top three trends in 2019? Dr. Hai Wang, NXP Semiconductors For the Automotive market, the global megatrends of autonomy, electrification and connectivity will continue to be key areas in In terms of the Industrial & IoT market, there will be increased focus on bringing artificial intelligence and machine learning closer to industrialization, with affordable low power processing solutions. Michael Campbell, Qualcomm Incorporated IOT, DATA ( at the edge, the cloud, and personal device); and machine learning. Ralph Lauxmann, Continental Automotive As mentioned, the four innovation trends in the Automotive industry are Automated Driving, Connectivity, Electrification and Shared Mobility. As a system provider and technology company it is becoming essential to provide not only components, but holistic solutions to our customers. As well we have to explore the potential of Artificial Intelligence for Automotive applications. Last but not least there is the clear demand to transform today s decentralized E/E vehicle architecture first to a domain-based and later to a central-server architecture. This will require much more computing power in the future. Wei- Chung: AI, automotive (autonomous, electrification, ADAS), and IoT. Dae-woo Kim, Samsung Semiconductors R&D Centre - FO PKG technology would be main mobile package, at least for development. - Package will be more important. Memory will find more stable spot in the market. More demands. Eiji Fujii, Panasonic Corporation, Automotive & Industrial Sytems Company AI, IoT, HMI

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