Type Marking Pin Configuration Package BCR139F BCR139L3 BCR139T 2=E 2=E 2=E 1=B 1=B 1=B 3=C 3=C 3=C
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1 BCR9... NPN Silicon Digital Transistor Switching circuit, inverter, interface circuit, driver circuit Built in bias resistor (R = kω) BCR9F/L BCR9T C R B E EH764 Type Marking Pin Configuration Package BCR9F BCR9L BCR9T WYs WY WYs =B =B =B =E =E =E =C =C =C TSFP TSLP4 SC75 Maximum Ratings Parameter Symbol Value Unit Collectoremitter voltage V CEO 5 V Collectorbase voltage V CBO 5 Emitterbase voltage V EBO 5 Input on voltage V i(on) Collector current I C m Total power dissipation BCR9F, T S 8 C BCR9L, T S 5 C BCR9T, T S 9 C P tot mw Junction temperature T j 5 C Storage temperature T stg Mar5
2 BCR9... Thermal Resistance Parameter Symbol Value Unit Junction soldering point ) R thjs K/W BCR9F BCR9L BCR9T Electrical Characteristics at T = 5 C, unless otherwise specified Parameter Symbol Values Unit min. typ. max. DC Characteristics Collectoremitter breakdown voltage I C = µ, I B = V (BR)CEO 5 V Collectorbase breakdown voltage I C = µ, I E = Emitterbase breakdown voltage I E = µ, I C = Collectorbase cutoff current V CB = 4 V, I E = DC current gain ) I C = 5 m, V CE = 5 V Collectoremitter saturation voltage ) I C = m, I B =.5 m Input off voltage I C = µ, V CE = 5 V Input on voltage I C = m, V CE =. V V (BR)CBO 5 V (BR)EBO 5 I CBO n h FE 6 V CEsat. V V i(off).4.8 V i(on).5. Input resistor R 5 9 kω C Characteristics Transition frequency I C = m, V CE = 5 V, f = MHz Collectorbase capacitance V CB = V, f = MHz f T 5 MHz C cb pf For calculation of RthJ please refer to pplication Note Thermal Resistance Pulse test: t < µs; D < % Mar5
3 BCR9... DC current gain h FE = ƒ(i C ) V CE = 5V (common emitter configuration) Collectoremitter saturation voltage V CEsat = ƒ(i C ), h FE = hfe IC 4 I C Input on Voltage Vi (on) = ƒ(i C ) V CE =.V (common emitter configuration) V V CEsat Input off voltage V i(off) = ƒ(i C ) V CE = 5V (common emitter configuration) IC IC V V i(on) V V i(off) Mar5
4 BCR9... Total power dissipation P tot = ƒ(t S ) BCR9F Total power dissipation P tot = ƒ(t S ) BCR9L mw mw Ptot Ptot C 5 T S C 5 T S Total power dissipation P tot = ƒ(t S ) BCR9T mw Ptot C 5 T S 4 Mar5
5 BCR9... Permissible Puls Load R thjs = ƒ ( ) BCR9F Permissible Pulse Load P totmax /P totdc = ƒ( ) BCR9F RthJS K/W D= Ptotmax/PtotDC D= s Permissible Puls Load R thjs = ƒ ( ) BCR9L s Permissible Pulse Load P totmax /P totdc = ƒ( ) BCR9L RthJS D = Ptotmax/ PtotDC D = s s 5 Mar5
6 BCR9... Permissible Puls Load R thjs = ƒ ( ) BCR9T Permissible Pulse Load P totmax /P totdc = ƒ( ) BCR9T K/W RthJS D= Ptotmax / PtotDC D= s s 6 Mar5
7 Package SC75 Package Outline.6 ± MX..7 ± acc. to DIN ±. MX..5 ±. MX..8 ±..5. M.5. M Foot Print Marking Layout Manufacturer Pin Type code BCR8T Example Packing Code E67: Reel ø8 mm =. Pieces/Reel Code E64: Reel ø mm =. Pieces/Reel MX Pin.75.9
8 Package TSFP Package Outline. ±.5. ±.5. ± ±.5. MIN. MX..8 ±.5.5 ±.5. M x.4.4. M Foot Print Marking Layout Manufacturer Pin Type code Example BCR847BF Packing Code E67: Reel ø8 mm =. Pieces/Reel Code E64: Reel ø mm =. Pieces/Reel Pin.5.7
9 Package TSLP4 Package Outline Top view.4 ±.5 Bottom view S.5 MX.. S ).5 ±.5 x.5.6. M B.5 x Orientation marking x. M ) Dimension applies to plated terminals B ).5 ±.5 ).5 ±.5 ).4 ±.5 B. M B. M B x Foot Print R Copper Solder mask Stencil apertures Marking Layout Type code Laser marking Packing Code E67: Reel ø8 mm = 5. Pieces/Reel R..5 Orientation marking.76
10 Impressum Published by Infineon Technologies G, St.MartinStrasse 5, 8669 München Infineon Technologies G 5. ll Rights Reserved. ttention please! The information herein is given to describe certain components and shall not be considered as a guarantee of characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of noninfringement, regarding circuits, descriptions and charts stated herein. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office ( Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in lifesupport devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that lifesupport device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.
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