SSC8036GQ4. N-Channel Enhancement Mode MOSFET 1 / 5. Features Applications. Pin configuration. General Description. Package Information
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- Joel Reynard Dickerson
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1 N-Channel Enhancement Mode MOSFET Features Applications Load Switch VDS VGS RDSon TYP ID PC/NB 3V ±2V 14 DCDC conversion 18A Pin configuration Bottom View General Description This device uses advanced trench technology to provide excellent RDS(ON) and low gate charge. This device is suitable for use as a load switch or in PWM applications. SSC836GQ4 Package Information Package: DFN3X3 1 /
2 SSC836GQ4 Absolute Maximum T A = 2 C unless otherwise specified Parameter Symbol 1S Maximum Steady Unit Drain-Source Voltage S 3 V Gate-Source Voltage S ±2 V Continuous Drain Current T C = 2 C 18 A Continuous Drain Current T C = 1 C 13 A Continuous Drain Current T A = 2 C SM A Continuous Drain Current T A = 7 C 7..8 A Plused Drain Current 3 M 12 A Repetitive avalanche energy L=.1mH 3 E AS 86 mj Power Dissipation 1 T C = 2 C P D 24 W Power Dissipation 1 T C = 1 C 9. W Power Dissipation 2 T A = 2 C P DSM 3 W Power Dissipation 2 T A = 7 C 2 W Storage and Junction Temperature Range T J, T STG - to +1 C Thermal Characteristics Parameter Symbol Typ Max Units Maximum Junction-to-Ambient 2 t 1S R JA C/W Maximum Junction-to-Ambient 2 4 Steady-State C/W Maximum Junction-to-Case Steady-State R JC --.2 C/W 2 /
3 SSC836GQ4 Electrical T A = 2 C unless otherwise specified Parameter Symbol Test Conditions Min Typ Max Unit Drain Source Breakdown Voltage V (BR)DSS = V, = 2μA V Gate Threshold Voltage (TH) =, =2μA V Gate Body Leakage Current I GSS = ± 2 V, = V ±1 na Zero Gate Voltage Drain Current SS = 24 V, = V ua Drain Source On State Resistance R DS(ON) = 1 V, = 1 A = 4. V, = 12 A mr Forward Transconductance G FS = 1 V, = 12 A S Diode Forward Voltage V SD = V, I S = 1A V Input Capacitance C ISS Output Capacitance C OSS = 1 V, = V, f = 1. MHz Reverse Transfer Capacitance C RSS Turn On Delay Time T D(ON) = 1 V, R L = 2.3R, Turn Off Delay Tim T D(OFF) = 1V, R GEN=3R pf ns Note : 1. The power dissipation P D is based on T J(MAX)=1 C, using junction-to-case thermal resistance, and is more useful in setting the upper dissipation limit for cases where additional heat sinking is used. 2. The value of R JA is measured with the device mounted on 1in 2 FR-4 board with 2oz. Copper, in a still air environment with T A =2 C. The Power dissipation P DSM is based on R JA t 1s value and the maximum allowed junction temperature of 1 C. The value in any given application depends on the user's specific board design. 3. Repetitive rating, pulse width limited by junction temperature T J(MAX)=1 C. Ratings are based on low frequency and duty cycles to keep initial T J =2 C. 4. The R JA is the sum of the thermal impedence from junction to case R JC and case to ambient. 3 /
4 Threshold Voltage (V) I S, Source-Drain Current (A) C, Capacitance (pf) On Resistance (mr), Drain Current (A), Drain current(a) SSC836GQ4 Typical Performance Characteristics =1.V =4.V =3.V =3.V , Drain-Source Voltage (V) Fig1. Output Characteristics o C 12 o C 2 o C - o C , Gate-to-source Voltage(V) Fig2. Transfer Characteristics =4.V =1V 1 1 2, Drain-to-Source Voltage (V) Fig3. Capacitance Tj, Junction Temperature ( o C) Fig4. On Resistance vs. Temperature =2uA Tj, Junction Temperature ( o C) Fig. Gate Threshold vs. Temperature , Drain-Source Voltage (V) Fig6. Diode Forward Characteristics 4 /
5 SSC836GQ4 DISCLAIMER AFSEMI RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. AFSEMOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICIENCE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THE GRAPHS PROVIDED IN THIS DOCUMENT ARE STATISTICAL SUMMARIES BASED ON A LIMITED NUMBER OF SAMPLES AND ARE PROVIDED FOR INFORMATIONAL PURPOSE ONLY. THE PERFORMANCE CHARACTERISTICS LISTED IN THEM ARE NOT TESTED OR GUARANTEED. IN SOME GRAPHS, THE DATA PRESENTED MAY BE OUTSIDE THE SPECIFIED OPERATING RANGE (E.G,. OUTSIDE SPECIFIED POWER SUPPLY RANGE ) AND THEREFORE OUTSIDE THE WARRANTED RANGE. /
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FEATURES Trench Power MOSFET Technology Low R DS(ON) Low Gate Charge Optimized For Fast-switching Applications TTD18P1AT, TTP18P1AT 1V P-Channel Trench MOSFET APPLICATIONS Load Switches Battery Switch
More informationCharacteristics Symbol Rating Unit. T C=70 o C 53.0 T A=25 o C 22.8 (3) T A=70 o C 18.2 (3) Pulsed Drain Current I DM 100 A 46.2 T C=70 o C 29.6.
General Description The MDU1514 uses advanced MagnaChip s MOSFET Technology, which provides high performance in on-state resistance, fast switching performance and excellent quality. MDU1514 is suitable
More informationN- & P-Channel Enhancement Mode Field Effect Transistor
N- & annel Enhancement Mode P8NDG TO-- PRODUCT SUMMARY V (BR)DSS R DS(ON) I D annel V 8mΩ A annel -V 8mΩ -A G D S G D S D/D SG S G G : GATE D : DRAIN S : SOURCE ABSOLUTE MAXIMUM RATINGS (T A = C Unless
More informationMEI. 20V P-Channel Enhancement-Mode MOSFET P2301BLT1G. Features. Simple Drive Requirement Small Package Outline Surface Mount Device G 1 2 V DS -20
V P-Channel Enhancement-Mode MOSFET VDS= -V RDS(ON), Vgs@-.5V, Ids@-.A = mω RDS(ON), Vgs@-.5V, Ids@-.A = 15 mω Features Advanced trench process technology High Density Cell Design For Ultra Low On-Resistance
More informationV DS I D (at V GS =10V) R DS(ON) (at V GS = 4.5V) 100% UIS Tested 100% R g Tested DFN5X6 D. Top View
AON648 V NChannel MOSFET General Description The AON648 combines advanced trench MOSFET technology with a low resistance package to provide extremely low R DS(ON). This device is ideal for boost converters
More informationProduct Summery. Applications
General Description The QM3056M6 is the highest performance trench N-ch MOSFETs with extreme high cell density, which provide excellent RDSON and gate charge for most of the synchronous buck converter
More informationMDU1516 Single N-channel Trench MOSFET 30V, 47.6A, 9.0mΩ
MDU1516 Single N-Channel Trench MOSFET 3V MDU1516 Single N-channel Trench MOSFET 3V, 7.6A, 9.mΩ General Description Features The MDU1516 uses advanced MagnaChip s MOSFET Technology, which provides high
More informationHCS70R350E 700V N-Channel Super Junction MOSFET
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More informationFDS8949 Dual N-Channel Logic Level PowerTrench MOSFET
FDS899 Dual N-Channel Logic Level PowerTrench MOSFET V, 6A, 9mΩ Features Max r DS(on) = 9mΩ at V GS = V Max r DS(on) = 36mΩ at V GS =.5V Low gate charge High performance trench technology for extremely
More informationSSF2341E. Main Product Characteristics V DSS -20V. R DS(on) 37mΩ (typ.) I D. Features and Benefit. Description
Main Product Characteristics V DSS -20V R DS(on) 37mΩ (typ.) I D -4A 1 SOT-23 Marking and Pin A s s i gnm e nt Schematic Diagram Features and Benefit Advanced MOSFET process technology Ideal for PWM, load
More informationSSF11NS65UF 650V N-Channel MOSFET
Main Product Characteristics V DSS R DS(on) I D 650V 0.32Ω (typ.) 11A TO-220F Marking and Pin S c h e m a ti c Dia g r a m Assignment Features and Benefits High dv/dt and avalanche capabilities 100% avalanche
More informationDFN3X3-8 Pin Configuration. Units Symbol. Parameter
General Description Product Summery Description The WSD20L75DN uses advanced trench technology and design to provide excellent R DS(ON) with low gate charge. It can be used in a wide variety of applications.
More informationDevice Marking Device Device Package Reel Size Tape width Quantity SIP3210 SIP3210 SOP-8 330mm
SIAI N-Channel Enhancement Mode Power MOSFET DESCRIPTION The SIP3210 uses advanced trench technology and design to provide excellent R DS(ON) with low gate charge. It can be used in a wide variety of applications.
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Logic Level N-Ch Power MOSFET 200V LOGIC N-Channel MOSFET Features Drain-Source breakdown voltage: BV DSS =200V (Min.) Low gate charge: Q g =12nC (Typ.) Low drain-source On-Resistance: R DS(on) =0.34Ω
More informationTSM4936D 30V N-Channel MOSFET
SOP-8 Pin Definition: 1. Source 1 8. Drain 1 2. Gate 1 7. Drain 1 3. Source 2 6. Drain 2 4. Gate 2 5. Drain 2 PRODUCT SUMMARY V DS (V) R DS(on) (mω) I D (A) 36 @ V GS = 10V 5.9 30 53 @ V GS = 4.5V 4.9
More information3000/Tape&Reel. 2 P D Maximum Power Dissipation TA = 75 o C 1.44 T J, T stg Operating Junction and Storage Temperature Range
DS = 30 R DS(ON), gs @10, I ds @8.5A = 38mΩ R DS(ON), gs @4.5, I ds @5A = 52mΩ Features Advanced trench process technology High Density Cell Design For Ultra Low On-Resistance High Power and Current Handling
More informationN-Channel Power MOSFET 800V, 0.3A, 21.6Ω
N-Channel Power MOSFET 800V, 0.3A, 21.6Ω FEATURES Advanced planar process 100% avalanche tested Fast switching APPLICATION Power Supply Lighting KEY PERFORMANCE PARAMETERS PARAMETER VALUE UNIT V DS 800
More informationMDU1511 Single N-channel Trench MOSFET 30V, 100.0A, 2.4mΩ
MDU1511 Single N-Channel Trench MOSFET 3V ㅊ MDU1511 Single N-channel Trench MOSFET 3V, 1.A, 2.mΩ General Description Features The MDU1511 uses advanced MagnaChip s MOSFET Technology, which provides high
More informationHFP4N65F / HFS4N65F 650V N-Channel MOSFET
HFP4N65F / HFS4N65F 650V N-Channel MOSFET Features Originative New Design Very Low Intrinsic Capacitances Excellent Switching Characteristics 100% Avalanche Tested RoHS Compliant Key Parameters May 2016
More informationSPECIFICATIONS (T J = 25 C, unless otherwise noted)
N-Channel V (D-S) MOSFET PRODUCT SUMMARY V DS (V) R DS(on) ( ) I D (A) a, e Q g (Typ.). at V GS = V at V GS = 4.5 V nc DFN 3x3 EP Top View Bottom View Pin Top View FEATURES APPLICATIONS D 3 4 8 7 5 G Pin
More informationDevice Marking Device Device Package Reel Size Tape width Quantity 6075K FNK6075K TO-252-2L Parameter Symbol Limit Unit
FNK N-Channel Enhancement Mode Power MOSFET Description The FNK6075K uses advanced trench technology and design to provide excellent R DS(ON) with low gate charge. It can be used in a wide variety of applications.
More informationSMN01L20Q Logic Level N-Ch Power MOSFET
Logic Level N-Ch Power MOSFET 200V LOGIC N-Channel MOSFET Features 0.85A, 200V, R DS(on) =1.35Ω @ V GS =10V Low gate charge: Q g =4nC (Typ.) Fast switching 100% avalanche tested RoHS compliant device D
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