SPP-ID970/ID971 SERVICE MANUAL CORDLESS TELEPHONE. US Model SPP-ID970 Canadian Model SPP-ID971

Transcription

1 SPP-ID970/ID971 SERVICE MANUAL Ver With SUPPLEMENT-1 ( ) With SUPPLEMENT-2 ( ) US Model SPP-ID970 Canadian Model SPP-ID971 Photo: SPP-ID970 SPECIFICATIONS General Frequency band (SPP-ID970) MHz Frequency band (SPP-ID971) MHz Base unit : 18 µw Handset : 73 µw Operating channel 30 channels Dial signal Tone, 10 PPS (pulse) selectable Supplied accessories AC power adaptor AC-T127 (1) Telephone line cords (2) Wall bracket for base unit (1) Rechargeable battery pack BP-T23 (1) Handset Power source Rechargeable battery pack BP-T23 Battery life Standby : Approx. 7 days Talk : Approx. 6 hours Dimensions Approx mm (w/h/d), antenna excluded (approx. 2 3/ /16 inches) Antenna: Approx. 72 mm (approx. 2 7/8 inches) Mass Approx. 270 g (approx. 9.5 oz), battery included Base unit Power source DC 9V from AC power adaptor AC-T127 Battery charging time Approx. 12 hours Dimensions Approx mm (w/h/d), antenna excluded (approx. 4 7/8 2 1/2 8 7/8 inches) Antenna: Approx. 120 mm (approx. 4 3/4 inches) Mass Approx. 360 g (approx. 13 oz), wall bracket excluded Design and specifications are subject to change without notice. Notes on Chip Component Replacement Never reuse a disconnected chip component. Notice that the minus side of a tantalum capacitor may be damaged by heat. CORDLESS TELEPHONE MICROFILM 1

2 Note for Replacement of the ASIC Board The ID is written in the ASIC board. When replacing the ASIC board, the U2001 on BASE MAIN board and U1001 on HAND MAIN board should be replaced together as a pair. Part No. : X ASIC ASSY (one assy of two parts) HAND MAIN BOARD (SIDE B) BASE MAIN BOARD (SIDE A) U1001 U2001 TABLE OF CONTENTS 1. GENERAL Read This First... 3 Checking the Package Contents... 3 Setting Up the Base Unit... 3 Preparing the Battery Pack... 4 Entering the Area Code... 4 Identifying the Parts... 5 Making Calls... 6 Receiving Calls... 6 Phone Directory... 7 Setting the Ringer Type... 8 Paging... 9 Understanding the Caller ID Service... 9 Looking at the Caller ID List... 9 Using the Caller ID List Using Caller ID with Call Waiting Service Using Visual Message Waiting Service DISASSEMBLY 2-1. Case (Rear) RF Unit (HS), Hand Main Board Base (Bottom) Base Main Board RF Unit (BU) LED Board ELECTRICAL ADJUSTMENTS 3-1. Handset Base Unit DIAGRAMS 4-1. Block Diagram Base Unit Section Block Diagram Handset Section Schematic Diagram Base Unit Section (1/2) Schematic Diagram Base Unit Section (2/2) Printed Wiring Boards Base Unit Section Printed Wiring Board Handset Section Schematic Diagram Handset Section EXPLODED VIEWS 5-1. Handset Section Base Unit Section ELECTRICAL PARTS LIST

3 SECTION 1 GENERAL This section is extracted from SPP-ID970 s instruction manual. 3

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12 Note : This set can be disassemble according to the following sequence. Note : Follow the disassembly procedure in the numerical order given CASE (REAR) SECTION 2 DISASSEMBLY HANDSET CASE (REAR) RF UNIT (HS), HAND MAIN BOARD BASE UNIT BASE (BOTTOM) BASE MAIN BOARD RF UNIT (BU) LED BOARD 8 9 case (rear) 2 battery case lid (HS) claw BTP 3x RF UNIT (HS), HAND MAIN BOARD antenna (ANT1001) 1 BTP 3x12 8 RF unit (HS) 2 B 2x8 4 B 2x6 5 B 2x6 battery terminals 3 BTP 3x12 9 Removal the solders. qa HAND MAIN board 7 Removal the solders. 6 VOL knob (HS) 0 Removal the solders. charge terminals 12

13 2-3. BASE (BOTTOM) 2 BTP 3x12 6 base (bottom) 3 BTP 3x12 1 BTP 3x BASE MAIN BOARD 3 BTP 3x12 4 Removal the solders. 2 BTP 3x12 1 screws (3x30) 7 BASE MAIN board 5 Removal the solders. charge springs 6 Removal the solders. 13

14 2-5. RF UNIT (BU) 1 BTP 3x12 3 B 2x8 lug 2 BTP 3x12 4 RF unit (BU) 2-6. LED BOARD 1 BTP 3x12 2 LED board 14

15 SECTION 3 ELECTRICAL ADJUSTMENTS 3-1. HANDSET 1. Test Mode Entry Press PGM key and enter TEST on keypad. Alternative entry Write 99h into LSB of location 9 in EEPROM. Exit Press on OFF key. LCD test Press the 7 key. Toggle TX power Press the 0 key. Increment RF channel Press the # key. * * 2. Test Equipment Required and Connection HAND MAIN BOARD C1029 C1031 RF UNIT (HS) J1003 J1 BATTERY 3.6V U1001 C1030 J1004 frequency counter 3. Verify Procedure Item 18.4MHz Frequency Error Remark Connect the frequency counter to the test point J1, press 0 key to turn on the TX power. Then, check the frequency ± 1 khz. If the result is within ± 1 khz, then no adjustment required. Otherwise, refer to item 4. for Adjustment Procedure. 4. Adjustment Procedure Item Adjustment Element Remark 18.4MHz Frequency Error C Remove C1031 from the HAND MAIN board. 2. Solder an 20PF chip capacitor C1030 ( ) on the HAND MAIN board (in parallel of C1029). 3. Connect the frequency counter to the test point J1. Adjust for 0 Hz ± 1 khz. 15

16 3-2. BASE UNIT 1. Test Mode Entry Simultaneously press the HANDSET LOCATOR key and toggle the DIAL MODE switch. When in test mode, the LINE and CHARGE LEDs will be light on. Alternative entry Write 99h into LSB of location 9 in EEPROM. Exit Remove the AC power adaptor. Toggle TX power DIAL MODE switch (S2001) T (TONE) position : TX ON P (PULSE) position : TX OFF Increment RF channel Press the HANDSET LOCATOR key. 2. Test Equipment Required and Connection frequency counter BASE MAIN BOARD (SIDE B) BASE MAIN BOARD (SIDE A) RF UNIT (BU) J1 U2001 C2017 C2015 C Verify Procedure Item 18.4MHz Frequency Error Remark Connect the frequency counter to the test point J1, press 0 key to turn on the TX power. Then, check the frequency ± 1 khz. If the result is within ± 1 khz, then no adjustment required. Otherwise, refer to item 4. for Adjustment Procedure. 4. Adjustment Procedure Item Adjustment Element Remark 18.4MHz Frequency Error C Remove C2017 from the BASE MAIN board. 2. Solder an 20PF chip capacitor C2016 ( ) on the BASE MAIN board (in parallel of C2015). 3. Connect the frequency counter to the test point J1. Adjust for 0 Hz ± 1 khz. 16

17 SECTION 4 DIAGRAMS SPP-ID970/ID BLOCK DIAGRAM BASE UNIT SECTION ANT2001 TELESCOPIC ANTENNA RF UNIT (BU) SYSTEM CONTROL U2001 D RX AUDIO 4 TX DATA 10 PLL REF 1 RSSI 5 PLL EN 9 SER DATA OUT 8 SER CLK DSIN TXDATA PLL REF APIN2 GPIO2/MONO2 APO 83 AON 84 P T1001 HOOK DET U1002 J1008 LINE RX PWR 3 TX PWR 11 RF POWER CONTROL Q2001 EEPROM U2002 CS SK DI DO GPIO5/TST1 63 SCLK 62 SOUT 59 SIN AIN 90 ADIN GPIO3/MON3 P AMP U1003 REG Q2003 X MHz 48 XTAL2 49 XTAL1 FSK 89 S2001 DIAL MODE T P 56 GPIO4/TST0 P6.0 3 D5 LINE 3.2V P6.1 4 D4 CHARGE P6.2 5 D2 MESSAGES J1001 DC IN 9V! REG U1001 5V 74 VBAT 76 REG CTRL P6.3 6 D1 NEW CALL CHARGE TERMINAL J1003 J1004 POWER CONTROL Q V 2 DVCC1 78 AVCC1 P5.4 P S1 HANDSET LOCATOR Q1007 HANDSET CHARGE Q1006 CHARGE DET Q P1.3 Signal Path : TX (To Tel Line) 04 : RX (From Tel Line) : bell 17 18

18 SPP-ID970/ID BLOCK DIAGRAM HANDSET SECTION ANT1001 HELICAL ANTENNA RF UNIT (HS) SYSTEM CONTROL U1001 PLL REF 1 RX AUDIO 4 TX DATA 10 RSSI 5 PLL EN 9 SER DATA OUT 8 SER CLK 7 64 PLL REF 67 DSIN 68 TXDATA 79 ADIN2 58 GPIO2/MON2 APO 83 AON 84 RINGER 86 RINGER OUT Q1009 U1005 SPEAKER U1002 BUZZER RX PWR 3 RF POWER CONTROL Q1006 EEPROM U1006 CS SK DI DO GPIO5/TST1 63 SCLK 62 SOUT 59 SIN AIN 90 (LCD/KEY PAD BACK-LIGHT) U1003 MIC TX PWR 11 RF POWER CONTROL Q1007 X MHz 48 XTAL2 49 XTAL1 P LED DRIVE Q1002 LCD1001 LCD MODULE 56 GPIO4/TST0 57 GPIO3/MON3 RECHARGEABLE BATTERY BP-T23 DC 3.6V J1003 J1004 REG U V H M L S103 VOL S102 (ROTARY ENCODER) 80 ADIN1 13 P P P1.4 P6.0 P6.1 P6.2 P6.3 P1.5 P1.6 P LCD DB LCD DB5 LCD DB6 LCD DB7 LCD E LCD R/W LCD RS 3.1V J1001 D1003,1004 REG Q1010,1012 POWER CONTROL Q DVCC1 78 AVCC1 CHARGE TERMINAL J1002 CHARGE DET Q REG CTRL 11 P1.0 P I I P ROW0-ROW4 KEY MATRIX S1004-S P4.0 I P I 39 COL0-COL4 Signal Path : TX (To Tel Line) : RX (From Tel Line) : bell 19 20

19 SPP-ID970/ID971 THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS. (In addition to this, the necessary note is printed in each block.) 4-3. SCHEMATIC DIAGRAM BASE UNIT SECTION (1/2) For schematic diagrams All capacitors are in µf unless otherwise noted. pf: µµf 50 WV or less are not indicated except for electrolytics and tantalums. All resistors are in Ω and 1 /4 W or less unless otherwise specified. C : panel designation. U : B+ Line. Power voltage is dc 9 V and fed with regulated dc power supply from external power voltage jack. (BASE UNIT) Power voltage is dc 12 V and fed with regulated dc power supply from J1006 with 100 Ω in series. (BASE UNIT) Power voltage is dc 3 V and fed with regulated dc power supply from battery terminal. (HANDSET) Voltage is dc with respect to ground under no-signal condition. : Impossible to measure Voltages are taken with a VOM (Input impedance 10 MΩ). Voltage variations may be noted due to normal production tolerances. Signal path. N : TX (To Tel Line) O : RX (From Tel Line) P : bell (Page 23) For printed wiring boards X : parts extracted from the component side. : Carbon pattern. z : Through hole. b : Pattern from the side which enables seeing. (The other layer s patterns are not indicated.) Caution: Pattern face side: Parts on the pattern face side seen from the (Side B) pattern face are indicated. Parts face side: Parts on the parts face side seen from the (Side A) parts face are indicated

20 SPP-ID970/ID SCHEMATIC DIAGRAM BASE UNIT SECTION (2/2) Refer to page 31 for IC Block Diagram. (Page 22) 23 24

21 SPP-ID970/ID PRINTED WIRING BOARDS BASE UNIT SECTION Semiconductor Location Ref. No. Location (D1006) B-2 (D1007) B-3 (D1008) B-3 (D1009) B-3 (D1010) B-2 D1011 E-2 D1012 E-1 D1015 D-1 D1016 D-1 D2001 Q1006 F-1 (Q1007) I-2 Q1008 F-1 Q2001 F-5 Q2003 F-6 (U1001) D-3 (U1002) C-3 U1003 E-1 U2001 G-4 U2002 G-6 U2003 F-4 ( ) : SIDE B 25 26

22 SPP-ID970/ID PRINTED WIRING BOARD HANDSET SECTION Semiconductor Location Ref. No. Location (D1001) A-8 (D1002) C-8 (D1003) A-7 (D1004) A-8 (D1006) B-8 D1008 A-4 D1010 B-4 D1016 A-6 D1018 B-6 (D1020) A-3 D1023 A-2 D1024 B-2 D1025 B-2 D1026 B-2 D1027 A-2 D1028 B-2 (D1030) B-6 (D1031) A-7 D1032 C-2 D1033 C-2 (Q1002) B-3 (Q1004) A-6 (Q1006) B-1 (Q1007) B-1 (Q1008) A-7 (Q1009) B-7 (Q1010) A-6 (Q1012) A-7 (U1001) B-4 (U1006) A-2 (U1007) C-1 ( ) : SIDE B 27 28

23 SPP-ID970/ID SCHEMATIC DIAGRAM HANDSET SECTION Refer to page 31 for IC Block Diagram

24 Ver SECTION 5 EXPLODED VIEWS IC Block Diagram CS SK DI 3 DO 4 U1006, 2002 CAT93C86S-LE10 1 INSTRUCTION 8 2 DECODER, CONTROL LOGIC AND CLOCK GENERATORS INSTRUCTION REGISTER ADDRESS REGISTER DECODER IOF 1024 (or 2048) DATA OUT BUFFER EEPROM ARRAY BIT & (1024X16) or (2048X8) READ WRITE AMPS DATA IN/OUT RESISTER 16 (or 8) BITS HIGH VOLTAGE GENERATOR AND PROGRAM TIMER VCC 7 NC 6 ORG 5 VSS NOTE: The mechanical parts with no reference number in the exploded views are not supplied. Items marked * are not stocked since they are seldom required for routine service. Some delay should be anticipated when ordering these items HANDSET SECTION 15 U XX and -X mean standardized parts, so they may have some difference from the original one. Color Indication of Appearance Parts Example : KNOB, BALANCE (WHITE)... (RED) R R Parts Color Cabinet s Color 7 8 ANT Accessories and packing materials are given in the last of this parts list U J1003, J1001, LCD Ref. No. Part No. Description Remark KEY (HS), RUBBER (ID970) KEY (HS), RUBBER (ID971) HAND FRONT (ID970) HAND FRONT (ID971) RUBBER, MICROPHONE LENS (HS) HOLDER (HS), LCD RING, CUSHION RECEIVER CUSHION, SPEAKER 8 A A RF UNIT (HS) Ref. No. Part No. Description Remark KNOB (HS), VOL FELT, RX * 16 A A HAND MAIN BOARD, COMPLETE (ID970) * 16 A A HAND MAIN BOARD, COMPLETE (ID971) DIFFUSER (HS) SHEET COVER (HS), HOOK ANT ANTENNA J TERMINAL, CHARGE J TERMINAL, CHARGE SCREW +BTP 3X12 TYPE2 N-S CASE (REAR) (HAND) LID (HS), BATTERY CASE SCREW, TAPPING (BIND 2X8) SCREW, TAPPING (BIND 2X6) J TERMINAL, BATTERY J TERMINAL, BATTERY LCD LCD MODULE U MICROPHONE, ELECTRET CONDENSER U SPEAKER (2.8cm)

25 Ver BASE UNIT SECTION ANT J1003, Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark * 51 A A BASE MAIN BOARD, COMPLETE SCREW +BTP 3X12 TYPE2 N-S TERMINAL BOARD, ANTENNA BASE, STUD SCREW (3X30) BASE (TOP) (ID970) BASE (TOP) (ID971) PLATE, ANTENNA RETAINER KNOB, TP SW BASE (BOTTOM) (ID970) SCREW, TAPPING (BIND 2X8) 57 A A RF UNIT (BU) * LED BOARD KEY, PAGE BASE, LENS BASE (BOTTOM) (ID971) FOOT, RUBBER ANT ANTENNA J SPRING, CHARGE J SPRING, CHARGE HOOK 33

26 BASE MAIN NOTE: Due to standardization, replacements in the parts list may be different from the parts specified in the diagrams or the components used on the set. -XX and -X mean standardized parts, so they may have some difference from the original one. RESISTORS All resistors are in ohms. METAL:Metal-film resistor. METAL OXIDE: Metal oxide-film resistor. F:nonflammable SECTION 6 ELECTRICAL PARTS LIST Items marked * are not stocked since they are seldom required for routine service. Some delay should be anticipated when ordering these items. SEMICONDUCTORS In each case, u : µ, for example: ua.. : µa.. upa.. : µpa.. upb.. : µpb.. upc.. : µpc.. upd.. : µpd.. CAPACITORS uf : µf COILS uh : µh The components identified by mark 0 or dotted line with mark 0 are critical for safety. Replace only with part number specified. Les composants identifiés par une marque 0 sont critiques pour la sécurité. Ne les remplacer que par une piéce portant le numéro spécifié. When indicating parts by reference number, please include the board. Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark * A A BASE MAIN BOARD, COMPLETE ************************** < CAPACITOR > C ELECT 100uF 20% 25V C ELECT 100uF 20% 16V C CERAMIC 100PF 5% 50V C CERAMIC 100PF 5% 50V C CERAMIC CHIP 2.2uF 10% 10V C CERAMIC CHIP 0.047uF 10% 16V C CERAMIC CHIP uF 10% 50V C CERAMIC CHIP 0.1uF 10% 16V C CERAMIC CHIP 0.1uF 10% 16V C CERAMIC CHIP uF 10% 50V C CERAMIC CHIP 33PF 5% 16V C CERAMIC CHIP uF 10% 16V C CERAMIC CHIP 100PF 5% 50V C CERAMIC CHIP 33PF 5% 16V C CERAMIC CHIP uF 10% 16V C CERAMIC CHIP 0.001uF 10% 50V C CERAMIC CHIP 0.1uF 10% 16V C ELECT 4.7uF 20% 50V C CERAMIC CHIP 0.1uF 10% 16V C CERAMIC CHIP 0.1uF 10% 16V C CERAMIC CHIP 0.1uF 10% 16V C CERAMIC CHIP 0.1uF 10% 16V C CERAMIC CHIP 0.1uF 10% 16V C CERAMIC CHIP 0.1uF 10% 16V C CERAMIC CHIP 0.1uF 10% 16V C CERAMIC CHIP 0.1uF 10% 16V C ELECT 22uF 10% 10V C TANTALUM CHIP 10uF 20% 4V C TANTALUM CHIP 10uF 20% 4V C CERAMIC CHIP 1uF 10V C CERAMIC CHIP 1uF 10V C CERAMIC CHIP 0.001uF 10% 50V C CERAMIC CHIP 0.001uF 10% 50V C CERAMIC CHIP 0.001uF 10% 50V C CERAMIC CHIP 100PF 5% 50V C CERAMIC CHIP 0.1uF 10% 16V C CERAMIC CHIP 22PF 5% 50V C CERAMIC CHIP 0.022uF 10% 25V C CERAMIC CHIP 0.022uF 10% 25V C CERAMIC CHIP 0.047uF 10% 2KV C CERAMIC CHIP 0.047uF 10% 16V C CERAMIC CHIP 22PF 5% 50V C CERAMIC CHIP 0.1uF 10% 16V C ELECT 10uF 20% 6.3V C CERAMIC CHIP 0.1uF 10% 16V C CERAMIC CHIP 0.1uF 10% 16V C CERAMIC CHIP 0.1uF 10% 16V C CERAMIC CHIP 0.1uF 10% 16V C ELECT 10uF 20% 50V C CERAMIC CHIP 0.1uF 10% 16V C CERAMIC CHIP 22PF 5% 50V C CERAMIC CHIP 0.022uF 10% 25V C CERAMIC CHIP 18PF 5% 50V C CERAMIC CHIP 470PF 10% 50V C ELECT 10uF 20% 50V C CERAMIC CHIP 0.1uF 10% 16V C CERAMIC CHIP 0.001uF 10% 50V C CERAMIC CHIP 7PF 0.5PF 50V C CERAMIC CHIP 10PF 0.5PF 50V < DIODE > D VARISTOR D DIODE U05G D DIODE U05G D DIODE U05G D DIODE U05G D DIODE BAV99 D DIODE BAV99 D DIODE BAV99 D DIODE BAV99 D DIODE BB555 < JACK > J JACK, DC (DC IN 9V) J JACK, MODULAR 2P (LINE) < COIL > L MICRO INDUCTOR 10uH L MICRO INDUCTOR 10uH L MICRO INDUCTOR 10uH L MICRO INDUCTOR 10uH L MICRO INDUCTOR 10uH < TRANSISTOR > Q TRANSISTOR MMBT3904LT1 34

27 BASE MAIN HAND MAIN Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark Q TRANSISTOR 2N3906 Q TRANSISTOR MMBT3904LT1 Q TRANSISTOR MMBT3906LT1 Q TRANSISTOR SST297AT116 < RESISTOR > R METAL CHIP 47K 5% 1/16W R METAL CHIP 10K 5% 1/16W R RES,CHIP 2K 5% 1/16W R METAL CHIP 8.2 5% 1/10W R METAL CHIP 10K 5% 1/16W R METAL CHIP 10K 5% 1/16W R METAL CHIP 2.2K 5% 1/16W R METAL CHIP 100K 5% 1/16W R METAL CHIP 560 5% 1/16W R METAL CHIP 820 5% 1/16W R RES,CHIP 20K 5% 1/16W R METAL CHIP 1K 5% 1/16W R METAL CHIP 10K 5% 1/16W R METAL CHIP 220K 5% 1/16W R METAL CHIP 120K 5% 1/16W R RES,CHIP 20K 5% 1/16W R METAL CHIP 10K 5% 1/16W R METAL CHIP 10K 5% 1/16W R METAL CHIP 0 5% 1/16W R METAL CHIP 0 5% 1/16W R METAL CHIP 15K 5% 1/16W R METAL CHIP 2.2M 5% 1/16W < SWITCH > S SWITCH, SLIDE (DIAL MODE) R METAL CHIP 180 5% 1/16W R METAL CHIP 180 5% 1/16W R RES,CHIP 9.1K 5% 1/16W R METAL CHIP 22K 5% 1/16W R RES,CHIP 20K 5% 1/16W R RES,CHIP 20K 5% 1/16W R METAL CHIP 10K 5% 1/16W R METAL CHIP 10M 5% 1/16W R CARBON 2.2M 5% 1/4W R METAL CHIP 10M 5% 1/16W R METAL CHIP 10M 5% 1/16W R CARBON 2.2M 5% 1/4W R METAL CHIP 10M 5% 1/16W R RES,CHIP 1.6M 5% 1/16W R RES,CHIP 1.6M 5% 1/16W R METAL CHIP 10K 5% 1/16W R METAL CHIP 10K 5% 1/16W R METAL CHIP 180K 5% 1/16W R METAL CHIP 100K 5% 1/16W R METAL CHIP 10M 5% 1/16W R METAL CHIP 10M 5% 1/16W R METAL CHIP 1M 5% 1/16W R METAL CHIP 1M 5% 1/16W R METAL CHIP 10K 5% 1/16W R METAL CHIP 10K 5% 1/16W R RES,CHIP 300 5% 1/16W R METAL CHIP 220 5% 1/16W R METAL CHIP 220 5% 1/16W R METAL CHIP 220 5% 1/16W R METAL CHIP 220 5% 1/16W R METAL CHIP 1.5K 5% 1/16W R METAL CHIP 10K 5% 1/16W R METAL CHIP 0 5% 1/16W R RES,CHIP 62K 1% 1/10W R RES,CHIP 300K 1% 1/10W R RES,CHIP 62K 1% 1/10W R METAL CHIP 47K 5% 1/16W < LINE TRANSFORMER > T TRANSFORMER, LINE < IC > U IC MC78M05CDT U PHOTO COUPLER TLP627 U IC NJM2902M U2001 X ASIC ASSY (ASIC BOARD, COMPLETE) U IC CAT93C86S-LE10 U IC LP29811M5-3.0 < FUSE > W FUSE (250mA/250V) < VIBRATOR > X VIBRATOR, CRYSTAL (18.4MHz) ************************************************************* * A A HAND MAIN BOARD, COMPLETE (ID970) * A A HAND MAIN BOARD, COMPLETE (ID971) *************************** < CAPACITOR > C CERAMIC CHIP 0.001uF 10% 50V C CERAMIC CHIP 0.01uF 10% 25V C CERAMIC CHIP 0.1uF 10% 16V C CERAMIC CHIP 0.1uF 10% 16V C CERAMIC CHIP 1uF 16V C CERAMIC CHIP 0.01uF 10% 25V C CERAMIC CHIP 1uF 16V C CERAMIC CHIP 0.1uF 10% 16V C CERAMIC CHIP 0.33uF 10% 16V C TANTALUM CHIP 10uF 20% 4V C CERAMIC CHIP 0.1uF 10% 16V C CERAMIC CHIP 0.1uF 10% 16V C CERAMIC CHIP 22PF 5% 50V 35

28 HAND MAIN Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark C CERAMIC CHIP 0.022uF 10% 25V C CERAMIC CHIP 18PF 5% 50V C CERAMIC CHIP 0.1uF 10% 16V C TANTALUM CHIP 10uF 20% 4V C CERAMIC CHIP 0.1uF 10% 16V Q TRANSISTOR MMBT3906LT1 Q TRANSISTOR MMBT3906LT1 Q1008 T TRANSISTOR MMBT3904LT1 Q1009 T TRANSISTOR MMBT3904LT1 Q TRANSISTOR MMST2907A C CERAMIC CHIP 470PF 10% 50V C CERAMIC CHIP 0.1uF 10% 16V C CERAMIC CHIP 0.001uF 10% 50V C CERAMIC CHIP 0.1uF 10% 16V C TANTALUM CHIP 10uF 20% 4V C CERAMIC CHIP 10PF 0.5PF 50V C CERAMIC CHIP 7PF 0.5PF 50V C CERAMIC CHIP 0.001uF 10% 50V C CERAMIC CHIP 0.1uF 10% 16V C CERAMIC CHIP 0.1uF 10% 16V C TANTALUM CHIP 4.7uF 20% 6.3V C TANTALUM CHIP 4.7uF 20% 6.3V C CERAMIC CHIP 0.1uF 10% 16V C CERAMIC CHIP 0.1uF 10% 16V C CERAMIC CHIP 0.1uF 10% 16V C CERAMIC CHIP 0.1uF 10% 16V C CERAMIC CHIP 0.1uF 10% 16V C ELECT 10uF 10% 16V C ELECT 10uF 10% 16V C ELECT 22uF 10% 10V C CERAMIC CHIP 0.001uF 10% 50V C CERAMIC CHIP 0.047uF 10% 16V < DIODE > D VARISTOR D VARISTOR D DIODE BAV99 D DIODE BAV99 D DIODE BAS16 D LED MS31D (ID971) D LED MS31D (ID971) D LED MS31D (ID971) D LED MS31D (ID971) D DIODE BB555 D LED SML-310MTT86 D LED SML-310MTT86 D LED SML-310MTT86 D LED SML-310MTT86 D LED SML-310MTT86 D LED SML-310MTT86 D DIODE BAS16 D DIODE PDZ5.1B-115 D LED SML-310MTT86 D LED SML-310MTT86 < TRANSISTOR > Q TRANSISTOR MMBT3906LT1 Q TRANSISTOR MMST2907A Q TRANSISTOR MMBT2222ALT1 < RESISTOR > R METAL CHIP 10K 5% 1/16W R METAL CHIP 10K 5% 1/16W R METAL CHIP 470K 5% 1/16W R METAL CHIP 470K 5% 1/16W R METAL CHIP 560 5% 1/16W R RES,CHIP 18 5% 1/8W R METAL CHIP 560 5% 1/16W R METAL CHIP 39 5% 1/16W R METAL CHIP 39 5% 1/16W R RES,CHIP 18 5% 1/16W (ID971) R METAL CHIP 3.3K 5% 1/16W R RES,CHIP 24K 5% 1/8W R METAL CHIP 301K 0.50% 1/16W R RES,CHIP 62K 1% 1/10W R METAL CHIP 10K 5% 1/16W R RES,CHIP 62K 1% 1/10W R RES,CHIP 200K 5% 1/16W R METAL CHIP 100K 5% 1/16W R METAL CHIP 47K 5% 1/16W R RES,CHIP 20K 5% 1/16W R METAL CHIP 1K 5% 1/16W R METAL CHIP 120K 5% 1/16W R METAL CHIP 2.2M 5% 1/16W R METAL CHIP 10K 5% 1/16W R RES,CHIP 20K 5% 1/16W R RES,CHIP 24K 5% 1/8W R METAL CHIP 10K 5% 1/16W R RES,CHIP 24K 5% 1/8W R METAL CHIP 10K 5% 1/16W R METAL CHIP 18K 5% 1/16W R RES,CHIP 2K 5% 1/16W R RES,CHIP 51K 5% 1/16W R METAL CHIP 100K 5% 1/16W R METAL CHIP 1K 5% 1/16W R METAL CHIP 10K 5% 1/16W R METAL CHIP 1K 5% 1/16W R METAL CHIP 390K 5% 1/16W R RES,CHIP 51 5% 1/16W R METAL CHIP 100K 5% 1/16W R METAL CHIP 0 5% 1/16W R METAL CHIP 15K 5% 1/16W R METAL CHIP 0 5% 1/16W R METAL CHIP 220K 5% 1/16W 36

29 HAND MAIN LED Ref. No. Part No. Description Remark < SWITCH > S ENCODER, ROTARY S SWITCH, SLIDE (VOL) < IC > U1001 X ASIC ASSY (ASIC BOARD, COMPLETE) U BUZZER U MICROPHONE, ELECTRET CONDENSER U SPEAKER (2.8cm) U IC CAT93C86S-LE10 U IC LP29811M5-3.0 < VIBRATOR > X VIBRATOR, CRYSTAL (18.4MHz) ************************************************************* * LED BOARD ********** < DIODE > D LED SLB-25VR3F (NEW CALL) D LED SLB-25VR3F (MESSAGES) D LED SLR-342VR3F (CHARGE) D LED SLR-342MGT32 (LINE) < SWITCH > S SWITCH, KEY BOARD (HANDSET LOCATOR) ************************************************************* MISCELLANEOUS *************** 8 A A RF UNIT (HS) (HANDSET) 57 A A RF UNIT (BU) (BASE UNIT) ANT ANTENNA (HANDSET) ANT ANTENNA (BASE UNIT) LCD LCD MODULE (HANDSET) ************************************************************* ACCESSORIES & PACKING MATERIALS ******************************** ADAPTOR, AC (AC-T127) BATTERY PACK (BP-T23) CORD (WITH MODULAR PLUG) (LINE) (215cm) CORD (WITH MODULAR PLUG) (LINE) (15cm) CASE (WALL HOOK) MANUAL, INSTRUCTION (ENGLISH,SPANISH) (ID970) MANUAL, INSTRUCTION (ENGLISH,FRENCH) (ID971) GUIDE, QUICK START (ENGLISH,SPANISH) (ID970) GUIDE, QUICK START (ENGLISH,FRENCH) (ID971) 37 The components identified by mark 0 or dotted line with mark 0 are critical for safety. Replace only with part number specified. Les composants identifiés par une marque 0 sont critiques pour la sécurité. Ne les remplacer que par une piéce portant le numéro spécifié.

30 SPP-ID970/ID Sony Corporation Personal Audio Division Company 38 99K Printed in Japan Published by General Engineering Dept.

31 SPP-ID970/ID971 SERVICE MANUAL US Model SPP-ID970 Canadian Model SPP-ID971 Ver SUPPLEMENT-1 File this supplement with the service manual. Subject : 1. Correction 2. Hand main board change (ECN-CPE00044, ECN-CPA00314) 1. Correction 1-1. ELECTRICAL PARTS LIST The ASIC MOUNT and EEPROM have two versions. In service, check the version before replacing parts. How to identify the version : The A6 version has the label indicating 493A P-23 attached on each ASIC MOUNT of the HAND SET and BASE UNIT. Page INCORRECT CORRECT (TYPE-1: Version A4) CORRECT (TYPE-2: Version A6) Ref. No. Part No. Description Remark U2001 X ASIC ASSY (ASIC BOARD, COMPLETE) U CAT93C86S-LE10 U2002 U1001 X ASIC ASSY (ASIC BOARD, COMPLETE) U CAT93C86S-LE10 U1006 Part No. Description Remark A A ASIC MOUNT BASE (ASIC BOARD, COMPLETE) X EEPROM ASSY (ID971) X EEPROM ASSY (ID970) A A ASIC MOUNT HAND (ASIC BOARD, COMPLETE) X EEPROM ASSY (ID971) X EEPROM ASSY (ID970) Part No. Description Remark A A ASIC MOUNT (ID970 BASE2) (ASIC BOARD, COMPLETE) X EEPROM ASSY A A ASIC MOUNT (ID970 HAND2) (ASIC BOARD, COMPLETE) X EEPROM ASSY Note : The ID cord is written in the EEPROM. When replacing the EEPROM, U2002 on the BASE MAIN board and U1006 on HAND MAIN board should be replaced together as a pair.

32 1-2. ELECTRICAL ADJUSTMENTS 1) Frequency Tables This section outlines the RF frequencies and corresponding channel numbers. The handset uses a high side LO while the base uses a low side LO to down-convert the incoming signal. 1. Handset Frequencies (Unit : MHz) Channel Transmit Receive RX LO Base Unit Frequencies (Unit : MHz) Channel Transmit Receive RX LO

33 2) HANDSET 1. Test Mode Entry Press PGM key and enter TEST on keypad. Alternative entry Write 99h into LSB of location 9 in EEPROM. Exit Press on OFF key. LCD test Press the 7 key. Toggle TX power Press the 0 key. Increment RF channel Press the # key. * * 2. Test Equipment Required and Connection 3) BASE UNIT 1. Test Mode Entry Simultaneously press the HANDSET LOCATOR key and toggle the DIAL MODE switch. When in test mode, the LINE and CHARGE LEDs will be light on. Alternative entry Write 99h into LSB of location 9 in EEPROM. Exit Remove the AC power adaptor. Toggle TX power DIAL MODE switch (S2001) T (TONE) position : TX ON P (PULSE) position : TX OFF Increment RF channel Press the HANDSET LOCATOR key. 2. Test Equipment Required and Connection HAND MAIN BOARD C1029 C1030 RF UNIT (HS) J pin BATTERY 3.6V U1001 C1031 J1 frequency counter RF UNIT (BU) BASE MAIN BOARD (SIDE B) BASE MAIN BOARD (SIDE A) frequency counter J1 J1004 frequency counter frequency counter U Verify Procedure Item 18.4MHz Frequency Error Remark Connect the frequency counter to the test point J1, press 0 key to turn on the TX power. Then, check the frequency ± 1 khz. If the result is within ± 1 khz, then no adjustment required. Otherwise, refer to item 4. for Adjustment Procedure. 4. Adjustment Procedure Item Adjustment Element Remark 18.4MHz Frequency Error C Remove C1031 from the HAND MAIN board. 2. Solder an 20PF chip capacitor C1030 ( ) on the HAND MAIN board (in parallel of C1029). 3. Connect the frequency counter to the U1001 pin rk. Adjust for 0 Hz ± 1 khz. 3. Verify Procedure Item 18.4MHz Frequency Error Remark Connect the frequency counter to the test point J1, press 0 key to turn on the TX power. Then, check the frequency ± 1 khz. If the result is within ± 1 khz, then no adjustment required. Otherwise, refer to item 4. for Adjustment Procedure. 4. Adjustment Procedure Item Adjustment Element Remark 18.4MHz Frequency Error C Remove C2017 from the BASE MAIN board. 2. Solder an 20PF chip capacitor C2016 ( ) on the BASE MAIN board (in parallel of C2015). 3. Connect the frequency counter to the U2001 pin rk. Adjust for 0 Hz ± 1 khz. C pin C2017 C

34 SPP-ID970/ID Hand Main Board Change 2-1. PRINTED WIRING BOARD HANDSET SECTION A HAND MAIN BOARD (SIDE A) S1003 VOL H M L J B LCD1001 LCD MODULE 1 2 D1023 S1019 FLASH S1013 3/DEF S1016 6/MNO S1010 9/WXYZ S1007 S1004 REDIAL C D E ANT1001 HELICAL ANTENNA U1005 SPEAKER RF UNIT(HS) RED BLK 11 1 D1024 D1025 D1033 D1027 D1026 D1028 D1032 D ,1032,1033 (LCD BACK LIGHT) S1020 OFF S1021 TALK S1022 TALK D1008 (ID971) D1010 (ID971) S1014 2/ABC S S1017 5/JKL S1018 4/GHI D1008,1010,1016,1018 (KEY PAD BACK LIGHT) D1018 D1016 S1011 8/TUV (ID971) (ID971) S1012 (ID971) 7/PQRS S1008 0/OPER S1009 /TONE S1006 PGM S1005 PAUSE F G H I Semiconductor Location Ref. No. Location D1001 I-12 D1002 G-12 D1003 I-3 D1004 I-12 D1006 H-12 (D1008) B-7 (D1010) D-7 (D1016) B-9 (D1018) D-9 D1020 I-6 D1023 B-4 D1024 C-4 D1025 C-4 D1026 C-4 D1027 B-4 D1028 C-4 D1030 H-10 D1032 D-4 D1033 D-4 Q1002 G-6 Q1004 H-10 Q1006 G-4 Q1007 H-3 Q1008 I-11 Q1009 I-11 Q1010 H-10 Q1014 H-11 HAND MAIN BOARD (SIDE B) C1041 C1040 C1012 C1022 R1037 C1051 Q1007 C1050 C1038 R1057 R1058 R1060 C1039 R1065 R1064 U Q1006 R R1009 R1010 A S1002 ROTARY ENCODER R1032 R1067 C1027 U B R1084 R R1033 R1066 Q1002 X1001 (ID971) C1006 R1014 R1008 C1024 C1052 C1047 C1048 R1044 C1031 D1020 C1030 (ADJ) C1029 C C1025 R1039 C1026 R1041 C1015 U1001 R1079 C R C1017 R1035 C1018 R1036 C C1049 R1031 C1019 C1043 C1014 C1013 Q1004 C1020 R1073 C1005 C1016 R1026 RECHARGEABLE BATTERY BP-T23 DC3.6V R1025 D1030 Q1010 Q1014 R1091 J1004 BAT- R1083 R1090 J1003 BAT+ R1004 Q1008 R1001 C1054 C1011 R1068 R1022 R1021 C1009 Q1009 R1089 C1001 C1002 R1003 R1002 C1053 C1004 C1003 D1004 D1006 D1001 D1002 J1002 CHARGE TERMINAL J1001 CHARGE TERMINAL U1003 MIC U1002 BUZZER J U1001 H-8 U1006 I-5 U1007 G-7 ( ) : ID D

35 SPP-ID970/ID SCHEMATIC DIAGRAM HANDSET SECTION For printed wiring boards X : parts extracted from the component side. : Carbon pattern. z : Through hole. b : Pattern from the side which enables seeing. (The other layer s patterns are not indicated.) Caution: Pattern face side: Parts on the pattern face side seen from the (Side B) pattern face are indicated. Parts face side: Parts on the parts face side seen from the (Side A) parts face are indicated. For schematic diagrams All capacitors are in µf unless otherwise noted. pf: µµf 50 WV or less are not indicated except for electrolytics and tantalums. All resistors are in Ω and 1 /4 W or less unless otherwise specified. C : panel designation. U : B+ Line. Power voltage is dc 3.6 V and fed with regulated dc power supply from battery terminal. (HANDSET) 7 8 Voltage is dc with respect to ground under no-signal condition. : Impossible to measure Voltages are taken with a VOM (Input impedance 10 MΩ). Voltage variations may be noted due to normal production tolerances. Signal path. N : TX (To Tel Line) O : RX (From Tel Line) P : bell

36 HAND MAIN SPP-ID970/ID971 HAND MAIN 2-3. ELECTRICAL PARTS LIST NOTE: Due to standardization, replacements in the parts list may be different from the parts specified in the diagrams or the components used on the set. -XX and -X mean standardized parts, so they may have some difference from the original one. RESISTORS All resistors are in ohms. METAL:Metal-film resistor. METAL OXIDE: Metal oxide-film resistor. F:nonflammable Items marked * are not stocked since they are seldom required for routine service. Some delay should be anticipated when ordering these items. SEMICONDUCTORS In each case, u : µ, for example: ua.. : µa.. upa.. : µpa.. upb.. : µpb.. upc.. : µpc.. upd.. : µpd.. CAPACITORS uf : µf COILS uh : µh When indicating parts by reference number, please include the board. Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark * A A HAND MAIN BOARD, COMPLETE (ID970) * A A HAND MAIN BOARD, COMPLETE (ID971) *************************** < CAPACITOR > C CERAMIC CHIP 0.001uF 10% 50V C CERAMIC CHIP 0.01uF 10% 25V C CERAMIC CHIP 0.1uF 10% 16V C CERAMIC CHIP 0.1uF 10% 16V C CERAMIC CHIP 1uF 16V C CERAMIC CHIP 0.01uF 10% 25V C CERAMIC CHIP 1uF 16V C CERAMIC CHIP 0.1uF 10% 16V C CERAMIC CHIP 0.33uF 10% 16V C TANTALUM CHIP 10uF 20% 4V C CERAMIC CHIP 0.1uF 10% 16V C CERAMIC CHIP 0.1uF 10% 16V C CERAMIC CHIP 22PF 5% 50V C CERAMIC CHIP 0.022uF 10% 25V C CERAMIC CHIP 18PF 5% 50V C CERAMIC CHIP 0.1uF 10% 16V C TANTALUM CHIP 10uF 20% 4V C CERAMIC CHIP 0.1uF 10% 16V C CERAMIC CHIP 470PF 10% 50V C CERAMIC CHIP 0.1uF 10% 16V C CERAMIC CHIP 0.001uF 10% 50V C CERAMIC CHIP 0.1uF 10% 16V C TANTALUM CHIP 10uF 20% 4V C CERAMIC CHIP 10PF 0.5PF 50V C CERAMIC CHIP 7PF 0.5PF 50V C CERAMIC CHIP 20PF 5% 50V (ADJ) C CERAMIC CHIP 0.001uF 10% 50V C CERAMIC CHIP 0.1uF 10% 16V C CERAMIC CHIP 0.1uF 10% 16V C TANTALUM CHIP 4.7uF 20% 6.3V C TANTALUM CHIP 4.7uF 20% 6.3V C CERAMIC CHIP 0.1uF 10% 16V C CERAMIC CHIP 0.1uF 10% 16V C CERAMIC CHIP 0.1uF 10% 16V C CERAMIC CHIP 0.1uF 10% 16V C CERAMIC CHIP 0.1uF 10% 16V C ELECT 10uF 10% 16V C ELECT 10uF 10% 16V C ELECT 22uF 10% 10V C CERAMIC CHIP 0.001uF 10% 50V C CERAMIC CHIP 0.047uF 10% 16V < DIODE > D VARISTOR D VARISTOR D DIODE BAV99 D DIODE BAV99 D DIODE BAS16 D LED MS31D (ID971) D LED MS31D (ID971) D LED MS31D (ID971) D LED MS31D (ID971) D DIODE BB555 D LED SML-310MTT86 D LED SML-310MTT86 D LED SML-310MTT86 D LED SML-310MTT86 D LED SML-310MTT86 D LED SML-310MTT86 D DIODE BAS16 D LED SML-310MTT86 D LED SML-310MTT86 < TRANSISTOR > Q TRANSISTOR MMBT3906LT1 Q TRANSISTOR MMST2907A Q TRANSISTOR MMBT3906LT1 Q TRANSISTOR MMBT3906LT1 Q1008 T TRANSISTOR MMBT3904LT1 Q1009 T TRANSISTOR MMBT3904LT1 Q TRANSISTOR MMST2907A Q TRANSISTOR MMBT3906LT1 < RESISTOR > R METAL CHIP 10K 5% 1/16W R METAL CHIP 10K 5% 1/16W R METAL CHIP 470K 5% 1/16W R METAL CHIP 470K 5% 1/16W R METAL CHIP 560 5% 1/16W R METAL CHIP 39 5% 1/16W R METAL CHIP 39 5% 1/16W R RES,CHIP 18 5% 1/16W (ID971) R METAL CHIP 3.3K 5% 1/16W Ref. No. Part No. Description Remark R RES,CHIP 24K 5% 1/8W R METAL CHIP 301K 0.50% 1/16W R RES,CHIP 62K 1% 1/10W R METAL CHIP 10K 5% 1/16W R RES,CHIP 62K 1% 1/10W R RES,CHIP 200K 5% 1/16W R METAL CHIP 100K 5% 1/16W R METAL CHIP 47K 5% 1/16W R RES,CHIP 20K 5% 1/16W R METAL CHIP 1K 5% 1/16W R METAL CHIP 120K 5% 1/16W R METAL CHIP 2.2M 5% 1/16W R METAL CHIP 10K 5% 1/16W R RES,CHIP 20K 5% 1/16W R RES,CHIP 24K 5% 1/8W R METAL CHIP 10K 5% 1/16W R RES,CHIP 24K 5% 1/8W R METAL CHIP 10K 5% 1/16W R METAL CHIP 18K 5% 1/16W R RES,CHIP 2K 5% 1/16W R RES,CHIP 51K 5% 1/16W R METAL CHIP 100K 5% 1/16W R METAL CHIP 1K 5% 1/16W R RES,CHIP 51 5% 1/16W R METAL CHIP 0 5% 1/16W R METAL CHIP 15K 5% 1/16W R METAL CHIP 0 5% 1/16W R METAL CHIP 15 5% 1/8W R METAL CHIP 130 5% 1/16W R METAL CHIP 910 5% 1/16W < SWITCH > S ENCODER, ROTARY S SWITCH, SLIDE (VOL) Sony Corporation Audio Entertainment Group 9 10 < IC > U1001 A A ASIC MOUNT HAND (ASIC BOARD, COMPLETE) (VER.A4) U1001 A A ASIC MOUNT (ID970 HAND2) (ASIC BOARD, COMPLETE) (VER.A6) U BUZZER U MICROPHONE, ELECTRET CONDENSER U SPEAKER (2.8cm) U1006 X EEPROM ASSY (ID971) (VER.A4) U1006 X EEPROM ASSY (ID970) (VER.A4) U1006 X EEPROM ASSY (VER.A6) U IC LP29811M5-3.0 < VIBRATOR > X VIBRATOR, CRYSTAL (18.4MHz) 2000G Printed in Japan Published by PE General Engineering Dept.

37 SPP-ID970/ID971 SERVICE MANUAL Ver SUPPLEMENT-2 File this supplement with the service manual. Subject : Change of Base Main Board (ECN-CPE00320) Printed wiring boards and schematic diagram of new type, and changed parts list are described in this supplement-2. Refer to original service manual ( ) previously issued for the other information. When performing service and inspection, check the suffix of the part number of the main, relay and display boards. DISCRIMINATION US Model SPP-ID970 Canadian Model SPP-ID971 THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS. (In addition to this, the necessary note is printed in each block.) For schematic diagrams All capacitors are in µf unless otherwise noted. pf: µµf 50 WV or less are not indicated except for electrolytics and tantalums. All resistors are in Ω and 1 /4 W or less unless otherwise specified. C : panel designation. U : B+ Line. Power voltage is dc 9 V and fed with regulated dc power supply from external power voltage jack. (BASE UNIT) Power voltage is dc 12 V and fed with regulated dc power supply from J1006 with 100 Ω in series. (BASE UNIT) Voltage is dc with respect to ground under no-signal condition. : Impossible to measure Voltages are taken with a VOM (Input impedance 10 MΩ). Voltage variations may be noted due to normal production tolerances. Signal path. N : TX (To Tel Line) O : RX (From Tel Line) P : bell For printed wiring boards X : parts extracted from the component side. z : Through hole. : Pattern from the side which enables seeing. (The other layer s patterns are not indicated.) Caution: Pattern face side: Parts on the pattern face side seen from the (Side B) pattern face are indicated. Parts face side: Parts on the parts face side seen from the (Side A) parts face are indicated. - BASE MAIN BOARD (SIDE A) - U2001 BASE MAIN Board Part No. Former type : New type :

38 SPP-ID970/ID PRINTED WIRING BOARD BASE UNIT SECTION Refer to page 2 for Note A B C D E Semiconductor Location Ref. No. Location Ref. No. Location (Q1007) G-13 Q1008 H-8 Q2001 C-8 Q2003 C-9 (D1006) G-4 (D1007) F-4 (D1008) F-4 (D1009) F-4 (D1010) F-4 D1011 G-7 D1012 G-7 D1015 H-6 D1016 H-6 D2001 B-11 Q1006 H-9 ( ) : SIDE B (U1001) F-7 (U1002) F-5 U1003 G-7 U2001 C-10 U2002 B-10 U2003 D-8 BASE MAIN BOARD (SIDE A) C2001 R R2035 C2009 C2008 C2006 R R2025 R2020 R2019 C2030 C2012 C2007 U2002 R2018 Q C2028 C Q2001 R2009 R2010 C2027 R2011 R2021 C2010 R2034 U C C2037 C2003 R2015 C2026 C2020 C2031 U C2018 R2026 R2030 C2013 R2038 D2001 C2034 C2014 R2028 C2017 C2021 C2029 R2004 R2001 R2003 R2005 R2032 C2015 R2037 F G H R1020 C1030 C1013 R1049 R1022 D1011 D1012 R1048 R1026 C1025 C1012 C1009 R1046 R1025 C1027 R R1023 R1053 C1010 R1021 C1026 R1063 C1029 C1040 C1028 R1016 R1024 R1017 R1052 R1011 R1012 C1005 D1016 R1037 R1059 C1015 Q1008 C1023 C C1014 Q1006 R1039 R1036 R1027 R1050 R1038 R1043 R1028 R1019 R1018 R1055 C1035 C1034 D1015 R1042 C1033 U1003 C1032 R I 3 4

39 SPP-ID970/ID A S2001 DIAL MODE P T C2011 BASE MAIN BOARD (SIDE B) C2019 C2023 J ANT2001 TELESCOPIC ANTENNA B J TX PWR LED BOARD X2001 RX AUDIO C2024 RF UNIT (BU) C 1 ATE RX 1 GND ATE TX DSP PWR PX PWR D CHARGE TERMINAL Q1007 C2039 C1007 L1003 J1003 C2004 MCU PWR U V C1004 C1031 C1001 T1001 R1044 R1045 U1002 R1033 R1029 C1022 C1021 L1001 D1009 D1007 D1008 D1010 C1017 D1006 W1001 L1005 L1006 GND J1001 DC IN 9V! J1006 LINE E F G C1006 J1004 C1018 R1062 R1035 R1061 R1032 H 04 L1004 CHG ATE

40 SPP-ID970/ID SCHEMATIC DIAGRAM BASE UNIT SECTION (1/2) Refer to page 2 for Note. 7 8

41 SPP-ID970/ID SCHEMATIC DIAGRAM BASE UNIT SECTION (2/2) Refer to page 2 for Note. 9 10

42 3. ELECTRICAL PARTS LIST NOTE: Due to standardization, replacements in the parts list may be different from the parts specified in the diagrams or the components used on the set. -XX and -X mean standardized parts, so they may have some difference from the original one. RESISTORS All resistors are in ohms. METAL:Metal-film resistor. METAL OXIDE: Metal oxide-film resistor. F:nonflammable Items marked * are not stocked since they are seldom required for routine service. Some delay should be anticipated when ordering these items. SEMICONDUCTORS In each case, u : µ, for example: ua.. : µa.. upa.. : µpa.. upb.. : µpb.. upc.. : µpc.. upd.. : µpd.. CAPACITORS uf : µf COILS uh : µh When indicating parts by reference number, please include the board. Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark * A A BASE MAIN BOARD, COMPLETE ************************** < CAPACITOR > C ELECT 100uF 20% 25V C ELECT 100uF 20% 16V C CERAMIC CHIP 0.01uF 50V C CERAMIC 100PF 5% 50V C CERAMIC 100PF 5% 50V C CERAMIC CHIP 2.2uF 10% 10V C CERAMIC CHIP 0.047uF 10% 16V C CERAMIC CHIP uF 10% 50V C CERAMIC CHIP 0.1uF 10% 16V C CERAMIC CHIP 0.1uF 10% 16V C CERAMIC CHIP uF 10% 25V C CERAMIC uF 10% 2KV C CERAMIC 100PF 10% 50V C CERAMIC uF 10% 2KV C CERAMIC 100PF 10% 50V C CERAMIC CHIP 0.1uF 10% 16V C CERAMIC CHIP 47PF 5% 50V C CERAMIC CHIP 0.022uF 10% 25V C CERAMIC CHIP 0.022uF 10% 25V C CERAMIC CHIP 0.015uF 10% 25V C CERAMIC CHIP 0.1uF 25V C CERAMIC CHIP 47PF 5% 50V C CERAMIC CHIP 0.1uF 10% 16V C ELECT 10uF 20% 6.3V C CERAMIC CHIP 0.1uF 10% 16V C CERAMIC CHIP 0.1uF 10% 16V C CERAMIC CHIP 100PF 5% 50V C CERAMIC CHIP 100PF 5% 50V C CERAMIC CHIP 0.1uF 10% 16V C CERAMIC CHIP 0.1uF 10% 16V C CERAMIC CHIP 0.001uF 10% 50V C CERAMIC CHIP 2.4PF 16V C CERAMIC CHIP 15PF 5% 50V C CERAMIC CHIP 0.001uF 10% 50V C CERAMIC CHIP 0.1uF 10% 16V C ELECT 4.7uF 20% 50V C CERAMIC CHIP 0.1uF 10% 16V C CERAMIC CHIP 0.1uF 10% 16V C ELECT 10uF 20% 50V C ELECT 10uF 20% 50V C CERAMIC CHIP 0.1uF 10% 16V C CERAMIC CHIP 0.1uF 10% 16V C CERAMIC CHIP 0.1uF 10% 16V C CERAMIC CHIP 0.1uF 10% 16V C CERAMIC CHIP 0.1uF 10% 16V C CERAMIC CHIP 0.1uF 10% 16V C ELECT 22uF 20% 10V C CERAMIC CHIP 1uF 10V C CERAMIC CHIP 1uF 10V C CERAMIC 100PF 10% 50V < VARISTOR > D VARISTOR < DIODE > D DIODE U05G D DIODE U05G D DIODE U05G D DIODE U05G D DIODE BAV99 D DIODE BAV99 D DIODE BAV99 D DIODE BAV99 D DIODE BB555 BASE MAIN SPP-ID970/ID971 BASE MAIN Ref. No. Part No. Description Remark < TRANSISTOR > Q1006 T TRANSISTOR MMBT3904LT1 Q TRANSISTOR 2N3906 Q1008 T TRANSISTOR MMBT3904LT1 Q TRANSISTOR MMBT3906LT1 Q TRANSISTOR SST297AT116 < RESISTOR > R RES-CHIP 30K 5% 1/16W R METAL CHIP 8.2K 5% 1/16W R RES-CHIP 7.5K 5% 1/16W R METAL CHIP 10K 5% 1/16W R METAL CHIP 10K 5% 1/16W R METAL CHIP 2.2K 5% 1/16W R METAL CHIP 100K 5% 1/16W R METAL CHIP 560 5% 1/16W R METAL CHIP 820 5% 1/16W R RES-CHIP 240 5% 1/16W R RES-CHIP 240 5% 1/16W R METAL CHIP 4.7K 5% 1/16W R METAL CHIP 27K 5% 1/16W R RES-CHIP 24K 5% 1/16W R METAL CHIP 10K 5% 1/16W R METAL CHIP 10K 5% 1/16W R CARBON 470K 5% 1/2W R CARBON 5.1M 5% 1/4W R CARBON 470K 5% 1/2W R CARBON 5.1M 5% 1/4W R METAL CHIP 330K 5% 1/16W R METAL CHIP 330K 5% 1/16W R METAL CHIP 18K 5% 1/16W R METAL CHIP 10K 5% 1/16W R RES-CHIP 62K 1% 1/10W R METAL CHIP 100K 5% 1/16W R METAL 10M 10% 1/4W R METAL 10M 10% 1/4W R RES-CHIP 1.2M 5% 1/16W R RES-CHIP 1.2M 5% 1/16W R METAL CHIP 18K 5% 1/16W R METAL CHIP 10K 5% 1/16W R RES-CHIP 300 5% 1/16W R RES-CHIP 430 5% 1/16W R METAL CHIP 2.7K 5% 1/16W R METAL CHIP 0 5% 1/16W R RES-CHIP 16K 5% 1/16W R CARBON 5.1M 5% 1/4W R CARBON 5.1M 5% 1/4W R RES-CHIP 43K 5% 1/16W Ref. No. Part No. Description Remark R METAL CHIP 1.5K 5% 1/16W R METAL CHIP 10K 5% 1/16W R METAL CHIP 0 5% 1/16W R RES-CHIP 62K 1% 1/10W R METAL CHIP 301K 0.5% 1/16W R RES-CHIP 62K 1% 1/10W R METAL CHIP 47K 5% 1/16W R RES-CHIP 20K 5% 1/16W R METAL CHIP 1K 5% 1/16W R METAL CHIP 10K 5% 1/16W R METAL CHIP 2.2M 5% 1/16W R METAL CHIP 120K 5% 1/16W R RES-CHIP 20K 5% 1/16W R METAL CHIP 10K 5% 1/16W R METAL CHIP 10K 5% 1/16W R METAL CHIP 2.2 5% 1/16W R METAL CHIP 15K 5% 1/16W R RES-CHIP 200 5% 1/16W R METAL CHIP 0 5% 1/16W < SWITCH > S SWITCH, SLIDE (DIAL MODE) < TRANSFORMER > T TRANSFORMER, LINE < IC > U IC MC78M05CDT U IC LM324M * U2001 A A ASIC MOUNT (ID970 BASE2) U2002 X EEPROM ASSY U IC LP29811M5-3.0 < PHOTO COUPLER > U PHOTO COUPLER TLP627 < FUSE > W FUSE (250mA/250V) < VIBRATOR > X VIBRATOR, CRYSTAL(18.4MHz) C CERAMIC CHIP 0.1uF 10% 16V C CERAMIC CHIP 0.1uF 10% 16V C ELECT 10uF 20% 50V C CERAMIC CHIP 0.1uF 10% 16V C CERAMIC CHIP 22PF 5% 50V C CERAMIC CHIP 0.022uF 10% 25V C CERAMIC CHIP 18PF 5% 50V C CERAMIC CHIP 470PF 10% 50V C ELECT 10uF 20% 50V C CERAMIC CHIP 0.1uF 10% 16V < JACK > J JACK, DC (DC IN 9V) J JACK, MODULAR 2P (LINE) < COIL > L INDUCTOR 10uH L INDUCTOR 10uH L INDUCTOR 10uH L INDUCTOR 10uH L INDUCTOR 10uH R METAL CHIP 220 5% 1/16W R METAL CHIP 220 5% 1/16W R METAL CHIP 220 5% 1/16W R METAL CHIP 220 5% 1/16W Sony Corporation Audio Entertainment Group J Printed in Japan Published by General Engineering Dept.