CRYSTAL OSCILLATOR (Programmable) SPREAD SPECTRUM OUTPUT: CMOS SG series
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1 CRYSTAL OSCILLATOR (Programmable) SPREAD SPECTRUM OUTPUT: CMOS SG - 9 series Frequency range :.67 MHz ~ 7 MHz ( ppm Step) Supply voltage :.6 V ~.6 V Function : Output enable (OE) or Standby (ST ) Down or Center spread modulation Configurable spreading modulation profile (Hershey-kiss, Sine-wave, Triangle), modulation frequency, 6 spread percentage Package :. x.,. x.,. x., 7. x. (mm) PLL technology to enable short lead time Available field oscillator programmer SG-Writer II Product Number (please contact us) SG-9CA: XGxxxxx SG-9CB: XGxxxxx SG-9CE: XGxxxxx SG-9CG: XG9xxxxx CG CE CB CA Specifications (characteristics) Item Symbol Specifications Conditions/Remarks Supply voltage V CC.8 V Typ.. V Typ.. V Typ..6 V ~.98 V.98 V ~. V. V ~.8 V.7 V ~.6 V - Output frequency range f O.67 MHz ~ 7 MHz Storage temperature T_stg - ºC ~ + ºC Storage as single product. Operating temperature T_use - ºC ~ +8 ºC - ºC ~ + ºC Current consumption I CC. ma Max.. ma Max..6 ma Max..7 ma Max. T_use = + ºC.9 ma Typ.. ma Typ.. ma Typ. T_use = + ºC No load, f O = MHz.7 ma Max. 6. ma Max. 6.9 ma Max. 8. ma Max. T_use = + ºC.9 ma Typ..9 ma Typ. 7. ma Typ. T_use = + ºC No load, f O = 7 MHz Output disable current I_dis. ma Max.. ma Max.. ma Max..7 ma Max. OE = GND, f O = 7 MHz Standby current I_std.9 µa Max.. µa Max.. µa Max.. µa Max. T_use = + ºC. µa Typ.. µa Typ.. µa Typ.. µa Typ. T_use = + ºC ST = GND Symmetry SYM % ~ % % V CC Level I OH/I OL Conditions [ma] Rise/Fall time Vcc *A *B *C *D V OH 9 % V CC Min. Default (f O > MHz), I OH Fast I OL.... Output voltage I (DC characteristics) Default (f O MHz) OH I OL.... I Slow OH V OL % V CC Max. I OL.... *A.6 V ~.98 V, *B.98 V ~. V, *C. V ~.8 V, *D.7 V ~.6 V Output load condition L_CMOS pf Max. - Input voltage V IH 7 % V CC Min. OE or ST V IL % V CC Max.. ns Max. f O > MHz Default Rise and Fall 6. ns Max. f O MHz % - 8 % V tr/tf CC, time Fast. ns Max. f O =.67 MHz ~ 7 MHz L_CMOS = pf Slow. ns Max. f O =.67 MHz ~ MHz Measured from the time OE or ST pin crosses % Disable Time t_stp µs Max. Enable Time t_sta µs Max. Measured from the time OE pin crosses 7 % V CC Resume Time t_res ms Max. Measured from the time ST pin crosses 7 % V CC Start-up time t_str ms Max. Measured from the time V CC reaches its rated minimum value,.6 V Spread spectrum configuration C: Center spread Code 7 modulation Spread percentage ±. % ±. % ±.7 % ±. % ±. % ±. % D: Down spread Code modulation Spread percentage -. % -. % -. % -. % -. % -. % Modulation frequency:. khz (default), 6. khz, 8. khz,.7 khz Modulation profile: Hershey-kiss (default), Sine-wave, Triangle Product Name SG-9CG 7.MHz C P H A A A Model Package type Frequency Spread type Spread percentage code Function Operating temperature Modulation frequency Modulation profile Rise/Fall time V CC Package Type Spread type Operating temperature Modulation profile CA: 7. mm x. mm C: Center spread G: - C ~ +8 C A: Hershey-kiss (default) CB:. mm x. mm D: Down spread H: - C ~ + C B: Sine-wave CE:. mm x. mm C: Triangle CG:. mm x. mm Function Modulation frequency P: Output enable A:. khz (default) Rise/Fall time S: Standby B:.7 khz A: Default C: 8. khz B: Fast D: 6. khz C: Slow
2 Pin description Pin Name I/O type Function OE Input Output enable High: Specified frequency output from OUT pin Low: Out pin is low (weak pull down), only output driver is disabled. High: Specified frequency output from OUT pin ST Input Standby Low: Out pin is low (weak pull down), Device goes to standby mode. Supply current reduces to the least as I_std. GND Power Ground OUT Output Clock output V CC Power Power supply External dimensions (Unit: mm) Footprint (Recommended) (Unit: mm) SG-9CG SG-9CG SG-9CE SG-9CE SG-9CB SG-9CB SG-9CA SG-9CA Notes: In order to achieve optimum jitter performance, the. µf capacitor between V CC and GND should be placed. It is also recommended that the capacitors are placed on the device side of the PCB, as close to the device as possible and connected together with short wiring pattern.
3 Specification GraphTypical supplemental specification. Unless otherwise specified T_use =, L_CMOS = pf Current Consumption 8 L_CMOS = No load L_CMOS = pf 7 6 Icc (ma) Vcc =. V Vcc =. V Vcc =.8 V Icc (ma) 8 6 Vcc =. V Vcc =. V Vcc =.8 V Output disable current Standby current. I_dis (ma)... Vcc =. V Vcc =. V Vcc =.8 V Notes: Spead percentage : ±. %, Modulation frequency :. khz, Modulation profile : Hershey-kiss Specification GraphTypical supplemental specification. Unless otherwise specified T_use =, L_CMOS = pf Cycle-to-Cycle Jitter Peak-Peak CycletoCycleJitter Peak -Peak (ps) Vcc=.8 V Rise/Fall time = Default Rise/Fall time = Fast Rise/Fall time = Slow CycletoCycleJitter Peak -Peak (ps) Vcc=. V Rise/Fall time = Default Rise/Fall time = Fast Rise/Fall time = Slow CycletoCycleJitter Peak -Peak (ps) Vcc=. V Rise/Fall time = Default Rise/Fall time = Fast Rise/Fall time = Slow Notes: Spead percentage : ±. %, Modulation frequency :. khz, Modulation profile : Hershey-kiss
4 Spread Spectrum Specification Graph Spread Spectrum Profile fo : 7 MHz / Spread spectrum : ±. % / Modulation frequency :. khz Hershey-kiss Sine-wave Triangle Harmonics Specification Graph Typical supplemental specification. Unless otherwise specified T_use =, L_CMOS = pf, Vcc =. V Harmonics spectrum ( fo = MHz ) No spread spectrum Center spread ±. %, Hershey-kiss,. khz Power (dbm) frequency (MHz) Power (dbm) frequency (MHz) Modulation profile Modulation frequency fo = MHz Hershey-kiss fo = MHz Sine-wave fo = MHz Triangle fo = MHz. khz fo = MHz 6. khz Spread percentage Output frequency fo = MHz ±. % fo = MHz ±. % fo = MHz ±. % fo = 7 MHz fo = MHz fo = MHz Tr/Tf = fast Notes: Hermonics order attenuation is normalizing to no-spread spectrum mode.
5 Specification GraphTypical supplemental specification. Unless otherwise specified T_use =, L_CMOS = pf Rise/Fall Time (fo = MHz) Rise Time(ns)..... Rise time L_CMOS = pf Tr/Tf mode = Slow Tr/Tf mode = Default Tr/Tf mode = Fast..... Vcc (V) Fall Time(ns)..... Fall time L_CMOS = pf Tr/Tf mode = Slow Tr/Tf mode = Default Tr/Tf mode = Fast..... Vcc (V) Rise Time(ns)..... Rise time L_CMOS = pf Tr/Tf mode = Slow Tr/Tf mode = Default Tr/Tf mode = Fast..... Vcc (V) Harmonics comparison Center spread ±. %, Hershey-kiss,. khz Rise/Fall time = Fast fo = MHz Vcc =. V fo = MHz Vcc =. V fo = MHz Vcc =.8 V Fall Time(ns)..... Fall time L_CMOS = pf Tr/Tf mode = Slow Tr/Tf mode = Default Tr/Tf mode = Fast..... Vcc (V) Rise/Fall time = Slow fo = MHz Vcc =. V fo = MHz Vcc =. V fo = MHz Vcc =.8 V Attenuation (dbc) comparation of Rise/Fall time Vcc =. V fo = MHz, Rise/Fall time=fast fo = MHz Rise/Fall time=default fo = MHz, Rise/Fall time=slow HarmonicsOdd Order Normalize to Vcc =.V. Normalize to Vcc =.V. Normalize to Rise/Fall time = Fast. Notes: frequency slow default fast.67 M M See Slow See Default See Fast M M - See Default See Fast M 7 M - See Fast See Fast
6 Simulation Model IBIS Model is available upon request. Please contact us. Information Required: Oscillator operating condition (i.e. Power Supply, Rise/Fall Time, Temperature) ESD Rating Test items Human Body Model (HBM) Machine Model (MM) Charged Device Model (CDM) Breakdown voltage V V 7V Device Material & Environmental Information Model Package Dimensions # of Pins Reference Weight (Typ.) Terminal Material Terminal Plating Complies With EU RoHS SMD products Reflow profile(example) The availability of the heat resistance for reflow conditions of JEDEC-STD-D. is judged individually. Please inquire. Pb Free MSL Rating Peak Temp. (Max) SG-9CG.x.x.7mm mg W Au Yes Yes 6 C SG-9CE.x.x.mm mg W Au Yes Yes 6 C SG-9CB.x.x.mm mg W Au Yes Yes 6 C SG-9CA 7.x.x.mm mg W Au Yes Yes 6 C Temperature [ C ] TP ; +6 C OVER + C TL ; +7 C Ts max ; + C Ramp-up rate + C/s Max. tl 6 s to s tp ; at least s Ramp-down rate -6 C/s Max. Ts min ; + C ts 6 s to s Time + C to Peak Time [ s ] Pb free. Complies with EU RoHS directive. About the products without the Pb-free mark. Contains Pb in products exempted by EU RoHS directive. (Contains Pb in sealing glass, high melting temperature type solder or other.)
7 Device Marking Model Factory Programmed Part Marking Field Programmable Part Marking (Blank Samples) SG-9CG SG-9CE SG-9CB SG-9CA Standard Packing Specification SMD products are packed in the shipping carton as below table in accordance with taping standards EIA-8 and IEC-686 Marking Marking Standard Packing Quantity & Dimension(Unit mm) Model Reel Dimension Career Tape Dimension Direction of Quantity Feed (L= Left (pcs/reel) a b W A B C D Direction) SG-9CG Φ8 Φ L SG-9CE Φ8 Φ L SG-9CB Φ8 Φ L SG-9CA Φ Φ L
8 PROMOTION OF ENVIRONMENTAL MANAGEMENT SYSTEM CONFORMING TO INTERNATIONAL STANDARDS At Seiko Epson, all environmental initiatives operate under the Plan-Do-Check-Action (PDCA) cycle designed to achieve continuous improvements. The environmental management system (EMS) operates under the ISO environmental management standard. All of our major manufacturing and non-manufacturing sites, in Japan and overseas, completed the acquisition of ISO certification. ISO is an international standard for environmental management that was established by the International Standards Organization in 996 against the background of growing concern regarding global warming, destruction of the ozone layer, and global deforestation. WORKING FOR HIGH QUALITY In order provide high quality and reliable products and services than meet customer needs, Seiko Epson made early efforts towards obtaining ISO9 series certification and has acquired ISO9 for all business establishments in Japan and abroad. We have also acquired ISO/TS 699 certification that is requested strongly by major automotive manufacturers as standard. ISO/TS699 is the international standard that added the sector-specific supplemental requirements for automotive industry based on ISO9. Explanation of the mark that are using it for the catalog Pb free. Complies with EU RoHS directive. *About the products without the Pb-free mark. Contains Pb in products exempted by EU RoHS directive. (Contains Pb in sealing glass, high melting temperature type solder or other.) Designed for automotive applications such as Car Multimedia, Body Electronics, Remote Keyless Entry etc. Designed for automotive applications related to driving safety (Engine Control Unit, Air Bag, ESC etc ). Notice This material is subject to change without notice. Any part of this material may not be reproduced or duplicated in any form or any means without the written permission of Seiko Epson. The information about applied data, circuitry, software, usage, etc. written in this material is intended for reference only. Seiko Epson does not assume any liability for the occurrence of customer damage or infringing on any patent or copyright of a third party. This material does not authorize the licensing for any patent or intellectual copyrights. When exporting the products or technology described in this material, you should comply with the applicable export control laws and regulations and follow the procedures required by such laws and regulations. You are requested not to use the products (and any technical information furnished, if any) for the development and/or manufacture of weapon of mass destruction or for other military purposes. You are also requested that you would not make the products available to any third party who may use the products for such prohibited purposes. These products are intended for general use in electronic equipment. When using them in specific applications that require extremely high reliability, such as the applications stated below, you must obtain permission from Seiko Epson in advance. / Space equipment (artificial satellites, rockets, etc.) / Transportation vehicles and related (automobiles, aircraft, trains, vessels, etc.) / Medical instruments to sustain life / Submarine transmitters / Power stations and related / Fire work equipment and security equipment / traffic control equipment / and others requiring equivalent reliability. All brands or product names mentioned herein are trademarks and/or registered trademarks of their respective. Seiko Epson Corporation
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