Clock Crystal Oscillators CMOS Crystal Oscillators EXO-3

Transcription

1 Clock Crystal Oscillators CMOS Crystal Oscillators XO-3 eatures Since it has a frequency dividing function, it is able to obtain a frequency division of 1/2-1/2 8 (1/256). The symmetry of frequency divided output is within 50 ±2%. The oscillation start time has the fast starting characteristic of being 1.5msec. or less. The pin arrangement is I 8IN. Supply Voltage V=5.0V pplications musement Specifications Item Symbol Conditions Min. Max. Units Output requency ange requency Stability Storage Temp. ange Operating Temp. ange Supply Voltage Current Consumption uty atio ise/all Time Output Voltage-"" Output Voltage-"H" Output oad Start-up Time OUT MHz SBY ppm TSTG C TO C V Volt I - 20 m V % Tr/Tf - 15 ns VO - 10% V Volt VOH 90% V - Volt C - 50 p ST ms Note: lease contact us for inquires about extended operating temperature range, available frequencies and other conditions. ll electrical characteristics are defined at the maximum load and operating temperature range. in connection Settings of the frequency division output imensions (Unit : mm) (ivider Select) V C B XO M KSS JN ST GN (OUTUT) 1. Outputs the original frequency (fo) of the internal quartz crystal. 2. Outputs the frequency of programmed dividing ratio (fo/2 n ). ossible to be oscillated when set to 3.ST HIGH level and stopped in oscillation when set to OW level. when this function is not needed, be sure to set the STNBY pin to the HIGH level. 4.GN 5. 6.B Used to program the dividing ratio for 7.C the original frequency. Supply voltage 8.V Input H fo clock fo 1/2 clock H H fo clock fo 1/2 2 clock H H fo clock fo 1/2 3 clock H H H fo clock fo 1/2 4 clock H H fo clock fo 1/2 5 clock H H H fo clock fo 1/2 6 clock H H H fo clock fo 1/2 7 clock H H H H fo clock fo 1/2 8 clock _ Output XO-3 Select 12.8MX. ST Original ivided C B requency Wave form #8 #7 #6 #5 #1 #2 #3 #4 φ ± MIN. 7.0MX MX ±0.25 MIN. 7.62± MX 0~15 (mm)

2 Handling Notes for Crystal Oscillators 1. Shock & rop Vibration o not inflict excessive shock and mechanical vibration that exceeds the norm, such as hitting or mistakenly dropping, when transporting and mounting on a board. There are cases when pieces of crystal break, and pieces that are used become damaged, and become inoperable. When a shock or vibration that exceeds the norm has been inflicted, make sure to check the characteristics. 2. Cleaning Since a crystal piece can be broken by resonance when a crystal device is cleaned by ultrasonic cleaning. Be careful when carrying out ultrasonic cleaning. 3. Soldering conditions To maintain the product reliability, please follow recommended conditions. Standard soldering iron conditions Crystal Oscillators Soldering iron Time 280 C ~ 340 C 3+1/ 0sec. max eflow conditions (xample) +0 eak: C 10sec. max Temperature( C) C 200 C min 40sec. max 120sec. max Time(sec.) Crystal Oscillators/TCXOs ecommended reflow Conditions vary depending upon products. lease check with the respective specification for details. 4. Mounting recautions eaded evices The special glass, located where the lead of the retainer base comes out, is aligned with the coefficient of thermal expansion of the lead, If the glass is damaged and cracks appear, there may be cases in which performance deteriorates and it fails to operate. Consequently, when making the device adhere closely and applying solder, align the gap of the hole of the board with the gap of the lead and insert without excessive force. When making the device adhere closely to a through hole board and applying solder, be careful that the solder does not get into the metal part of the retainer base and cause a short. utting in an insulation spacer is one more method of preventing a short circuit. When the lead is mounted floating, fix it as far as possible so that contact with other parts and the breakage due to the fatigue, and the mechanical resonance of the lead will not occur. When the lead is bent and used, do not bend the lead directly from the base, separate it 0.5mm or more and then bend it. When bending, before attaching to the board, fix the place where the lead comes out in advance and attach it after bending so that a crack does not occur in the glass part. Surface Mount evices The lead of the device and the pattern of the board is soldered on the surface. Since extreme deformation of the board tears off the pattern, tears off the lead metal, cracks the solder and damages the sealed part of the device and there are cases in which performance deteriorates and operation fails, use it within the stipulated bending conditions. ue to the small cracks in the board resulting from mounting, please pay sufficient attention when attaching a device at the position where the warping of the board is great. When using an automatic loading machine, as far as possible, select a type that has a small impact and use it while confirming that there is no damage. Surface mount devices are NOT flow soldering compatible. 5. Storage Condition Since the long hour high temperature and low temperature storage, as well as the storage at high humidity are causes of deterioration in frequency accuracy and solderability. arts should be stored in temperature range of -5 to +40C, humidity 40 to 60% H, and avoid direct sunlight. Then use within 6 months.

3 Handling Notes for Crystal Oscillators 6. In order to use crystal oscillators (1)The minlature crystal oscillator for the clock utillzes a C-MOS IC and incorporates a protective circuit against static electricity However, exerclse care in the same manner as for a normal C MOS IC. (2)Internal capacitor is not provided in the power supply section (+C GNC). To serve as overimpressed voltage and overcurrent protective device, place a bypass capacitor (0.01 µ) as near as possible to the (+C GN) terminal. However, the capacity value is meant as a guideline. epending on the capacitor type, frequency characteristics vary. ccordingly, use a capacitor that matches the frequency characteristics. (3)pplying reverse voltage could result in damage to internal parts. Take care not to connect terminals incorrectly. (4)lease do not use oscillators under unfavorable condition such as beyond specified range in catalog or specification sheet. (5)lease keep oscillators away from water, salt water or harmful gas. (6)K50H-3C / SO series should be stored in humidity-controlled area after the package is unsealed, in temperature +25±5 C under humidity of 65%H, and should be mounted on CB within 7 days. (7)K50H-3C / SO series has Bypass Capacitior between V and GN. Test Circuits and Clock Timing Chart CMOS Output Test Circuits Clock Timing chart(c-mos Output) Note) Maximum load(includes capacitances of fixture and probe) V-C Output Test Circuits Clock Timing chart (V-C Output)

4 Tape & eel Specifications Crystal Oscillators Tape & eel Specifications B C G H J N O Q S U W Qty φ ±0.1 φ330±2φ254±2 φ13± / SO-1C/1 SO-2B/2C/2 VC-SO-1 φ ±0.1 φ330±2φ254±2 φ13± ±0.5/ / XO-31 XO-34 XO-37 VC-XO-35 VCXO-7050 φ1.5± ± ±0.1 φ180+0/-3 17±0.2 K50H K50 K53 K50V-3 3.5± ± ± ± ± ±0.05 φ180±2 φ60 9.0±0.1 KT21 φ / 0 3.6± ± ±0.1 φ180+1/ / 0 (VC)TCXO-214C 8.0±0.3/ 4.4± ± ±0.1/1.3± ±0.05/ φ254±1/φ180+1/ 1.5 / 9.0±0.3/ / (VC)TCXO-212C / 1.6±0.1/1.5±0.1 /φ60 (VC)TCXO-208C MO-208 KT18B / 1.6±0.1/1.5±0.1 φ ± ± KT20 7.4± ±0.1 φ254±2 17.5±0.5 (VC)TCXO-204C B C G H J N O Q S U W Qty φ1.1± ± ± ± ± ±0.3 KC ± ± ±0.3 K ± ± ±0.3 K30 3.6± ±0.1 φ254±2 φ13± /-0 XO-61 XO-64 VC-XO-65 eed direction T T

5 Ordering ormat for Crystal Oscillatiors OING OMT O CYST OSCITOS lease specify the following items when ordering crystal oscillators. I. Standard products shown in the catalogue: lease specify package type and nominal frequency. II. Special-order products: lease specify the following items in specification. 1. requency (1)Oscillation requency Hz 2. requency Stability (1)Temperature 10-6 MX. ~ C (On the basis of +25 C frequency) (2)Supply Voltage 10-6 MX. VC ± % (3)oad MX. Ω// p ± % ± % (4)ging 10-6 MX./year 3. requency Tuning ange ± 10-6 MIN 4. requency Control ange ± ~± 10-6 /+ V± V 5. Output (1)Voltage Vrms V- MIN. (2)Wave orm Sine, Half sine wave, Harmonics 2nd db, 3rd db, Others db (3)oad esistance Ω//Capacitance p 6. Supply Voltage (1)or circuit VC± %, m MX. 7. nvironmental Condition (1)Operating Temperature ange ~ C (2)Vibration Total mplitude mm, Vibration requency Hz~ Hz (3)Shock 8. imensions, in Connection 9. pplication