SGM8631/2/3/4 470μA, 6MHz, Rail-to-Rail I/O CMOS Operational Amplifiers

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1 PRODUCT DESCRIPTION The SGM863 (single), SGM863 (dual), SGM8633 (single with shutdown) and SGM8634 (quad) are low noise, low voltage, and low power operational amplifiers, that can be designed into a wide range of applications. The SGM863//3/4 have a high gain-bandwidth product of 6MHz, a slew rate of 3.7V/μs, and a quiescent current of 47μA/amplifier at 5V. The SGM8633 has a power-down disable feature that reduces the supply current to 9nA. The SGM863//3/4 are designed to provide optimal performance in low voltage and low noise systems. They provide rail-to-rail output swing into heavy loads. The input common mode voltage range includes ground, and the maximum input offset voltage are 3.5mV for SGM863//3/4. They are specified over the extended industrial temperature range (-4 to +5 ). The operating range is from.5v to 5.5V. The SGM863 single is available in Green SC7-5, SOT-3-5 and SOIC-8 packages. The SGM863 dual is available in Green SOIC-8 and MSOP-8 packages. The SGM8633 single with shutdown is available in Green SOT-3-6 and SOIC-8 packages. The SGM8634 quad is available in Green TSSOP-4 and SOIC-4 packages. FEATURES Low Cost Rail-to-Rail Input and Output.8mV Typical V OS High Gain-Bandwidth Product: 6MHz High Slew Rate: 3.7V/μs Settling Time to.% with V Step:.μs Overload Recovery Time:.9μs Low Noise: nv/ Hz Supply Voltage Range:.5V to 5.5V Input Voltage Range: -.V to +5.6V with V S = 5.5V Low Supply Current 47μA/Amplifier (TYP) 9nA Shutdown Current for SGM8633 Small Packaging SGM863 Available in SC7-5, SOT-3-5 and SOIC-8 SGM863 Available in MSOP-8 and SOIC-8 SGM8633 Available in SOT-3-6 and SOIC-8 SGM8634 Available in TSSOP-4 and SOIC-4 APPLICATIONS Sensors Audio Active Filters A/D Converters Communications Test Equipment Cellular and Cordless Phones Laptops and PDAs Photodiode Amplification Battery-Powered Instrumentation REV. C

2 PACKAGE/ORDERING INFORMATION MODEL SGM863 SGM863 SGM8633 SGM8634 ORDER NUMBER PACKAGE DESCRIPTION PACKAGE OPTION MARKING INFORMATION SGM863XC5/TR SC7-5 Tape and Reel, SGM863XN5/TR SOT-3-5 Tape and Reel, SGM863XS/TR SOIC-8 Tape and Reel, 5 SGM863XS SGM863XMS/TR MSOP-8 Tape and Reel, 3 SGM863XMS SGM863XS/TR SOIC-8 Tape and Reel, 5 SGM863XS SGM8633XN6/TR SOT-3-6 Tape and Reel, SGM8633XS/TR SOIC-8 Tape and Reel, 5 SGM8633XS SGM8634XS4/TR SOIC-4 Tape and Reel, 5 SGM8634XS4 SGM8634XTS4/TR TSSOP-4 Tape and Reel, 3 SGM8634XTS4 ABSOLUTE MAXIMUM RATINGS Supply Voltage, +V S to -V S V Common Mode Input Voltage....(-V S) -.5V to (+V S) +.5V Storage Temperature Range to +5 Junction Temperature...6 Operating Temperature Range to +5 Package Thermal T A = 5 SC7-5, θ JA /W SOT-3-5, θ JA... 9 /W SOT-3-6, θ JA... 9 /W SOIC-8, θ JA...5 /W MSOP-8, θ JA... 6 /W Lead Temperature (Soldering sec) ESD Susceptibility HBM...5V MM...4V CAUTION This integrated circuit can be damaged by ESD if you don t pay attention to ESD protection. SGMICRO recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. SGMICRO reserves the right to make any change in circuit design, specification or other related things if necessary without notice at any time. Please contact SGMICRO sales office to get the latest datasheet. NOTE: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

3 PIN CONFIGURATIONS (TOP VIEW) SGM863 SGM863/8633 OUT 5 +V S NC 8 DISABLE (SGM8633 ONLY) -V S -IN 7 +V S +IN 3 4 -IN +IN 3 6 OUT SOT-3-5/SC7-5 -V S 4 NC = NO CONNECT 5 NC SGM8633 SOIC-8 OUT -V S V S DISABLE OUTA SGM OUTD +IN 3 4 -IN -INA 3 -IND SOT-3-6 +INA 3 +IND SGM863 +V S 4 -V S OUTA -INA 8 7 +V S OUTB +INB -INB OUTB INC -INC OUTC +INA 3 6 -INB TSSOP-4/SOIC-4 -V S 4 5 +INB SOIC-8/MSOP-8 3

4 SGM863//3/4 ELECTRICAL CHARACTERISTICS: V S = +5V (At T A = +5, V CM = V S /, R L = 6Ω, unless otherwise noted.) SGM863//3/4 TYP MIN/MAX OVER TEMPERATURE PARAMETER CONDITIONS to -4 to -4 to MIN / UNITS MAX INPUT CHARACTERISTICS Input Offset Voltage (V OS) mv MAX Input Bias Current (I B ) pa TYP Input Offset Current (I OS ) pa TYP Input Common Mode Voltage Range (V CM ) V S = 5.5V -. to V TYP +5.6 Common Mode Rejection Ratio (CMRR) V S = 5.5V, V CM = -.V to 4V V S = 5.5V, V CM = -.V to 5.6V db db MIN MIN Open-Loop Voltage Gain (A OL) R L = 6Ω,V O =.5V to 4.85V R L = kω,v O =.5V to 4.95V db db MIN MIN Input Offset Voltage Drift (ΔV OS /Δ T ).4 μv/ TYP OUTPUT CHARACTERISTICS Output Voltage Swing from Rail R L = 6Ω. V TYP R L = kω.5 V TYP Output Current (I OUT) ma MIN Closed-Loop Output Impedance f = khz, G = 3 Ω TYP POWER-DOWN DISABLE Turn-On Time 4 μs TYP Turn-Off Time. μs TYP DISABLE Voltage-Off.8 V MAX DISABLE Voltage-On V MIN POWER SUPPLY Operating Voltage Range V V MIN MAX Power Supply Rejection Ratio (PSRR) V S = +.5V to +5.5V V CM = (-V S ) +.5V db MIN Quiescent Current/Amplifier (I Q ) I OUT = μa MAX Supply Current when Disabled 9 na MAX (SGM8633 Only) DYNAMIC PERFORMANCE Gain-Bandwidth Product (GBP) R L = kω 6 MHz TYP Phase Margin (φ O) 6 degrees TYP Full Power Bandwidth (BW P ) <% distortion, R L = 6Ω 5 khz TYP Slew Rate (SR) G = +, V Step, R L = kω 3.7 V/μs TYP Settling Time to.% (t S ) G = +, V Step, R L = 6Ω. μs TYP Overload Recovery Time V IN Gain = V S, R L = 6Ω.9 μs TYP NOISE PERFORMANCE Voltage Noise Density (e n) f = khz nv/ Hz TYP Current Noise Density (i n ) f = khz 3 fa/ Hz TYP 4

5 SGM863//3/4 TYPICAL PERFORMANCE CHARACTERISTICS At T A = +5, V CM = V S /, R L = 6Ω, unless otherwise noted. Output Voltage (V p-p ) Closed-Loop Output Voltage Swing V IN = 4.9V P-P T A = 5 R L = kω G = Frequency (khz) Output Impedance (Ω) Output Impedance vs. Frequency G = G = G = Frequency (khz) Positive Overload Recovery Negative Overload Recovery V V IN mv /div V IN V mv /div V OUT V R L = kω G = V S = ±.5V V IN = -mv P-P (RET to GND) C L = pf V /div V V OUT R L = kω G = V S = ±.5V V IN = +mv P-P (RET to GND) C L = pf V /div Time (.3µs/div) Time (.3µs/div) Large-Signal Step Response Small-Signal Step Response Voltage (V/div) G = + C L = pf R L = kω Voltage (5mV/div) G = + C L = pf R L = kω Time (μs/div) Time (μs/div) 5

6 SGM863//3/4 TYPICAL PERFORMANCE CHARACTERISTICS At T A = +5, V CM = V S /, R L = 6Ω, unless otherwise noted. PSRR vs. Frequency CMRR vs. Frequency PSRR (db) 8 6 CMRR (db) Frequency (khz).. Frequency (khz) Small-Signal Overshoot (%) Small-Signal Overshoot vs. Load Capacitance R L = kω T A = 5 G = +OS -OS Load Capacitance (pf) Channel Separation (db) Channel Separation vs. Frequency R L = 6Ω T A = 5 G =. Frequency (khz) CMRR vs. Temperature V S = 5.5V V CM = -.V to 4V 3 PSRR vs. Temperature V S =.5V to 5.5V CMRR (db) 9 8 PSRR (db) 9 7 V CM = -.V to 5.6V Temperature ( ) Temperature ( ) 6

7 SGM863//3/4 TYPICAL PERFORMANCE CHARACTERISTICS At T A = +5, V CM = V S /, R L = 6Ω, unless otherwise noted. Supply Current (μa) Supply Current vs. Temperature V S =.5V 35 V S = 3V Temperature ( ) Shutdown Current (na) Shutdown Current vs. Temperature 8 5 V S = 3V V S =.5V Temperature ( ) Open Loop Gain (db) Open-Loop Gain vs. Temperature R L = kω R L = 6Ω Temperature ( ) Output Voltage (V) Output Voltage Swing vs. Output Current 5 Sourcing Current Sinking Current Output Current (ma) Output Voltage (V) 3 Output Voltage Swing vs. Output Current V S = 3V Sourcing Current Sinking Current Output Current (ma) Small-Signal Overshoot (%) Small-Signal Overshoot vs. Load Capacitance V S =.7V R L = kω T A = +5 G = +OS -OS Load Capacitance (pf) 7

8 SGM863//3/4 TYPICAL PERFORMANCE CHARACTERISTICS At T A = +5, V CM = V S /, R L = 6Ω, unless otherwise noted. Output Impedance (Ω) V S =.7V Output Impedance vs. Frequency G = G = G = Frequency (khz) Output Voltage (V p-p ) Closed-Loop Output Voltage Swing V S =.7V V IN =.6V P-P T A = 5 R L = kω G = Frequency (khz) Large-Signal Step Response Small-Signal Step Response Voltage (5mV/div) V S =.7V G = + C L = pf R L = kω Voltage (5mV/div) V S =.7V G = + C L = pf R L = kω Time (μs/div) Time (μs/div) Channel Separation (db) 4 3 Channel Separation vs. Frequency V S =.7V R L = 6Ω T A = 5 G = Voltage Noise (nv/ Hz) Input Voltage Noise Spectral Density vs. Frequency 9. Frequency (khz) Frequency (Hz) 8

9 SGM863//3/4 TYPICAL PERFORMANCE CHARACTERISTICS At T A = +5, V CM = V S /, R L = 6Ω, unless otherwise noted. Percentage of Amplifiers (%) Offset Voltage Production Distribution Offset Voltage (mv) 9

10 APPLICATION NOTES Driving Capacitive Loads The SGM863//3/4 can directly drive pf in unity-gain without oscillation. The unity-gain follower (buffer) is the most sensitive configuration to capacitive loading. Direct capacitive loading reduces the phase margin of amplifiers and this results in ringing or even oscillation. Applications that require greater capacitive driving capability should use an isolation resistor between the output and the capacitive load like the circuit in Figure. The isolation resistor R ISO and the load capacitor C L form a zero to increase stability. The bigger the R ISO resistor value, the more stable V OUT will be. Note that this method results in a loss of gain accuracy because R ISO forms a voltage divider with the R LOAD. Power-Supply Bypassing and Layout The SGM863//3/4 family operates from either a single +.5V to +5.5V supply or dual ±.5V to ±.75V supplies. For single-supply operation, bypass the power supply +V S with a.µf ceramic capacitor which should be placed close to the +V S pin. For dual-supply operation, both the +V S and the -V S supplies should be bypassed to ground with separate.µf ceramic capacitors..µf tantalum capacitor can be added for better performance. Good PC board layout techniques optimize performance by decreasing the amount of stray capacitance at the op amp s inputs and output. To decrease stray capacitance, minimize trace lengths and widths by placing external components as close to the device as possible. Use surface-mount components whenever possible. V IN SGM863 R ISO C L V OUT For the operational amplifier, soldering the part to the board directly is strongly recommended. Try to keep the high frequency big current loop area small to minimize the EMI (electromagnetic interfacing). Figure. Indirectly Driving Heavy Capacitive Load +V S µf An improved circuit is shown in Figure. It provides DC accuracy as well as AC stability. R F provides the DC accuracy by connecting the inverting signal with the output. C F and R Iso serve to counteract the loss of phase margin by feeding the high frequency component of the output signal back to the amplifier s inverting input, thereby preserving phase margin in the overall feedback loop. Vn Vp +V S µf.µf SGM863 V OUT Vn Vp.µF SGM863 µf V OUT C F -V S(GND).µF R F V IN SGM863 R ISO C L R L V OUT Figure. Indirectly Driving Heavy Capacitive Load with DC Accuracy For non-buffer configuration, there are two other ways to increase the phase margin: (a) by increasing the amplifier s gain or (b) by placing a capacitor in parallel with the feedback resistor to counteract the parasitic capacitance associated with inverting node. -V S Figure 3. Amplifier with Bypass Capacitors Grounding A ground plane layer is important for SGM863//3/4 circuit design. The length of the current path speed currents in an inductive ground return will create an unwanted voltage noise. Broad ground plane areas will reduce the parasitic inductance. Input-to-Output Coupling To minimize capacitive coupling, the input and output signal traces should not be parallel. This helps reduce unwanted positive feedback.

11 TYPICAL APPLICATION CIRCUITS Differential Amplifier The circuit shown in Figure 4 performs the difference function. If the resistor ratios are equal (R 4 /R 3 = R /R ), then V OUT = (Vp - Vn) R /R + V REF. Vn Vp R R SGM863 V OUT Low Pass Active Filter The low pass filter shown in Figure 6 has a DC gain of (-R /R ) and the -3dB corner frequency is / R C. Make sure the filter bandwidth is within the bandwidth of the amplifier. The large values of feedback resistors can couple with parasitic capacitance and cause undesired effects such as ringing or oscillation in high-speed amplifiers. Keep resistor values as low as possible and consistent with output loading consideration. C R 3 R 4 V IN R R V REF Figure 4. Differential Amplifier SGM863 V OUT Instrumentation Amplifier The circuit in Figure 5 performs the same function as that in Figure 4 but with a high input impedance. R 3 = R // R Figure 6. Low Pass Active Filter Vn SGM863 R R SGM863 V OUT Vp SGM863 R 3 R 4 V REF Figure 5. Instrumentation Amplifier

12 PACKAGE OUTLINE DIMENSIONS SC7-5 e D e.65 E E.9 b RECOMMENDED LAND PATTERN (Unit: mm) L L A A A θ. c Symbol In Millimeters In Inches MIN MAX MIN MAX A A....4 A b c D E E e.65 TYP.6 TYP e.3 BSC.5 BSC L.55 REF. REF L θ 8 8

13 PACKAGE OUTLINE DIMENSIONS SOT-3-5 D.9 e E E b e RECOMMENDED LAND PATTERN (Unit: mm) L A A A θ. c In Millimeters In Inches Symbol MIN MAX MIN MAX A A....4 A b c D E E e.95 BSC.37 BSC e.9 BSC.75 BSC L θ 8 8 3

14 PACKAGE OUTLINE DIMENSIONS SOT-3-6 D e e E E b RECOMMENDED LAND PATTERN (Unit: mm) L A A A θ. c In Millimeters In Inches Symbol MIN MAX MIN MAX A A....4 A b c D E E e.95 BSC.37 BSC e.9 BSC.75 BSC L θ 8 8 4

15 PACKAGE OUTLINE DIMENSIONS SOIC-8 D e.6. E E 5. b.7 RECOMMENDED LAND PATTERN (Unit: mm) L A A A θ c In Millimeters In Inches Symbol MIN MAX MIN MAX A A A b c D E E e.7 BSC.5 BSC L θ 8 8 5

16 PACKAGE OUTLINE DIMENSIONS MSOP-8 b E E 4.8 e RECOMMENDED LAND PATTERN (Unit: mm) D L A A A c θ Symbol In Millimeters In Inches MIN MAX MIN MAX A A A b c D E E e.65 BSC.6 BSC L θ 6 6 6

17 PACKAGE OUTLINE DIMENSIONS SOIC-4 D INDEX Ф.8±. DEP.±. E E 5. Ф.±. BTM E-MARK DEP.±.5. e b.7.6 RECOMMENDED LAND PATTERN (Unit: mm) A A A3 R R L L h h A θ L Symbol In Millimeters In Inches MIN MOD MAX MIN MOD MAX A A A A b D E E e.7 BSC.5 BSC L L.4 REF.4 REF L.5 BSC. BSC R.7.3 R.7.3 h θ 8 8 7

18 PACKAGE OUTLINE DIMENSIONS TSSOP-4 D E E b e.4.65 RECOMMENDED LAND PATTERN (Unit: mm) A L A A θ H c In Millimeters In Inches Symbol MIN MAX MIN MAX A..43 A A b c D E E e.65 BSC.6 BSC L H.5 TYP. TYP θ 7 7 8

19 TAPE AND REEL INFORMATION REEL DIMENSIONS TAPE DIMENSIONS P P W Q Q Q Q Q Q B Q3 Q4 Q3 Q4 Q3 Q4 Reel Diameter P A K Reel Width (W) DIRECTION OF FEED NOTE: The picture is only for reference. Please make the object as the standard. KEY PARAMETER LIST OF TAPE AND REEL Package Type Reel Diameter Reel Width W A B K P P P W Pin Quadrant SOT Q3 SC Q3 SOT Q3 SOIC Q MSOP Q SOIC Q TSSOP Q 9

20 CARTON BOX DIMENSIONS NOTE: The picture is only for reference. Please make the object as the standard. KEY PARAMETER LIST OF CARTON BOX Reel Type Length Width Height Pizza/Carton 7 (Option)