HCD-DX50/RG80 SERVICE MANUAL MINI HI-FI COMPONENT SYSTEM. Canadian Model. Australian Model E Model. Ver
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1 SERVICE MANUAL Ver Canadian Model HCD-RG80 Australian Model E Model HCD-DX50 HCD-DX50/RG80 are the tuner, deck, CD and amplifier section in MHC-DX50/RG80. Photo : HCD-DX50 Model Name Using Similar Mechanism NEW CD CD Mechanism Type CDM58E-30BD60 Section Base Unit Name BU-30BD60 Optical Pick-up Name A-MAX.3 Tape deck Model Name Using Similar Mechanism NEW Section Tape Transport Mechanism Type TCM-230PWR41C SPECIFICATIONS Continued on next page MINI HI-FI COMPONENT SYSTEM J Sony Corporation Home Audio Company Published by Sony Engineering Corporation
2 NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT The laser diode in the optical pick-up block may suffer electrostatic break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care. NOTES ON LASER DIODE EMISSION CHECK The laser beam on this model is concentrated so as to be focused on the disc reflective surface by the objective lens in the optical pickup block. Therefore, when checking the laser diode emission, observe from more than 30 cm away from the objective lens. Laser component in this product is capable of emitting radiation exceeding the limit for Class 1. This appliance is classified as a CLASS 1 LASER product. The CLASS 1 LASER PRODUCT MARKING is located on the rear exterior. CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure. Notes on chip component replacement Never reuse a disconnected chip component. Notice that the minus side of a tantalum capacitor may be damaged by heat. Flexible Circuit Board Repairing Keep the temperature of soldering iron around 270 C during repairing. Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). Be careful not to apply force on the conductor when soldering or unsoldering. SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. ATTENTION AU COMPOSANT AYANT RAPPORT À LA SÉCURITÉ! LES COMPOSANTS IDENTIFÉS PAR UNE MARQUE 0 SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE REMPLACER CES COMPOSANTS QUE PAR DES PIÈSES SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU DANS LES SUPPÉMENTS PUBLIÉS PAR SONY. 2
3 TABLE OF CONTENTS SAFETY CHECK-OUT After correcting the original service problem, perform the following safety checks before releasing the set to the customer: Check the antenna terminals, metal trim, metallized knobs, screws, and all other exposed metal parts for AC leakage. Check leakage as described below. LEAKAGE The AC leakage from any exposed metal part to earth ground and from all exposed metal parts to any exposed metal part having a return to chassis, must not exceed 0.5 ma (500 microampers). Leakage current can be measured by any one of three methods. 1. A commercial leakage tester, such as the Simpson 229 or RCA WT-540A. Follow the manufacturers instructions to use these instruments. 2. A battery-operated AC milliammeter. The Data Precision 245 digital multimeter is suitable for this job. 3. Measuring the voltage drop across a resistor by means of a VOM or battery-operated AC voltmeter. The limit indication is 0.75 V, so analog meters must have an accurate low-voltage scale. The Simpson 250 and Sanwa SH-63Trd are examples of a passive VOM that is suitable. Nearly all battery operated digital multimeters that have a 2V AC range are suitable. (See Fig. A) 0.15µF To Exposed Metal Parts on Set 1.5kΩ Earth Ground AC voltmeter (0.75V) Fig. A. Using an AC voltmeter to check AC leakage. 1. GENERAL 4 2. DISASSEMBLY 7 3. TEST MODE MECHANICAL ADJUSTMENTS ELECTRICAL ADJUSTMENTS DIAGRAMS 6-1. Circuit Board Location Block Diagrams Schematic Diagram Main Section (1/4) Schematic Diagram Main Section (2/4) Schematic Diagram Main Section (3/4) Schematic Diagram Main Section (4/4) Printed Wiring Board Main Section Schematic Diagram BD Section Printed Wiring Board BD Section Schematic Diagram AMP Section Printed Wiring Board AMP Section Schematic Diagram Panel Section Printed Wiring Board Panel Section Schematic Diagram Panel SW Section Printed Wiring Board Panel SW Section Schematic Diagram Leaf SW Section Printed Wiring Board Leaf SW Section Schematic Diagram Driver Section Printed Wiring Board Driver Section Schematic Diagram Trans Section Printed Wiring Board Trans Section Printed Wiring Board Switch Section IC Pin Function Description IC Block Diagrams EXPLODED VIEWS 7-1. Cabinet Section Front Panel Section Main Board Section Tape Mechanism Section-1 (TCM-230PWR41C) Tape Mechanism Section-2 (TCM-230PWR41C) CD Mechanism Deck Section (CDM58E-30BD60) Base Unit Section (BU-30BD60) ELECTRICAL PARTS LIST 54 MODEL IDENTIFICATION BACK PANEL PARTS No. MODEL DX50 : E, SP, AR models DX50 : KR, MX, AUS/RG80 models Abbreviation AUS : Australian model MX SP : Singapore model AR KR : Korea model PARTS No s s : Mexican model : Argentina model 3
4 SECTION 1 GENERAL This section is extracted from instruction manual. 4
5 5
6 6
7 SECTION 2 DISASSEMBLY HCD-DX50/RG80 The equipment can be removed using the following procedure. Set Upper case (Top) Loading panel assy Front panel section Panel board Base unit Sub trans board and Main trans board Main board and Power board Leaf SW board, Head (A) board and Head (B) board Driver board, Moter board and Address sensor board Note : Follow the disassembly procedure in the numerical order given UPPER CASE (TOP) q; 9 Four screws (+BVTP 3 12) Upper case (Top) 5 Two screws (Case) qa 7 Two screws q; 8 4 Side panel (R) 6 Screw (Case) Side panel (L) 3 Two screws 1 Two screws (Case) 2 Screw (Case) 7
8 2-2. LOADING PANEL ASSY Loading panel CD mechanism deck (CDM58E) 1 Turn the pulley to the direction of arrow. Front panel side pulley 3 2 Pull-out the disc tray FRONT PANEL SECTION CD mechanism deck (CDM58E) 5 1 Flat type wire (21 core) 4 Screw 2 Connector 6 Flat type wire (17 core) 8 Screws qf qd 7 Screws 3Screw 9 Connector qs Screw q; Connector Front panel section qa Two screws 8
9 2-4. PANEL BOARD 6 Four claws 7 CD Switch board qa Eight screws (+BVTP 2.6 8) qs Pad switch board 5 Four screws (+BVTP 2.6 8) 8 Nine screws (+BVTP 2.6 8) 9 Two claws q; Panel board 2 Nut 1 Knob (Volume) 4 Ring volume 3 Bracket ring qf Tape mechanism deck qd Five screws (+BVTP 2.6 8) 2-5. SUB TRANS BOARD AND MAIN TRANS BOARD qa Sensor board q; Screw 9 Back panel qd Switch board qs Screw (+BVTP 3 8) 1 Connector (CN973) 6 Main trans board 2 Connector (CN977) 4 Two screws (+BVTT 4 8) qg Sub trans board qf Three screws 3 Two screws (+BVTT 4 8) 8 Five screws 7 Two screws 5 Power transformer (T910) 9
10 2-6. MAIN BOARD AND POWER BOARD 4 Three screws 7 Heat sink 6 Two screws (+BVTT 3 8) Main board 5 Power board 3 Two screws (+BVTP 3 16) 2 Main board 1 Two screws 2-7. LEAF SW BOARD, HEAD (A) BOARD AND HEAD (B) BOARD 1 Five claws 2 Leaf SW board Remove the four solderings. 4 Head (A) board 3 Screw (+PTT 2 4) 6 Head (B) board 5 Screw (+PTT 2 4) 10
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