SRF-M55 SERVICE MANUAL FM STEREO PLL SYNTHESIZED RADIO. AEP Model E Model Chinese Model. Ver SPECIFICATIONS MICROFILM
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1 SRF-M SERVICE MANUAL Ver AEP Model E Model Chinese Model SPECIFICATIONS FM STEREO PLL SYNTHESIZED RADIO MICROFILM
2 TABLE OF CONTENTS Specifications.... GENERAL Location and Function of Controls DISASSEMBLY 2-. Cabinet ASSY, Front, Cabinet ASSY, Rear Main Board LCD Microcomputer Board... 4 Flexible Circuit Board Repairing Keep the temperature of the soldering iron around 270 C during repairing. Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). Be careful not to apply force on the conductor when soldering or unsoldering. Notes on chip component replacement Never reuse a disconnected chip component. Notice that the minus side of a tantalum capacitor may be damaged by heat. 3. ADJUSTMENTS DIAGRAMS 4-. Explanation of IC Terminals Block Diagrams Printed Wiring Boards Schematic Diagram EXPLODED VIEW ELECTRICAL PARTS LIST... 8 LOCATION AND FUNCTION OF CONTROLS SECTION GENERAL 2
3 r The equipment can be removed using the following procedure. Set Cabinet ASSY, Front Cabinet ASSY, Rear Main board SECTION 2 DISASSEMBLY Microcomputer board LCD20 Note : Follow the disassembly procedure in the numerical order given. 2-. CABINET ASSY, FRONT, CABINET ASSY, REAR Cabinet ASSY, front 2 Claws LCD flexible board (3 core) 4 Flexible board (0 core) 2 Claws 3 2 Claw Cabinet ASSY, rear Screws (B.7x8) 2-2. MAIN BOARD Button (power) 2 Main board 4 Lid, battery case 3 Claw Cabinet ASSY, front 3 Claw 3
4 2-3. LCD20 LCD20 2 Cabinet ASSY, front Claws 2-4. MICROCOMPUTER BOARD Screws (.4) Microcomputer board 4 Claw 4 Claws Cover, side 3 Cabinet ASSY, rear 2 Claws 4
5 SECTION 3 ADJUSTMENTS FM Section Setting : 0 db=µv FM RF signal generator 22.kHz frequency deviation by 400Hz signal. Output level : as low as possible set 6 Ω 0.0µF level meter (ANT) FM STEREO (9kHz) Adjustment Setting : FM RF signal generator 0.0µF Carrier frequency : 98MHz Modulation : khz, 22.kHz deviation Output level : mv (more than 60dB) Procedure :. Connect the frequency counter to (9kHz). 2. Turn the set to 98MHz. 3. Adjust RV for 9kHz reading frequency counter. Standard Value : kHz (ANT) Connection: For FM frequency coverage adjustment digital voltmeter headphones jack EP (i) Connection: [MAIN BOARD] (SIDE A) (9kHz) µf/0v frequency counter (LPF) C C0 R03 R04 R D0 R20 C2 R C02 Q CF R08 CF2 BPF0 R07 R0 (LPF) C03 R06 C24 D02 C0 BCE R0 C04 R09 Q0 Q04 C B E [MAIN BOARD] (SIDE A) Q0 R9 ECB (ANT) R (ANT) 2 R3 R4 C3 C4 C 3 C2 C 20 C0 24 C09 C08 R C07 Adjustments Location : (9kHz) IC0 [MAIN BOARD] (SIDE A) C6 R2 2 0 CF3 Repeat the procedures in each adjustment several times, and the frequency coverage and tracking adjustments should be finally done by the trimmer capacitors. FM IF ADJUSTMENT Adjust for a maximum reading on level meter. T 0.7MHz FM FREQUENCY COVERAGE ADJUSTMENT Adjust for a maximum reading on level meter. adjustment value: 2V CT2 87.MHz standard value:. 2.V Confirm 08.0MHz standard value: 9 3V FM TRACKING ADJUSTMENT Adjust for a maximum reading on level meter. CT 98MHz RV : FM Stereo (9kHz) Adjustment T : FM IF Adjustment CT : FM Tracking Adjustment CT2 : FM Frequency Coverage Adjustment
6 SECTION 4 DIAGRAMS 4-. EXPLANATION OF IC TERMINALS IC30 µ PD70GS-6-GJG (SYSTEM CONTROL, LCD DRIVE) Pin No. Pin name I/O Description POB2 I Key return input. 2 PCO0 O Key source output. 3 PCO O Key source output. 4 PCO2 I Power (AUTO OFF) key input. PCO3 I HOLD key input. 6 POD0/BEEP O Beep output. 7 POA0 I Key return input (Fixed at L ). 8 POA I Voltage decrease information input. E : On-and-off 9 POA2 O Power ON/OFF output. H : ON 0 POA3 O Mute signal output. H : Mute ON CE I Voltage decrease information input. E : Lighting 2 XOUT O System clock output (7 khz). 3 XIN I System clock input (7 khz). 4 VDD Power supply. GND Ground. 6 EO O PLL error output. 7 VREG O Voltage regulator output. 8 VCOH I FM VCO input. 9 VCOL Not used (OPEN) LCD 0 8 O LCD segment output COM 0 3 O LCD common output. 33 VLCD Power supply for LCD drive. 34 CAP 3 CAP0 Connecting pins of the capacitor for LCD drive voltage. 36 VLCD0 Power supply for LCD drive. 37 POB0 38 POB I Key return input. 6
7 4-2. BLOCK DIAGRAMS SRF-M Signal path. F : FM 7 8 9
8 SRF-M 4-3. PRINTED WIRING BOARDS r Semiconductor Location Ref. No. Location D0 F- D02 F- D30 F-4 D303 F-4 D30 D- D306 D- IC F-8 IC2 D-8 IC3 C- IC0 E-2 IC20 D-3 IC202 D-3 IC30 C- IC302 E- Q0 F-2 Q02 E- Q03 B-2 Q04 G-2 Q0 G-2 Q30 G- Q304 D-4 Q30 D-4 Q306 F- Q307 G- Q308 F- Q30 F- Note on Printed Wiring Boards: Note: X : parts extracted from the component side. r : Through hole. b : Pattern from the side which enables seeing. (The other layers' patterns are not indicated.) Caution: Pattern face side: Parts on the pattern face side seen from the (Side B) pattern face are indicated. Parts face side: Parts on the parts face side seen from the (Side A) parts face are indicated. Note on Schematic Diagram: Note: All capacitors are in µf unless otherwise noted. pf: µµf 0 WV or less are not indicated except for electrolytics and tantalums. All resistors are in Ω and /4 W or less unless otherwise specified. U : B+ Line. H : adjustment for repair. Power voltage is dc.v and fed with regulated dc power supply from battery terminal. Voltages and waveforms are dc with respect to ground under no-signal (detuned) conditions. no mark : FM Voltages are taken with a VOM (Input impedance 0 MΩ). Voltage variations may be noted due to normal production tolerances. Waveforms are taken with a oscilloscope. Voltage variations may be noted due to normal production tolerances. Circled numbers refer to waveforms. Signal path. F : FM A B C D E F G 02 [MICROCOMPUTER BOARD] (SIDE B) S202 C204 C S202 POWER (AUTO OFF) R206 R202 C203 C202 CN20 R20 X IC20 2 IC202 4 R C20 R203 0 S203 MODE R20 C206 CN202 S20 HOLD LCD20 LIQUID CRYSTAL DISPLAY C37 R30 R302 C36 R30 C326 C30 C303 C39 R3 R30 R309 0 C302 C320 R308 C32 R307 C33 R306 R38 D30 C304 R33 C34 9 Q304 Q30 C3 ECB ECB C32 D303 T30 L304 R303 D306 C329 S20(JOG) 3 2 R304 R32 C3 C38 IC30 D30 4 IC302 C324 Q306 L303 ECB Q30 Q307 C B E Q30 R33 [MICROCOMPUTER BOARD] (SIDE A) [MAIN BOARD] (SIDE B) [MAIN BOARD] (SIDE A) R334 BCE R332 ECB R32 R39 R320 R36 C327 C R R330 Q308 R333 C323 BATT2 LITHIUM BATTERY S2 GROOVE MEGA BASS OFF S FM SENS DX LOCAL C C22 C2 6 0 S2 S C20 R C8 C9 C9 IC3 C28 C4 R4 R30 0 CN C2 L4 C2 RV2 VOL R98 R97 R96 L3 R99 C23 C27 R8 C7 C6 C24 R C29 C26 C IC2 7 IC C2 C C6 L 8 4 T R9 C0 C7 R3 R2 L2 C C8 C3 C4 RV CT CT2 EP 2 DRY BATTERY SIZE "AAA" (IEC DESIGNATION R03) PC,.V C30 () () () () R2 R3 R4 C3 L7 R23 R22 C20 C9 R6 R7 L C4 C 3 C2 C 20 C0 24 C06 C09 C08 C0 R03 R04 R24 R0 BCE C02 R D0 R20 C2 R L6 C07 Q02 IC0 CF R08 R8 C23 Q03 E C B C22 C2 (9kHz) C6 BPF0 R2 2 0 CF2 R07 CF3 R0 (LPF) C03 R06 C24 D02 C0 BCE R0 C04 R09 Q0 Q04 C B E Q0 R9 ECB R02 (ANT) 0 2
9 4-4. SCHEMATIC DIAGRAM r Refer to page 0 for Notes. r Refer to page 6 for IC Block Diagrams. SRF-M r WAVEFORMS 4.6Vp-p 360 nsec Q30-2 C VOLT/DIV : V AC TIME/DIV : 0. µsec 2.2Vp-p 982 nsec T30 VOLT/DIV : V AC TIME/DIV : 0.2 µsec 3 330mVp-p 7kHz IC30 qs XOUT 4 VOLT/DIV : 0. V AC TIME/DIV : µsec 2.9 Vp-p 2 µsec IC302 VOLT/DIV : 0. V AC TIME/DIV : µsec 3 4
10 SECTION EXPLODED VIEW MAIN SECTION 6 ELECTRICAL PARTS LIST r IC BLOCK DIAGRAMS IC TA737AF-EL FM RF VCC RF IN GND AFC DIODE(C) MIX OUT REG RF MIX OSC OSC AFC DIODE(A) L R 2 HP- 3 HP-2 4 LP-IN LP-GAIN 6 LP-OUT 7 IC2 LA30M- ON/OFF L R DET IN DET OUT REF VCC GND NOTE : -XX, -X mean standardized parts, so they may have some difference from the original one. Color indication of Appearance Parts Example : KNOB, BALANCE (WHITE) (RED) Parts color Cabinet's color 0 Items marked * are not stocked since they are seldom required for routine service. Some delay should be anticipated when ordering these items. The mechanical parts with no reference number in the exploded views are not supplied. Hardware (# mark) list and accessories and packing materials are given in the last of this parts list. Abbreviation CH : Chinese LCD NOTE : Due to standardization, replacements in the parts list may be different from the parts specified in the diagrams or the components used on the set. -XX, -X mean standardized parts, so they may have some difference from the original one. RESISTORS All resistors are in ohms METAL : Metal-film resistor METAL OXIDE :Metal oxide-film resistor F : nonflammable Items marked * are not stocked since they are seldom required for routine service. Some delay should be anticipated when ordering these items. SEMICONDUCTORS In each case, u : µ, for example : ua... : µ A..., upa... : µ PA... upb... : µ PB..., upc... : µ PC... upd... : µ PD... CAPACITORS uf : µ F COILS uh : µ H When indicating parts by reference number, please include the board. Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark * A A MAIN BOARD, COMPLETE (AEP,CH,E) * A A MAIN BOARD, COMPLETE (Panama) ********************** Abbreviation CH : Chinese C CERAMIC CHIP uf 0% 6.3V C CERAMIC CHIP 0.uF 0% 6V C CERAMIC CHIP 0.082uF 0% 2V IC3 LA437M < BAND PASS FILTER > BPF FILTER, BAND PASS < CAPACITOR > C CERAMIC CHIP 0.047uF 0% 6V C CERAMIC CHIP 0.0uF 0% 2V C CERAMIC CHIP 0.0uF 0% 2V C CERAMIC CHIP 0.022uF 0% 2V C TANTAL. CHIP 00uF 20% 4V POWER SW L-IN GND R-IN REF POWER SWITCH MUTE 0 MUTE 2 3 BIAS AMP 9 8 L-OUT POWER GND 4 AMP 7 R-OUT 6 VCC BATT2 Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark CLIP SCREW(B.7X8), TAPPING 3 X CABINET ASSY, REAR (SILVER) 3 X CABINET ASSY, REAR (GREEN) * 4 A A MICROCOMPUTER BOARD, COMPLETE FLEXIBLE BOARD(B-B) TERMINAL (-), BATTERY 7 X TERMINAL BOARD ASSY, BATTERY LID,BATTERY CASE (SILVER) LID,BATTERY CASE (GREEN) * 9 A A MAIN BOARD, COMPLETE (AEP,CH,E) * 9 A A MAIN BOARD, COMPLETE (Panama) 0 X CABINET ASSY, FRONT (SILVER) 0 X CABINET ASSY, FRONT (GREEN) BUTTON (POWER) SCREW (.4), TAPPING,PRECISION SCREW (B.4X2), TAPPING RETAINER (HOLD) KNOB(HOLD) (SILVER) S KNOB(HOLD) (GREEN) BUTTON (MODE) (SILVER) BUTTON (MODE) (GREEN) COVER, SIDE (SILVER) COVER, SIDE (GREEN) KNOB(GROOVE) (SILVER) KNOB(GROOVE) (GREEN) SHEET,INSULATION SCREW.7X RETAINER (DX/LOCAL) KNOB(DX/LOCAL) (SILVER) KNOB(DX/LOCAL) (GREEN) FLEXIBLE BOARD(B-E) SPACER CUSHON (A) BATT BATTERY, PAS SECONDARY 8 LCD DISPLAY PANEL, LIQUID CRYSTAL S ENCODER, ROTARY (JOG) C CERAMIC CHIP 0.0uF 0% 2V C CERAMIC CHIP 820PF % 0V C TANTAL. CHIP 3.3uF 20% 6.3V C --6- CERAMIC CHIP uf 0V C CERAMIC CHIP uf 0V C CERAMIC CHIP 0.uF 0% 6V C CERAMIC CHIP 0.00uF 0% 0V C CERAMIC CHIP 0.00uF 0% 0V C CERAMIC CHIP 0.uF 0% 6V C TANTAL. CHIP 3.3uF 20% 6.3V C TANTALUM CHIP uf 20% 20V C TANTAL. CHIP 3.3uF 20% 6.3V C TANTALUM CHIP 0uF 20% 4V C TANTAL. CHIP 00uF 20% 4V C CERAMIC CHIP uf 0V C CERAMIC CHIP uf 0V C CERAMIC CHIP 00PF % 0V C TANTAL. CHIP 00uF 20% 4V C CERAMIC CHIP uf 0V C CERAMIC CHIP uf 0V C CERAMIC CHIP uf 0V C CERAMIC CHIP 00PF % 0V C CERAMIC CHIP 00PF % 0V C TANTALUM CHIP 22uF 20% 4V C CERAMIC CHIP 7PF % 0V C CERAMIC CHIP uf 0V C TANTAL. CHIP 33uF 20% 2.V C CERAMIC CHIP 000PF % 0V C CERAMIC CHIP 000PF % 0V C CERAMIC CHIP 000PF % 0V C CERAMIC CHIP 000PF % 0V C CERAMIC CHIP 000PF % 0V C CERAMIC CHIP.PF 0.2PF 0V C CERAMIC CHIP 0.0uF 0% 2V C CERAMIC CHIP 0.022uF 0% 2V C CERAMIC CHIP 0.00uF 0% 0V C CERAMIC CHIP uf 0% 6.3V C TANTAL. CHIP 47uF 20% 4V C TANTAL. CHIP 00uF 20% 4V C TANTAL. CHIP 47uF 20% 4V C CERAMIC CHIP uf 0V C CERAMIC CHIP 000PF % 0V C CERAMIC CHIP 0.0uF 0% 2V < FILTER > CF FILTER, CERAMIC CF FILTER, CERAMIC CF FILTER, CERAMIC(DISCRIMINATOR) < CONNECTOR > CN CONNECTOR, FFC/FPC (ZIF) 0P < TRIMMER > CT CAP, ADJ (FM TRACKING) CT CAP, ADJ (FM FREQUENCY COVERAGE) < DIODE > D DIODE T362 D DIODE T362 < JACK > EP JACK, HEADPHONE (i) < IC > IC IC TA737AF-EL IC IC LA30M- IC IC LA437M IC IC TA-2022AFN-EL < COIL > L INDUCTOR 0.uH L INDUCTOR 82nH L INDUCTOR CHIP 22uH 6 7 8
11 MAIN MICROCOMPUTER Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark L INDUCTOR CHIP 22uH L INDUCTOR 4.7uH L INDUCTOR 4.7uH L INDUCTOR 4.7uH < TRANSISTOR > Q TRANSISTOR 2SC393-C Q TRANSISTOR 2SC393-C Q TRANSISTOR 2SB8B7-TB Q TRANSISTOR 2SB8B7-TB Q TRANSISTOR UN920J-(TX).SO < RESISTOR > R RES,CHIP 0K % /6W R METAL CHIP 0K % /6W R METAL CHIP 0K % /6W R METAL CHIP 3.3K % /6W R METAL CHIP 3.3K % /6W R METAL CHIP 0 % /6W R RES, CHIP 4.7K % /6W R RES, CHIP 0 % /6W R RES, CHIP 27K % /6W R RES, CHIP 27K % /6W R RES, CHIP K % /6W R RES, CHIP K % /6W R METAL CHIP 2.2K % /6W (EXCEPT Panama) R METAL CHIP 68 % /6W (Panama) R METAL CHIP 220 % /6W (EXCEPT Panama) < SWITCH > S SWITCH, SLIDE (FM SENS) S SWITCH, SLIDE (GROOVE/MEGA BASS/OFF) < TRANSFORMER > T TRANSFORMER, IF (TV IFT) (FM IF) ************************************************************** * A A MICROCOMPUTER BOARD, COMPLETE *********************** < BATTERY > BATT BATTERY, PAS SECONDARY < CAPACITOR > C TANTALUM CHIP 0uF 20% 4V C CERAMIC CHIP uf 0V C CERAMIC CHIP 220PF % 0V C CERAMIC CHIP 0.uF 0% 6V C CERAMIC CHIP 0.uF 0% 6V C CERAMIC CHIP uf 0V C TANTAL. CHIP 0uF 20% 6.3V C CERAMIC CHIP 0PF 0.PF 0V C CERAMIC CHIP 0.uF 0% 6V C CERAMIC CHIP 0PF 0.PF 0V C CERAMIC CHIP uf 6V C CERAMIC CHIP 0.uF 0% 6V C CERAMIC CHIP 0.0uF 0% 2V C CERAMIC CHIP 0.33uF 0% 6V C CERAMIC CHIP 0.00uF 0% 0V R METAL CHIP 00K % /6W R METAL CHIP 00K % /6W R METAL CHIP 00K % /6W R METAL CHIP 00K % /6W R METAL CHIP 0 % /6W R METAL CHIP 22K % /6W R METAL CHIP 220 % /6W R METAL CHIP 00K % /6W R METAL CHIP 0 % /6W R METAL CHIP 4.7K % /6W R METAL CHIP K % /6W R METAL CHIP 4.7K % /6W R METAL CHIP 2.7K % /6W R METAL CHIP 68K % /6W R METAL CHIP 68K % /6W R METAL CHIP K % /6W R METAL CHIP K % /6W R METAL CHIP 47 % /6W R METAL CHIP 00 % /6W R RES,CHIP 0K % /6W R RES,CHIP 0K % /6W R METAL CHIP 330 % /6W < VARIABLE RESISTOR > RV RES, ADJ, CERMET 22K (STEREO 9kHz) RV RES, VAR (VOL w) C CERAMIC CHIP 000PF % 0V C CERAMIC CHIP 470PF % 0V C CERAMIC CHIP 220PF % 0V C CERAMIC CHIP 220PF % 0V C CERAMIC CHIP 220PF % 0V C CERAMIC CHIP 22PF % 0V C CERAMIC CHIP 22PF % 0V C CERAMIC CHIP 0.0uF 0% 2V C CERAMIC CHIP uf 0V C CERAMIC CHIP uf 0V C CERAMIC CHIP 220PF % 0V C CERAMIC CHIP 220PF % 0V C TANTAL. CHIP 22uF 20% 4V < CONNECTOR > CN CONNECTOR, FFC/FPC (ZIF) 3P CN CONNECTOR, FFC/FPC (ZIF) 0P < DIODE > D DIODE MA-(K8).S0 D DIODE MA830 D DIODE SS367-T3SONY D DIODE SS367-T3SONY < IC > IC IC S-8082ANNP-E72-T2 9
12 SRF-M MICROCOMPUTER Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark < SWITCH > IC IC S-8080ANNP-E70-T2 IC IC upd70gs-6-gjg IC IC S-8323A2MC-ELF-T2 < COIL > L INDUCTOR 00uH L INDUCTOR CHIP 00uH S SWITCH, TACTILE (HOLD) S SWITCH, TACTILE (POWER (AUTO OFF)) S SWITCH, TACTILE (MODE) S ENCODER, ROTARY (JOG) < TRANSFORMER > < TRANSISTOR > Q TRANSISTOR XN0 Q TRANSISTOR 2SD226J-R(TX).SO Q TRANSISTOR 2SD226J-R(TX).SO Q TRANSISTOR 2SB8B6B7.TB Q TRANSISTOR UN920J-(TX).SO Q TRANSISTOR 2SD226J-R(TX).SO Q TRANSISTOR 2SB462-Q < RESISTOR > R METAL CHIP 00K % /6W R METAL CHIP 4.7K % /6W R METAL CHIP M % /6W R METAL CHIP M % /6W R METAL CHIP 22K % /6W R METAL CHIP 0 % /6W R METAL CHIP 0 % /6W R METAL CHIP 00K % /6W R METAL CHIP K % /6W R METAL CHIP 47K % /6W T COIL, DC/DC CONVERTER < VIBRATOR > X VIBRATOR, CRYSTAL (7kHz) ************************************************************** MISCELLANEOUS ************* FLEXIBLE BOARD(B-B) FLEXIBLE BOARD(B-E) BATT BATTERY, PAS SECONDARY LCD DISPLAY PANEL, LIQUID CRYSTAL S ENCODER, ROTARY (JOG) ************************************************************** ACCESSORIES & PACKING MATERIALS ******************************** MANUAL, INSTRUCTION (ENGLISH, FRENCH, SPANISH, PORTUGUESE, CHINESE) MANUAL, INSTRUCTION (GERMAN, DUTCH, SWEDISH, ITALIAN, FINNISH)(AEP) HEADPHONE MDR-ED36 R RES,CHIP 0K % /6W R METAL CHIP 00K % /6W R RES,CHIP 0K % /6W R RES,CHIP 0K % /6W R METAL CHIP 00K % /6W R METAL CHIP K % /6W R METAL CHIP 4.7K % /6W R METAL CHIP 4.7K % /6W R METAL CHIP 4.7K % /6W R METAL CHIP M % /6W R METAL CHIP M % /6W R METAL CHIP 00K % /6W R METAL CHIP K % /6W R METAL CHIP K % /6W R METAL CHIP K % /6W R METAL CHIP 470K % /6W R METAL CHIP 470K % /6W R METAL CHIP 470K % /6W R METAL CHIP 470K % /6W R METAL CHIP M % /6W Sony Corporation Personal Audio Company 20 99I026- Printed in Japan Published by General Engineering Dept.
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