High Power UV LED. Product Specification. Approval Sheet. Updated on 2018/01/15. Lextar.com. PU88S01 UV Emitter Product Specification

Transcription

1 Lextar.com High Power UV LED Updated on 2018/01/15 Approval Sheet PU88S01 UV Emitter

2 Product Part Number Customer UV 3535 Emitter PU88S01 Issue Date 2015/6/1 Feature 3W UV LED Emitter Compact dimensions: 3.45 mm 3.45 mm 2.10 mm Dice Technology : AlGaN View angle: = 125 High power operation Low thermal resistance Environmental friendly ; RoHS compliance Applications UV curing Counterfeit banknote detection Photo catalytic purification MAKER CUSTOMER Prepared Checked Approved Taichi Wang Vincent Chuang KH Shen

3 Outline Dimension PU88S01 UV Emitter Outline Dimension *. Tolerance:±0.15mm

4 Performance PU88S01 UV Emitter Opto-Electrical Characteristics Parameter Symbol Condition Min. Typ. Max. Unit Forward Voltage* (1) V F I F = 500mA V Wavelength* (2) W P I F = 500mA nm Thermal Resistance* (3) R th I F = 500mA /W View Angle θ I F = 500mA deg Reverse Current I R V R = 5V 10 μ A 365nm Radiant Power* (4) P O I F = 500mA 385nm nm mw 405nm (1).The Forward Voltage tolerance is ±0.1V (2).Peak Wavelength tolerance is ±3nm (3).Thermal resistance is calculated from junction to solder (4).The Radiant Power tolerance ±10% Absolute Maximum Ratings Parameter Symbol Rating Unit DC Forward Current I F 700 ma Surge Forward Current* (1) I FS 1000 ma ESD V ESD 8000 V Power Dissipation P d 3.10 W Soldering Temperature* (2) T S 260 Junction Temperature T J 120 Storage Temperature T Stg -40~+100 Operation Temperature T Op -30~+85 o C o C o C o C (1) Frequency Duty<10%, t p =100μ s. (2) JEDEC STD-020 latest version compliant. (3) Proper current rating must be observed to maintain junction temperature below Tj max.

5 Binning Binning PU88S01 UVA Emitter PU88S01 UVA Emitter Wavelength Rank (Ta=25 ) W P Rank Min. Max. Unit Condition U nm I F =500mA U nm I F =500mA U nm I F =500mA U nm I F =500mA Radiant Power Rank (Ta=25 ) P O Rank Min. Max. Unit Condition mw I F =500mA mw I F =500mA mw I F =500mA mw I F =500mA mw I F =500mA mw I F =500mA mw I F =500mA mw I F =500mA mw I F =500mA mw I F =500mA Forward Voltage Rank (Ta=25 ) V F Rank Min. Max. Unit Condition V I F =500mA V I F =500mA V I F =500mA V I F =500mA V I F =500mA Bin code definition (for example) Wp Rank P O Rank V F Rank U

6 Relative luminous intensity Forward voltager (V) No. 3, Gongye E. 3rd Road, Hsinchu Science Park, Hsinchu 30075, Taiwan Characteristics Relative Radiant Flux vs. Forward Current PU88S01 UV Emitter Relative Spectral Distribution vs. Wavelength at 25, I F =500mA Forward Current vs. Forward Voltage at 25 4 Relative radiant flux vs. Ambient Temperature ,000 Forward current (ma) Ambient Temperature vs. Allowable forward current Directivity Angle (degree)

7 Packing PEX1N01 PU88S01 UV V0 1W Emitter Emitter Label Lextar Q ty : 500 Bin code : K1CA1 Vendor lot : LED OEM\ODM vendor lot no M/N : Packing process Regent-XM Lextar P/N : SMT P/N Q ty : 500 Lot No. : SMT lot no Bin code : K1CA1 Vendor lot : LED OEM\ODM vendor lot no M/N : PD1**** Silica gel Q ty : 500 Lextar Bin code : K1CA1 Vendor lot : LED OEM\ODM vendor lot no M/N : PD1****

8 Carrier dimensions Orientation: UNIT:mm Symbol Ao Bo Ko Po P1 P2 T Spec 3.72± ± ± ± ± ± ±0.10 Symbol E F Do D1 W 10Po -- Spec 1.75± ± ± ± ± ± USER REEL DIRECTION 7 inch Anti-Static Reel Max 500pcs/reel Min 200pcs/reel

9 Small Box Medium Box Large Box

10 Temperature ( C) No. 3, Gongye E. 3rd Road, Hsinchu Science Park, Hsinchu 30075, Taiwan Application Notes PU88S01 UV Emitter Soldering PAD Design Recommended Reflow Soldering Profile (JEDEC-STD-020 latest version compliant) Ramp-up 20 sec TP 260 C TL 217 C Tsmax 200 C Ramp-down Tsmin 150 C sec tl (Soldering) 25 C 60 ~ 120 sec ts (Preheat) Time (sec)

11 Profile Items Conditions Preheat -Temperature Min.( T Smin ) -Temperature Max.( T Smax ) -Time(Min. to Max.)( t S ) 150 C 200 C 90±30 sec Soldering Zone -Temperature(T L ) -Time 217 C 60~100 sec Peak Temperature(T P ) 260 C Ramp-up rate Ramp-down rate 3 C / sec max. 3~6 C / sec Note: 1. One time soldering is recommended; do not exceed 3 times reflow process. 2. The recommended peak temperature is 245 C. The maximum soldering temperature should be controlled under 260 C.