3 5 6 NC-T3 8 SSP-T 9 SP-T 11 VT 14 VTC 15 SII GROUP ENVIRONMENTAL POLICY...

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2 Contents [Quartz Crystal Units] Quartz Crystal Unit Handling Precautions... 3 Oscillation Circuit Design Precautions... 5 Packing... 6 NC-T3 Surface Mount Type for Low Frequency... 8 SSP-T series Surface Mount Quartz Crystal Units for Low Frequencies... 9 SP-T series Surface Mount Quartz Crystal Units for Low Frequencies VT series Quartz Crystal Units for Watches VTC series Quartz Crystal Units for Low Frequencies SII GROUP ENVIRONMENTAL POLICY Check List for Quartz Crystal Unit Selection

3 Quartz Crystal Unit Handling Precautions 1. Mounting Precautions 1.1 Lead Type Crystal Units Structure Tubular crystal units (VT, VTC) are hermetically sealed using glass (see Figures 1 and 2). Case Case Hermetic Glass Lead Figure 1 Lead Figure 2 Hermetic Glass Unbending the lead (1) DO NOT pull the lead excessively if unbending a lead or removing a crystal unit. The excessive force may crack the glass and reduce the degree of vacuum. This may eventually result in deterioration of the characteristics and may also break the crystal chip(see Figure 3). (2) Unbend the lead by pressing on the bent part from both the upper and lower sides with fixing the bottom of lead tightly. (see Figure 4). Breakage Pull out Tweezers or needle-nose pliers Case Lead Figure 3 Figure Bending the lead (1) Bend the lead so that the lead will remain straight for more than 0.5mm from the case when soldering a crystal unit after bending. If not, the glass may be cracked (see Figures 5 and 6). (2) Always leave a length greater than the case diameter when bending a lead after soldering (see Figure 7). 0.5mm 0.5mm D Solder Printed circuit board Figure 5 Figure 6 Soldering directly to the case will reduce the degree of vacuum and may result in deterioration of the characteristics and may break the crystal chip Soldering When mounting or removing a quartz crystal unit, heat the lead part at 280 C or lower for 5 seconds or less (in the case of a lead-type conventional product). A long period of time of heating may result in deterioration of the characteristics and may break the crystal unit. Be sure to keep the case at or below 150 C. Solder Solder Figure 7 L > D Make the length from the case to the printed circuit board (L) longer than the case diameter (D) so that the lead wire will not be pulled in case the crystal unit falls over. L 3

4 Quartz Crystal Unit Handling Precautions 1.2 SMD Type Quartz Crystal Units Soldering (1) An example of the infrared ray reflow temperature profile is shown as follows (see Figure 8). Example of SMD product soldering conditions (230 C peak: Conventional products) Example of SMD product soldering conditions (260 C peak: Lead-free products) Temperature ( C) C -10 C 150 C 30~40sec 15~20sec Note: the temperature is the PCB surface temperature Time(sec.) Temperature ( C) ±10 C Note: the temperature is the PCB surface temperature C peak. 250±10 C 220 C 120±20sec Time(sec.) 10±1sec 50±10sec Figure.8 2. Cleaning (1) Since a small, thin crystal chip is used for low or intermediate frequency crystal units and the frequency approximates that of an ultrasonic cleaner, the crystal chip may break easily. Therefore, DO NOT perform ultrasonic cleaning. (2) Other crystal units may also break depending upon the ultrasonic cleaning condition. Please check the ultrasonic cleaning condition. 3. Mechanical Shock (1) Quartz crystal units are designed to withstand a drop from 75 cm onto a hard wooden board at least 3 times. However, their crystal chips may break depending on the conditions when they are dropped. Ensure that the crystal unit functions normally before use if the crystal units have been dropped or subjected to an excessive mechanical shock. (2) Unlike chip parts such as resistors, and capacitors, the SMD crystal unit has a crystal chip which is hermetically sealed inside. Therefore, check the influence of shock caused during automatic mounting before use. 4. Classification of Conventional Products and Lead-Free Products Products that use lead-free leads are distinguished from conventional non-lead-free products by their product code and external appearance. Details are given below. (1) Product code Conventional products and lead-free products are distinguished by the 7th digit of the product code. In the case of conventional products, the 7th digit is 0 ; whereas in the case of lead-free products, it is N or M. M corresponds to the SP-T1B and SP-T2B, and N corresponds to the SP-T1A and other products. Conventional product Lead-free product Q - xxxxoxxxxxxxxxxx Q - xxxxnxxxxxxxxxxx (2) External appearance distinction The 1st digit of the product marking, which indicates the frequency, is a number in the case of conventional products, and a letter in the case of lead-free products. Example: 32 C2, 75-G5 Conventional products Lead-free products Numeric representation Alphabetical representation ABCDEFGHJK 4 Remarks 1. The NC-T3 product has been a completely lead-free product from the beginning, and SSP-T6 has featured a lead-free lead part from the beginning. Therefore, rules (1) and (2) do not apply to these two products. 2. Products whose lead part can be made without lead are indicated by suffixing -F to the product name.

5 Oscillation Circuit Design Precautions 1. Drive Level (DL) The drive level of a crystal unit is shown by the level of the operating power or the current consumption (see Figures 9, 10, and 11). Operating the crystal unit at an excessive power level will result in the degradation of its characteristics, which may cause frequency instability or physical failure of the crystal chip. Depending upon the type of the crystal unit, the appropriate drive level range differs. Ensure that the drive level is appropriate. L1 C1 R1 Cg Rf IX Rd Cd Crystal unit Le Re IX Oscillation circuit CL -R Drive Level: DL 2 DL: I X Re 2 Re: R1(1+Co/CL) I X: Current Re: Effective resistance C0 Figure 9 Figure 10 Figure Oscillation Frequency and Load Capacitance (CL) The load capacitance (CL) is a parameter for determining the frequency of the oscillation circuit. The CL is represented by an effective equivalent capacitance that is loaded from the oscillation circuit to both ends of the crystal unit (see Figures 10 and 11). The oscillation frequency varies depending upon the load capacitance of the oscillation circuit. In order to obtain the desirable frequency accuracy, matching between the load capacitances of the oscillation circuit and the crystal unit is required. When set to a small load capacitance, the frequency may be influenced by tolerance in the circuit elements. For more details, please contact SII. Figure 12 shows an example of the frequency vs. load capacitance of a khz VT-200. Frequency Deviation f/f0 (x 10-6 ) VT kHZ CL=12.5PF Typ. 3. Oscillation Allowance (pf) Load Capacitance CL Figure 12 To ensure stable oscillation, the negative resistance of the circuit should be significantly larger than the equivalent series resistance (the oscillation allowance is large). The targeted oscillation allowance is at least five times as large as the equivalent series resistance. Oscillation Allowance Evaluation Method Add resistor Rx to the crystal unit in series and ensure that the oscillation starts or stops. The approximate negative resistance of the circuit is the value obtained by adding the effective resistance Re to the maximum resistance Rx when the oscillation starts or stops after gradually making Rx value larger. Negative resistance -R = Rx + Re Cg Rf Rx Rd Cd -R is a value at least five times as large as the maximum equivalent series resistance (R1 max.) of the crystal unit. *Re is the effective resistance value during oscillation. CO Re = R1 (1+ ) 2 CL Figure 13 5

6 Packing The following is the standard packing. 1. Lead type products After products are inserted in polyethylene bags, the bags are placed in boxes for shipping. Product name Quantity per lot Quantity per bag Quantity per box VT Series VTC Series 10,000 pcs. 10,000 pcs. 500 pcs. 20 bags 500 pcs. 20 bags 2. SMD products Product name SP-T1 SP-T2 SP-T3 SSP-T6 SSP-T7 Quantity per reel 2,000 pcs. 3,000 pcs. 3,000 pcs. 3,000 pcs. 3,000 pcs. NC-T3 3,000 pcs. Tape and reel configuration Reel configuration SP-T1/T2/T3, SSP-T6/T7 (Conforms with IEC ) NC-T3 (Conforms with IEC ) (2.2) +0 ø R6 R135 R6 R55 R1.1 R10.6 ø13 6 ø101 ø ± ø60 R1.0 t t T ø21±0.8 ø10 ø13±0.5 t T t SP-T1/T2/T3, SSP-T6/T7 T 16.4 t 2.2 NC-T UNIT : mm 6

7 Emboss tape configuration SP-T1/T2/T3 (Conforms with IEC ) NC-T3 (Conforms with IEC ) 40(10P)± ± ±0.05 ø ± ± ±0.05 φ W ω 1.75±0.1 W ω φ 1.0± ± ±0.1 SSP-T6 (Conforms with IEC ) SSP-T7 (Conforms with IEC ) 40(10P)± ± ±0.05 ø ±0.1 ω W 4.0± ±0.1 ø ± ±0.1 ω ø W 4.0±0.1 SP-T1/T2/T3, SSP-T6/T7 ω 7.5 W 16.0 NC-T UNIT : mm 7

8 NC-T3 Surface Mount Type for Low Frequency New Products FEATURES Ultra small mount area; 3.2mm x 1.2mm Ultra thin type with the height 1.1mm Max. SMD type suitable for automatic & high density surface mounting Combination of highly reliable photo lithographic technology & new packaging technology Excellent shock and heat resistance 100% lead free APPLICATIONS Cellular Phone, PHS, PDA, Radio Communication Equipment, Portable Applications, etc. STANDARD SPECIFICATIONS Conditions without notice (Temperature: +25± 2 C) Item Symbol Specifications Conditions / Notes Nominal Frequency fo kHz Allowable Frequency Tolerance ±20 x 10-6, ±50 x 10-6 Turnover Temperature Tp +25±5 C Temperature Coefficient K (-3.5±1.0) x 10-8 / C 2 Load Capacitance CL 7.0 pf / 12.5pF Series Resistance R1 65kΩ max. Absolute Maximum Drive Level DLmax 1.0µW Recommended Drive Level DL 0.1µW Shunt Capacitance C0 1.7pF typ. Frequency Change Over Time ±3 x 10-6 max. +25±3 C, First Year Operating Temperature Range Tope -40 C to +85 C Storage Temperature Range Tsto -55 C to +125 C DIMENSIONS (For details, please refer to individual specification) INTERNAL LEAD CONNECTION 1.2±0.1 RECOMMENDED SOLDERING PATTERN 3.2± Max ± ±0.1 8

9 SSP-T Series (SSP-T7) Surface Mount Type for Low Frequencies FEATURES Ultra thin type with height 1.4mm Max. SMD type suitable for automatic & high density surface mounting. Plastic mold package containing highly reliable tubular type quartz crystal. Excellent shock and heat resistance. APPLICATIONS Cellular Phones, PDA, DVC, Radio Communication Equipment, Portable Applications etc. STANDARD SPECIFICATIONS Conditions without notice (Temperature: +25± 2 C) Item Nominal Frequency Allowable Frequency Tolerance Turnover Temperature Temperature Coefficient Load Capacitance Series Resistance Absolute Maximum Drive Level Recommended Drive Level Shunt Capacitance Frequency Change Over Time Operating Temperature Range Storage Temperature Range Symbol fo Tp K CL R1 DLmax DL C0 Tope Tsto Specifications kHz ±20 x 10-6, ±50 x ±5 C (-3.5±1.0) x 10-8 / C pf / 12.5pF 65kΩ max. 1µW 0.1µW 0.8pF typ. ±3 x 10-6 max. -40 C to +85 C -55 C to +125 C Conditions / Notes +25±3 C, First Year DIMENSIONS (For details, please refer to individual specification) INTERNAL LEAD CONNECTION 4# 3# # 3# 1# 6.7 2# 7.0 Max. 1.5 Max # 2# RECOMMENDED SOLDERING PATTERN Max # 2# # 3# 0.2 * Do not connect #2 and #3 to external device. 9

10 SSP-T Series (SSP-T6) Surface Mount Quartz Crystal Units for Low Frequencies FEATURES Ultra thin type with height 1.6mm Max. Ultra small mounting area of 16.8mm 2 SMD type suitable for automatic & high density surface mounting. Plastic mold package containing highly reliable tubular type quartz crystal. Excellent shock and heat resistance. APPLICATIONS Cellular Phones, Pagers, Radio Communication Equipment, Portable Applications etc. STANDARD SPECIFICATIONS Item Nominal Frequency Allowable Frequency Tolerance Turnover Temperature Temperature Coefficient Load Capacitance Series Resistance Absolute Maximum Drive Level Recommended Drive Level Shunt Capacitance Frequency Change Over Time Operating Temperature Range Storage Temperature Range Symbol fo Tp K CL R1 DLmax DL C0 Tope Tsto Conditions without notice (Temperature: +25± 2 C) Specifications Conditions / Notes kHz/75.000kHz ±10 x 10-6, ±20 x 10-6, ±50 x 10-6 Can be used in high accurate products +25±5 C (-3.5±1.0) x 10-8 / C 2 7.0pF/12.5pF 55kΩ max. 1µW 0.1µW 0.95pF typ. ±3 x 10-6 max. +25±3 C, First Year -40 C to +85 C -55 C to +125 C DIMENSIONS (For details, please refer to individual specification) INTERNAL LEAD CONNECTION 2# 3# 8.0 MAX. 1# 2.1 MAX. RECOMMENDED SOLDERING PATTERN 3# 1# # MAX * Do not connect #3 to external device. Note: Please make sure that there is no electric wire line under SSP-T6 on the circuit board. 10

11 SP-T Series (SP-T3) Surface Mount Quartz Crystal Units for Low Frequencies FEATURES Low height 2.0mm max. Plastic mold package incorporated tubular type quartz crystal. Suitable for automatic and high density surface mounting. Excellent shock and heat resistance. APPLICATIONS Radio Communication Equipment, Pagers, Cellular Phones, Portable Applications, Clock Source for Micro-Computers STANDARD SPECIFICATIONS Item Nominal Frequency Allowable Frequency Tolerance Turnover Temperature Temperature Coefficient Load Capacitance Series Resistance Absolute Maximum Drive Level Recommended Drive Level Shunt Capacitance Frequency Change Over Time Operating Temperature Range Storage Temperature Range Symbol fo Tp K CL R1 DLmax DL C0 Tope Tsto Conditions without notice (Temperature: +25±2 C) Specifications Conditions / Notes kHz ±20 x 10-6, ±30 x 10-6, ±50 x 10-6, ±100 x 10-6 Can be used in high accurate products +25±5 C (-3.5±1.0) x 10-8 / C to 12.5pF 55kΩ max. 1µW 0.1µW 0.9pF typ. ±3 x 10-6 max. +25±3 C, First Year -40 C to +85 C -55 C to +125 C DIMENSIONS (For details, please refer to individual specification) INTERNAL LEAD CONNECTION 4# 3# 7.3MAX. 4# 3# MAX. 1# 2# * Do not connect #2 and #3 to external device. 1# 2# RECOMMENDED SOLDERING PATTERN MAX

12 SP-T Series(SP-T1/SP-T2) Surface Mount Quartz Crystal Units for Low Frequencies FEATURES Plastic mold package incorporated tubular type quartz crystal. Suitable for automatic and high density surface mounting. Excellent shock and heat resistance. APPLICATIONS Radio Communication Equipment, Cellular Phones, Camcorders, Portable Applications, Clock Source for Micro-Computers STANDARD SPECIFICATIONS Item Symbol Nominal Frequency fo Allowable Frequency Tolerance Turnover Temperature Tp Temperature Coefficient K Load Capacitance CL Series Resistance R1 Absolute Maximum Drive Level DLmax Recommended Drive Level DL Shunt Capacitance C0 Frequency Change Over Time Operating Temperature Range Tope Storage Temperature Range Tsto Conditions without notice (Temperature: +25±2 C) Specifications Conditions / Notes kHz 32kHz to 200kHz* ±20 x 10-6, ±50 x 10-6, ±100 x ±5 C +25±8 C (-3.5±0.8) x 10-8 / C to 12.5pF 50kΩ max. 1µW 0.1µW 1.0pF typ. 0.95pF typ. ±5 x 10-6 max. +25±3 C, First Year -40 C to +85 C -55 C to +125 C * Please feel free to contact us for inquiries about other frequencies in need. FREQUENCY-TEMPERATURE CURVE -6 (x 10 ) Frequency Deviation f/f Typ. Tp=25 C K= x 10-6 / C ( C) Temperature 12

13 SP-T Series(SP-T1/SP-T2) Surface Mount Quartz Crystal Units for Low Frequencies DIMENSIONS (For details, please refer to individual specification) SP-T1 SP-T2 4# 1# max. 3# 2# 4.06max # 3# 1# 2# 8.7max. 3.7max min. 3.56max max INTERNAL LEAD CONNECTION SP-T1 4# 3# SP-T2 4# 3# 1# 2# (SP-T1A) 1# 2# (SP-T2A) 4# 3# 4# 3# 1# 2# 1# 2# (SP-T1B) (SP-T2B) Note: Do not connect terminals #2, #3 of T1A and T2A to the outside electrode. These are dummy terminals. RECOMMENDED SOLDERING PATTERN SP-T1 SP-T Note: The drawings are not a PCB layout. 13

14 VT Series(VT-150/VT-200) Quartz Crystal Units for Watches FEATURES Compact tubular package. Photolithographic process. Excellent shock resistance and environmental characteristics. APPLICATIONS Real Time Clocks, Timers, Pagers, Cameras, Remote- Controllers, Portable Applications STANDARD SPECIFICATIONS Item Nominal Frequency Allowable Frequency Tolerance Turnover Temperature Temperature Coefficient Load Capacitance Series Resistance Absolute Maximum Drive Level Recommended Drive Level Shunt Capacitance Frequency Change Over Time Operating Temperature Range Storage Temperature Range DIMENSIONS Symbol fo Tp K CL R1 DLmax DL C0 Tope Tsto Conditions without notice (Temperature: +25±2 C) Specifications Conditions / Notes kHz (±5 x 10-6 ) ±10 x 10-6, ±20 x ±5 C (-3.5±0.8) x 10-8 / C to 12.5pF 50kΩ max. 1µW 0.1µW 0.86pF typ. ±5 x 10-6 max. +25±3 C, First Year -10 C to +60 C -30 C to +70 C FREQUENCY-TEMPERATURE CURVE VT max. 4.5 min. -6 (x 10 ) 0-10 ø1.5 ø0.2 (0.45) Frequency Deviation f/f Typ. Tp=25 C -6 K= x 10 / C 2 VT ( C) Temperature 6.0 max. 5.0 min. ø2.0 (0.6) ø0.2 14

15 VTC Series(VTC150/VTC-200) Quartz Crystal Units for Low Frequencies FEATURES Compact tubular package. Low frequency coverage from 32kHz to 200kHz. Photolithographic process. Excellent shock resistance and environmental characteristics. APPLICATIONS Radio Communication Equipment, Clock Source for Micro-Computers, Portable Applications STANDARD SPECIFICATIONS Item Symbol Nominal Frequency fo Allowable Frequency Tolerance Turnover Temperature Tp Temperature Coefficient K Load Capacitance CL Series Resistance R1 Absolute Maximum Drive Level DLmax Recommended Drive Level DL Shunt Capacitance C0 Frequency Change Over Time Operating Temperature Range Tope Storage Temperature Range Tsto Conditions without notice (Temperature: +25±2 C) Specifications 32kHz to 49.9kHz* 50kHz to 79.9kHz* 80kHz to 200kHz* ±30 x 10-6, ±50 x ±8 C (-3.5±0.8)x10-8 / C 2 Conditions / Notes 6.0 to12.5pf 50kΩ max. 35kΩ max. 25kΩ max. 1µW 0.1µW 0.8pF typ. 0.75pF typ. ±5 x 10-6 max. +25±3 C, First Year -10 C to +60 C -30 C to +70 C * Please feel free to contact us for inquiries about other frequencies in need. DIMENSIONS VTC max. 4.5 min. ø1.5 ø0.2 (0.45) VTC max. 5.0 min. ø2.0 (0.6) ø0.2 15

16 SII GROUP ENVIRONMENTAL POLICY ENVIRONMENTAL CONCEPT: As a good corporate citizen, the SII Group aims to realize harmony between corporate activities and the global environment. SII works to preserve and continually improve the environment, aiming to create a sustainable society where all living things can coexist in harmony. Environmental Actions taken by Quartz Crystal Division 1) Provide Environmentally Friendly Products and Services - Promote LCA (Life Cycle Assessment) - Promote lead-free soldering - Expand "Green Purchasing" Complete lead-free product: NC-T3 - Expand lineup of SII s green products 2) Save Energy and Contribute to diminish Global Warming - Energy Saving in Production Process Promote measures for more efficient operation of air conditioning equipment, etc. to reduce CO2 emissions while expanding sales. 3) Maintain zero emissions and promote resource saving as well as recycling and the reduction of industrial waste. - Promoting to abolish any toxic or dangerous material, use environment-friendly substitutes and re-use; quartz crystal electrode membrane, plastic mold resin, lead frame, etc. 4) Encourage Employees to contribute to the Protection of the Environment in their every day life, personal as well as the professional. - Stop using ozone-layer depleting materials: * SII discontinued specific fluorine at the end of 1991; * SII discontinued trichloroethane at the end of 1992; * SII discontinued mehtylene chloride at the end of 1996; - Establish a green procurement standard, specify materials to be entirely eliminated from products, and promote activities to observe international legal regulations (RoHS and WEEE directives, etc.). 5) Green Life Our manufacturing site is located close to Taiheyzan Natural Park. Accordingly we promote planting trees at our site and contribute to neighboring community with closer communication. 6) Trend of Miniaturizing of SMD Quartz Crystal Unit Series SP-T1 SP-T2 SP-T3 SSP-T6 SSP-T7 NC-T3 Area(mm 2 ) Height(mm) Weight(mg)

17 Fax Transmittal Crystal Product Name Nominal Frequency Allowable Frequency Tolerance Load Capacitance Series Resistance Check List for Quartz Crystal Unit Selection Please use this check list for your best selection of quartz crystal unit To : Quartz Crystal Sales, Network Components Business Unit Seiko Instruments Inc. Fax : LOW FREQUENCY QUARTZ CRYSTAL UNIT fo CL R1 NC-T3 HFC-150 SSP-T7 SSP-T6 SP-T3 SP-T2A SP-T2B SP-T1A SP-T1B HTF-VT HTF-VTC VT-150 VT-200 VTC-200 KHZ ±10 x 10-6 ±20 x 10-6 ±30 x 10-6 ±50 x 10-6 x pF 9pF 12.5pF pf KΩmax OTHER SPECIAL REQUIREMENTS Customer s Name and Address Name Company name / Station Telephone Facsimile 17

18 Memo 18

19 IMPORTANT 1. The information herein is subject to change without notice. 2. Neither reproduction nor duplication of this catalog in whole or part is allowed without the prior written approval of Seiko Instruments Inc. 3. The colors of the products reproduced herein may be different from the actual colors. Check color on actual products before using the product. 4. Circuits and respective application methods described herein are for reference only. Seiko Instruments Inc. is not responsible for any and all infringement or damages to the rights of third parties (including industrial properties) caused by the use of circuits or application methods herein. Seiko Instruments Inc. shall not license any industrial properties owned by Seiko Instruments Inc. or any third party through this catalog. 5. When products described herein include Strategic Products (or Services) stipulated in the Foreign Exchange and Trade Control Law, they shall not be exported without permission of governmental authorities. 6. The products described herein are designed for consumer equipment and cannot be used as part of any device or equipment which influences the human body or requires a significantly high reliability, such as physical exercise equipment, medical equipment, disaster prevention equipment, gas related equipment, vehicles, aircraft and equipment mounted on vehicles. 19

20 TAKUMI, only achieved by the finest artisans and craftsmen in Japan s long history. Based on our 60 years history of precision watch manufacturing, SII embodies TAKUMI as the core of our DNA. Our TAKUMI spirit comes to life in all of our components through lower power consumption, high precision and continuous commitment to challenge and improve. The Display Division of Seiko Instruments Inc. who manufactures the products described in this catalogue holds the ISO 9001 and ISO Quality Systems Certificate. Seiko Instruments Inc. Network Components Business Unit 1-8, Nakase, Mihama-ku, Chiba-shi, Chiba , Japan Telephone : Facsimile : component@sii.co.jp Seiko Instruments USA Inc. Electronic Components Div Lomita Blvd., Torrance, CA 90505, U.S.A. Telephone : Facsimile : info@siu-la.com Seiko Instruments GmbH Siemensstraße 9, D Neu-Isenburg, Germany Telephone : Facsimile : info@seiko-instruments.de Seiko Instruments France S.A.R.L. 55, Rue d` Aguesseau Boulogne Billancourt Cedex, France Telephone : Facsimile : info@seiko-instruments.fr Seiko Instruments (H.K.) Ltd. 4-5 / F, Wyler Centre 2,200 Tai Lin Pai Road, Kwai Chung, N.T., Kowloon, Hong Kong Telephone : Facsimile : sales@sih.com.hk Seiko Instruments Taiwan Inc. 4FL, No.40, Sec. 2, Min-Chuan E. Rd., Taipei 104, Taiwan R.O.C. Telephone : Facsimile : public@sii.co.jp Seiko Instruments Singapore Pte. Ltd. 2, Marsiling Lane, Singapore Telephone : Facsimile : (Specification are subject to change without notice.) Released in September 2004 No. CAL0409EJ C printed on 100% recycled paper and with soy ink.