Optocoupler, Phototransistor Output, with Base Connection, 300 V BV CEO

Transcription

1 SFH64 Optocoupler, Phototransistor Output, with Base Connection, 3 V BV CEO i DESCRIPTION The SFH64 is an optocoupler with very high BV CER, a minimum of 3 V. It is intended for telecommunications applications or any DC application requiring a high blocking voltage. A C NC B C E FEATURES Good CTR linearity with forward current Low CTR degradation Very high collector emitter breakdown voltage, BV CER = 3 V Isolation test voltage: 3 V RMS Low coupling capacitance High common mode transient immunity Phototransistor optocoupler 6 pin DIP package with base connection Compliant to RoHS Directive 22/9/EC and in accordance to WEEE 22/96/EC AGENCY APPROVALS UL177, file no. E2744 system code H or J, double protection DIN EN (VDE 884) available with option 1 CSA 9371 BSI IEC 69; IEC 66 ORDERING INFORMATION S F H # X # # T DIP PART NUMBER CTR BIN PACKAGE OPTION TAPE AND REEL 7.62 mm Option 7 Option 9 AGENCY CERTIFIED/PACKAGE CTR (%) 1 ma UL, CSA, BSI 63 to 12 1 to 2 DIP-6 SFH64-2 SFH64-3 SMD-6, option 7 SFH64-2X7 SFH64-3X7T (1) VDE, UL, CSA, BSI 63 to 12 1 to 2 SMD-6, option 9 - SFH64-3X19T (1) Notes Additional options may be possible, please contact sales office. (1) Also available in tubes, do not put T on the end. >.7 mm >.1 mm ABSOLUTE MAXIMUM RATINGS (T amb = 2 C, unless otherwise specified) PARAMETER TEST CONDITION SYMBOL VALUE UNIT INPUT Reverse voltage V R 6. V DC forward current I F 6 ma Surge forward current t p 1 μs I FSM 2. A Total power dissipation P diss 1 mw Rev. 1., 8-Sep-11 1 Document Number: ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT

2 SFH64 ABSOLUTE MAXIMUM RATINGS (T amb = 2 C, unless otherwise specified) PARAMETER TEST CONDITION SYMBOL VALUE UNIT OUTPUT Collector emitter voltage V CEO 3 V Collector base voltage V CBO 3 V Emitter base voltage V EBO 7. V Collector current I C ma Surge collector current t p 1 ms I C 1 ma Total power dissipation P diss 3 mw COUPLER Isolation test voltage between emitter and detector Isolation resistance 3 V RMS V ISO 7 V PK V IO = V, T amb = 2 C R IO 1 12 V IO = V, T amb = 1 C R IO 1 11 Insulation thickness between emitter and detector.4 mm Creepage distance 7 mm Clearance distance 7 mm Comparative tracking index per DIN IEC 112/VDE 33, part 1 CTI 17 Storage temperature range T stg - to + 1 C Operating temperature range T amb - to + 1 C Soldering temperature (1) max. 1 s, dip soldering: distance to seating plane 1. mm T sld 26 C Notes Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. Functional operation of the device is not implied at these or any other conditions in excess of those given in the operational sections of this document. Exposure to absolute maximum ratings for extended periods of the time can adversely affect reliability. (1) Refer to reflow profile for soldering conditions for surface mounted devices (SMD). Refer to wave profile for soldering conditions for through hole devices (DIP). ELECTRICAL CHARACTERISTICS (T amb = 2 C, unless otherwise specified) PARAMETER TEST CONDITION PART SYMBOL MIN. TYP. MAX. UNIT INPUT Forward voltage I F = 1 ma V V V Reverse voltage I R = 1 μa V R 6 V Reverse current V R = 6 V I R.1 1 μa Capacitance V F = V, f = 1 MHz C O 2 pf Thermal resistance R thja 7 K/W OUTPUT Collector emitter breakdown voltage I CE = 1 ma, R BE = 1 M BV CER 3 V Voltage emitter base I EB = 1 μa BV BEO 7 V Collector emitter capacitance V CE = 1 V, f = 1 MHz C CE 7 pf Collector base capacitance V CB = 1 V, f = 1 MHz C CB 8 pf Emitter base capacitance V EB = V, f = 1 MHz C EB 38 pf Thermal resistance R thja 2 K/W COUPLER Coupling capacitance C C.6 pf Saturation voltage collector I F = 1 ma, I C = 3.2 ma SFH64-2 V CEsat.2.4 V emitter I F = 1 ma, I C = ma SFH64-3 V CEsat.2.4 V Collector emitter leakage current V CE = 2 V, R BE = 1 M I CER 1 1 na Note Minimum and maximum values are testing requirements. Typical values are characteristics of the device and are the result of engineering evaluation. Typical values are for information only and are not part of the testing requirements. Rev. 1., 8-Sep-11 2 Document Number: ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT

3 SFH64 CURRENT TRANSFER RATIO (T amb = 2 C, unless otherwise specified) PARAMETER TEST CONDITION PART SYMBOL MIN. TYP. MAX. UNIT I F = 1 ma, V CE = 1 V SFH64-2 I C /I F % Current transfer ratio I F = 1 ma, V CE = 1 V SFH64-2 I C /I F 22 4 % I F = 1 ma, V CE = 1 V SFH64-3 I C /I F 1 2 % I F = 1 ma, V CE = 1 V SFH64-3 I C /I F 34 7 % SWITCHING CHARACTERISTICS (T amb = 2 C, unless otherwise specified) PARAMETER TEST CONDITION SYMBOL MIN. TYP. MAX. UNIT Turn-on time I C = 2 ma, R L = 1, V CC = 1 V t on μs Rise time I C = 2 ma, R L = 1, V CC = 1 V t r 2. μs Turn-off time I C = 2 ma, R L = 1, V CC = 1 V t off 6 μs Fall time I C = 2 ma, R L = 1, V CC = 1 V t f. μs TYPICAL CHARACTERISTICS (T amb = 2 C, unless otherwise specified) I F R L I C V CC V CE = 1 V 1 normalized to I F = 1 ma, NCTR = f (I F ) NCTR 3 47 Ω 1 isfh64_1a I F /A isfh64_2 Fig. 1 - Switching Times Measurement Test Circuit and Waveform Fig. 3 - Current Transfer Ratio (typ.) Input pulse 1.2 V V F = f (I F, T A ) I/ F ºC ºC 7 ºC 1 % 9 % t r t f Output pulse 1. t on t off isfh64_1b I F ma 1 2 isfh64_3 Fig. 2 - Switching Times Measurement Test Circuit and Waveform Fig. 4 - Diode Forward Voltage (typ.) Rev. 1., 8-Sep-11 3 Document Number: ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT

4 SFH I CE = f(v CE, I B ) / B = 1 µa / B = 8 µa 7. / B = 6 µa / B = 4 µa 2. / B = 2 µa V CE /V isfh64_4 I CE /ma Fig. - Output Characteristics (typ.) P tot /mw I F =, R BE = 1. MW, I CER = f(v CE ) V CE /V isfh64_7 Fig. 8 - Collector-Emitter Leakage Current (typ.) I CE /ma 3 I CE = f(v CE, I F ) 2 2 / F = 2mA 1 / F = 16mA 1 / F = 14mA / F = 12mA / F = 1mA V CE /V isfh64_ I F /ma 1 9 I F = f (T A ) T A /º C isfh64_8 Fig. 6 - Output Characteristics (typ.) Fig. 9 - Permissible Loss Diode C XX /pf C CE C EB C CB f = 1. MHz, I CE = f(v CE ) C CB = f(v CB ), C EB = f(v EB ) V XX /V isfh64_6 P tot /mw 4 P IOT = 3 f (T A ) Transistor 1 1 Diode T A /º C isfh64_9 Fig. 7 - Transistor Capacitances (typ.) Fig. 1 - Permissible Power Dissipation Rev. 1., 8-Sep-11 4 Document Number: ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT

5 SFH64 PACKAGE DIMENSIONS in millimeters Pin one ID 6.4 ± ISO method A 8.6 ±.1 1 min. 1.2 ± typ. 3. ±.2 4 typ..8 min ±. i1784. ±..8 ±. 3 to 9.2 typ to typ. Option typ. Option ref..7 8 min. 8.4 min min..3 typ. 1 max. 1.3 max R R min min Rev. 1., 8-Sep-11 Document Number: ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT

6 VISHAY DIP-6A DIP-6A Package Dimensions in Inches (mm) pin one ID.248 (6.3).26 (6.) 4 6 ISO Method A.39 (1.) Min..33 (8.).343 (8.7).48 (.4).22 (.).13 (3.3).1 (3.81).3 (7.62) typ. 4 typ..18 (.4).22 (.).31 (.8) min..31 (.8).3 (.9).1 (2.4) typ (.2) typ ( ).114 (2.9).13 (3.) i1784 Document Number Rev. 1.1, 1-Dec-3 1

7 DIP-6A VISHAY Ozone Depleting Substances Policy Statement It is the policy of Vishay Semiconductor GmbH to 1. Meet all present and future national and international statutory requirements. 2. Regularly and continuously improve the performance of our products, processes, distribution and operatingsystems with respect to their impact on the health and safety of our employees and the public, as well as their impact on the environment. It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as ozone depleting substances (ODSs). The Montreal Protocol (1987) and its London Amendments (199) intend to severely restrict the use of ODSs and forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban on these substances. Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the use of ODSs listed in the following documents. 1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively 2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 199 by the Environmental Protection Agency (EPA) in the USA 3. Council Decision 88/4/EEC and 91/69/EEC Annex A, B and C (transitional substances) respectively. Vishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain such substances. We reserve the right to make changes to improve technical design and may do so without further notice. Parameters can vary in different applications. All operating parameters must be validated for each customer application by the customer. Should the buyer use products for any unintended or unauthorized application, the buyer shall indemnify against all claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal damage, injury or death associated with such unintended or unauthorized use. Vishay Semiconductor GmbH, P.O.B. 33, D-742 Heilbronn, Germany Telephone: 49 () , Fax number: 49 () Document Number Rev. 1.1, 1-Dec-3

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