SHORT-PULSE LASERS PowerLine Pico Series for Marking and Micro Processing

Size: px

Start display at page:

Download "SHORT-PULSE LASERS PowerLine Pico Series for Marking and Micro Processing"

Maximilian Chapman
6 years ago
Views:

1 Superior Reliability And Performance SHORT-PULSE LASERS PowerLine Pico Series for Marking and Micro Processing

Short-pulse lasers from ROFIN offer high pulse peak power.

In addition, the thermal penetration depth in highly sensitive material-removal processes such as the marking of certain metals and semiconductor materials can

Material-friendly processing n Low thermal penetration depth (HAZ) n Structural changes reduced n Maximized process control with very thin substrates n

To cover customer-specific fields of application to optimum effect, ROFIN offers lasers in the femtosecond, picosecond and nanosecond range.

for microprocessing such as thin-layer removal and structuring.

2 Short-pulse lasers from ROFIN offer high pulse peak power. This improves the quality of material removal, reduces surface roughness and increases the precision of selective layer removal. In addition, the thermal penetration depth in highly sensitive material-removal processes such as the marking of certain metals and semiconductor materials can be significantly reduced with shorter pulses. Material-friendly processing n Low thermal penetration depth (HAZ) n Structural changes reduced n Maximized process control with very thin substrates n Virtually no material accumulation Suitable for different application fields SHORT-PULSE LASER Why Coherent I ROFIN? To cover customer-specific fields of application to optimum effect, ROFIN offers lasers in the femtosecond, picosecond and nanosecond range. The PowerLine Pico lasers are suitable even at high frequencies for demanding marking applications semiconductor or medical applications, for example as well as for microprocessing such as thin-layer removal and structuring. Result of material processing with short-pulsed lasers Overlap maximized n Extremely high, variable pulse frequency n High pulse-to-pulse overlap thus maximized n Time-efficient material processing n High-precision selective layer removal Your Benefits n Outstanding processing quality at high speed n Optimal solution for applications involving sensitive materials and miniaturized components n Ease of integration thanks to compact dimensions n Low operating costs Result of material processing with nanosecond lasers Low Overlap n Typical result with nanosecond lasers 2 3

MARKING UNIT LASER BEAM SOURCE From laser source to laser marker The extremely high, variable pulse

be maximized, as in case of the thin-film structuring of solar cells, for example.

In addition, ROFIN offers the laser at double and triple frequency with a wavelength of 532 nm and in

The PowerLine Pico is available as a beam source and in an enhanced configuration level as a marking

Thanks to its extremely compact dimensions and all-in-one design, the PowerLine Pico can be integrated

Product features n Wavelengths of 1064 nm, 532 nm Ablation of plastic coatings Plastics marking Product

3 MARKING UNIT LASER BEAM SOURCE From laser source to laser marker The extremely high, variable pulse frequency of our short-pulse lasers ensures rapid processing and allows the pulse-to-pulse overlap to be maximized, as in case of the thin-film structuring of solar cells, for example. The laser can be operated quickly and easily via the TCP/IP, USB and RS 422 interfaces. In addition, ROFIN offers the laser at double and triple frequency with a wavelength of 532 nm and in different power classes. The PowerLine Pico is available as a beam source and in an enhanced configuration level as a marking laser. Thanks to its extremely compact dimensions and all-in-one design, the PowerLine Pico can be integrated easily. Product features n Wavelengths of 1064 nm, 532 nm Ablation of plastic coatings Plastics marking Product features n Easily integrated, compact 19 plug-in for the laser control unit n Wavelengths of 1064 nm, 532 nm n Comprehensive marking software included with the product n Flexible laser configuration for specific purposes n Beam expansion included n Software for parameterization included with the product n Configurable marking area size n Compact all-in-one design Marking of aluminium Decoating of insulating glass 4 5

4 482,6 Technical data PowerLine Pico 10 Technical data PowerLine Pico 50 Laser Beam source Supply unit Laser Beam source 88,5 Supply unit , (6,5) Platz für Kabel space for cable ,5 66,5 74 Laser Marker 42 Laser Marker ,4 5,4 Top view Top view 482,6 118,35 246, ,4 117,85 129,15 10, ,9 88,5 Laser Beam source PowerLine Pico PowerLine Pico Platz für Kabel space for cable Average power (W): 400 khz 400 khz Pulse width (ps): 400 khz 400 khz Beam quality: TEM 00 TEM 00 M 2 : < 1.6 < 1.5 Energy per Pulse (µj): 400 khz; 800 khz 400 khz; 800 khz Peak power (kw): 400 khz 800 khz Beam diameter (mm): approx. 2 approx. 2 Divergence angle full radius (mrad): collimated collimated Polarization: random; > 100:1 linear; > 100:1 Power supply (V DC): /-10, 50/60 Hz /-10, 50/60 Hz Laser Beam source PowerLine Pico PowerLine Pico Average power (W): 250 khz 250 khz Pulse width (ps): < 250 khz < 250 khz Beam quality: TEM 00 TEM 00 M 2 : 1,5 1,5 Energy per Pulse (µj): 250 khz 250 khz Peak power (kw): > 250 khz > 250 khz Beam diameter (mm): 3 tbd Divergence angle full radius (mrad): < 1 < 1 Polarization: linear; > 100:1 vertical linear; > 100:1 horizontal Power supply (V DC): /- 10%, 50/60 Hz /- 10%, 50/60 Hz Operating temperature ( C): Laser Marker PowerLine Pico PowerLine Pico Pulse width (ps): 400 khz 400 khz Dimensions (W x D x H, mm): 167 x 631 x x 631 x 285 Air flow (m3/h): approx. 180 approx. 180 Field size (mm): 120 x120 or 240 x x 120 or 240 x 240 Focus distance (mm): 193 (+/- 7) or 432 (+/- 25) 193 (+/- 7) or 432 (+/- 25) Supply unit dimensions (W x D x H, mm): 19, 2 rack units 19, 2 rack units Software: VLM VLM Air flow 19 supply unit (m3/h): approx. 80 approx. 80 Power supply (V): , +/- 10, 1 P/N/PE , +/- 10, 1 P/N/PE Laser Marker PowerLine Pico PowerLine Pico Pulse width (ps): < 250 khz < 250 khz Dimensions (W x D x H, mm): 360 x 980 x x 980 x 212 Field size (mm): variable variable Focus distance (mm): variable variable Supply unit dimensions (W x D x H, mm): 2 HE h x 482,6 x HE h x 482,6 x 400 Software: VLM VLM Air flow 19 supply unit (m3/h): Power supply (V): /- 10%, 50/60 Hz /- 10%, 50/60 Hz A separate cooling-system is mandatory and optionally available. 6 7

5 ROFIN-SINAR Laser GmbH Dieselstraße Bergkirchen Phone: Fax: info-marking@rofin.de ROFIN-BAASEL Lasertech GmbH & Co. KG Zeppelinstraße Gilching Phone: Fax: sales-micro@rofin.de ROFIN-SINAR Laser GmbH Berzeliusstraße Hamburg Phone: Fax: info-macro@rofin.de Misprints and rights for improvements and modifications of our products reserved. Version / ars litera GmbH, Munich Benelux: Phone info@rofin-baasel.nl CA: Phone info-canada@rofin-inc.com CH: Phone info@rofin-baasel.ch CN: Phone info@rofin-baasel.com.cn ES/PT: Phone info@rofin-es.com F: Phone info@rofin.fr IN: Phone /2 /3 /5 info@rofin.in IT: Phone info@rofin.it JP: Phone info@rofin-baasel.co.jp KR: Phone info@rofin-baasel.co.kr SG: Phone reception@rofin-baasel.com.sg TW: Phone info@rofin-baasel.com.tw UK: Phone sales@rofin-baasel.co.uk US: Phone info@rofin-inc.com You can find further representatives and partners on and Superior Reliability And Performance

LASER PROCESSING GLASS AND OTHER TRANSPARENT & BRITTLE MATERIALS W E T H I N K L A S E R

LASER PROCESSING GLASS AND OTHER TRANSPARENT & BRITTLE MATERIALS LASER PROCESSING OF GLASS AND OTHER TRANSPARENT & BRITTLE MATERIALS Laser processing of glass and other transparent brittle materials provides