SPECIFICATIONS FOR NC-T3 (32.768kHz ) QUARTZ CRYSTAL RESONATOR

Transcription

1 SPECIFICATIONS FOR NC-T3 (32.768kHz ) QUARTZ CRYSTAL RESONATOR Spec.No. nct3ageneral Customer : Approved by : Name : Title : Date : It is our pleasure to submit to you 2 copies of the specifications. Please return 1 copy to us with the authorized signature in the space provided above. Seller : Seiko Instruments Inc. Approved by : Name : Shozo Murayama Title : General Manager, Quartz Crystal Sales Date : 20 June, 2002 Address : 1-8, Nakase, Mihama- ku, Chiba -shi, Chiba Japan Phone No. : Fax No. : Manufacturer : SII Quartz Techno Ltd. Approved by : Name : Shigeo Takagi Title : Manager, Quality Assurance Date : 20 June, 2002 Address : 1110, Hirai-cho, Tochigi-shi, Tochigi , Japan Phone No. : Fax No. :

2 1.Scope These specifications apply to QUARTZ CRYSTAL RESONATORS ( hereinafter referred to as RESONATORS ) to be manufactured by SII Quartz Techno Ltd. ( hereinafter referred to as SQT ) and to be supplied by Seiko Instruments Inc. ( hereinafter referred to as SII ) to xxxx co. Ltd. 2.Designation RESONATORS are designated " NC-T3 (32.768kHz ). 3.Shape and dimensions As per the NC-T3 drawing shown on page 7. 4.Electrical characteristics Specified on page 3 through 4. 5.Shipment and packaging 5.1 (3,000) pcs are the standard lot size to which the lot number shall be allotted 5.2 The packaging shall conform to the SQT's resonator packaging standards. 6.Outgoing inspection 7.Warranty 6.1 When mutually agreed, the outgoing inspection shall be conducted as per the standard on page The outgoing inspection slip is not basically affixed to each packaging. In the event that any defective RESONATORS or defective lot is found at incoming inspection at xxxx co. Ltd. and that any defect resulting from failures in process-control at SII after incoming inspection is found, good RESONATORS shall be supplied to xxxx co. Ltd. free of charge as a replacement. In the event that any trouble or problems rising directly from RESONATORS occurs, it will be amicably settled between both parties, provided that warranty shall be done within the score of replacement of good RESONATORS. 8.Amendment or abolition of the specifications Amendment or abolition of the specifications shall be made upon mutual consent between xxxx co. Ltd. and SII. If any problem arises, it shall be amicably settled between both parties. 9.Effectiveness of the specifications These specifications are effective after receipt of returned copies with your approved sign. 2

3 Electrical characteristics 4.1 Specification Measurement temperature : room temperature 25±2 Item Symbol Specification Measurement conditions 1 Nominal frequency f khz As per the SII's standard circuit (see page5). 2 Frequency tolerance f/f 0 ±20ppm Not including aging 3 Load capacitance C L 7pF 9pF 4 Equivalent series resistance 5 Q-value Q min. 12.5pF R 1 50 k Ω max. Measured with ATI 4192A impedance analyzer. 6 Equivalent series C ff typ. capacitance 7 Parallel capacitance C 0 1.7pF typ. Measured with ATI 4192A impedance analyzer. 8 Turning point Tp 25±5 Measure this coefficient at 3 points of 17, 25 and 33 9 Secondary temperature k (-3.5±1.0) 10-8 / 2 Using C-MOS circuit. coefficient. 10 Amount of aging f/f ±5ppm/Year Measured with C-MOS circuit +25±3 first year 11 Drive level DL 1.0 μ W max. 12 Insulation resistance IR Between electrodes (#1,#2) 500M Ω min 13 Operating temperature range 14 Storage temperature range T OPR T STG -40~+85-55~+125 Measure with ATI 4329A Insulation Resistance Meter. Apply DC100V. 3

4 Item Specification Measurement conditions 15 High temperature storage f/f 0 = ±10ppm max. After storage under 85 for 500 hrs, measure at room temperature. 16 Low temperature storage 17 High temperature and high humidity storage 18 Thermal shock resistance 19 Mechanical shock resistance f/f 0 = ±10ppm max. After storage under -40 for 500hrs, measure at room temperature. f/f 0 = ±10ppm max. After storage under 60 ±2, 90 to 95% RH for 500 hrs, measure at room f/f 0 = ±10ppm max. f/f 0 = ±10ppm max. temperature. Measured at room temperature after 20 cycles for 30 minutes. Measure after free drop of the RESONATOR three times from the height of 75cm onto a concrete board. 20 Vibration resistance f/f 0 = ±5ppm max. Amplitude 1.5mm and 10~60Hz with cycle time 2 ~ 3 minutes in 3 direction (X,Y,and Z axis)each for 2 hrs. 21 IR Reflow f/f 0 = ±5ppm max. Measure after reflow under reflow profile specified in page 13. *1 *1 *1 *1 *2 *2 *1 Note: 1. The above tests no.15 to 21 must be conducted independently (not series tests). 2. *1: Measure after 24 hours soak at room temperature. 3. *2: Measure after 2 hours soak at room temperature. 4. R1 is 60k Ωmax. after the each above test. 4

5 10.Precautions Recommended mounting conditions Reflow profile As per reflow profile shown in page 13 Manual soldering 350 max. for 5 sec. max. Heat only the terminals. Must not heat the crystal unit body Cleaning The crystal units may break depending upon the ultrasonic cleaning condition. Ultrasonic cleaning is not guaranteed. 11.Others Dimensions : As per the drawing shown on page Appearance : As per boundary sample Standard circuit: Rf IC:74HC04AP Vdd OUT Rf:10MΩ Rd:330KΩ Cg X'tal Rd Cd Vdd:3.0 V C L 値 7.0pF 9.0pF 12.5pF Cg: 14pF 18pF 25pF Cd: 14pF 18pF 25pF C-MOS OSCILLATING CIRCUIT 5

6 Outgoing inspection standard The outgoing inspection shall be conducted as per the following standard. The sampling shall be performed according to the ANSI/ASQCZ Item Sampling level AQL(%) 1 Frequency tolerance Ⅰ Series resistance Ⅰ Outer appearance Ⅰ Others characteristics Periodical quality inspection 6

7 1. Out Line Drawing 3.2 ± ± ± ± ±0.10 Tolerance: ±0.1 Unit: mm 7

8 2. Marking Marking includes following items. #1 #2 (Top View) Week of Production 01~52 Year of Production last digit of the year CL value mark A: 7pF B: 9pF C: 12.5pF Frequency 32: kHz 3. Lead Connection #1 #2 (Bottom View) #1 #2 4. Recommended land pattern Unit: mm 8

9 Taping specification 1.Drawing of tape dimensions 1 Carrier tape see Drawing No. NCT3-04 (page 12) 2 Reel for carrier tape see Drawing No. NCT3-03 (page 11) 2.Material 1 Carrier tape 2 Reel for carrier tape : A-PET : Cardboard 3. Taping method (1) Cover tape shall never be detached. (2) Taping shall be placed into tapes in such manner as to assure that marking of the components is visible as per Fig. 1. User direction of feed marking marking marking marking marking Fig. 1. (3) Reel 1 On the side of reel there shall be more than 20 blocks of "No components" 2 The beginning of Carrier Tape shall be bent vertically and hooked on groove of reel. (4) Tape Leader 1On the side of leader, there shall be more than 20 blocks of "No components " 2The length of Cover Tape shall be more than 150 mm. 3The Length of Stick Tape for Cover Tape shall be about 100 mm and Stick Tape shall never be detached. Carrier Tape Cover Tape Stick Tape No Components Tape Leader No Components Components Start User direction of feed 9 Fig 2.

10 (5)Gap between Carrier Tape and Cover Tape 1Cover Tape protrudes from Carrier Tape by 0.5mm max. Carrier Tape 0.5 mm max. Cover Tape Fig. 3 2 Holes of Carrier Tape are covered with Cover Tape by 0.75mm max. Fig mm max. (6)Peel strength 1The method of testing is done as shown below. 2The value of force is at the beginning of desealing. 3The Cover Tape peel forth shall be 0.1~1.3N at a peel speed of 300± 10mm/min. 165 ~ 180 Direction of Pulling Cover Tape Direction of Moving Fig. 5 10

11 (1) Conforms with IEC (2) Quantity per reel : 3,000pcs. Taping reel specification Unit: mm Item Specifications Unit Material PS - Surface Resistance rate Ωmax. Tape Width 12 mm Internal Width W /-0 mm External Width W2 15.4±1.0 mm NCT

12 Carrier tape specification (1) Conforms with IEC (2) Tolerance: ± Unit: mm NCT

13 Recommended Reflow Profile Notes: 1. The temperature used herein is the temperature on the circuit board. 2. Reflow: 2 times max. 13

14 Attached sheet-1-1 Packing specification 1) Attach a label per reel. (Fig. 1) 2) Put reels into a plastic bag. (Fig. 2) Label Label Plastic bag Fig. 1 Fig. 2 3) Outer box packing conformation (cross-section drawing; Fig. 3) A delivery note (or a customer s designated slip) is inserted into an envelope and attached here if required. Reel Packing Carton case Plastic bag Fig. 3 3) Packed quantity (Lot. Forming ) N=3,000pcs / Lot If the quantity is small (in case of less than one packing unit or an odd lot), it may differ. 14

15 Attached sheet-1-2 5) Example of the label (Please refer to Fig. 1 and Fig. 2, page 14) bar code PART NC-T PART : SII product name Manufacturing code Lot No. Lot No.: Lot No. of the components bar code Part code *********** Bar code Quantity Caliber 3,000psc kHz ±20ppm 7/9/12.5pF Quantity : Number of the components Caliber : Frequency, Fo tolerance, CL value Remarks : Marking etc. Quantity, Lot. No. Remark 6) Storage environment (1) Products before unpacking shall not be exposed to the direct rays and shall be stored under the conditions; T=5~30 and RH=40~60%. (2) Storage period shall not exceed 6 months after your receipt to keep good solderability. (3) Package shall not be opened before use. Please use the products soon after unpacking. In case of long-term storage after unpacking, products shall be stored in a moisture-proof container with desiccant. (4) Products shall not be stored along with chemicals. (5) Outer boxes shall be stored or carried, avoiding the external pressure on them. 7) Reel handling directions (1) Please don't transform the tape and the inner products. (2) Please don't hold the reel with one side. The tapes may be moved from the middle core. 15

16 Precautions Recommended mounting conditions Attached sheet-2 (1) Reflow conditions: As per reflow profile (shown in page 13) x 2 times. (2) Manual soldering: 350 max. (at the tip of the soldering iron), 5 sec max. Heat only electrode terminals and must not touch the crystal unit body with the iron. Resonator Electrode Soldering iron Solder paste ハは Circuit board Land pattern (3) Cleaning The crystal units may break, depending upon the ultrasonic cleaning conditions. Therefore, ultrasonic cleaning is not guaranteed. (4) Vibration and shock Please do not apply excessive vibration or shock to the crystal units. Because the crystal units may break due to large vibration or shock in the assembling process, please apply the optimal conditions for the least vibration and shock. In case conditions change, please review this point. 16