SGM330A Quad, Wide-Bandwidth SPDT Video Analog Switch

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1 GENERAL DESCRIPTION The SGM330A is a quad, bidirectional, single-pole/ double-throw (SPDT) CMOS video analog switch (Mux/ DeMux) designed to operate from a single 2.7V to 5.5V power supply. This 2-channel multiplexer/demultiplexer is recommended for both RGB and composite video switching applications. The video switch can be driven from a current output RAMDAC or voltage output composite video source. Wide bandwidth (500MHz), low on-resistance (12Ω), and low crosstalk make it suitable for high-frequency and other applications. Also this device has exceptionally high current capability which is far greater than most analog switches offered today. The SGM330A offers a high-performance, low-cost solution to switch between video sources. It is specified -40 to +85 temperature range. The SGM330A is available in Green SOIC-16, TSSOP-16 and SSOP-16 packages. FEATURES Wide Bandwidth: 500MHz Low On-Resistance: 12Ω (TYP) Low Crosstalk: -60dB at 10MHz (TYP) Power Supply Voltage Range: 2.7V to 5.5V Fast Switching Time Rail-to-Rail Operation Typical Power Consumption (I CC = 0.1μA) TTL/CMOS Compatible Micro Size Packages SOIC-16 TSSOP-16 SSOP-16 APPLICATIONS Personal Video Recorders Terrestrial Set-Top Boxes Hard Disk Recorders DVD Players Game Consoles Digital VCRs Desktop Video Editors Audio and Video Switching JANUARY, 2017 REV. B. 4

2 PACKAGE/ORDERING INFORMATION MODEL SGM330A PACKAGE DESCRIPTION SPECIFIED TEMPERATURE RANGE ORDERING NUMBER SOIC to +85 SGM330A-YS/TR SSOP to +85 SGM330A-YQS/TR TSSOP to +85 SGM330A-YTS/TR PACKAGE MARKING SGM330A-YS XXXXX SGM330A -YQS XXXXX SGM330A -YTS XXXXX PACKING OPTION Tape and Reel, 2500 Tape and Reel, 3000 Tape and Reel, 3000 NOTE: XXXXX = Date Code and Vendor Code. Green (RoHS & HSF): defines "Green" to mean Pb-Free (RoHS compatible) and free of halogen substances. If you have additional comments or questions, please contact your SGMICRO representative directly. ABSOLUTE MAXIMUM RATINGS Supply Voltage to Ground Potential (Inputs & V + only) V to 6V Supply Voltage to Ground Potential (Outputs & D only) V to 6V DC Input Voltage V to 6V Package Thermal T A = +25 SOIC-16, θ JA /W TSSOP-16, θ JA /W SSOP-16, θ JA /W Junction Temperature Storage Temperature Range to +150 Lead Temperature (Soldering, 10s) ESD Susceptibility HBM V MM V RECOMMENDED OPERATING CONDITIONS Operating Temperature Range to +85 OVERSTRESS CAUTION Stresses beyond those listed may cause permanent damage to the device. Functional operation of the device at these or any other conditions beyond those indicated in the operational section of the specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. ESD SENSITIVITY CAUTION This integrated circuit can be damaged by ESD if you don t pay attention to ESD protection. SGMICRO recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. DISCLAIMER reserves the right to make any change in circuit design, specification or other related things if necessary without notice at any time. 2

3 PIN CONFIGURATION (TOP VIEW) IN 1 16 V+ S 1 A 2 15 EN S 2 A 3 14 S 1 D D A 4 13 S 2 D S 1 B 5 12 D D S 2 B 6 11 S 1 C D B 7 10 S 2 C GND 8 9 D C SSOP-16/SOIC-16/TSSOP-16 PIN DESCRIPTION PIN NAME FUNCTION 1 IN Select Input. 2, 5, 11, 14, 3, 6, 10, 13 S 1A, S 1B, S 1C, S 1D S 2A, S 2B, S 2C, S 2D Analog Video I/O. 4, 7, 9, 12 D A, D B, D C, D D Analog Video I/O. 8 GND Ground. 15 EN Switch-Enable Input. 16 V + Power Supply. FUNCTIONAL BLOCK DIAGRAM FUNCTION TABLE EN IN ON SWITCH D A D B S 1 A S 2 A S 1 B 0 0 S 1A, S 1B, S 1C, S 1D 0 1 S 2A, S 2B, S 2C, S 2D 1 X Disabled D C S 2 B S 1 C D D S 2 C S 1 D 13 S 2 D EN 15 DECODER/DRIVERS 1 IN 3

4 PARAMETER DEFINITIONS PARAMETER R ON I O V IN V I V EN C IN C OFF C ON V IH V IL I IH (IIL) t ON t OFF BW X TALK D G D P O IRR DESCRIPTION Resistance between source and drain with switch in the ON state. Output leakage current measured at S1, S2, and D with the switch OFF. Digital voltage at the IN pin that selects between S1 and S2 analog inputs. Voltage applied to the D or S1, S2 pins when D or S1, S2 is the switch input. A voltage that ENABLES the chip. Capacitance at the digital inputs. Capacitance at analog I/O (S1, S2, D) with switch OFF. Capacitance at analog I/O (S1, S2, D) with switch ON. Minimum input voltage for logic HIGH. Minimum input voltage for logic LOW. Input current of the digital input. Propagation delay measured between 50% of the digital input to 90% of the analog output when switch is turned ON. Propagation delay measured between 50% of the digital input to 90% of the analog output when switch is turned OFF. Frequency response of the switch in the ON state measured at 3dB down. Is an unwanted signal coupled from channel to channel. Measured in -db. X TALK = 20LOG V OUT/V IN. This is non-adjacent crosstalk. Magnitude variation between analog input and output pins when the switch is ON and the dc offset of composite-video signal varies at the analog input pin. In the NTSC standard, the frequency of the video signal is 3.58MHz. Phase variation between analog input and output pins when the switch is ON and the dc offset of composite-video signal varies at the analog input pin. In the NTSC standard, the frequency of the video signal is 3.58MHz. Off isolation is the resistance (measured in -db) between the input and output with the switch off (NO). 4

5 ELECTRICAL CHARACTERISTICS (At V + = +5V, T A = +25, unless otherwise noted.) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Input Voltage V IN 0 V + V DC CHARACTERISTICS On-Resistance R ON 0V VS1 or VS2 V+, ID = 13mA Ω Input High Voltage V IH 2 V Input Low Voltage V IL 0.6 V Input High Current I IH V + = 5.5V, V IN and V EN = V + ±1 μa Input Low Current I IL V + = 5.5V, V IN and V EN = 0V ±1 μa Analog Output Leakage Current I O V + = 5.5V, V S1 or V S2 = 3.3V/0.3V, V D = 0.3V/3.3V ±1 μa Clamp Diode Voltage V IK I IN = -18mA -1 V DYNAMIC CHARACTERISTICS Turn-On Time t ON R L = 75Ω, C L = 20pF, See Figure 1 25 ns Turn-Off Time t OFF R L = 75Ω, C L = 20pF, See Figure 1 13 ns Off Isolation O IRR R L = 150Ω, f = 10MHz, See Figure 5-58 db Channel-to-Channel Crosstalk X TALK R IN = 10Ω, R L = 150Ω, f = 10MHz, See Figure 4-60 db -3dB Bandwidth BW R L = 150Ω, See Figure MHz Input/Enable Capacitance C IN f = 1MHz 4 pf Switch OFF Capacitance C OFF f = 1MHz 4 pf Switch ON Capacitance C ON f = 1MHz 8 pf Differential Gain D G R L = 150Ω, f = 3.58MHz, See Figure % Differential Phase D P R L = 150Ω, f = 3.58MHz, See Figure POWER REQUIREMENTS Power Supply Range V V Power Supply Current I CC V + = +5.5V, V IN and V EN = 5V/0V μa Supply Current per TTL HIGH Δ ICC V + = +5.5V, V IN or V EN = 3.4V 300 μa 5

6 TYPICAL PERFORMANCE CHARACTERISTICS On Response (db) On Response vs. Frequency -6 V + = +5V T A = Frequency (MHz) Off Isolation (db) Off Isolation vs. Frequency -10 V = +5V T A = Frequency (MHz) 0-20 V + = +5V T A = +25 Crosstalk vs. Frequency Crosstalk (db) Frequency (MHz) 6

7 TEST CIRCUITS Input Generator V G1 50Ω V IN 50Ω IN V + S 1 DUT V S1 D V O S 2 EN C L (1) R L V S2 Test V+ R L C L V S1 V S2 t ON t OFF 5V±0.5V 75Ω 20pF GND 3V 5V±0.5V 75Ω 20pF 3V GND 5V±0.5V 75Ω 20pF GND 3V 5V±0.5V 75Ω 20pF 3V GND Output Control (V IN ) 50% 50% 3V 0V Analog Ouput Waveform (V O ) t ON 90% 90% t OFF V OH 0V VOLTAGE WAVEFORMS t ON AND t OFF TIMES NOTES: 1. C L includes probe and jig capacitance. 2. All input pulses are supplied by generators having the following characteristics: PRR 10MHz, Z O = 50Ω, t r 2.5ns, t f 2.5ns. 3. The outputs are measured one at a time, with one transition per measurement. Figure 1. Test Circuit for Voltage Waveform and Switch Time 7

8 TEST CIRCUITS (continued) EXT TRIGGER P2 R L S 1 A Sawtooth Waveform Generator V BIAS BIAS Network Analyzer (HP8753ES) V + DUT P1 D A IN EN V IN V EN Figure 2. Test Circuit for Differential Gain/Phase Measurement Differential gain and phase are measured at the output of the ON channel. For example, when V IN = 0, V EN = 0, and D A is the input, the output is measured at S 1 A. EXT TRIGGER P2 R L S 1 A V BIAS BIAS Network Analyzer (HP8753ES) V + DUT P1 D A IN EN V IN V EN Figure 3. Test Circuit for Frequency Response (BW) Frequency response is measured at the output of the ON channel. For example, when V IN = 0, V EN = 0, and D A is the input, the output is measured at S 1 A. All unused analog I/O ports are left open. HP8753ES Setup Average = 4 RBW = 3Hz V BIAS = 1/2 V + ST = 2s P1 = 0dBM 8

9 TEST CIRCUITS (continued) EXT TRIGGER V BIAS BIAS Network Analyzer (HP8753ES) P1 P2 V + D A S 1 A IN R L 50Ω(1) V IN EN DUT V EN R IN = 10Ω D B S 1 B R L NOTE: 1. A 50Ω termination resistor is needed for the network analyzer. Figure 4. Test Circuit for Crosstalk (X TALK) Crosstalk is measured at the output of the nonadjacent ON channel. For example, when V IN = 0, V EN = 0, and D A is the input, the output is measured at S 1 B. HP8753ES Setup Average = 4 RBW = 3kHz V BIAS = 1/2 V + ST = 2s P1 = 0dBM 9

10 TEST CIRCUITS (continued) EXT TRIGGER P2 S 1 A S 2 A V BIAS BIAS Network Analyzer (HP8753ES) R L V + DUT R L 50Ω(1) P1 D A IN EN V IN V EN NOTE: 1. A 50Ω termination resistor is needed for the network analyzer. Figure 5. Test Circuit for Off Isolation (O IRR) Off isolation is measured at the output of the OFF channel. For example, when V IN = V +, V EN = 0, and D A is the input, the output is measured at S 1 A. All unused analog input (D) ports are left open. HP8753ES Setup Average = 4 RBW = 3kHz V BIAS = 1/2 V + ST = 2s P1 = 0dBM 10

11 PACKAGE INFORMATION PACKAGE OUTLINE DIMENSIONS SOIC-16 D e 1.75 E1 E RECOMMENDED LAND PATTERN (Unit: mm) L A b A1 A2 θ c Symbol Dimensions In Millimeters Dimensions In Inches MIN MAX MIN MAX A A A b c D E E e 1.27 BSC BSC L θ TX

12 PACKAGE INFORMATION PACKAGE OUTLINE DIMENSIONS SSOP-16 D E1 E b e RECOMMENDED LAND PATTERN (Unit: mm) L A A1 A2 θ c Dimensions In Millimeters Dimensions In Inches Symbol MIN MAX MIN MAX A A A b c D E E e BSC BSC L θ TX

13 PACKAGE INFORMATION PACKAGE OUTLINE DIMENSIONS TSSOP-16 D E1 E e b RECOMMENDED LAND PATTERN (Unit: mm) L A A1 A2 θ H c Dimensions In Millimeters Dimensions In Inches Symbol MIN MAX MIN MAX A A A b c D E E e BSC BSC L H 0.25 TYP 0.01 TYP θ TX

14 PACKAGE INFORMATION TAPE AND REEL INFORMATION REEL DIMENSIONS TAPE DIMENSIONS P2 P0 W Q1 Q2 Q1 Q2 Q1 Q2 B0 Q3 Q4 Q3 Q4 Q3 Q4 Reel Diameter P1 A0 K0 Reel Width (W1) DIRECTION OF FEED NOTE: The picture is only for reference. Please make the object as the standard. KEY PARAMETER LIST OF TAPE AND REEL Package Type Reel Diameter Reel Width W1 A0 B0 K0 P0 P1 P2 W Pin1 Quadrant SOIC Q1 SSOP Q1 TSSOP Q1 DD0001 TX

15 PACKAGE INFORMATION CARTON BOX DIMENSIONS NOTE: The picture is only for reference. Please make the object as the standard. KEY PARAMETER LIST OF CARTON BOX Reel Type Length Width Height Pizza/Carton DD0002 TX