No. 3, Gongye E. 3rd Road, Hsinchu Science Park, Hsinchu 30075, Taiwan TEL: Lextar.com PB04H07.0. Product Specification

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1 Lextar.com PB04H07.0 Product Specification

2 Approval Sheet PB04H07.0 Product Specification Product Model Name COB PB04H07.0 Issue Date 2015/11 Features White COB LED (13.5*13.5*0.9mm) Hot color targeting to 3 step ANIS eclipse bin 2700K, 3000K, 4000K, 5000K, 5700K CCT available 9V & 37V version Dice Technology : InGaN Environmental friendly ; RoHS compliance Applications Replacement lamp General lighting Indoor and outdoor commercial lighting PAR lamp, Bulb light, etc.

3 Outline Dimension PB04H07.0 Product Specification Unit: mm Tolerances unless otherwise specified: ±0.15mm Note: Circuit layout is 3 series and 4 parallels & 12 series and 1 parallel

4 Performance PB04H07.0 Product Specification Electro-Optical Characteristics (I F =480mA & 120mA, Ts=25 o C) Parameter Symbol Condition Min. Typical Max. Unit Forward Voltage (1) V F I F =480mA V Forward Voltage (1) V F I F =120mA V Color Temperature (2) CCT 4000 K I F =480mA I F =120mA Color Rendering Index Ra 80 Thermal Resistance R th 5.0 / W View Angle θ 120 deg (1) The Forward Voltage tolerance is ±3%. (2) Correlated Color Temperature is derived from the CIE 1931Chromaticity diagram. Absolute Maximum Ratings Parameter Symbol Value Unit DC Forward Current (1) I F 720 ma DC Forward Current (1) I F 180 ma Power Dissipation Pd 7.2 W Storage Temperature T stg -40 ~ 100 Junction Temperature T J 130 Substrate Temperature T s 100 o C o C o C Manual Soldering Time at 300 o C(Max) T sol 3.5 sec (1) Please refer to the operating limit sections.

5 Chromaticity Coordinates (Extrapolated to Ts= 85 0 C) Items 2700K 3-Step (273) 3000K 3-Step (303) 4000K 3-Step (403) 5000K 3-Step (503) 5700K 3-Step (573) Center Point, Cx Center Point, Cy Major Axis, a Minor Axis, b Rotation Angle (1) Tolerance of measurement is Chromaticity (x,y) ± 0.005

6 Binning PB04H07.0 Product Specification Binning (I F =480mA;120mA) CCT (1) Step CRI (2) Flux (3) Voltage (4) L4 DD CCT Bin Code CCT K-3step K-3step K-3step K-3step K-3step CRI Bin Code CRI 8 >80 Flux Bin Code Ts25 o C Ts85 o C (5) Min Max Min Max L L M V F Binning (I F =480mA) Voltage Bin Code V Ts25 o C V Ts85 o C (5) Min Max Min Max AI

7 V F Binning (I F =120mA) Voltage Bin Code V Ts25 o C V Ts85 o C (5) Min Max Min Max DD (1) Correlated color Temperature is derived from the CIE 1931Chromaticity diagram. (2) The CRI tolerance is 2. (3) The luminous flux is Ts 25 o C, tolerance is ± 7%. (4) The Forward Voltage is Ts 25 o C, tolerance is ±3%. (5) The luminous flux and forward Ts 85 o C is only for reference.

8 Characteristics PB04H07.0 Product Specification Spectrum (I F =480mA; 120mA, Ta=25 0 C) Radiation Pattern (I F =480mA; 120mA, Ta=25 0 C)

9 Forward Voltage vs. Forward Current (Ta=25 0 C) I F =480mA I F =120mA

10 Forward Current vs. Related Luminous Flux (Ta=25 0 C) I F =480mA I F =120mA

11 Forward Current vs. Chromaticity Coordinate (Ta=25 0 C) I F =480mA

12 I F =120mA

13 Substrate Temperature vs. Forward Voltage (I F =480mA; 120mA) Substrate Temperature vs. Relative Luminous Flux (I F =480;120mA)

14 Substrate Temperature vs. Chromaticity Coordinate (I F =480mA;120mA)

15 Reliability PB04H07.0 Product Specification No Item Condition Time/Cycle 1 High Temperature Operation Life Test Ts= Hrs 2 Low Temperature Operation Life Test Ta= Hrs 3 High Temperature and High Humidity Operation Life Test Ts= 85, 85%RH 1000 Hrs 4 High Temperature Storage Ta= Hrs 5 Low Temperature Storage Ta= Hrs 6 High Temperature High Humidity Storage Ta= 85, 85 % RH 1000 Hrs 7 Temperature Cycle Storage -40 ~100 (20min dwell) / 5min transfer 300 Cycles Judgment Criteria Item Symbol Judgment Criteria Forward Voltage V F ΔV F < 10 % Luminous Flux Iv Decay 20 %

16 Packing PB04H07.0 Product Specification Tray One tray composed of maximum 100 pieces COB. One inner box contains maximum 10 trays (1000 pieces) and one upper lid-tray in one anti static bag. <One tray> < One inner box > Label information

17 Precautions PB04H07.0 Product Specification 1. Avoid the application of any stress to the resin portion (lighting area). 2. Avoid any contact by a sharp metal nail or other materials with the resin portion (lighting area). Resin portion (lighting area) 3. This product should be secured firmly by fastening screws on both sides of the product. Please be careful not to apply any stress to the product during the clamping operation. 4. For fixing this product to the outer heat sink, thermal pad or thermal glue should be applied between backside of substrate and heat sink so that the product can dissipate heat completely. Please avoid product deformation when fixing the clamping operation. 5. Handling of static electricity - These products are sensitive to static electricity charge. Please prevent any static electricity within the assembling process. - All devices, equipment and machinery must be properly grounded. It is recommended that precautions be taken against surge voltage to the equipment that mounts the LEDs. - ESD sensitivity of this product is 1000V (HBM, based on JEITA ED-4701/304). - It is easy to find static-damaged LEDs by a light-on test. 6. Before open the package, should kept at room temperature, 90% RH environment or less. The LED should be used within 6 months. 7. After open the package, the LED should be kept at room temperature, 60% RH environment or less. The LED should be soldered within 168 hours (7 days) after opening the package. If unused LEDs remain, they should be stored in moisture proof packages, such as sealed containers with packages of moisture absorbent material (silica gel). 8. Applying proper resistor for the circuit design is recommended. Otherwise slight voltage shift may cause big current change and the LED may be burn out. 9. Please ensure that heat and electronic generation is not in excess of the absolute maximum rating.

18 Revision History PB04H07.0 Product Specification Date Contents Writer Tentative Spec Version1 Jacqueline Song Preliminary Spec Version1- Add OE Curve Jacqueline Song Product Spec Version1 Chin Lin Lextar Electronics Corp. is the leading LED (Light Emitting Diode) maker integrating upper stream epitaxial, middle stream chip, and downstream package, SMT and LED lighting applications. Founded in May, 2008, Lextar is a subsidiary of AU Optronics, the leading TFT-LCD and solar PV manufacturer. Lextar s product applications include lighting and LCD backlight. Lextar s manufacturing sites include Hsinchu and Chunan in Taiwan, and Suzhou in China. The company turnover in 2010 is 266 million USD.